CN218450447U

CN218450447U - Microphone and loudspeaker combination module, earphone and electronic equipment

Info

Publication number: CN218450447U
Application number: CN202221992639.9U
Authority: CN
Inventors: 王磊; 何云乾; 彭勃; 许超; 李珠莹
Original assignee: Huawei Technologies Co Ltd
Current assignee: Huawei Technologies Co Ltd
Priority date: 2022-07-27
Filing date: 2022-07-27
Publication date: 2023-02-03
Anticipated expiration: 2032-07-27

Abstract

The embodiment of the application provides a microphone and speaker combination module, an earphone and electronic equipment. The microphone and loudspeaker combined module at least comprises a microphone and a loudspeaker. The loudspeaker is a micro-electro-mechanical system loudspeaker, and the microphone is a micro-electro-mechanical system microphone. The loudspeaker is provided with a loudspeaker front cavity, a loudspeaker rear cavity and a sound outlet hole. The loudspeaker front cavity is communicated with the external space of the microphone and loudspeaker combined module through the sound outlet hole. The microphone has a microphone cavity and a sound pick-up hole. The microphone cavity is located below the loudspeaker rear cavity along the first direction, and the wall of the microphone cavity facing the loudspeaker rear cavity along the first direction is opposite to at least part of the wall of the loudspeaker rear cavity facing the microphone cavity along the first direction. The microphone cavity is communicated with the external space of the microphone and loudspeaker combined module through the sound pickup hole. This microphone and speaker combination module can improve earphone or electronic equipment's high frequency tone quality, helps improving user's experience and feels.

Description

Microphone and loudspeaker combination module, earphone and electronic equipment

Technical Field

The embodiment of the application relates to the technical field of wireless earphones, in particular to a microphone and loudspeaker combined module, an earphone and electronic equipment.

Background

With the development of True Wireless Stereo (TWS) wireless bluetooth headset technology, a True wireless Stereo headset includes numerous sensors, thereby resulting in higher integration of headset components and more strain on the internal space of the headset.

In order to make the earphone have a good uplink call effect and a feedback signal pickup requirement of Active Noise Cancellation (ANC), a microphone may be disposed between a speaker of the earphone and an ear canal to achieve Noise reduction. In the related art, the speaker and the microphone are connected to the same substrate, and the speaker and the microphone are independent and arranged in a staggered manner in a direction perpendicular to the sound output direction of the earphone. When the earphone works, the microphone is used for picking up surrounding noise signals, the noise signals are transmitted to the loudspeaker after being reversed through the circuit, and the reversed noise signals output by the loudspeaker are offset with the noise signals directly entering ears, so that the purpose of reducing noise is achieved.

However, the high-frequency sound quality of the earphone in the related art is insufficient, and the use experience of the user is affected.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application provides a microphone and speaker combination module, earphone and electronic equipment, can reduce the distance between microphone and speaker combination module and the user's ear tympanic membrane, helps improving the high frequency tone quality of earphone, can improve user's use and experience the sense.

A first aspect of an embodiment of the present application provides a microphone and speaker combination module, which at least includes: a microphone and a loudspeaker. The loudspeaker is a micro-electro-mechanical system loudspeaker, and the microphone is a micro-electro-mechanical system microphone. The loudspeaker is provided with a loudspeaker front cavity, a loudspeaker rear cavity and a sound outlet hole. The loudspeaker front cavity is communicated with the external space of the microphone and loudspeaker combined module through the sound outlet hole. The microphone has a microphone cavity and a sound pick-up hole. The microphone cavity is located below the loudspeaker rear cavity along a first direction, and the microphone cavity faces the cavity wall of the loudspeaker rear cavity along the first direction and is opposite to at least part of the cavity wall of the loudspeaker rear cavity facing the microphone cavity along the first direction. The microphone cavity is communicated with the external space of the microphone and loudspeaker combined module through the sound pickup hole.

The microphone and loudspeaker combination module provided by the embodiment of the application can reduce the thickness of the loudspeaker and the thickness of the microphone by adopting the micro-electro-mechanical system loudspeaker and the micro-electro-mechanical system microphone, in addition, the loudspeaker rear cavity is positioned above the microphone cavity along the first direction, and the cavity wall of the loudspeaker rear cavity facing the microphone cavity and the cavity wall of the microphone cavity facing the loudspeaker rear cavity are at least partially arranged oppositely in the first direction, so that the microphone cavity and the loudspeaker rear cavity can be arranged in a stacking way in the first direction, and further the microphone and the loudspeaker are arranged in a stacking way in the first direction.

In one possible embodiment, the microphone and speaker combination module includes a substrate assembly, a first housing, a first transducer assembly, a second housing, and a second transducer assembly. The first transducer assembly includes a first MEMS transducer and the second transducer assembly includes a second MEMS transducer. The substrate assembly, the first housing and the first transducer assembly collectively define the speaker, the first housing and the first transducer assembly are both mounted on a first surface of the substrate assembly, the first transducer assembly is configured to convert electrical energy into acoustic energy, the first transducer assembly is disposed within the first housing and collectively defines the speaker back volume with the substrate assembly, and the first housing, the first transducer assembly and the substrate assembly collectively define the speaker front volume. The substrate assembly, the second housing and the second transducer assembly collectively define the microphone, the second housing and the second transducer assembly both mounted on a second surface of the substrate assembly, the second housing and the substrate assembly collectively defining the microphone cavity, the second transducer assembly being located within the microphone cavity and being for converting acoustic energy into electrical energy. Wherein the first surface and the second surface are oppositely disposed along the first direction. So set up, can reduce the required installation space of microphone and speaker combination module for microphone and speaker combination module are closer with the distance of user's ear tympanic membrane, help improving the high frequency tone quality of earphone.

In one possible embodiment, the microphone cavity comprises a microphone front cavity and a microphone back cavity. The second transducing member and the substrate member together define the microphone back volume. The second housing, the second transducer assembly, and the substrate assembly collectively define the microphone front cavity. The sound pickup hole is arranged on the substrate component or the second shell, so that the microphone can collect noise signals near the microphone and loudspeaker combined module, and active noise reduction is realized.

In a possible embodiment, the substrate assembly includes a first substrate, and the first transducer assembly and the second transducer assembly are respectively disposed on two opposite sides of the first substrate along the first direction, so as to help further reduce the thickness of the microphone and speaker combination module in the first direction, and reduce the size of the microphone and speaker combination module, and the installation space required by the microphone and speaker combination module.

In one possible embodiment, the substrate assembly includes a first substrate and a second substrate stacked in the first direction. The first housing and the first transducer assembly are both disposed on a surface of the first substrate, and the second housing and the second transducer assembly are both disposed on a surface of the second substrate. So set up, can reduce the required installation space of microphone and speaker combination module on the one hand, on the other hand can improve the production efficiency of microphone and speaker combination module.

In a possible embodiment, the sound pickup hole includes a first sound hole section and a second sound hole section which are arranged in communication. The first sound hole section penetrates through the second substrate and is communicated with the microphone rear cavity. The second sound hole section is arranged between the first substrate and the second substrate and is used for being communicated with the external space of the microphone and loudspeaker combined module. So set up for pick up the sound hole and can set up on the base plate subassembly, and can improve the sensitivity of microphone, help improving the range of application of microphone and speaker combination module.

In one possible embodiment, the substrate assembly further comprises: a third substrate. The first substrate is connected with the second substrate through the third substrate. And a communication structure for communicating the sound pickup hole with the external space of the microphone and loudspeaker combined module is arranged on the third substrate. Through the third base plate, help reducing and set up the laying degree of difficulty on the base plate subassembly with the pick-up hole to can reduce the processing degree of difficulty of base plate subassembly, thereby can improve the range of application of microphone and speaker combination module.

