CN215789171U - Grinding fluid supply and conveying device of semiconductor grinding equipment - Google Patents
Grinding fluid supply and conveying device of semiconductor grinding equipment Download PDFInfo
- Publication number
- CN215789171U CN215789171U CN202121604760.5U CN202121604760U CN215789171U CN 215789171 U CN215789171 U CN 215789171U CN 202121604760 U CN202121604760 U CN 202121604760U CN 215789171 U CN215789171 U CN 215789171U
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- grinding
- vertical
- vertical shaft
- lifting seat
- bevel gear
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- 239000012530 fluid Substances 0.000 title claims abstract description 61
- 239000004065 semiconductor Substances 0.000 title claims abstract description 17
- 239000007788 liquid Substances 0.000 claims description 31
- 238000005498 polishing Methods 0.000 claims description 14
- 241000220317 Rosa Species 0.000 claims description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- 238000007789 sealing Methods 0.000 claims description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000004064 recycling Methods 0.000 description 2
- 230000003245 working effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000007730 finishing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
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Abstract
The utility model discloses a grinding fluid supply and conveying device of semiconductor grinding equipment, which comprises a vertical frame, wherein a fluid supply tank is installed in the vertical frame, the right side of the top of a workbench is connected with a hydraulic rod, the movable end of the top of the hydraulic rod is connected with a lifting seat, the right side of the top of the lifting seat is connected with a driving motor, the left power output end of the driving motor is connected with a bevel gear, the middle part of the lifting seat is rotatably connected with a vertical shaft, the upper part of the outer wall of the vertical shaft is connected with a bevel gear ring, a round through hole is formed in the axis of the vertical shaft, the lower end of the vertical shaft is connected with a fluid supply seat, the left side of the top of the lifting seat is connected with a fixed frame, the upper end of the fixed frame is connected with an L-shaped pipe, the transverse part of the L-shaped pipe is connected with a conveying hose, one end of the conveying hose extending into the fluid supply tank is connected with a fluid pump, and the vertical part of the L-shaped pipe is rotatably connected with the upper end of the vertical shaft; the grinding machine has reasonable structural design, is convenient for grinding operation, can effectively cool and lubricate the workpiece, and is more energy-saving and environment-friendly.
Description
Technical Field
The utility model relates to the technical field of grinding equipment, in particular to a grinding fluid supply and conveying device of semiconductor grinding equipment.
Background
Lapping is a finishing process of a work surface by relative movement of a grinder and a work under a certain pressure using abrasive particles coated or pressed on the grinder. The grinding can be used for processing various metal and non-metal materials, and the processed surface has the shapes of planes, inner and outer cylindrical surfaces, conical surfaces, convex and concave spherical surfaces, threads, tooth surfaces and other molded surfaces.
In order to guarantee the working effect of semiconductor grinding equipment, grinding fluid needs to be injected during grinding operation, most of the existing grinding fluid supply equipment has fixed conveying direction, grinding dispersion is uneven during use, the grinding blocks cannot be cooled sufficiently, and the working effect is affected.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a grinding fluid supply and conveying device of semiconductor grinding equipment, which is used for overcoming the technical problems in the prior art.
In order to achieve the technical purpose and achieve the technical effect, the utility model provides the following technical scheme:
a grinding fluid supply and conveying device of semiconductor grinding equipment comprises a vertical frame, wherein a fluid supply tank is installed in the vertical frame, the top of the vertical frame is connected with a workbench, the right side of the top of the workbench is connected with a hydraulic rod, the movable end of the top of the hydraulic rod is connected with a lifting seat, the right side of the top of the lifting seat is connected with a driving motor, the left power output end of the driving motor is connected with a bevel gear, the middle part of the lifting seat is rotatably connected with a vertical shaft, the upper part of the outer wall of the vertical shaft is connected with a bevel gear ring, the bevel gear ring is meshed with the bevel gear, a round through hole is formed in the axis of the vertical shaft, the lower end of the vertical shaft is connected with a fluid supply seat, the left side of the top of the lifting seat is connected with a fixed frame, the upper end of the fixed frame is connected with an L-shaped tube, the transverse part of the L-shaped tube is connected with a conveying hose, one end of the conveying hose extending into the fluid supply tank is connected with a fluid extraction pump, the vertical part of the L-shaped pipe is rotatably connected with the upper end of the vertical shaft.
Preferably, in the grinding fluid supply and conveying device of the semiconductor grinding equipment, the top of the workbench is connected with a fluid bath, a grinding table is arranged in the fluid bath, the bottom of the fluid supply seat is connected with a grinding block, a fluid guide cavity is formed in the fluid supply seat, a plurality of fluid outlet holes are formed in the bottom of the fluid guide cavity, the fluid outlet holes are uniformly distributed around the grinding block, and the grinding table is located under the grinding block.
Preferably, in the grinding fluid supply and conveying device of the semiconductor grinding equipment, a filter box is installed in the vertical frame, a filter element is connected to the middle of an inner cavity of the filter box, a fluid collecting pipe is communicated between the top of the filter box and the bottom of the fluid tank, and a return pipe is communicated between the bottom of the outer wall of the filter box and the fluid supply tank.
