CN216122994U - Circuit board and motor controller - Google Patents
Circuit board and motor controller Download PDFInfo
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- CN216122994U CN216122994U CN202122505629.XU CN202122505629U CN216122994U CN 216122994 U CN216122994 U CN 216122994U CN 202122505629 U CN202122505629 U CN 202122505629U CN 216122994 U CN216122994 U CN 216122994U
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- metal layer
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- hole wall
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Abstract
The utility model discloses a circuit board and a motor controller, wherein the circuit board comprises a substrate, a through hole is formed in the substrate, a concave surface is arranged on the wall of the through hole, a first metal layer is preset on the wall of the through hole, and the concave surface is covered by the first metal layer; the metal plate also comprises a second metal layer, and the second metal layer is electroplated on the surface of the first metal layer. According to the technical scheme, the concave surface is arranged on the hole wall of the through hole arranged on the circuit board substrate, the first metal layer and the second metal layer are plated on the hole wall, the first metal layer with the curved surface is formed, the adhesive force between the first metal layer and the hole wall can be improved through the curved surface shape, the pulling force generated by thermal expansion difference is reduced, and the phenomenon that the first metal layer is separated from the hole wall of the substrate when the circuit board is subjected to thermal impact is effectively avoided.
Description
Technical Field
The utility model relates to the technical field of PCB manufacturing, in particular to a circuit board and a motor controller.
Background
Pcb (printed Circuit board), which is called printed Circuit board for short, is one of the important parts in the electronics industry, and is a support for electronic components and a carrier for electrical connection.
Vias are part of the design of Printed Circuit Boards (PCBs) and function to connect, secure and position components electrically. A metallized hole consists of three parts: hole, pad area around the hole, POWER layer isolation area. Manufacturing a metallized hole: and plating a layer of metal on the cylindrical surface of the wall of the through hole for communicating the copper foils of the middle layers.
As a special through hole, namely a metalized groove hole, the cross section of the metalized groove hole is rectangular, so that the hole wall of the through hole is a plane, the PCB needs to be subjected to thermal shock in the tinning process of the metalized groove hole, a copper layer and a base material are heated to expand, the copper layer plated on the base material and the hole wall generates a pulling force due to the difference of thermal expansion coefficients, the self supporting force of the copper on the hole wall cannot support the pulling force resisting the thermal expansion difference, the phenomenon that the copper layer is separated from the hole wall is easily caused, and further the PCB is scrapped in batches.
SUMMERY OF THE UTILITY MODEL
The utility model mainly aims to provide a circuit board, aiming at improving the phenomenon of hole wall separation of a metallized groove hole.
In order to achieve the above object, the circuit board provided by the present invention includes a substrate, a through hole is formed on the substrate, a concave surface is formed on a wall of the through hole, a first metal layer is preset on the wall of the through hole, and the first metal layer covers the concave surface; the metal plate further comprises a second metal layer, and the second metal layer is electroplated on the surface of the first metal layer.
Optionally, the concavities are evenly distributed on the bore wall.
Optionally, the concavities are uniformly distributed along the circumferential or axial direction of the bore wall.
Optionally, the concavities are symmetrically distributed along a circumferential or axial direction of the bore wall.
Optionally, adjacent concave end portions are sequentially connected along the cross section of the through hole.
Optionally, the concave surface is a curved surface structure.
Optionally, the height of the concave surface is consistent with the height of the through hole.
Optionally, the first metal layer is made of copper.
Optionally, the second metal layer is made of tin.
The utility model further provides a motor controller which comprises the circuit board.
According to the technical scheme, the concave surface is arranged on the hole wall of the through hole arranged on the circuit board substrate, the first metal layer and the second metal layer are plated on the hole wall to form the first metal layer with the concave surface, the contact area between the first metal layer and the hole wall is increased through the concave surface, supporting forces in different directions are formed when the first metal layer is heated, the adhesive force between the first metal layer and the hole wall is improved, the pulling force generated by thermal expansion difference is reduced, and the phenomenon that the first metal layer is separated from the hole wall of the substrate when the circuit board is heated and impacted is effectively avoided.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a schematic top view of a wave-shaped design of a through hole wall of a circuit board according to the present invention;
FIG. 2 is a schematic diagram of a circuit board via cross-sectional structure according to the present invention.