In a possible embodiment, the substrate assembly is provided with a sound hole, and the speaker back cavity is communicated with the external space of the microphone and speaker combination module through the sound hole. Through the sound hole, the rear cavity of the loudspeaker can be communicated with the external space of the microphone and loudspeaker combined module, and the balance of the pressure of the rear cavity of the loudspeaker and the pressure of the front cavity of the loudspeaker can be guaranteed.

In a possible embodiment, when the sound pickup hole is disposed on the substrate assembly, the sound pickup hole is communicated with the sound pickup hole, so that the speaker back cavity and the microphone cavity are both communicated with the external space of the microphone and speaker combination module. With this configuration, the number of holes formed in the substrate assembly can be reduced, and the rigidity of the substrate assembly can be improved.

In one possible embodiment, the microphone and speaker combination module includes a fourth substrate, a first housing, a first transducer assembly, a second housing, and a second transducer assembly. The first transducer assembly includes a first MEMS transducer and the second transducer assembly includes a second MEMS transducer. The fourth substrate, the first housing, and the first transducer assembly collectively define the speaker, and the fourth substrate, the second housing, and the second transducer assembly collectively define the microphone. The first shell, the second shell and the second transduction component are all installed on the same surface of the fourth substrate, the first transduction component, the second shell and the second transduction component are all located in the first shell, and the second transduction component is located in the second shell. The first transducer assembly is mounted on the outer surface of the second enclosure and defines the speaker back volume together with the outer surface of the second enclosure, and the first transducer assembly, the first enclosure, the outer surface of the second enclosure, and the fourth substrate define the speaker front volume together. The inner surface of the second housing and the fourth substrate together define the microphone cavity, and the sound pickup hole is disposed on the fourth substrate. Microphone and speaker can reduce the thickness of microphone and speaker combination module on the one hand through sharing same base plate to reduce the volume size of microphone and speaker combination module, on the other hand can reduce the production degree of difficulty of microphone and speaker combination module, help improving the production efficiency of microphone and speaker combination module.

In one possible embodiment, the microphone cavity comprises a microphone front cavity and a microphone back cavity. The second transducer assembly and the fourth substrate together define the rear microphone cavity, and the second transducer assembly, the fourth substrate and the second housing together define the front microphone cavity. One end of the sound pickup hole is communicated with the front cavity of the microphone or the rear cavity of the microphone, and the other end of the sound pickup hole is communicated with the external space of the microphone and loudspeaker combined module.

In one possible embodiment, the second housing is an electromagnetic shielding housing. Alternatively, the second housing includes an electromagnetic shielding layer and a resin layer stacked in the first direction. The resin layer is used for being fixedly connected with the second transduction assembly and defining a loudspeaker rear cavity together with the second transduction assembly. Due to the arrangement, the electromagnetic shielding effect of the microphone is more obvious, and the electromagnetic interference capability of the microphone can be improved.

In a possible embodiment, a receiving groove for receiving the second transducer assembly is disposed on the fourth substrate, and this arrangement helps to further reduce the thickness of the microphone and speaker combination module in the first direction.

In a possible embodiment, the sound outlet hole is provided in a side wall or a top wall of the first housing, so that the speaker can emit sound in a normal direction or in a side direction.

A second aspect of the embodiments of the present application provides an earphone, which at least includes: a first housing, a second housing, and a microphone and speaker combination module as claimed in any one of the first aspect. The first shell is fixedly connected with the second shell and defines a containing cavity together, and a sound outlet communicated with the containing cavity is formed in the inner wall of the second shell. The microphone and loudspeaker combined module is positioned in the accommodating cavity and is arranged close to the sound outlet, or the microphone and loudspeaker combined module is positioned in the sound outlet.

The earphone that this application embodiment provided, because microphone and speaker combination module adopt and pile up the micro-electromechanical system microphone and the micro-electromechanical system speaker that set up along first direction, make the thickness of microphone and speaker combination module in the orientation reduce, thereby the volume of microphone and speaker combination module diminishes, the required installation space of microphone and speaker combination module diminishes, microphone and speaker combination module can be installed in the position department of being close to the human ear tympanic membrane, with the interval between microphone and speaker combination module and the human ear tympanic membrane that reduces, with the high-frequency sound effect that promotes the earphone.

In one possible embodiment, the method further comprises: a speaker unit. The loudspeaker unit is located hold the intracavity and be located microphone and speaker combination module and first casing between. So set up, help improving the sound production effect of earphone.

In one possible embodiment, the loudspeaker unit is a moving coil unit or a moving iron unit.

A third aspect of the embodiments of the present application provides an electronic device, which at least includes: a body and a microphone and speaker combination module as defined in any one of the first aspects, the microphone and speaker combination module being mounted on the body.

The electronic equipment that this application embodiment provided, through setting up like first aspect microphone and speaker combination module, high frequency audio when can improving the electronic equipment sound production to can improve user's experience and feel.

Drawings

Fig. 1 is a schematic structural diagram of an earphone according to an embodiment of the present disclosure;

fig. 2 is a cross-sectional view of the earphone of the embodiment shown in fig. 2;

fig. 3 is a schematic structural diagram of another earphone provided in the embodiment of the present application;

fig. 4 is a cross-sectional view of the earphone of the embodiment shown in fig. 3;

fig. 5 is a cross-sectional view of a microphone and speaker combination module according to an embodiment of the present disclosure;

FIG. 6 is a cross-sectional view of a first transducer assembly provided by an embodiment of the present application;

fig. 7 is a partial perspective view of another microphone and speaker combination module provided in an embodiment of the present application;

FIG. 8 is a cross-sectional view of a second transducer assembly provided by an embodiment of the present application;

fig. 9 is a cross-sectional view of another microphone and speaker combination module provided in the embodiments of the present application;

fig. 10 is a cross-sectional view of a soundhole provided by an embodiment of the present application;

fig. 11 is a schematic structural diagram of another microphone and speaker combination module according to an embodiment of the present disclosure;

FIG. 12 is a schematic structural diagram of the microphone and speaker combination module of the embodiment shown in FIG. 11;

fig. 13 is a schematic view illustrating communication between a sound hole and a sound pickup hole according to an embodiment of the present disclosure;

fig. 14 is a schematic structural diagram of another microphone and speaker combination module according to an embodiment of the present disclosure;

fig. 15 is a cross-sectional view of the microphone and speaker combination module of the embodiment shown in fig. 14;

fig. 16 is a cross-sectional view of another microphone and speaker combination module according to an embodiment of the present application;

fig. 17 is a cross-sectional view of another microphone and speaker combination module provided in an embodiment of the present application;

fig. 18 is a cross-sectional view of another microphone and speaker combination module according to an embodiment of the present application;

fig. 19 is a schematic diagram of a first step of manufacturing the microphone and speaker combination module of the embodiment shown in fig. 17;

FIG. 20 is a second step of fabricating the microphone and speaker assembly of the embodiment shown in FIG. 17;

fig. 21 is a third step of fabricating the microphone and speaker combination module of the embodiment shown in fig. 17;

fig. 22 is a schematic diagram of a fourth step of manufacturing the microphone and speaker combination module of the embodiment shown in fig. 17.

Description of reference numerals:

10. a microphone cavity; 11. a microphone front cavity; 12. a microphone back cavity;

20. a sound pickup hole; 21. a first tone hole section; 22. a second tone hole section;

31. a speaker front cavity; 32. a speaker back volume; 33. a sound outlet hole; 34 a sound hole; 341. a fourth groove; 342. a first through hole;

100. a microphone and loudspeaker combined module;

110. a microphone;

111. a second housing; 1111. an electromagnetic shielding layer; 1112. a resin layer;

112. a second transducer assembly; 1121. vibrating diaphragm; 1122. a second substrate; 113. a processing element;

120. a speaker;

121. a first housing;

122. a first transducer assembly;

1221. a vibrating element; 12211. a substrate layer; 12212. a first electrode layer; 12213. a piezoelectric layer; 12214. a second electrode layer;

1222. a first substrate; 1223. a gap structure;

130. a substrate assembly; 131. a first substrate; 132. a second substrate; 133. a third substrate; 1331. a communicating structure; 134. a fourth substrate; 1341. accommodating a tank;

140. a wire; 150. a bonding pad;

200. an earphone; 210. a first housing; 220. a second housing; 230. a sound outlet; 240. a speaker unit; 250. a support;

x, a first direction;

y, second direction.