Preferably, in the polishing liquid supply and delivery device of the semiconductor polishing apparatus, a seal bearing is installed between the vertical end of the L-shaped pipe and the circular through hole.
Preferably, in the polishing solution supply and delivery device of the semiconductor polishing apparatus, a PLC controller is connected to an outer wall of the table, and the PLC controller is electrically connected to the hydraulic rod, the driving motor, and the liquid pump.
The utility model has the beneficial effects that:
the grinding fluid storage device is reasonable in structural design, grinding fluid is stored in the fluid supply tank, the lifting seat is driven to descend through the hydraulic rod, the bevel gear is driven to rotate through the driving motor, the bevel gear is meshed with the transmission bevel gear ring, the vertical shaft drives the fluid supply seat to rotate, the grinding block synchronously rotates along with the fluid supply seat, grinding operation is convenient to carry out, the grinding fluid is extracted through the fluid pump, the grinding fluid can enter the flow guide cavity along the circular through hole and is conveyed to the side edge of the grinding block through the fluid outlet hole, a workpiece can be effectively cooled and lubricated, the grinding fluid deposited in the fluid tank can enter the filter box along the fluid collecting pipe, filtering treatment is carried out through the filter element, and the filtered grinding fluid is gathered into the fluid supply tank along the return pipe for recycling, so that the grinding fluid storage device is more energy-saving and environment-friendly.
Drawings
In order to more clearly illustrate the technical solution of the present invention, the drawings used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained based on these drawings without inventive labor.
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic view of the internal structure of the present invention;
fig. 3 is a partially enlarged schematic view of a portion a in fig. 2.
In the figure: 1. erecting a frame; 2. a liquid supply tank; 3. a work table; 4. a hydraulic lever; 5. a lifting seat; 6. a drive motor; 7. a bevel gear; 8. a vertical axis; 9. a bevel gear ring; 10. a circular through hole; 11. a liquid feeding seat; 12. a fixed mount; 13. an L-shaped pipe; 14. a delivery hose; 15. a liquid pump; 16. a liquid bath; 17. a grinding table; 18. grinding blocks; 19. a flow guide cavity; 20. a liquid outlet hole; 21. a filter box; 22. a filter element; 23. a liquid collecting pipe; 24. a return pipe; 25. a PLC controller.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-3, the present embodiment is a polishing liquid supply and delivery device for a semiconductor polishing apparatus, comprising a vertical frame 1, a liquid supply tank 2 installed in the vertical frame 1, a worktable 3 connected to the top of the vertical frame 1, a hydraulic rod 4 connected to the right side of the top of the worktable 3, a lifting seat 5 connected to the movable end of the top of the hydraulic rod 4, a driving motor 6 connected to the right side of the top of the lifting seat 5, a bevel gear 7 connected to the left power output end of the driving motor 6, a vertical shaft 8 rotatably connected to the middle of the lifting seat 5, a bevel gear ring 9 connected to the upper portion of the outer wall of the vertical shaft 8, the bevel gear ring 9 engaged with the bevel gear 7, a circular through hole 10 formed in the axis of the vertical shaft 8, a liquid supply seat 11 connected to the lower end of the vertical shaft 8, a fixed frame 12 connected to the left side of the top of the lifting seat 5, an L-shaped pipe 13 connected to the upper end of the fixed frame 12, a delivery hose 14 connected to the horizontal portion of the L-shaped pipe 13, one end of the conveying hose 14 extending into the liquid supply tank 2 is connected with a liquid pump 15, and the vertical part of the L-shaped pipe 13 is rotatably connected with the upper end of the vertical shaft 8.
The top of workstation 3 is connected with cistern 16, is equipped with grinding table 17 in the cistern 16, gives the bottom of liquid seat 11 and is connected with grinding block 18, has seted up water conservancy diversion chamber 19 in the liquid seat 11, and a plurality of liquid holes 20 have been seted up to the bottom in water conservancy diversion chamber 19, and liquid holes 20 equipartition is around grinding block 18, and grinding table 17 is located under grinding block 18.
Install rose box 21 in the grudging post 1, the inner chamber middle part of rose box 21 is connected with filter core 22, and the intercommunication has the collector tube 23 between rose box 21 top and the cistern 16 bottom, and the intercommunication has back flow 24 between rose box 21 outer wall bottom and the confession fluid reservoir 2, is convenient for retrieve the filter to the lapping liquid.
A sealing bearing is arranged between the vertical end of the L-shaped pipe 13 and the circular through hole 10, the sealing performance is good, and the grinding fluid is prevented from overflowing.
The outer wall of workstation 3 is connected with PLC controller 25, and PLC controller electric connection hydraulic stem 4, driving motor 6 and drawing liquid pump 15, the control assembly operation of being convenient for.