The reference numbers illustrate:
| reference numerals | Name (R) | Reference numerals | Name (R) |
| 1 | |
10 | Through |
| 11 | |
11a | |
| 30 | |
40 | Tin layer |
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that, if directional indications (such as up, down, left, right, front, and back … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative positional relationship between the components, the movement situation, and the like in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indications are changed accordingly.
In addition, if there is a description of "first", "second", etc. in an embodiment of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
The utility model provides a circuit board 11, wherein a circuit board 1 comprises a substrate, and a through hole 10 is formed in the substrate.
In the embodiment of the present invention, as shown in fig. 1, a concave surface 11a is disposed on a hole wall 11 of a through hole 10, a first metal layer is preset on the hole wall 11 of the through hole 10, and the concave surface 11a is covered by the first metal layer; the metal plate also comprises a second metal layer, and the second metal layer is electroplated on the surface of the first metal layer.
The hole wall 11 of the through hole 10 is provided with a concave surface, so that the hole wall 11 and the concave surface are connected to form a curved surface, and the hole wall 11 with the curved surface enables the shape of the first metal layer plated on the hole wall 11 to be the same as that of the hole wall 11, so as to form the first metal layer with the curved surface. The curved surface hole wall is arranged, the first metal layer plated on the hole wall and the hole wall have stronger adhesive force through the curved surface shape, so that the pulling force caused by the thermal expansion difference is reduced, the problems of stress residue and uneven stress distribution in the manufacturing process of the circuit board are solved, and the phenomenon that the first metal layer is separated from the hole wall due to PCB thermal shock is effectively avoided.
According to the technical scheme, the concave surface 11a is arranged on the hole wall 11 of the through hole 10 arranged on the substrate of the circuit board 1, the first metal layer and the second metal layer are plated on the hole wall 11 to form the first metal layer with a curved surface, the contact area of the first metal layer and the hole wall is increased through the curved surface shape, the first metal layer has strong adhesive force, the pulling force caused by thermal expansion difference is reduced, and the phenomenon that the first metal layer is separated from the hole wall of the substrate when the circuit board 1 is impacted by heat is effectively avoided.
In an embodiment of the present invention, the concaves 11a are uniformly distributed on the hole wall 11.
The hole wall 11 of the through hole 10 is provided with a plurality of concave surfaces 11a, and the plurality of concave surfaces 11a are arranged continuously and at the same interval. So set up, guaranteed that the effect that produces between two adjacent concave surfaces 11a is the same, further guaranteed that the holding power that each department on the first metal level of establishing of plating on pore wall 11 received is the same, can not take place the phenomenon of separating with pore wall 11 when effectively avoiding every department on the first metal level to receive thermal shock.
In an embodiment of the present invention, the concave surfaces 11a are uniformly distributed along the circumferential or axial direction of the hole wall 11.
The hole wall 11 may be concave surfaces 11a uniformly arranged in the axial direction, may also be concave surfaces 11a uniformly arranged in the circumferential direction, and may also be concave surfaces 11a uniformly arranged in the oblique direction. In an embodiment of the present application, the concave surfaces 11a are uniformly arranged on the hole wall 11 along the circumferential direction, so that the processing difficulty of the through hole 10 on the circuit board 1 can be reduced, the plating of the first metal layer is facilitated, the plating difficulty is reduced, and the fitting degree of the plated first metal layer and the hole wall 11 is ensured. When the hole wall 11 is a curved surface arranged along the axial direction, different heights in the hole wall 11 can be ensured to keep the same radian, so that the first metal layers at different heights have the same stress resistance, the phenomenon that the first metal layers are separated from the hole wall 11 is better avoided, and the effect of the through hole 10 is ensured.