Detailed Description

Embodiments of the present application provide an earphone 200 that may be used in a conversation scenario as an accessory to an electronic device, including but not limited to a handheld device, an in-vehicle device, a wearable device, a computing device, or other processing device connected to a wireless modem. The electronic devices may include cellular phones (cellular phones), smart phones (smartphones), personal Digital Assistants (PDAs), tablet computers, laptop computers (laptop computers), car computers, smart watches (smart watches), smart bracelets (smartwatches), pedometers (pedometers), and other electronic devices having a call function. The electronic device in the embodiment of the present application may also be referred to as a terminal. The call scene includes, but is not limited to, an indoor call scene, an outdoor call scene, and a vehicular call scene. The call scenes may include quiet call scenes, noisy call scenes (e.g., scenes in streets, shopping malls, airports, stations, construction sites, in the rain, at tours, concerts, etc.), riding call scenes, outdoor windy call scenes, monaural call scenes, binaural call scenes, and other call-enabled scenes. The earphone 200 (ear-set) may be a pair of conversion units for receiving electrical signals from a media player or receiver and converting the electrical signals into audible sound waves by the speaker 120 near the ear.

The headset 200 may be generally classified into a wired headset 200 (wired headset) and a wireless headset 200 (wireless headset). The wired headset 200 has two headsets 200 and a connecting line, wherein the left and right headsets 200 are connected by the connecting line. The wired headset 200 may be inconvenient to wear and need to be connected to the electronic device through the jack of the headset 200, and the power of the electronic device needs to be consumed during the operation. The wireless headset 200 can communicate with an electronic device by using a wireless communication technology (e.g., bluetooth technology, infrared radio frequency technology, 2.4G wireless technology, ultrasonic wave, etc.), and compared with the wired headset 200, the wireless headset 200 is more convenient and fast to use due to the fact that the wireless headset 200 is free from the constraint of physical wires, so that the wireless headset is rapidly developed. Wherein, the left earphone 200 of the wireless earphone 200 can be connected to the right earphone 200 through bluetooth.

The true wireless bluetooth headset 200, also called True Wireless Stereo (TWS) headset 200, the TWS headset 200 completely eliminates the wire connection, including two headsets 200 (e.g., a master headset 200 and a slave headset 200). For example, when the earphone is used, an electronic device (also referred to as a transmitting device, such as a mobile phone, a tablet, a music player with bluetooth output, etc.) is wirelessly connected to the master earphone 200, and then the master earphone 200 is connected to the slave earphone 200 in a bluetooth wireless manner, so that the real bluetooth left and right channel wireless separation can be realized. The left and right earphones 200 of the TWS earphone 200 can form a stereo system through Bluetooth, and the performances of listening to songs, communicating and wearing are improved. In addition, either of the two earphones 200 can also work alone, for example, in case the master earphone 200 is not connected to the slave earphone 200, the master earphone 200 can return to mono sound quality. Due to the property that the left and right earphones 200 of the TWS earphone 200 have no physical connection, almost all of the TWS earphones 200 are equipped with a charging box having both charging and housing functions.

The TWS headset 200 has a limited internal space due to the limitation of the external shape, and compared to the wired headset 200, the internal of the TWS headset 200 needs to be provided with an acoustic device, a battery, a circuit board, and other devices, for example, in some technologies, the acoustic device includes a speaker and a microphone, the speaker and the microphone are disposed on the same circuit board and located on the same surface of the circuit board, the speaker and the microphone are independently disposed and staggered in the direction perpendicular to the sound emitting direction of the headset, so that the space utilization rate of the microphone and the speaker can be improved, but the planar size of the circuit board is too large, which may result in the installation space required by the circuit board being enlarged, thereby limiting the position of the circuit board in the headset, and further resulting in the distance between the speaker and the eardrum of the user's ear being increased and the high-frequency sound quality of the headset being insufficient.

Fig. 1 is a schematic structural diagram of an earphone according to an embodiment of the present application, fig. 2 is a cross-sectional view of the earphone according to the embodiment shown in fig. 2, fig. 3 is a schematic structural diagram of another earphone according to the embodiment of the present application, and fig. 4 is a cross-sectional view of the earphone according to the embodiment shown in fig. 3.

As shown in fig. 1-3, the application embodiment provides a headset 200, where the headset 200 at least includes: a first housing 210, a second housing 220, and a microphone and speaker combination module 100. The first housing 210 and the second housing 220 are tightly connected and jointly define a containing cavity, and the containing cavity can be used for containing devices such as a battery, a microphone and loudspeaker combined module 100 and the like. The inner wall of the second housing 220 is provided with a sound outlet 230 communicated with the accommodating cavity, and the sound outlet 230 can be used for transmitting the sound emitted by the earphone 200 to the external space of the earphone 200.

In the embodiment of the present application, the microphone and speaker assembly 100 includes the mems speaker 120 and the mems microphone 110 stacked, and the thickness of the mems speaker 120 and the thickness of the mems microphone 110 are small, so that the thickness of the microphone and speaker assembly 100 is small, and in addition, the length of the microphone and speaker assembly 100 in the direction perpendicular to the thickness direction thereof is small because the mems speaker 120 and the mems microphone 110 are stacked along the thickness direction (for example, the X direction in fig. 5) of the microphone and speaker assembly 100, so that the volume of the microphone and speaker assembly 100 is small, and the installation space required by the microphone and speaker assembly 100 is reduced, so that the layout range of the installation position of the microphone and speaker assembly 100 in the earphone 200 can be increased, and the microphone and speaker assembly 100 can be installed at a position where the distance between the microphone and speaker assembly 100 and the ear of the user can be reduced, so as to improve the high-frequency sound quality of the earphone 200. In addition, since the high frequency sound quality of the mems speaker 120 is good, the high frequency sound quality of the earphone 200 can be further improved.

In the embodiment of the present application, since the installation space required for the microphone 110 and the speaker 120 is small, as shown in fig. 1 and fig. 2, the microphone and speaker combination module 100 can be disposed close to the sound outlet 230, in other words, the microphone and speaker combination module 100 is disposed to cover the end of the sound outlet 230 communicating with the accommodating cavity, and thus the distance between the microphone and speaker combination module 100 and the eardrum of the human ear can be reduced, which is helpful for improving the high-frequency sound quality of the earphone 200. Of course, besides the microphone and speaker combination module 100 being located at the sound outlet 230, as shown in fig. 3 and 4, the microphone and speaker combination module 100 can be embedded in the sound outlet 230, so as to further reduce the distance between the microphone and speaker combination module 100 and the ear drum of the user, which is helpful to further improve the high-frequency sound quality of the earphone 200.

In order to further improve the sound generating effect of the earphone 200, as shown in fig. 2, the earphone 200 may further include a speaker unit 240, and the speaker unit 240 is located in the accommodating cavity and located between the microphone and speaker combination module 100 and the first housing 210, it can be understood that since the microphone and speaker combination module 100 has the mems speaker 120, the earphone 200 has two sound generating units, namely the speaker unit 240 and the mems speaker 120, which can meet different sound generating requirements of the earphone 200.