The specific implementation mode of the utility model is as follows:
when the device is used, an external power supply is used, the workbench 3 is supported by the vertical frame 1, grinding fluid is stored by the fluid supply tank 2, a workpiece is placed on the grinding table 17 of the fluid bath 16, the lifting seat 5 is driven to descend by the hydraulic rod 4, the grinding block 18 is close to the grinding table 17, the bevel gear 7 is driven to rotate by the driving motor 6, the bevel gear 7 is meshed with the transmission bevel gear ring 9, so that the vertical shaft 8 drives the fluid supply seat 11 to rotate, the grinding block 18 synchronously rotates along with the fluid supply seat 11, so that grinding operation is carried out, the grinding fluid is extracted by the fluid pump 15 in the grinding process, the grinding fluid enters the L-shaped pipe 13 along the conveying hose 14, then enters the flow guide cavity 19 from the circular through hole 10 and is conveyed to the side edge of the grinding block 18 through the fluid outlet hole 20, so as to cool and lubricate the workpiece, the grinding fluid deposited in the fluid bath 16 can enter the filter box 21 along the fluid collecting pipe 23, and is filtered by the filter element 22, the filtered grinding fluid flows into the fluid supply tank 2 along the return pipe 24 for recycling, so that the energy is saved and the environment is protected.
In the description herein, references to the description of "one embodiment," "an example," "a specific example" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the utility model. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The preferred embodiments of the utility model disclosed above are intended to be illustrative only. The preferred embodiments are not intended to be exhaustive or to limit the utility model to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the utility model and the practical application, to thereby enable others skilled in the art to best utilize the utility model. The utility model is limited only by the claims and their full scope and equivalents.
Claims (5)
1. A grinding fluid supply and delivery device of semiconductor grinding equipment comprises a vertical frame (1), and is characterized in that: the liquid supply tank (2) is installed in the vertical frame (1), the top of the vertical frame (1) is connected with a workbench (3), the right side of the top of the workbench (3) is connected with a hydraulic rod (4), the movable end of the top of the hydraulic rod (4) is connected with a lifting seat (5), the right side of the top of the lifting seat (5) is connected with a driving motor (6), the left power output end of the driving motor (6) is connected with a bevel gear (7), the middle part of the lifting seat (5) is rotatably connected with a vertical shaft (8), the upper part of the outer wall of the vertical shaft (8) is connected with a bevel gear ring (9), the bevel gear ring (9) is meshed with the bevel gear (7), a round through hole (10) is formed in the axis position of the vertical shaft (8), the lower end of the vertical shaft (8) is connected with a liquid supply seat (11), the left side of the top of the lifting seat (5) is connected with a fixed frame (12), the upper end of mount (12) is connected with L type pipe (13), L type pipe (13) horizontal part is connected with delivery hose (14), delivery hose (14) stretch into the one end of feed tank (2) and are connected with drawing liquid pump (15), L type pipe (13) vertical part rotates and connects vertical axis (8) upper end.
2. The polishing liquid supply and delivery device of a semiconductor polishing apparatus according to claim 1, wherein: the top of workstation (3) is connected with cistern (16), be equipped with grinding table (17) in cistern (16), the bottom of giving liquid seat (11) is connected with grinding piece (18), it leads water conservancy diversion chamber (19) to have seted up in liquid seat (11), a plurality of liquid holes (20) have been seted up to the bottom in water conservancy diversion chamber (19), go out liquid hole (20) equipartition around grinding piece (18), grinding table (17) are located under grinding piece (18).
3. The polishing liquid supply and delivery device of a semiconductor polishing apparatus according to claim 2, wherein: install rose box (21) in grudging post (1), the inner chamber middle part of rose box (21) is connected with filter core (22), it has collector tube (23) to communicate between rose box (21) top and cistern (16) bottom, it has back flow (24) to communicate between rose box (21) outer wall bottom and feed liquor jar (2).
4. The polishing liquid supply and delivery device of a semiconductor polishing apparatus according to claim 1, wherein: and a sealing bearing is arranged between the vertical end of the L-shaped pipe (13) and the circular through hole (10).
5. The polishing liquid supply and delivery device of a semiconductor polishing apparatus according to claim 1, wherein: the outer wall of workstation (3) is connected with PLC controller (25), PLC controller electric connection hydraulic stem (4), driving motor (6) and drawing liquid pump (15).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121604760.5U CN215789171U (en) | 2021-07-15 | 2021-07-15 | Grinding fluid supply and conveying device of semiconductor grinding equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121604760.5U CN215789171U (en) | 2021-07-15 | 2021-07-15 | Grinding fluid supply and conveying device of semiconductor grinding equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215789171U true CN215789171U (en) | 2022-02-11 |
Family
ID=80182050
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121604760.5U Expired - Fee Related CN215789171U (en) | 2021-07-15 | 2021-07-15 | Grinding fluid supply and conveying device of semiconductor grinding equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215789171U (en) |
-
2021
- 2021-07-15 CN CN202121604760.5U patent/CN215789171U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20220211 |
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| CF01 | Termination of patent right due to non-payment of annual fee |