Furthermore, the concave surface 11a can be obliquely arranged, the concave surface 11a is obliquely arranged at the opening of the through hole 10, the obliquely arranged concave surface 11a can better open the hole, because the through hole 10 is opened, the drill bit is required to rotate to drill into the substrate, the oblique concave surface 11a is similar to the rotating direction, the difficulty of opening the hole is reduced, and the obliquely arranged concave surface 11a can reduce the number of the concave surfaces 11a and increase the length of the concave surfaces 11 a. The first metal layer is more convenient to be arranged for subsequent plating, and the first metal layer has better protection effect.
In an embodiment of the present invention, the concave surfaces 11a are symmetrically distributed along the circumferential or axial direction of the hole wall 11.
The concave surfaces 11a are symmetrically distributed, the concave surfaces 11a are arranged on the hole walls 11 on two opposite sides of the through hole 10, and the concave surfaces 11a arranged on the hole walls on two opposite sides are the same in number and opposite in position. So set up, make things convenient for the design of concave surface 11a on the pore wall 11 and bore the seting up of concave surface when establishing through-hole 10 on the one hand, only need design adjacent both sides face through the duplication can obtain the design of four complete pore wall 11 concave surfaces 11a, the concave surface 11a that sets up of other side symmetry can ensure that the holding power that the first metal level of relative two sides received is the same, avoids first metal level and pore wall 11 to appear the phenomenon of separation better, has guaranteed the effect of through-hole 10.
In an embodiment of the utility model, along the cross section of the through hole, the adjacent concave end portions are connected in sequence.
The hole wall 11 is provided with concave surfaces 11a, and the adjacent concave surfaces 11a are connected in sequence. So set up, have the characteristics that the trompil degree of difficulty is low, the processing cost is low, guaranteed simultaneously that the shape that forms between concave surface 11a and pore wall 11 is the curved surface.
In an embodiment of the present invention, the concave surface 11a is a curved surface structure.
The hole wall 11 that the curved surface structure set up can be the wavy of concave surface 11a and hole wall 11 cooperation formation, and each concave surface 11a extends the setting along the axial of through-hole 10, and a plurality of concave surfaces 11a set up at the interval on the circumferential direction of through-hole 10, and the cell wall of concave surface 11a is wavy with the hole wall cooperation of through-hole 10.
The wave-shaped structure can also be formed by arranging the bulges and the concave surfaces 11a at intervals, and the wave-shaped structure can be formed by arranging the bulges and the concave surfaces 11a at intervals, so that the radian of a curved surface can be increased, the pulling force generated by thermal expansion resistance of the plated first metal layer is furthest realized, and the phenomenon of separation between the first metal layer and the hole wall 11 is avoided.
Further, the wavy hole wall 11 can also be set to be a wave formed by matching a protrusion with the hole wall 11, and the combination of the surface of the protrusion and the wall surface of the hole wall 11 can form a wave, so that the effect of setting the hole wall 11 to be a wave can be achieved.
In an embodiment of the present invention, the height of the concave surface 11a is identical to the height of the through hole 10.
The height of the concave surface is consistent with that of the through hole, the concave surface is favorably covered on the hole wall of the through hole, the concave surface structure is ensured to be arranged on the hole wall when the first metal layer is plated, the concave surface structure is ensured to be arranged on each part of the first metal layer, the self supporting force of the first metal layer is improved, the dragging force generated by the difference of thermal expansion is reduced, and the phenomenon that the first metal layer is separated from the hole wall of the substrate when the circuit board 1 is impacted by heat is effectively avoided.
In an embodiment of the utility model, the first metal layer is made of copper.
A layer of metal is plated on the cylindrical surface of the hole wall 11 of the through hole 10 by a chemical deposition method to be used for communicating copper foils in the middle layers, the upper surface and the lower surface of the through hole 10 are made into a circular pad 20 shape, and the circular pad 20 can be used for connecting components and also plays a role in electrically connecting, fixing or positioning the components.