In the embodiment of the present application, the speaker unit 240 may be a moving coil unit or a moving iron unit, and it is understood that the moving coil unit refers to a moving coil speaker and the moving iron unit refers to a moving iron speaker, and of course, the speaker unit 240 may also be other types of speakers 120, and is not limited in particular herein.

In the embodiment of the present application, as shown in fig. 2 to 4, the earphone 200 further includes a bracket 250, the microphone and speaker combination module 100 may be fixedly connected to the second housing 220 through the bracket 250, and in addition, the microphone and speaker combination module 100 may cover one end of the sound outlet 230 or be located in the sound outlet 230 through the bracket 250.

The following explains an implementation of the microphone and speaker combination module 100 provided in the embodiment of the present application.

Fig. 5 is a cross-sectional view of a microphone and speaker combination module 100 according to an embodiment of the present disclosure, referring to fig. 5, which at least includes: a microphone 110 and a speaker 120. The speaker 120 is a Micro-Electro-Mechanical System (MEMS) speaker 120, which is helpful for reducing the thickness of the speaker 120 and improving the high-frequency sound quality of the speaker 120. The speaker 120 has a speaker front chamber 31, a speaker rear chamber 32, and a sound outlet hole 33. The speaker front chamber 31 communicates with the external space of the microphone and speaker combination module 100 through the sound outlet hole 33 so that the sound emitted from the speaker 120 can be transmitted to the external space of the microphone and speaker combination module 100. The microphone 110 is a mems microphone 110, which helps to reduce the thickness of the microphone 110. The microphone 110 has a microphone chamber 10 and a sound pick-up opening 20. The microphone cavity 10 is located below the rear speaker cavity 32 along a first direction (for example, the X direction in fig. 5), and the wall of the microphone cavity 10 facing the rear speaker cavity 32 along the first direction is opposite to at least part of the wall of the rear speaker cavity 32 facing the microphone cavity 10 along the first direction, so that the dimension of the microphone and speaker combination module 100 in a direction perpendicular to the first direction (for example, the Y direction in fig. 5) can be reduced, which helps to reduce the size of the microphone and speaker combination module 100. The microphone chamber 10 communicates with the external space of the microphone and speaker combination module 100 through the sound pickup hole 20 so that the microphone 110 can pick up sound in the external space of the microphone and speaker combination module 100.

It should be noted that the microphone cavity 10 is located below the speaker back cavity 32 with reference to the position of the microphone and speaker combination module 100 in fig. 10, and when the position of the microphone and speaker combination module 100 changes, the microphone cavity 10 is always arranged with the speaker back cavity 32 along the first direction.

Since the microphone 110 and the speaker 120 are both manufactured by using a Micro-Electro-Mechanical System (MEMS) process, the MEMS speaker 120 and the MEMS microphone 110 manufactured by using the MEMS process have the advantages of small size, light weight, low power consumption, high reliability, small thickness, high sensitivity, and easy integration, which is helpful for reducing the thickness of the microphone and speaker combination module 100.

Since the speaker front chamber 31 is located above the speaker back chamber 32 in the first direction, in other words, the speaker front chamber 31 wraps the speaker back chamber 32 toward the chamber wall of the speaker back chamber 32 in the first direction, a portion of the speaker front chamber 31 is located above the speaker back chamber 32 in the first direction, so that the speaker front chamber 31, the speaker back chamber 32, and the microphone chamber 10 are arranged from top to bottom in the first direction, and the microphone 110 and the speaker 120 are stacked in the first direction.

The microphone chamber 10 is disposed opposite to the wall of the speaker chamber 32 facing the wall of the microphone chamber 10 along the first direction, and the speaker chamber 32 is disposed opposite to the wall of the speaker chamber 10 along the first direction, so that the microphone 110 and the speaker 120 are prevented from being arranged in a staggered manner in the second direction (for example, the Y direction in fig. 10), which helps to reduce the length of the microphone and speaker combination module 100 in the second direction. The second direction is perpendicular to the first direction, the first direction refers to a thickness direction of the microphone and speaker combination module 100, and the first direction is also a thickness direction of the speaker 120 and a thickness direction of the microphone 110.

Therefore, in the microphone and speaker combination module 100 according to the embodiment of the present application, by stacking the mems microphone 110 and the mems speaker 120 in the first direction, the advantage of the small thickness of the mems microphone 110 and the advantage of the small thickness of the mems speaker 120 can be effectively utilized, the length of the microphone and speaker combination module 100 in the second direction can be reduced, in other words, the cross-sectional area of the microphone and speaker combination module 100 can be reduced, which is beneficial to reducing the installation space required by the microphone and speaker combination module 100, and further, the distance between the microphone and speaker combination module 100 and the eardrum of the human ear can be reduced, which is beneficial to improving the high-frequency sound quality of the earphone 200. Wherein the cross section of the microphone and speaker combination module 100 is parallel to the second direction and perpendicular to the first direction.

The process of actively reducing noise for the microphone and speaker combination module 100 provided in the embodiment of the present application is as follows: external noise can enter the microphone cavity 10 through the sound pickup hole 20 and then be picked up by the microphone 110, the microphone 110 converts the picked-up sound signal into an electric signal and transmits the electric signal to the processing unit for processing, the processing unit can perform reverse processing according to the obtained electric signal and convert the obtained electric signal subjected to the reverse processing into a sound signal to be sent to the loudspeaker 120, and the loudspeaker 120 sends out reverse sound wave through the sound outlet hole 33 according to the sound signal to offset the external noise, so that active noise reduction is realized. It should be noted that the processing unit may be a processing chip of the microphone and speaker combination module 100 or a processing module separately disposed in the earphone 200, and is not limited in particular.

In the embodiment of the present application, the microphone cavity 10 includes the microphone front cavity 11 and the microphone rear cavity 12, and the sound pickup hole 20 may communicate with the microphone front cavity 11 or the microphone rear cavity 12, so that noise in the external space of the microphone and speaker combination module 100 may be picked up by the microphone 110 through the microphone rear cavity 12 or the microphone front cavity 11.

As shown in fig. 5, the microphone cavity 10 and the speaker front cavity 31 and the speaker back cavity 32 may be located on different sides of a substrate portion (e.g., the substrate assembly in fig. 10) of the microphone and speaker combination module 100 along the first direction, and the microphone cavity 10 and the speaker front cavity 31 and the speaker back cavity 32 are located on different sides of the substrate portion in the following detailed description.

In some possible embodiments, as shown in fig. 5, the microphone and speaker combination module 100 includes a substrate assembly 130, a first housing 121, a first transducer assembly 122, a second housing 111, and a second transducer assembly 112. Wherein the first transducer assembly 122 includes a first mems transducer that enables the first transducer assembly 122 to perform the function of interconversion between electrical energy and acoustic energy. The second transducer assembly 112 includes a second mems transducer that enables the second transducer assembly 112 to perform the function of electrical and acoustic energy interconversion.

As shown in fig. 5, the substrate assembly 130, the first housing 121, and the first transducer assembly 122 together define the speaker 120, and due to the arrangement of the first mems transducer, the first transducer assembly 122 can convert an electrical signal into an acoustic signal, so as to implement a sound generating function of the speaker 120. The first housing 121 and the first transducer assembly 122 are both mounted on a first surface of the substrate assembly 130, the first transducer assembly 122 is disposed within the first housing 121 and together with the substrate assembly 130 defines the rear speaker cavity 32, and the first housing 121, the first transducer assembly 122, and the substrate assembly 130 together define the front speaker cavity 31.

