CN214797346U - Integrated device for removing and fixing glue of wafer in semiconductor industry - Google Patents
Integrated device for removing and fixing glue of wafer in semiconductor industry Download PDFInfo
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- CN214797346U CN214797346U CN202121176214.6U CN202121176214U CN214797346U CN 214797346 U CN214797346 U CN 214797346U CN 202121176214 U CN202121176214 U CN 202121176214U CN 214797346 U CN214797346 U CN 214797346U
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- reaction chamber
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- vacuum reaction
- vacuum
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Abstract
The utility model discloses a semiconductor industry wafer degumming and glue fixing integrated device, which comprises a vacuum reaction chamber, wherein the top of the vacuum reaction chamber is connected with a cooling nitrogen pipeline, a wafer carrying platform is arranged in the vacuum reaction chamber, and a UV light source is arranged above the wafer carrying platform; the bottom of the vacuum reaction chamber is provided with a vacuum pump which is connected with the vacuum reaction chamber; the bottom of the vacuum reaction chamber is also provided with a temperature control device, and the temperature control device is connected with the wafer carrying platform. The utility model discloses what contain configuration vacuum function should the cavity, there is the wafer base that bears of controllable temperature inside, cavity top installation LED UV lamp panel, and the top is connected with protective nitrogen gas pipeline all the way. UV ultraviolet rays can irradiate the carrier platform from the top end of the cavity body to carry out glue fixing operation, and N2The gas pipeline flows into the cavity to enable the temperature inside the cavity to be uniformly distributed, volatile gas can be taken away through the dry pump, secondary pollution is prevented, the carrying platform has a temperature control function, and the glue fixing time can be greatly shortened due to appropriate temperature.
Description
Technical Field
The utility model relates to a gu glue equipment especially relates to a semiconductor industry wafer removes glues and glues integrative device admittedly belongs to wafer equipment technical field.
Background
In the wafer manufacturing process, a glue fixing device is an indispensable device in part of the production process, and at present, a glue removing device in the wafer manufacturing process does not have a glue fixing function and only comprises a vacuum reaction chamber a, a wafer carrying table B is arranged in the vacuum reaction chamber a, the wafer carrying table B is connected with a temperature control device C, the top of the vacuum reaction chamber a is connected with a nitrogen pipeline D, and the bottom of the vacuum reaction chamber a is connected with a vacuum device E, as shown in fig. 2. When glue needs to be solidified, other glue solidifying equipment is needed to carry out the glue solidifying process, and along with the continuous improvement of the requirements of the manufacturing process, the requirements on the stability of the glue solidifying equipment are higher and higher. Therefore, developing an integrated device for removing and fixing photoresist on a wafer in the semiconductor industry becomes a problem to be solved by those skilled in the art.
SUMMERY OF THE UTILITY MODEL
The utility model provides a solve above-mentioned not enough, provide a semiconductor industry wafer degumming and glue solid integrative device.
The above object of the present invention is achieved by the following technical solutions: the utility model provides an integrative device is glued concurrently to semiconductor trade wafer degumming, includes a vacuum reaction chamber, cooling nitrogen gas pipeline is connected at vacuum reaction chamber top, be equipped with wafer microscope carrier, its characterized in that in the vacuum reaction chamber: a UV light source is arranged above the wafer carrying platform; the vacuum reaction chamber is provided with a vacuum pump at the bottom, and the vacuum pump is connected with the vacuum reaction chamber and is used for protecting the protective N2And volatile gas venting; the bottom of the vacuum reaction chamber is also provided with a temperature control device, and the temperature control device is connected with the wafer carrying platform and is used for controlling the temperature of the wafer carrying platform.
Further, the UV light source comprises a UV light shade and an LED UV lamp panel, the UV light shade is arranged at the top of the vacuum reaction chamber and is spherical, UV bulbs are uniformly distributed on the LED UV lamp panel, and the UV bulbs emit ultraviolet rays of 400nm-650 nm.
Further, the temperature control device is a cooling water generator.
The utility model is based on the glue fixing principle, the UV lamp emits ultraviolet rays of 400nm-650nm to irradiate the wafer to solidify the photoresist, and the photoresist is clamped by the material taking and placing device and then is conveyed to the next station; adopt the utility model discloses the device can realize the automatic solid glue of product to can upgrade based on part strips and reform transform, economic benefits is obvious.
The utility model disclosesCompared with the prior art, the method has the advantages that: the utility model discloses what contain configuration vacuum function should the cavity, there is the wafer base that bears of controllable temperature inside, cavity top installation LED UV lamp panel, and the top is connected with protective nitrogen gas pipeline all the way. UV ultraviolet rays can irradiate the carrier platform from the top end of the cavity body to carry out glue fixing operation, and N2The gas pipeline flows into the cavity to enable the temperature inside the cavity to be uniformly distributed, volatile gas can be taken away through the dry pump, secondary pollution is prevented, the carrying platform has a temperature control function, and the glue fixing time can be greatly shortened due to appropriate temperature. And simultaneously, the utility model discloses glue the part admittedly based on the chamber of removing glues has increased for equipment both can carry out the operation of removing glues, also can carry out the operation of gluing admittedly, has increased the function of equipment, makes the equipment price/performance ratio improve greatly.
