CN216450001U - High-efficient radiating mainboard structure of computer - Google Patents
High-efficient radiating mainboard structure of computer Download PDFInfo
- Publication number
- CN216450001U CN216450001U CN202123199853.7U CN202123199853U CN216450001U CN 216450001 U CN216450001 U CN 216450001U CN 202123199853 U CN202123199853 U CN 202123199853U CN 216450001 U CN216450001 U CN 216450001U
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- Prior art keywords
- heat dissipation
- main board
- board body
- mainboard
- front surface
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- Expired - Fee Related
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 42
- 238000012806 monitoring device Methods 0.000 claims description 2
- 230000005855 radiation Effects 0.000 claims description 2
- 239000000428 dust Substances 0.000 claims 1
- 238000001816 cooling Methods 0.000 abstract description 14
- 238000010438 heat treatment Methods 0.000 description 4
- 239000006185 dispersion Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
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Abstract
The utility model belongs to the technical field of computer accessories, and particularly relates to a mainboard structure for efficient heat dissipation of a computer, which comprises a mainboard body, wherein mounting screws are arranged at four corners of the mainboard body, an expansion slot is arranged on the front surface of the mainboard body, a temperature sensor is arranged on the front surface of the mainboard body, an alarm is arranged on the front surface of the mainboard body, and the temperature sensor is electrically connected with the alarm; the mounting frames are arranged on two sides of the bottom of the mainboard body, a fan seat is arranged on the top of the mounting frames, and a heat dissipation fan is arranged on the top of the fan seat; the cooling plate is arranged on the rear surface of the mainboard body, the cooling fins are arranged on the surface of the cooling plate, and the cooling holes are formed in the surfaces of the cooling fins.
Description
Technical Field
The utility model relates to the technical field of computer accessories, in particular to a mainboard structure for efficient heat dissipation of a computer.
Background
The mainboard, also called main board, system board and mother board, it is installed in the chassis, it is one of the most basic and most important parts of the microcomputer, the mainboard is generally a rectangular circuit board, the main circuit system composing the computer is installed on it, there are many components generally, another characteristic of the mainboard, use the open structure, there are 6-8 expansion slots on the mainboard mostly, for the adapter plug-in of the peripheral equipment of PC, through changing these plug-in cards, can carry on the local upgrade to the corresponding subsystem of the microcomputer, make producer and user have greater flexibility in the respect of configurating the model, in a word, the mainboard plays the role of playing the foot in the whole microcomputer system, can say that the type and grade of the mainboard determine the type and grade of the whole microcomputer system, the performance of the mainboard influences the performance of the whole microcomputer system.
The existing computer motherboard structure has some defects in the use process, such as poor heat dissipation performance, which affects the overall performance of the computer.
SUMMERY OF THE UTILITY MODEL
This section is for the purpose of summarizing some aspects of embodiments of the utility model and to briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this section as well as in the abstract of the specification and the title of the application to avoid obscuring the purpose of this section, the abstract of the specification and the title of the application, and such simplifications or omissions are not intended to limit the scope of the utility model.
The present invention has been made in view of the problems occurring in the conventional computer main board.
Therefore, the utility model aims to provide a mainboard structure for efficiently radiating a computer, which can realize good radiating performance in the using process and improve the overall performance of the computer.
To solve the above technical problem, according to an aspect of the present invention, the present invention provides the following technical solutions:
a high-efficient radiating mainboard structure of computer, it includes:
the temperature monitoring device comprises a main board body, wherein mounting screws are arranged at four corners of the main board body, an expansion slot is arranged on the front surface of the main board body, a temperature sensor is arranged on the front surface of the main board body, an alarm is arranged on the front surface of the main board body, and the temperature sensor is electrically connected with the alarm;
the mounting racks are arranged on two sides of the bottom of the main board body, a fan seat is arranged at the top of the mounting racks, and a heat dissipation fan is arranged at the top of the fan seat;
the cooling plate is arranged on the rear surface of the main board body, cooling fins are arranged on the surface of the cooling plate, and cooling holes are formed in the surface of the cooling fins.