As shown in fig. 5, the substrate assembly 130, the second housing 111 and the second transducer assembly 112 together define the microphone 110, and due to the arrangement of the second mems transducer, the first transducer assembly 122 can convert a sound signal into an electrical signal, so as to achieve the sound pickup function of the microphone 110. The second housing 111 and the second transducer assembly 112 are both mounted on a second surface of the substrate assembly 130, the second housing 111 and the substrate assembly 130 together defining the microphone cavity 10; wherein the first surface and the second surface are oppositely arranged along the first direction. With this configuration, the installation space required by the microphone and speaker combination module 100 can be reduced, so that the microphone and speaker combination module 100 is closer to the ear drum of the user, which is helpful for improving the high-frequency sound quality of the earphone 200.

The sound emitting hole 33 may be provided on a side wall (e.g., shown in fig. 5) or a top wall (e.g., shown in fig. 13 or 14) of the first housing 121 so that the speaker 120 can realize a front sound emission or a side sound emission.

It is understood that the first housing 121 is used for protecting the first transducer assembly 122, and can be tightly connected with the second shell 220 of the earphone 200 through the first housing 121, so as to mount the microphone and speaker combination module 100 in the accommodating cavity or the sound outlet 230. In addition, the material of the first housing 121 may be metal (the material of the metal may be stainless steel material, aluminum alloy material, copper alloy material, ferrous material, iron alloy material), plastic (the plastic may be hard plastic, such as ABS, POM, PS, PMMA, PC, PET, PBT, PPO, etc.), ceramic, or the like. Similarly, the second housing 111 is also used for protecting the second transducer assembly 112, and can be tightly connected with the second casing 220 of the earphone 200 through the second housing 111 to mount the microphone and speaker combination module 100 in the accommodating cavity or sound outlet 230. In addition, the material of the second housing 111 may be metal (the material of the metal may be selected from stainless steel material, aluminum alloy material, copper alloy material, iron alloy material), plastic (the plastic may be selected from rigid plastic, such as ABS, POM, PS, PMMA, PC, PET, PBT, PPO, and the like), ceramic, and the like.

It will be appreciated that the first and second MEMS transducers are both fabricated in semiconductor material using MEMS technology, and thus, any one of the first and second MEMS transducers may be any one of the following: piezoelectric MEMS transducer, electrodynamic MEMS transducer, electrostatic MEMS transducer, and thermoacoustic MEMS transducer. Additionally, the first and second MEMS transducers may or may not be of the same type.

The structure of the first transducer assembly 122 and the second transducer assembly 112 will be described by taking the example where the first transducer assembly 122 and the second transducer assembly 112 both use piezoelectric mems transducers.

Fig. 6 is a cross-sectional view of a first transducer assembly provided in an embodiment of the present application, and fig. 7 is a partial perspective view of another microphone and speaker combination module provided in an embodiment of the present application.

As shown in fig. 6, the first transducer assembly 122 may include a vibrating element 1221 and a first substrate 1222 supporting the vibrating element 1221. The first base 1222 is fastened to the substrate assembly 130, so that the vibration element 1221 is fastened to the substrate assembly 130. In addition, the vibrating element 1221, the first substrate 1222, and the substrate assembly 130 collectively define the speaker back volume 32. The vibration element 1221 is made of a piezoelectric material, and the vibration element 1221 can deform under the action of an electric field to push air to produce sound.

The vibrating element 1221 is a first MEMS transducer fabricated by MEMS technology, and the vibrating element 1221 may be a piezoelectric single-cantilever beam, a multi-cantilever beam assembly (e.g., as shown in fig. 7), a piezoelectric cantilever beam and a dome assembly, or other cantilever beam structures. For example, as shown in fig. 11, the vibration element 1221 includes a substrate layer 12211, a first electrode layer 12212, a piezoelectric layer 12213, and a second electrode layer 12214 which are stacked in a first direction. The first electrode layer 12212 and the second electrode layer 12214 have opposite polarities, and the piezoelectric layer 12213 is made of a piezoelectric material, and the piezoelectric material generates an inverse piezoelectric effect under the action of an electric field defined by the first electrode layer 12212 and the second electrode layer 12214, so as to drive the vibration element 1221 to deform, thereby pushing air to generate sound. It is to be noted that the number of the piezoelectric layers 12213 between the first electrode layer 12212 and the second electrode layer 12214 may be a plurality of layers, and in addition, the piezoelectric layers 12213 of two adjacent layers may be connected by a connection layer.

The piezoelectric material refers to a material having a piezoelectric effect, such as lead zirconate titanate, aluminum nitride, scandium-doped aluminum nitride, zinc oxide, and the like.

As shown in fig. 7, the cantilever structure means that the connection end of the vibration element 1221 is firmly connected to the first substrate 1222, and the free end of the vibration element 1221 can vibrate up and down in the first direction under the action of an electric field.

As shown in fig. 7, the first mems transducer may include a plurality of vibrating elements 1221, with a gap structure 1223 between two adjacent vibrating elements 1221, the gap structure 1223 making the free end of the cantilever structure mechanically free to facilitate the vibrating elements 1221 to vibrate.

FIG. 8 is a cross-sectional view of a second transducer assembly provided in accordance with an embodiment of the present application.

As shown in fig. 8, the second transducer assembly 112 may include a diaphragm 1121 and a second base 1122 for supporting the diaphragm 1121, the second base 1122 being fixedly mounted on the substrate assembly 130, the diaphragm 1121, the second base 1122 and the substrate assembly 130 together defining a microphone back cavity 12, and the diaphragm 1121, the second base 1122, the substrate assembly 130 and the second housing 111 together defining a microphone front cavity 11. The diaphragm 1121 is a first MEMS transducer manufactured by an MEMS technique, and the diaphragm 1121 may be integrally etched by using a single crystal or polysilicon material, and a piezoelectric material (e.g., a ceramic material) is sprayed on the etched diaphragm 1121, or a layer of piezoelectric ceramic is covered on the etched diaphragm 1121, so as to form a piezoelectric MEMS transducer. When the diaphragm 1121 is bent, the diaphragm 1121 generates an electrical signal, and the processing element 113 electrically connected to the diaphragm 1121 processes the electrical signal.

In the embodiment, the substrate assembly 130 may be formed by a Printed Circuit Board (PCB), so that the electric signals generated by the vibration element 1221 and the diaphragm 1121 may be transmitted to the processing unit and the processing element 113 through the PCB, and in addition, the electrode layer of the vibration element 1221 may be electrically connected to the PCB through a lead.

The processing element 113 may include, but is not limited to, an Application Specific Integrated Circuit (ASIC) chip, a Digital Signal processing unit (DSP) chip, and the like. In addition, as shown in fig. 13, the processing element 113 may be mounted on a circuit board and electrically connected to the diaphragm 1121 and the circuit board through wires 140, respectively.

Fig. 9 is a sectional view of another microphone and speaker combination module according to an embodiment of the present disclosure, and fig. 10 is a sectional view of a sound hole according to an embodiment of the present disclosure.

As shown in fig. 9, in one possible embodiment, the substrate assembly 130 may include a first substrate 131, and the first transducer assembly 122 and the second transducer assembly 112 are respectively disposed on two opposite sides of the first substrate 131 along the first direction, which helps to further reduce the thickness of the microphone and speaker combination module 100 in the first direction, and the volume of the microphone and speaker combination module 100 may be reduced to reduce the installation space required by the microphone and speaker combination module 100.

The first substrate 131 and the second transducer assembly 112 together define a microphone back cavity 12, and the first substrate 131, the second transducer assembly 112 and the second housing 111 together define a microphone front cavity 11. In order to pick up noise in the external space of the microphone and speaker combination module 100, the sound pickup hole 20 may be provided on the first substrate 131 so that the microphone back cavity 12 communicates with the external space of the microphone and speaker combination module 100. Alternatively, the sound pickup hole 20 may be provided on the second housing 111 so that the microphone front cavity 11 communicates with the external space of the microphone and speaker combination module 100.