Drawings
Fig. 1 is a schematic structural diagram of the present invention.
FIG. 2 is a schematic diagram of a conventional photoresist stripping apparatus for wafer fabrication.
Detailed Description
The present invention will be described in detail with reference to the accompanying drawings.
As shown in fig. 1, an integrated device for removing and fixing glue on a wafer in the semiconductor industry comprises a vacuum reaction chamber 1, wherein the top of the vacuum reaction chamber 1 is connected with a cooling nitrogen pipeline 2, a wafer carrying platform 3 is arranged in the vacuum reaction chamber 1, and a UV light source 4 is arranged above the wafer carrying platform 3; the vacuum reaction chamber is provided with a vacuum pump 5 at the bottom, the vacuum pump 5 is connected with the vacuum reaction chamber 1 and is used for protecting the protective N2And volatile gas venting; the bottom of the vacuum reaction chamber is also provided with a temperature control device 6, and the temperature control device 6 is connected with the wafer carrying platform 3 and is used for controlling the temperature of the wafer carrying platform 3.
Further, the UV light source 4 includes a UV light shield 401 and a LED UV lamp panel 402, the UV light shield 401 is arranged on the top of the vacuum reaction chamber 1 and is in a spherical shape, UV bulbs 403 are uniformly distributed on the LED UV lamp panel 402, and the UV bulbs 403 emit ultraviolet rays of 400nm-650 nm.
Further, the temperature control device 6 is a cooling water generator.
The utility model discloses a device contains the cavity that should of configuration vacuum function, and there is the bearing wafer base of controllable temperature inside, cavity top installation LED UV lamp panel, and the top is connected with protective nitrogen gas pipeline all the way. UV ultraviolet rays can irradiate the carrier platform from the top end of the cavity body to carry out glue fixing operation, and N2The gas pipeline flows into the cavity to enable the temperature inside the cavity to be uniformly distributed, volatile gas can be taken away through the dry pump, secondary pollution is prevented, the carrying platform has a temperature control function, and the glue fixing time can be greatly shortened due to appropriate temperature.
The utility model is based on the glue fixing principle, the UV lamp emits ultraviolet rays of 400nm-650nm to irradiate the wafer to solidify the photoresist, and the photoresist is clamped by the material taking and placing device and then is conveyed to the next station; adopt the utility model discloses the device can realize the automatic solid glue of product to can upgrade based on part strips and reform transform, economic benefits is obvious.
The above only is the embodiment of the present invention, not limiting the patent scope of the present invention, all the equivalent structures or equivalent processes that are used in the specification and the attached drawings or directly or indirectly applied to other related technical fields are included in the patent protection scope of the present invention.
Claims (3)
1. The utility model provides an integrative device is glued concurrently to semiconductor trade wafer degumming, includes a vacuum reaction chamber, cooling nitrogen gas pipeline is connected at vacuum reaction chamber top, be equipped with wafer microscope carrier, its characterized in that in the vacuum reaction chamber: a UV light source is arranged above the wafer carrying platform; the vacuum reaction chamber is provided with a vacuum pump at the bottom, and the vacuum pump is connected with the vacuum reaction chamber and is used for protecting the protective N2And volatile gas venting; the bottom of the vacuum reaction chamber is also provided with a temperature control device, and the temperature control device is connected with the wafer carrying platform and is used for controlling the temperature of the wafer carrying platform.
2. The integrated device for removing and fixing glue on wafer in semiconductor industry as claimed in claim 1, wherein: the UV light source comprises a UV light shield and an LED UV lamp panel, the UV light shield is arranged at the top of the vacuum reaction chamber and is in a spherical surface shape, UV bulbs are uniformly distributed on the LED UV lamp panel, and the UV bulbs emit ultraviolet rays of 400nm-650 nm.
3. The integrated device for removing and fixing glue on wafer in semiconductor industry as claimed in claim 1, wherein: the temperature control device is a cooling water generator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121176214.6U CN214797346U (en) | 2021-05-28 | 2021-05-28 | Integrated device for removing and fixing glue of wafer in semiconductor industry |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121176214.6U CN214797346U (en) | 2021-05-28 | 2021-05-28 | Integrated device for removing and fixing glue of wafer in semiconductor industry |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214797346U true CN214797346U (en) | 2021-11-19 |
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ID=78698756
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121176214.6U Active CN214797346U (en) | 2021-05-28 | 2021-05-28 | Integrated device for removing and fixing glue of wafer in semiconductor industry |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214797346U (en) |
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2021
- 2021-05-28 CN CN202121176214.6U patent/CN214797346U/en active Active
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