The metal or alloy is deposited on the surface of the workpiece by an electrolysis method to form a uniform, compact and good-bonding-force metal layer. The electroplated copper layer has the advantages of good electrical conductivity, thermal conductivity, mechanical ductility and the like. Copper layers 30 are plated on both the upper and lower surfaces of the circuit board 1 so that the top and bottom layers of the printed circuit board are connected to each other. The layers of printed conductors are chemically and galvanically applied in the holes to make the insulated walls 11 of the holes reliably connected to each other by applying a layer of conductive metal to them.
In an embodiment of the utility model, the second metal layer is made of tin.
Tin has the advantages of easy soldering, low cost and good conductivity, and is widely applied to electric appliances and electronic parts needing soldering. On a PCB, copper is used to interconnect components on the substrate, and although it is a good conductor material to form a pattern of PCB conductive paths, it is also prone to tarnish due to oxidation and solderability loss due to corrosion if exposed to air for extended periods of time. Therefore, a surface treatment technique such as a tin-spraying process is required to protect the copper layer 30 and prevent the copper layer 30 from being oxidized when exposed to air.
The present invention further provides a motor controller, which includes a circuit board, and the specific structure of the circuit board refers to the above embodiments, and since the motor controller adopts all the technical solutions of all the above embodiments, the motor controller at least has all the beneficial effects brought by the technical solutions of the above embodiments, and details are not repeated herein.
The above description is only a preferred embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. A circuit board comprises a substrate, wherein a through hole is formed in the substrate, and the circuit board is characterized in that a concave surface is formed in the wall of the through hole, a first metal layer is preset on the wall of the through hole, and the first metal layer covers the concave surface; the metal plate further comprises a second metal layer, and the second metal layer is electroplated on the surface of the first metal layer.
2. The circuit board of claim 1, wherein the recessed surfaces are evenly distributed on the hole wall.
3. The circuit board of claim 2, wherein the recessed surfaces are evenly distributed along a circumferential or axial direction of the aperture wall.
4. The circuit board of claim 2, wherein the recessed surfaces are symmetrically distributed along a circumferential or axial direction of the hole wall.
5. The circuit board of claim 3 or 4, wherein adjacent concave end portions meet one another in sequence along a cross section of the through-hole.
6. The circuit board of claim 3 or 4, wherein the concave surface is a curved surface structure.
7. The circuit board of claim 1, wherein the height of the recessed surface coincides with the height of the via.
8. The circuit board of claim 1, wherein the first metal layer is a copper material.
9. The circuit board of claim 8, wherein the second metal layer is tin.
10. A motor controller comprising the circuit board of any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122505629.XU CN216122994U (en) | 2021-10-18 | 2021-10-18 | Circuit board and motor controller |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122505629.XU CN216122994U (en) | 2021-10-18 | 2021-10-18 | Circuit board and motor controller |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216122994U true CN216122994U (en) | 2022-03-22 |
Family
ID=80693531
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122505629.XU Active CN216122994U (en) | 2021-10-18 | 2021-10-18 | Circuit board and motor controller |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216122994U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023045640A1 (en) * | 2021-09-27 | 2023-03-30 | 荣耀终端有限公司 | Flexible printed circuit, circuit board assembly and electronic device |
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2021
- 2021-10-18 CN CN202122505629.XU patent/CN216122994U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023045640A1 (en) * | 2021-09-27 | 2023-03-30 | 荣耀终端有限公司 | Flexible printed circuit, circuit board assembly and electronic device |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 215000 52 tianedang Road, Yuexi, Wuzhong District, Suzhou City, Jiangsu Province Patentee after: Suzhou Huichuan United Power System Co.,Ltd. Address before: 215104 No. 52, tiandang Road, Yuexi, Wuzhong District, Suzhou City, Jiangsu Province Patentee before: SUZHOU HUICHUAN UNITED POWER SYSTEM Co.,Ltd. |