When the sound collecting hole 20 is disposed on the first substrate 131, it is helpful to further improve the sensitivity of the microphone 110, so as to improve the application range of the microphone and speaker combination module 100. For example, as shown in fig. 10, the sound pickup hole 20 includes a first sound hole section 21 and a second sound hole section 22 that are provided in communication. The first tone hole section 21 is located on the surface of the first substrate 131 where the second transducer assembly 112 is attached and within the microphone back cavity 12, and the second tone hole section 22 is disposed on the sidewall of the first substrate 131.

In order to equalize the pressure between the rear speaker chamber 32 defined by the first substrate 131 and the first transducer assembly 122 and the external space of the microphone and speaker combination module 100, in other words, between the rear speaker chamber 32 and the front speaker chamber 31, an acoustic hole 34 may be provided on the first substrate 131, and the rear speaker chamber 32 communicates with the external space of the microphone and speaker combination module 100 through the acoustic hole 34.

In order to reduce the number of openings in the first substrate 131 and improve the rigidity of the first substrate 131, the sound hole 34 may communicate with the sound pickup hole 20 in the first substrate 131.

It is understood that the first substrate 131 may be a first circuit board, and the first transducer assembly 122 and the second transducer assembly 112 are both mounted on the first circuit board and electrically connected to the first circuit board, respectively. In addition, the first circuit board is provided with pads 150 for electrical connection with an external circuit.

Fig. 11 is a schematic structural diagram of another microphone and speaker combination module provided in an embodiment of the present application, and fig. 12 is a schematic structural diagram of the microphone and speaker combination module in the embodiment shown in fig. 11.

As shown in fig. 11, in another possible embodiment, the substrate assembly 130 may include a first substrate 131 and a second substrate 132 that are stacked in a first direction. The first enclosure 121 and the first transducer assembly 122 are disposed on a surface of the first substrate 131, and the second enclosure 111 and the second transducer assembly 112 are disposed on a surface of the second substrate 132. With this arrangement, the mounting space required for the microphone and speaker combination module 100 can be reduced on the one hand, and the production efficiency of the microphone and speaker combination module 100 can be improved on the other hand.

It should be noted that the first substrate 131 may be a first circuit board, and the first transducer assembly 122 is mounted on and electrically connected to the first circuit board. The second substrate 132 may be a second circuit board on which the second transducer assembly 112 is mounted and electrically connected. In addition, the first circuit board has electrical connection circuits thereon, which are electrically connected to pads 150 (shown in fig. 11, for example) on the second circuit board and the first circuit board, respectively, so that the first circuit board and the second circuit board can share the pads 150 and be electrically connected to an external circuit. In addition, the first circuit board and the second circuit board can be fixedly connected in a welding mode.

It will be appreciated that the first transducer assembly 122 and the first substrate 131 together define the speaker back volume 32 and the first substrate 131, the first housing 121 and the first transducer assembly 122 together define the speaker front volume 31. The second transducer assembly 112 and the second substrate 132 together define a microphone back cavity 12, and the second substrate 132, the second housing 111 and the second transducer assembly 112 together define a microphone front cavity 11.

The sound emitting hole 33 may be provided on a top wall or a side wall of the first housing 121, and is not particularly limited thereto.

In order for the microphone 110 to pick up external noise, the sound pickup hole 20 may be disposed on the second housing 111 (for example, as shown in fig. 11 or 12), or the sound pickup hole 20 may be disposed on the substrate assembly 130 defined by the first substrate 131 and the second substrate 132, for example, in some examples, the sound pickup hole 20 includes a first sound hole section 21 and a second sound hole section 22 disposed in communication. The first tone hole section 21 is disposed through the second substrate 132 and communicates with the microphone rear cavity 12. The second sound hole section 22 is disposed between the first substrate 131 and the second substrate 132, and the second sound hole section 22 is used for communicating with the external space of the microphone and speaker combination module 100. With such an arrangement, the sound pickup hole 20 can be disposed on the substrate assembly 130, and the sensitivity of the microphone 110 can be improved, which is helpful for improving the application range of the microphone and speaker combination module 100.

The second tone hole segment 22 may include, but is not limited to, the following formations: the surface of the second substrate 132 contacting the first substrate 131 is provided with a first groove, and the first groove and the first substrate 131 cooperate to define the second sound hole section 22. Alternatively, a second groove is provided on the surface of the first substrate 131 contacting the second substrate 132, and the second groove and the second substrate 132 cooperate to define the second tone hole section 22. Alternatively, a first groove is provided on the surface of the first substrate 131 contacting the second substrate 132, a second groove is provided on the surface of the second substrate 132 contacting the first substrate 131, and the first groove and the second groove cooperate to define the second acoustic port section 22.

In order to balance the pressure between the speaker rear chamber 32 and the speaker front chamber 31, as shown in fig. 11 or 12, a sound hole 34 may be provided on the first substrate 131 through the first substrate 131, the sound hole 34 communicating the speaker rear chamber 32 with the external space of the microphone and speaker combination module 100, and the number of the sound holes 34 may include, but is not limited to, 1, 2, 3, 4, and the like.

Fig. 13 is a schematic view illustrating communication between a sound hole and a sound collecting hole provided in the embodiment of the present application, fig. 14 is a schematic view illustrating a structure of another microphone and speaker combination module provided in the embodiment of the present application, and fig. 15 is a cross-sectional view illustrating the microphone and speaker combination module in the embodiment of fig. 12.

As shown in fig. 13, the sound hole 34 can also communicate with the sound pickup hole 20, in other words, the sound hole 34 can communicate with the external environment through the sound pickup hole 20, or the sound pickup hole 20 can communicate with the external environment through the sound pickup hole 34, for example, taking the case that the sound hole 34 communicates with the sound pickup hole 20, one end of the sound hole 34 communicates with the speaker back cavity 32, and the other end of the sound hole 34 communicates with the sound pickup hole 20, so that the sound pickup hole 20 can transmit the external noise to the microphone 110 on the one hand, and can balance the pressure between the speaker back cavity 32 and the external environment on the other hand.

As shown in fig. 14 and 15, the sound hole 34 may include a fourth groove 341 provided on a surface of the first substrate 131 connected to the first transducer assembly 122, and a first through hole 342 penetrating the first substrate 141 and communicating with the fourth groove, the fourth groove 341 being adapted to communicate with the speaker back chamber 32 and the external environment, the first through hole 342 communicating the fourth groove 341 with the sound pickup hole 20, so that the sound pickup hole 20 communicates with the external environment through the sound hole 34, and the microphone back chamber 12 communicates with the external environment.

Fig. 16 is a cross-sectional view of another microphone and speaker combination module according to an embodiment of the present application.

In some examples, as shown in fig. 16, the substrate assembly 130 may further include: and a third substrate 133. The first substrate 131 is connected to the second substrate 132 through the third substrate 133. The third substrate 133 is provided with a communicating structure 1331 for communicating the sound pickup hole 20 with the external space of the microphone and speaker combination module 100. Through the third substrate 133, it is helpful to reduce the difficulty of laying the sound pickup hole 20 on the substrate assembly 130, and the difficulty of processing the substrate assembly 130 can be reduced, so that the application range of the microphone and speaker combination module 100 can be improved.

The connection structure 1331 may be a notch penetrating through the third substrate 133, a groove disposed on a sidewall of the third substrate 133, a groove disposed on a surface of the third substrate 133 contacting the second substrate 132, and the like, and is not particularly limited herein. For example, in the embodiment of the present application, the connection structure 1331 is a notch penetrating through the third substrate 133.

Since the sound hole 34 can communicate with the sound pickup hole 20, so that the external environment communicates with the speaker rear cavity 32 and the microphone rear cavity 12, respectively, the communicating structure 1331 can also communicate with the sound hole 34, so that both the sound hole 34 and the sound pickup hole 20 communicate with the external environment through the communicating structure 1331.