As a preferred scheme of the motherboard structure for efficiently dissipating heat of a computer in the present invention, wherein: the rear surface of mainboard body is provided with the recess with heating panel matched with.
As a preferred scheme of the motherboard structure for efficiently dissipating heat of a computer in the present invention, wherein: and screw holes matched with the mounting screws are formed in four corners of the main board body.
As a preferred scheme of the motherboard structure for efficiently dissipating heat of a computer in the present invention, wherein: and a dustproof net is arranged at the top of the heat radiation fan.
As a preferred scheme of the motherboard structure for efficiently dissipating heat of a computer in the present invention, wherein: the expansion slot comprises a processor slot, a memory slot, a display card slot, a network card slot, a field programmable gate array and a power distribution interface.
As a preferred scheme of the motherboard structure for efficiently dissipating heat of a computer in the present invention, wherein: the temperature sensor is a readable temperature detector.
Compared with the prior art, the utility model has the beneficial effects that: through being provided with radiator fan in the bottom both sides of mainboard body, dispel the heat to the mainboard body through radiator fan, improved heat dispersion, secondly, through being provided with the heating panel at the rear surface of mainboard body, the heating panel embedding mainboard body has improved heat dispersion, is provided with radiating fin and louvre on the surface of heating panel, further improvement heat dispersion.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the present invention will be described in detail with reference to the accompanying drawings and detailed embodiments, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without inventive exercise. Wherein:
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic view of the back surface structure of the present invention;
FIG. 3 is a schematic structural diagram of a main board body according to the present invention.
In the figure; 100 mainboard bodies, 110 mounting screws, 120 expansion slots, 130 temperature sensors, 140 alarms, 150 grooves, 200 mounting racks, 210 fan seats, 220 cooling fans, 300 cooling plates, 310 cooling fins and 320 cooling holes.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, but the present invention may be practiced in other ways than those specifically described herein, and it will be apparent to those of ordinary skill in the art that the present invention may be practiced without departing from the spirit and scope of the present invention, and therefore the present invention is not limited to the specific embodiments disclosed below.
Next, the present invention will be described in detail with reference to the drawings, wherein for convenience of illustration, the cross-sectional view of the device structure is not enlarged partially according to the general scale, and the drawings are only examples, which should not limit the scope of the present invention. In addition, the three-dimensional dimensions of length, width and depth should be included in the actual fabrication.
In order to make the objects, technical solutions and advantages of the present invention more apparent, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
The utility model provides the following technical scheme: a mainboard structure for efficient heat dissipation of a computer, which has good heat dissipation performance and improves the overall performance of the computer during use, please refer to fig. 1 to 3, and comprises a mainboard body 100, a mounting bracket 200 and a heat dissipation plate 300;
referring to fig. 1 to 3 again, mounting screws 110 are disposed at four corners of the main board body 100, an expansion slot 120 is disposed on the front surface of the main board body 100, a temperature sensor 130 is disposed on the front surface of the main board body 100, an alarm 140 is disposed on the front surface of the main board body 100, and the temperature sensor 130 is electrically connected to the alarm 140, specifically, the mounting screws 110 are screwed to the four corners of the main board body 100, the expansion slot 120 is screwed to the front surface of the main board body 100, the temperature sensor 130 is screwed to the front surface of the main board body 100, the alarm 140 is screwed to the front surface of the main board body 100, and the temperature sensor 130 is electrically connected to the alarm 140;
referring to fig. 1 to 3 again, the mounting bracket 200 is disposed at two sides of the bottom of the main board body 100, the fan base 210 is disposed at the top of the mounting bracket 200, and the heat dissipation fan is disposed at the top of the fan base 210, specifically, the mounting bracket 200 is welded at two sides of the bottom of the main board body 100, the fan base 210 is screwed at the top of the mounting bracket 200, and the heat dissipation fan is screwed at the top of the fan base 210;
referring to fig. 1 to 3 again, the heat dissipation plate 300 is disposed on the rear surface of the main board body 100, the surface of the heat dissipation plate 300 is provided with heat dissipation fins 310, the surface of the heat dissipation fins 310 is provided with heat dissipation holes 320, specifically, the heat dissipation plate 300 is adhered to the rear surface of the main board body 100, the surface of the heat dissipation plate 300 is adhered with the heat dissipation fins 310, and the surface of the heat dissipation fins 310 is provided with the heat dissipation holes 320.