The third substrate 133 may also adopt a third circuit board, so that the first circuit board and the second circuit board may be electrically connected, and further, the first circuit board and the second circuit board may be electrically connected with an external circuit through the pads 150 on the first circuit board.

While the above description illustrates the microphone cavity 10 and the speaker front cavity 31 and the speaker back cavity 32 being located on opposite sides of the substrate assembly 130 in a first direction, of course, the microphone cavity 10 and the speaker front cavity 31 and the speaker back cavity 32 may be located on the same side of the substrate assembly 130, such as the following.

Fig. 17 is a cross-sectional view of another microphone and speaker combination module provided in an embodiment of the present application.

As shown in fig. 17, in some possible implementations, the substrate assembly 130 may include a fourth substrate 134. Wherein the first casing 121, the second casing 111 and the second transducer assembly 112 are all mounted on the same surface of the fourth substrate 134, the first transducer assembly 122, the second casing 111 and the second transducer assembly 112 are all located in the first casing 121, and the second transducer assembly 112 is located in the second casing 111. The first transducer assembly 122 is mounted on the outer surface of the second housing 111 and cooperates with the outer surface of the second housing 111 to define the speaker back volume 32, and the first transducer assembly 122, the first housing 121, the outer surface of the second housing 111, and the fourth substrate 134 cooperate to define the speaker front volume 31. The inner surface of the second housing 111 and the fourth substrate 134 together define the microphone cavity 10, and the sound pickup hole 20 is disposed on the fourth substrate 134, ensuring that the microphone 110 can pick up external noise. The microphone 110 and the speaker 120 share the same substrate, so that the thickness of the microphone and speaker combination module 100 in the first direction can be reduced to reduce the size of the microphone and speaker combination module 100, and the difficulty in producing the microphone and speaker combination module 100 can be reduced to improve the production efficiency of the microphone and speaker combination module 100.

Since the microphone 110 and the speaker 120 share the fourth substrate 134 and can be stacked in the first direction, the thickness of the microphone and speaker combination module 100 in the first direction is reduced, so that the installation space required for the microphone and speaker combination module 100 can be reduced. In addition, since the microphone 110 and the speaker 120 are fabricated by using the same surface of the fourth substrate 134, and the first transducer assembly 122 is located on the outer surface of the second housing 111, the position of the fourth substrate 134 does not need to be moved or turned over during the process of fabricating the microphone and speaker combination module 100, which is helpful for reducing the fabrication steps of the microphone and speaker combination module 100, reducing the difficulty in producing the microphone and speaker combination module 100, and improving the production efficiency of the microphone and speaker combination module 100.

It is understood that the fourth substrate 134 may be a fourth circuit board, and the fourth circuit board may be electrically connected to the first transducer assembly 122 and the second transducer assembly 112 through the wires 140, so as to transmit electrical signals.

It will be appreciated that the second transducer assembly 112 and the fourth substrate 134 together define a rear microphone cavity 12, and the second housing 111, the second transducer assembly 112 and the fourth substrate 134 together define a front microphone cavity 11. In addition, one end of the sound pickup hole 20 communicates with the microphone front cavity 11 or the microphone rear cavity 12, and the other end of the sound pickup hole 20 communicates with the external space of the microphone and speaker combination module 100. When the sound pickup hole 20 is communicated with the microphone rear cavity 12, the sound pickup effect of the microphone 110 is improved.

In order to improve the anti-interference capability of the microphone 110, the second casing 111 may be an electromagnetic shielding casing made of an electromagnetic shielding material, for example, the second casing 111 is made of a metal material.

In order to improve the noise immunity of the microphone 110 and improve the connection effect of the first transducer assembly 122 and the second housing 111, the second housing 111 includes an electromagnetic shielding layer 1111 and a resin layer 1112 which are stacked in the first direction. The resin layer 1112 is adapted to be securely coupled to the second transducer assembly 112 and to define the speaker backing 32 in cooperation with the second transducer assembly 112.

Fig. 18 is a cross-sectional view of another microphone and speaker combination module according to an embodiment of the present application.

In order to further reduce the thickness of the microphone and speaker combination module 100 in the first direction, as shown in fig. 18, an accommodating groove 1341 for accommodating the second transducer assembly 112 may be provided on the surface of the fourth substrate 134, and in addition, the thickness of the second transducer assembly 112 in the first direction is less than or equal to the depth of the accommodating groove 1341 in the first direction.

It is understood that the second housing 111 can be partially located within the receiving slot 1341 or the second housing 111 is located above the receiving slot 1341. For example, the second housing 111 has a flat plate structure, and the second housing 111 is disposed to cover the receiving groove 1341.

It should be noted that, since the first transducer assembly 122 may employ a plurality of vibration elements 1221 with cantilever beam structures, the first transducer assembly 122 has a gap structure 1223, and the gap structure 1223 may enable the speaker back cavity 32 and the speaker front cavity 31 to communicate with each other, and may also enable the pressure between the speaker back cavity 32 and the speaker front cavity 31 to be balanced, so as to enable the pressure between the speaker back cavity 32 and the external space of the microphone and speaker combination module 100 to be balanced.

Fig. 19 is a schematic diagram of a first step of manufacturing the microphone and speaker combination module of the embodiment shown in fig. 17, fig. 20 is a schematic diagram of a second step of manufacturing the microphone and speaker combination module of the embodiment shown in fig. 17, fig. 21 is a schematic diagram of a third step of manufacturing the microphone and speaker combination module of the embodiment shown in fig. 17, and fig. 22 is a schematic diagram of a fourth step of manufacturing the microphone and speaker combination module of the embodiment shown in fig. 17.

The following describes a packaging process flow of the microphone and speaker combination module 100 formed by the microphone 110 and the speaker 120 sharing the fourth substrate 134:

s101, the microphone 110 is formed on the fourth substrate 134.

Specifically, referring to fig. 19 and 20, the second transducer assembly 112 and the ASIC chip may be mounted on the fourth substrate 134 by bonding, the second transducer assembly 112 may be bonded on the fourth substrate 134 first, the ASIC chip may be bonded on the fourth substrate 134 first, or the second transducer assembly 112 and the ASIC chip may be bonded on the fourth substrate 134 at the same time. After the second transducer assembly 112 and the ASIC chip are bonded, then after the second transducer assembly 112 is electrically connected to the ASIC chip and the fourth substrate 134 through the wires 140, the electromagnetic shielding layer 1111 of the second housing 111 is fixed on the fourth substrate 134 such that the second transducer assembly 112 and the ASIC chip are located in the electromagnetic shielding layer 1111, and finally the surface of the electromagnetic shielding layer 1111 away from the second transducer assembly 112 is covered with a high temperature resin to form a resin layer 1112.

S102, mounting the first transducer assembly 122 on the outer surface of the second housing 111 and electrically connecting the first transducer assembly 122 with the fourth substrate 134.

Specifically, referring to fig. 21, the first substrate 1222 of the first transducer assembly 122 is bonded to the surface of the resin layer 1112 of the second housing 111, and the electrode layer of the first transducer assembly 122 may be electrically connected to the fourth substrate 134 through the conductive wire 140.

S103, the first housing 121 is mounted on the fourth substrate 134 to form the speaker 120.

Specifically, referring to fig. 22, the first housing 121 may be adhesively attached to the fourth substrate 134.

In the description of the embodiments of the present application, it should be noted that unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, a fixed connection, an indirect connection via an intermediary, a connection between two elements, or an interaction between two elements. Specific meanings of the above terms in the embodiments of the present application can be understood by those of ordinary skill in the art according to specific situations.

Reference throughout this specification to apparatus or components, in embodiments or applications, means or components must be constructed and operated in a particular orientation and therefore should not be construed as limiting the present embodiments. In the description of the embodiments of the present application, "a plurality" means two or more unless specifically stated otherwise.

The terms "first," "second," "third," "fourth," and the like in the description and in the claims of the embodiments of the application and in the drawings described above, if any, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged under appropriate circumstances such that embodiments of the application described herein may be implemented, for example, in sequences other than those illustrated or described herein. Moreover, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.

The term "plurality" herein refers to two or more. The term "and/or" herein is merely an association relationship describing an associated object, and means that there may be three relationships, for example, a and/or B, which may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein generally indicates that the former and latter associated objects are in an "or" relationship; in the formula, the character "/" indicates that the preceding and following related objects are in a relationship of "division".

It is to be understood that the various numerical references referred to in the embodiments of the present application are merely for convenience of description and distinction and are not intended to limit the scope of the embodiments of the present application.

It should be understood that, in the embodiment of the present application, the sequence numbers of the above-mentioned processes do not mean the execution sequence, and the execution sequence of each process should be determined by its function and inherent logic, and should not constitute any limitation to the implementation process of the embodiment of the present application.

Claims

1. A microphone and speaker combination module, comprising at least: a microphone and a speaker;

the loudspeaker is a micro-electro-mechanical system loudspeaker, and the microphone is a micro-electro-mechanical system microphone;

the loudspeaker is provided with a loudspeaker front cavity, a loudspeaker rear cavity and a sound outlet hole;

the loudspeaker front cavity is communicated with the external space of the microphone and loudspeaker combined module through the sound outlet hole;

the microphone is provided with a microphone cavity and a sound pickup hole;

the microphone cavity is positioned below the loudspeaker rear cavity along a first direction, and the microphone cavity faces the cavity wall of the loudspeaker rear cavity along the first direction and is opposite to at least part of the loudspeaker rear cavity facing the cavity wall of the microphone cavity along the first direction;

the microphone cavity is communicated with the external space of the microphone and loudspeaker combined module through the sound pickup hole.

2. The microphone and speaker combination module of claim 1, wherein the microphone and speaker combination module comprises a substrate assembly, a first housing, a first transducing member, a second housing, and a second transducing member;

the first transducing assembly comprises a first microelectromechanical system transducer and the second transducing assembly comprises a second microelectromechanical system transducer;

the substrate assembly, the first housing, and the first transducer assembly collectively defining the speaker, the first housing and the first transducer assembly each mounted on a first surface of the substrate assembly, the first transducer assembly for converting electrical energy into acoustic energy, the first transducer assembly disposed within the first housing and collectively defining the speaker back cavity with the substrate assembly, the first housing, the first transducer assembly, and the substrate assembly collectively defining the speaker front cavity;

the substrate assembly, the second housing and the second transducer assembly together defining the microphone, the second housing and the second transducer assembly each being mounted on a second surface of the substrate assembly, the second housing and the substrate assembly together defining the microphone cavity, the second transducer assembly being located within the microphone cavity and being for converting acoustic energy into electrical energy;

wherein the first surface and the second surface are oppositely disposed along the first direction.

3. The microphone and speaker combination module of claim 2, wherein the microphone cavity comprises a microphone front cavity and a microphone back cavity;

the second transducer assembly and the substrate assembly together define the microphone back cavity;

the second housing, the second transducer assembly and the substrate assembly collectively define the microphone front cavity;

the sound pickup hole is provided on the substrate assembly or the second housing.

4. The microphone and speaker combination module of claim 3, wherein the substrate assembly comprises a first substrate, the first and second transducing assemblies being disposed on opposite sides of the first substrate along the first direction, respectively.

5. The microphone and speaker combination module of claim 3, wherein the substrate assembly comprises a first substrate and a second substrate arranged in a stack along the first direction; the first housing and the first transducer assembly are both disposed on a surface of the first substrate, and the second housing and the second transducer assembly are both disposed on a surface of the second substrate.

6. The microphone and speaker combination module of claim 5, wherein the sound pickup aperture comprises a first aperture segment and a second aperture segment in communication;

the first sound hole section penetrates through the second substrate and is communicated with the microphone rear cavity;

the second sound hole section is arranged between the first substrate and the second substrate and is used for being communicated with the external space of the microphone and loudspeaker combined module.

7. The microphone and speaker combination module of claim 6, wherein the substrate assembly further comprises: a third substrate; the first substrate is connected with the second substrate through the third substrate;

and a communication structure for communicating the sound pickup hole with the external space of the microphone and loudspeaker combined module is arranged on the third substrate.

8. A microphone and loudspeaker combination according to any one of claims 2 to 7 wherein the substrate assembly has an acoustic port provided therein through which the loudspeaker back volume communicates with the space outside the microphone and loudspeaker combination.

9. The microphone and speaker combination module of claim 8, wherein the sound pickup aperture is in communication with the sound pickup aperture when the sound pickup aperture is disposed on the substrate assembly such that the speaker back volume and the microphone volume are both in communication with the space outside of the microphone and speaker combination module.

10. The microphone and speaker combination module of claim 1, wherein the microphone and speaker combination module comprises a fourth substrate, a first housing, a first transducing member, a second housing, and a second transducing member;

the first transducing assembly comprises a first microelectromechanical systems transducer and the second transducing assembly comprises a second microelectromechanical systems transducer;

the fourth substrate, the first enclosure, and the first transducing member collectively defining the speaker, the fourth substrate, the second enclosure, and the second transducing member collectively defining the microphone;

the first shell, the second shell and the second transduction assembly are all installed on the same surface of the fourth substrate, the first transduction assembly, the second shell and the second transduction assembly are all located in the first shell, and the second transduction assembly is located in the second shell;

the first transducer assembly is mounted on the outer surface of the second housing and defines the speaker back cavity together with the outer surface of the second housing, and the first transducer assembly, the first housing, the outer surface of the second housing, and the fourth substrate define the speaker front cavity together;

the inner surface of the second housing and the fourth substrate together define the microphone cavity, and the sound pickup hole is disposed on the fourth substrate.

11. The microphone and speaker combination module of claim 10, wherein the microphone cavity comprises a microphone front cavity and a microphone back cavity;

the second transduction assembly and the fourth substrate together define the microphone back cavity, and the second transduction assembly, the fourth substrate and the second housing together define the microphone front cavity;

one end of the sound pickup hole is communicated with the front microphone cavity or the rear microphone cavity, and the other end of the sound pickup hole is communicated with the external space of the microphone and loudspeaker combined module.

12. A microphone and speaker combination module according to claim 10 or 11, wherein the second housing is an electromagnetically shielded housing; or,

the second housing includes an electromagnetic shielding layer and a resin layer stacked in the first direction; the resin layer is used for being fixedly connected with the second transduction component and defining a loudspeaker rear cavity together with the second transduction component.

13. A microphone and loudspeaker combination module according to claim 10 or 11, wherein the fourth substrate is provided with a receiving groove for receiving the second transducer assembly.

14. A microphone and loudspeaker combination module according to claim 2 or 10, wherein the sound outlet is provided in the first housing side wall or top wall.

15. An earphone, comprising a first housing, a second housing, and a microphone and speaker combination module according to any one of claims 1-14;

the first shell and the second shell are fixedly connected and jointly define an accommodating cavity, and a sound outlet communicated with the accommodating cavity is formed in the inner wall of the second shell;

the microphone and loudspeaker combined module is positioned in the accommodating cavity and is arranged close to the sound outlet, or the microphone and loudspeaker combined module is positioned in the sound outlet.

16. The headset of claim 15, further comprising: a speaker unit; the loudspeaker unit is located hold the intracavity and be located microphone and speaker combination module and first casing between.

17. The earphone of claim 16, wherein the speaker unit is a moving coil unit or a moving iron unit.

18. An electronic device comprising a body and a microphone and loudspeaker combination module according to any one of claims 1 to 14, the microphone and loudspeaker combination module being mounted on the body.