The working principle is as follows: in the using process of the utility model, the heat dissipation performance is improved by arranging the heat dissipation fans 220 at the two sides of the bottom of the mainboard body 100 and dissipating the heat of the mainboard body 100 through the heat dissipation fans 220, and secondly, the heat dissipation performance is improved by arranging the heat dissipation plate 300 on the rear surface of the mainboard body 100 and embedding the heat dissipation plate 300 into the mainboard body 100, and the heat dissipation performance is further improved by arranging the heat dissipation fins 310 and the heat dissipation holes 320 on the surface of the heat dissipation plate 300.
While the utility model has been described above with reference to an embodiment, various modifications may be made and equivalents may be substituted for elements thereof without departing from the scope of the utility model. In particular, the various features of the disclosed embodiments of the utility model may be used in any combination, provided that no structural conflict exists, and the combinations are not exhaustively described in this specification merely for the sake of brevity and resource conservation. Therefore, it is intended that the utility model not be limited to the particular embodiments disclosed, but that the utility model will include all embodiments falling within the scope of the appended claims.
Claims (6)
1. The utility model provides a high-efficient radiating mainboard structure of computer which characterized in that includes:
the temperature monitoring device comprises a main board body (100), wherein mounting screws (110) are arranged at four corners of the main board body (100), an expansion slot (120) is arranged on the front surface of the main board body (100), a temperature sensor (130) is arranged on the front surface of the main board body (100), an alarm (140) is arranged on the front surface of the main board body (100), and the temperature sensor (130) is electrically connected with the alarm (140);
the mounting rack (200) is arranged on two sides of the bottom of the main board body (100), a fan seat (210) is arranged on the top of the mounting rack (200), and a heat dissipation fan is arranged on the top of the fan seat (210);
the heat dissipation plate (300) is arranged on the rear surface of the main plate body (100), the surface of the heat dissipation plate (300) is provided with heat dissipation fins (310), and the surface of the heat dissipation fins (310) is provided with heat dissipation holes (320).
2. The motherboard structure for efficient heat dissipation of computers as recited in claim 1, further comprising: the rear surface of the main board body (100) is provided with a groove (150) matched with the heat dissipation plate (300).
3. The motherboard structure for efficient heat dissipation of computers as recited in claim 1, further comprising: screw holes matched with the mounting screws (110) are formed in four corners of the main board body (100).
4. The motherboard structure for efficient heat dissipation of computers as recited in claim 1, further comprising: the top of the heat radiation fan (220) is provided with a dust screen.
5. The motherboard structure for efficient heat dissipation of computers as recited in claim 1, further comprising: the expansion slot (120) comprises a processor slot, a memory slot, a display card slot, a network card slot, a field programmable gate array and a power distribution interface.
6. The motherboard structure for efficient heat dissipation of computers as recited in claim 1, further comprising: the temperature sensor (130) is a readable temperature detector.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123199853.7U CN216450001U (en) | 2021-12-20 | 2021-12-20 | High-efficient radiating mainboard structure of computer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123199853.7U CN216450001U (en) | 2021-12-20 | 2021-12-20 | High-efficient radiating mainboard structure of computer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216450001U true CN216450001U (en) | 2022-05-06 |
Family
ID=81375603
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123199853.7U Expired - Fee Related CN216450001U (en) | 2021-12-20 | 2021-12-20 | High-efficient radiating mainboard structure of computer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216450001U (en) |
-
2021
- 2021-12-20 CN CN202123199853.7U patent/CN216450001U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20220506 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |