CN214394507U - Wafer tectorial membrane cutting machine - Google Patents

Abstract

The utility model belongs to the technical field of wafer tectorial membrane production and specifically relates to a wafer tectorial membrane cutting machine, it includes the frame, be equipped with in the frame and supply the tectorial membrane to roll up the membrane frame of putting and the cutting bed that the tectorial membrane was placed is waited to cut with the confession, the cutting bed top is provided with the cutting assembly who is used for cutting the wafer tectorial membrane, cutting assembly is including the cutting gyro wheel, cutting assembly with be equipped with the rotation piece that is used for injecing cutting assembly to make circular motion between the frame, solved the wafer tectorial membrane edge after cutting and easily produced deckle edge, not complete normal circle, lead to the problem that wafer tectorial membrane and wafer do not laminate. The application has the advantages of ensuring the integrity of the cut wafer film and reducing the effect of the burrs of the wafer film.

Description

Wafer tectorial membrane cutting machine

Technical Field

The application relates to the field of wafer film covering production, in particular to a wafer film covering cutting machine.

Background

The wafer is an important raw material in semiconductor production, and before the wafer is produced into a semiconductor, one surface without a circuit structure is generally required to be polished and cut to be thin, so that the surface of the wafer with the circuit structure is required to be covered with a protective film to prevent the circuit structure of the wafer from being scratched and damaged, and the existing cutting mode is to cut the wafer covering film around the radius of the wafer by holding a cutter.

In view of the above-mentioned related technologies, the inventors believe that there is a defect that the edge of the cut wafer coating film is easily rough and not completely round, resulting in the non-bonding between the wafer coating film and the wafer.

SUMMERY OF THE UTILITY MODEL

In order to guarantee the integrality after the cutting of wafer tectorial membrane, reduce the production of wafer tectorial membrane deckle edge, this application provides a wafer tectorial membrane cutting machine.

The application provides a wafer tectorial membrane cutting machine adopts following technical scheme:

the utility model provides a wafer tectorial membrane cutting machine, includes the frame, be equipped with in the frame and supply the tectorial membrane of putting to wrap up the membrane frame and supply to wait to cut the cutting bed that the tectorial membrane was placed, the cutting bed top is provided with the cutting assembly who is used for the cutting to wait to cut the tectorial membrane, cutting assembly is including the cutting gyro wheel, cutting assembly with be equipped with the rotation piece that is used for injecing cutting assembly to make circular motion between the frame.

Through adopting above-mentioned technical scheme, set up cutting bed and cutting assembly in the frame, the cutting that the cutting assembly treated the cutting tectorial membrane has been made things convenient for, through connecting the rotation piece between cutting assembly and frame, make cutting assembly can move on the circumferencial direction, make cutting assembly more accurate to the cutting of wafer tectorial membrane, wafer tectorial membrane after the cutting more laminates a perfect circle, through setting up the cutting gyro wheel on cutting assembly, make the cutting gyro wheel treat the frictional force of cutting the tectorial membrane when cutting wafer tectorial membrane and reduce, reduced and treated the tectorial membrane and pulled and produce unedged probability by cutting assembly, the cutting quality of wafer tectorial membrane has been improved.

Optionally, the rotation piece includes the dwang of L shape, the dwang includes axis of rotation and head rod, the frame top articulates there is the cover, the axis of rotation revolutes the axis of rotation center pin and rotates set up in the cover center, head rod one end with the axis of rotation bottom is connected, the head rod is kept away from the one end of axis of rotation with cutting component is connected.

Through adopting above-mentioned technical scheme, articulated cover in the frame will rotate the piece and be connected to the cover, made things convenient for the rotation piece to revolve the axis of rotation and rotate on the cover to drive the cutting assembly on the head rod and revolve axis of rotation and make circular motion, make the cutting assembly more stable to the cutting of wafer tectorial membrane, made things convenient for the cutting of cutting assembly to wafer tectorial membrane.

Optionally, the cutting assembly further comprises a cutting head, the cutting head is arranged on the first connecting rod in a sliding mode along the length direction of the first connecting rod, a positioning bolt is connected to the cutting head in a threaded mode, and a first screw hole and a second screw hole which are in threaded fit with the positioning bolt are formed in the first connecting rod.

Through adopting above-mentioned technical scheme, set up the cutting head between cutting gyro wheel and head rod, made things convenient for the installation and the change of cutting gyro wheel on the cutting head, through threaded connection positioning bolt on the cutting head, and set up first screw and second screw on the head rod, fix the position department to first screw or second screw respectively with the cutting head, can make the cutting head revolute the axis of rotation and make circular motion in the different positions department of head rod, the cutting head can be with waiting to cut the tectorial membrane cutting on the cutting bed for the wafer tectorial membrane of different diameters, the cutting of the wafer tectorial membrane of different diameters has been made things convenient for.

Optionally, the cutting table is provided with a circular boss for placing a film to be cut, the circular boss is provided with a first annular groove and a second annular groove, the first annular groove and the second annular groove are respectively used for the rotation shaft as the circle center, the first annular groove is matched with the cutting roller when the positioning bolt is positioned in the first screw hole in an embedded manner, and the second annular groove is matched with the cutting roller when the positioning bolt is positioned in the second screw hole in an embedded manner.

Through adopting above-mentioned technical scheme, set up the boss on the cutting bed, make the cutting gyro wheel cut on the boss and wait to cut the tectorial membrane, prevent that the cutting gyro wheel from cutting and causing the mar wearing and tearing to the cutting bed when waiting to cut the tectorial membrane, through offering first ring channel and the second ring channel corresponding with first screw and second screw respectively on the boss, the cutting head cuts the gyro wheel gomphosis in first ring channel and treats to cut the tectorial membrane when first screw position, the cutting head cuts the gyro wheel gomphosis in the second ring channel and treats to cut the tectorial membrane and cut when second screw position, make the cutting head cutting gyro wheel more accurate stable to the cutting of waiting to cut the tectorial membrane when different positions, the cutting quality of wafer tectorial membrane has been improved.

Optionally, a first bar-shaped boss for supporting a film to be cut is connected to the cutting table, and a second bar-shaped boss corresponding to the first bar-shaped boss is arranged on the bottom surface of the machine cover.

Through adopting above-mentioned technical scheme, set up first bar boss on the cutting bed, set up the second bar boss corresponding with first bar boss at the lid bottom surface, first bar boss and the identical conflict of second bar boss when making the lid close, made things convenient for first bar boss and second bar boss to treat the clamp of cutting the tectorial membrane tightly and bearing, make the cutting gyro wheel more accurate smooth and easy to the cutting of waiting to cut the tectorial membrane, reduced the cutting gyro wheel and pulled the possibility that the tectorial membrane produced deckle edge of wafer when waiting to cut the tectorial membrane and leading to the cutting.

Optionally, the bottom end of the rotating shaft is further connected with a second connecting rod, and one end, far away from the rotating shaft, of the second connecting rod is connected with a sliding wheel used for pressing the film to be cut.

Through adopting above-mentioned technical scheme, connect the second connecting rod in the axis of rotation bottom, keep away from the one end of axis of rotation at the second connecting rod and connect the movable pulley, the movable pulley revolves the axis of rotation and slides on the cutting bed when the cutting tectorial membrane is waited to cut to the cutting gyro wheel for cutting gyro wheel and movable pulley are in balanced opposite state, with head rod and cutting gyro wheel bearing in the cutting bed top, make the cutting gyro wheel more stable to the cutting of waiting to cut the tectorial membrane, have improved the cutting quality of waiting to cut the tectorial membrane.

It is optional, put the tectorial membrane frame including supplying the tectorial membrane roll to wear to establish, the tectorial membrane roll is worn to locate the frame lateral wall, still wear to be equipped with in the frame and be used for the adjustment to wait to cut the deflector roll of tectorial membrane transmission orbit, the deflector roll with the tectorial membrane roll is parallel, the tectorial membrane roll keep away from with one side of frame junction is equipped with the rotor plate, the rotor plate articulate in the frame, the rotor plate with the position of tectorial membrane roll contact is equipped with the support ring that supplies the tectorial membrane roll to set up.

Through adopting the above technical scheme, wear to establish the tectorial membrane roller at the frame lateral wall, arrange the tectorial membrane book in on the tectorial membrane roller, the rotation of tectorial membrane roller and the blowing of tectorial membrane book have been made things convenient for, through at the articulated rotor plate of frame opposite side, and set up the support ring on the rotor plate, the installation and the change of tectorial membrane book have been made things convenient for, the bearing to tectorial membrane roller and tectorial membrane book has been strengthened, make the rotation of tectorial membrane roller and the blowing of tectorial membrane book more stable, through wearing to establish the deflector roll in the frame, and the deflector roll is parallel with the tectorial membrane roller, treat to cut tectorial membrane and deflector roll contact behind the blowing of tectorial membrane book on the tectorial membrane roller, the deflector roll is treated the transmission route of cutting tectorial membrane and is adjusted, make and treat to cut tectorial membrane and cutting bed and laminate more, the cutting of cutting gyro wheel to waiting to cut the tectorial membrane has been made things convenient for.

Optionally, in the frame put the membrane frame with be equipped with the cutter that is used for the transverse cutting to wait to cut the tectorial membrane between the cutting bench, be connected with the installation piece on the cutter, the groove of sliding has been seted up on the installation piece, the groove of sliding with the cover looks gomphosis, the installation piece top surface is connected with and is used for the pulling the pull handle of cutter.

Through adopting above-mentioned technical scheme, set up the cutter between putting membrane frame and cutting platform to connect the pull handle on the cutter, made things convenient for the cutter to the cutting and the recovery of excess material behind the cutting of wafer tectorial membrane, through setting up the groove of sliding on the installation piece, and the groove of sliding and cover side looks gomphosis, made things convenient for the pull handle to drive installation piece and cutter and slided at the cover side, made things convenient for the cutter to treat the cutting of cutting tectorial membrane excess material.

Optionally, a telescopic rod is arranged between the frame and the cover, the telescopic rod comprises an inner rod and an outer cylinder, the outer cylinder is hinged to the side wall of the frame, and the inner rod is hinged to the side wall of the cover.

Through adopting above-mentioned technical scheme, set up the telescopic link between frame and cover, and the urceolus of telescopic link articulates in the frame lateral wall, and the interior pole of telescopic link articulates in the cover lateral wall, and the pole slides along length direction in the urceolus through the interior pole of telescopic link, and the telescopic link has made things convenient for the support of cover when the cover is opened the state, has made things convenient for opening and shutting of cover to the cover.

Optionally, an observation port for observing the cutting state of the film to be cut is formed in the cover.

By adopting the technical scheme, the observation port is formed in the cover, so that the observation of the cutting state when the cutting roller cuts the to-be-cut laminated film is facilitated, and the probability of cutting the to-be-cut laminated film in a wrong way is reduced.

In summary, the present application includes at least one of the following beneficial technical effects:

1. the cutting table and the cutting assembly are arranged on the rack, so that the cutting of the cutting assembly to-be-cut film is facilitated, the rotating member is connected between the cutting assembly and the rack, the cutting assembly can move in the circumferential direction, the cutting assembly can cut the wafer film more accurately, the cut wafer film is more attached to a perfect circle, the cutting roller is arranged on the cutting assembly, the friction force of the cutting roller to-be-cut film is reduced when the cutting roller cuts the wafer film, the probability that the to-be-cut film is pulled by the cutting assembly to generate burrs is reduced, and the cutting quality of the wafer film is improved;

2. the cutting roller is conveniently embedded into the first annular groove or the second annular groove when the cutting roller cuts the covering film to be cut by arranging the first annular groove and the second annular groove corresponding to the first screw hole and the second screw hole, so that the cutting of the cutting roller is more stable and accurate, and the cutting quality of the cutting roller is improved;

3. through connecting the second connecting rod in the axis of rotation, through at second connecting rod end-to-end connection movable pulley, support head rod and cutting gyro wheel, make the cutting gyro wheel keep steady, made things convenient for the cutting of cutting gyro wheel to waiting to cut the tectorial membrane, connect the installation piece through gomphosis on the cutting table, and connect cutter and pull handle on the installation piece, made things convenient for the cutter to treat the horizontal cutting of cutting the tectorial membrane, made things convenient for the clearance of cutting clout, through set up first bar boss on the cutting bed, set up second bar boss at the bottom of the cutting table, will wait to cut the tectorial membrane centre gripping, reduced and cut out unedged probability of deckle edge because of waiting to cut the tectorial membrane slip and lead to wafer tectorial membrane, the cutting quality of wafer tectorial membrane has been improved.

Drawings

Fig. 1 is a schematic structural diagram of a wafer laminating cutting machine according to an embodiment of the present application.

Fig. 2 is a schematic structural diagram of a back view angle of a wafer laminating cutting machine according to an embodiment of the present application.

Fig. 3 is an enlarged view of a portion a of fig. 1.

Description of reference numerals: 1. a frame; 2. a machine cover; 21. a telescopic rod; 211. an outer cylinder; 212. a fitting groove; 213. an inner rod; 214. an elastic bulge; 22. a viewing port; 23. a second bar-shaped boss; 3. a cutting assembly; 31. a cutting head; 311. positioning the bolt; 32. cutting the roller; 4. a rotating member; 41. rotating the rod; 411. a rotating shaft; 412. rotating the handle; 413. a first connecting rod; 414. a first screw hole; 415. a second screw hole; 416. a second connecting rod; 417. a sliding wheel; 5. cutting table; 51. a circular boss; 511. a first annular groove; 512. a second annular groove; 52. a first bar-shaped boss; 6. placing a membrane frame; 61. a film laminating roller; 62. a rotating plate; 621. a support ring; 63. a guide roller; 64. a protective cover; 7. a cutter; 71. pulling a handle; 72. mounting blocks; 73. a sliding groove; 8. film-covered rolls; 81. the film to be cut.

Detailed Description

The present application is described in further detail below with reference to figures 1-3.

The embodiment of the application discloses a wafer tectorial membrane cutting machine. Referring to fig. 1, a wafer film cutting machine, including a frame 1, a cover 2 is hinged in the middle of the frame 1, a cutting assembly 3 and a rotating member 4 are arranged on the cover 2, the rotating member 4 includes a rotating shaft 411, a first connecting rod 413 and a second connecting rod 416, one end of the first connecting rod 413 and one end of the second connecting rod 416 are both connected with the rotating shaft 411, the first connecting rod 413 is connected with the cutting assembly 3, the end of the second connecting rod 416 is connected with a sliding wheel 417, and the central axis of the sliding wheel 417 is parallel to the second connecting rod 416, when the cutting assembly 3 makes a circular motion around the rotating shaft 411, the sliding wheel 417 and the cutting assembly 3 play a role in supporting and balancing the first connecting rod 413 and the second connecting rod 416, so that the circular motion of the cutting assembly 3 around the rotating shaft 411 is more stable.

Referring to fig. 1, a telescopic rod 21 is connected between a machine frame 1 and a machine cover 2, the telescopic rod 21 includes an outer cylinder 211 and an inner rod 213, the outer cylinder 211 is hinged to a side wall of the machine frame 1, the inner rod 213 is hinged to a side wall of the machine cover 2, the inner rod 213 is arranged in a cylinder body of the outer cylinder 211 and slides in the outer cylinder 211 along the length direction of the inner rod 213, an elastic protrusion 214 is arranged at the tail end of the inner rod 213, a tabling groove 212 which is matched with the elastic protrusion 214 in a tabling manner is arranged at the tail end of the outer cylinder 211, when the machine cover 2 is closed, the telescopic rod 21 is shortened, when the machine cover 2 is opened, the telescopic rod 21 is lengthened, the elastic protrusion 214 is tabling in the tabling groove 212, and the machine cover 2 can be supported.

Referring to fig. 2 and 3, the cutting assembly 3 includes a cutting head 31 and a cutting roller 32, the cutting roller 32 is rotatably connected to a side surface of the cutting head 31 around a central axis of the cutting roller 32, the cutting head 31 is slidably disposed on a first connecting rod 413, a positioning bolt 311 is threadedly connected to the cutting head 31, and a first screw hole 414 and a second screw hole 415 which are threadedly engaged with the positioning bolt 311 are formed in the first connecting rod 413. When the cutting head 31 is fixed at the first screw hole 414 by the positioning bolt 311, the horizontal distance between the cutting roller 32 and the central axis of the rotating shaft 411 is 6 inches, that is, the wafer film cut by the cutting roller 32 around the rotating shaft 411 is 12 inches, and is matched with a 12-inch wafer; when the positioning bolt 311 fixes the cutting head 31 at the second screw hole 415, the horizontal distance between the cutting roller 32 and the rotating shaft 411 is 4 inches, that is, the wafer film cut by the cutting roller 32 around the rotating shaft 411 is 8 inches, and fits with an 8-inch wafer.

Referring to fig. 2 and 3, a rotation handle 412 is fixedly connected to the top end of the rotation shaft 411, and the rotation handle 412 is located above the top surface of the cover 2, when the rotation handle 412 is rotated by a hand, the rotation shaft 411, the first connection rod 413 and the second connection rod 416 are driven to circularly move around the rotation shaft 411, so as to cut the film 81 to be cut below. The cover 2 is provided with a circular observation port 22 by taking the rotating shaft 411 as the center, so that the worker can observe the cutting state of the film 81 to be cut under the cover 2 when the cover 2 is closed, and can timely find and adjust the cutting problem.

Referring to fig. 1, a cutting table 5 is arranged at the front end of a machine frame 1, a circular boss 51 is arranged above the cutting table 5, a first annular groove 511 and a second annular groove 512 are formed in the circular boss 51, when a machine cover 2 is closed, the circle centers of the first annular groove 511 and the second annular groove 512 and the central axis of a rotating shaft 411 are located on the same vertical straight line, the radius of the first annular groove 511 is 6 inches, and the radius of the second annular groove 512 is 4 inches, that is, the first annular groove 511 and the cutting roller 32 are in embedded fit when the cutting head 31 is located in a first screw hole 414, and the second annular groove 512 and the cutting roller 32 are in embedded fit when the cutting head 31 is located in a second screw hole 415, so that the cutting roller 32 is more stable when cutting a film 81 to be cut around the rotating shaft 411, and the cutting of the film 81 to be cut is facilitated.

Referring to fig. 1, circular boss 51 both sides all are equipped with first bar boss 52 on the cutting table 5, and first bar boss 52 is parallel with the width direction of frame 1, cover 2 bottom surface is equipped with the second bar boss 23 with first bar boss 52 matched with, when cover 2 closes, first bar boss 52 coincide with second bar boss 23 and contradict, made things convenient for the centre gripping of treating cutting tectorial membrane 81, strengthened the cutting gyro wheel 32 cutting and waited the stability when cutting tectorial membrane 81, it produces deckle edge to prevent to wait to cut tectorial membrane 81 and is dragged and lead to the cutting.

Referring to fig. 1 and 2, a film placing frame 6 is arranged at the rear end of the rack 1, the film placing frame 6 comprises a film coating roller 61 and a rotating plate 62, the rotating plate 62 is hinged to the side wall of the rack 1, a support ring 621 is arranged on the inner side of the rotating plate 62, one end of the film coating roller 61 is arranged on the side wall of the rack 1 opposite to the rotating plate 62 in a penetrating manner, the other end of the film coating roller 61 is arranged in the support ring 621 in a lapping manner, when the rotating plate 62 is opened, a film coating roll 8 can be arranged on the film coating roller 61, or the film coating roll 8 on the film coating roller 61 is taken down, when the rotating plate 62 is closed, the film coating roller 61 is arranged in the support ring 621 in a lapping manner, and the support of the rack 1 for the film coating roller 61 is enhanced. A protective cover 64 is hinged on the frame 1, and the protective cover 64 is positioned above the film placing frame 6 to prevent foreign objects from polluting or scraping the film coating roller 61 in the film placing frame 6.

Referring to fig. 1, a guide roller 63 is further arranged between the film placing frame 6 and the cutting table 5 on the frame 1 in a penetrating manner, the guide roller 63 contacts the to-be-cut film 81 after being unfolded from the film winding roll 8 on the film coating roller 61, the to-be-cut film 81 is pressed downwards, the transmission track of the to-be-cut film 81 is adjusted to reduce the distance between the to-be-cut film 81 and the cutting table 5, the first strip-shaped boss 52 and the second strip-shaped boss 23 are convenient to clamp the to-be-cut film 81, and the cutting roller 32 is convenient to cut the to-be-cut film 81.

Referring to fig. 1 and 2, the installation block 72 is installed with frame 1 articulated one side to cover 2, the installation block 72 has been seted up towards one side of cover 2 and has been slided groove 73, make the installation block 72 can slide along the width direction of cover 2 at cover 2 side, the bottom of installation block 72 is connected with cutter 7, the top surface of installation block 72 is connected with pull handle 71, when cover 2 closes, cutter 7 perpendicular to cutting bed 5 top surface of installation block 72 lower extreme, when pulling pull handle 71 drives installation block 72 and slides at cover 2 side, cutter 7 can transversely cut off waiting to cut tectorial membrane 81, the processing recovery of the clout after the circular wafer tectorial membrane of excision has been made things convenient for.

The implementation principle of the wafer film covering cutting machine provided by the embodiment of the application is as follows: when 12-inch wafer coating needs to be produced, the protective cover 64 and the rotating plate 62 are opened, the coating roll 8 is placed on the coating roller 61, a section of coating 81 to be cut is pulled out and placed below the guide roller 63, the rotating plate 62 and the protective cover 64 are closed in sequence, the tail end of the coating roller 61 is placed in the supporting ring 621 of the rotating plate 62, the coating roller 61 is clamped and supported, the cover 2 is opened, the inner rod 213 of the telescopic rod 21 slides outwards the outer cylinder 211 along with the inner rod, the elastic protrusion 214 on the inner rod 213 is embedded in the embedding groove 212 on the outer cylinder 211, the telescopic rod 21 can support the cover 2, and the cover 2 is prevented from being closed under the action of gravity.

The film 81 to be cut below the guide roller 63 is pulled outwards and is placed on the cutting table 5, the film 81 to be cut covers the first strip-shaped boss 52 and the round boss 51, the positioning bolt 311 is placed in the first screw hole 414, the cutting head 31 is fixed on the first connecting rod 413, the cover 2 is closed, the second strip-shaped boss 23 on the bottom surface of the cover 2 and the first strip-shaped boss 52 on the cutting table 5 can clamp the film 81 to be cut, and the film 81 to be cut is prevented from sliding.

The rotation handle 412 is pushed around the rotation shaft 411, the first connection rod 413 and the second connection rod 416 below the cover 2 drive the cutting roller 32 and the sliding wheel 417 to rotate around the rotation shaft 411, the cutting roller 32 is embedded in the first annular groove 511 to cut the to-be-cut coating 81 on the circular boss 51, and after the cutting roller 32 completes a complete circular motion around the rotation shaft 411, a perfect circular 12-inch wafer coating is cut on the to-be-cut coating 81.

The pull handle 71 is pushed along the width direction of the machine cover 2, so that the mounting block 72 slides on the side edge of the machine cover 2, the cutter 7 below the mounting block 72 can transversely cut off the to-be-cut film 81, the machine cover 2 is opened, the cut wafer film and film excess materials are taken out, the cutting of the wafer film is completed, the to-be-cut film 81 is pulled out again, and the next cutting of the wafer film can be performed.

When an 8-inch wafer coating needs to be produced, the positioning bolt 311 is placed in the second screw hole 415, the cutting head 31 is fixed on the first connecting rod 413, the above operations are repeated, the cutting roller 32 can be embedded in the second annular groove 512 to cut the coating 81 to be cut on the circular boss 51, and after the cutting roller 32 completes a complete circular motion around the rotating shaft 411, a complete 8-inch wafer coating is cut on the coating 81 to be cut.

The above is a preferred embodiment of the present application, and the scope of protection of the present application is not limited by the above, so: all equivalent changes made according to the structure, shape and principle of the present application shall be covered by the protection scope of the present application.

Claims (10)

1. The utility model provides a wafer tectorial membrane cutting machine which characterized in that: including frame (1), be equipped with in frame (1) and supply to supply that tectorial membrane roll (8) are placed put membrane frame (6) and the confession is waited to cut cutting table (5) that tectorial membrane (81) were placed, cutting table (5) top is provided with cutting assembly (3) that are used for the cutting to wait to cut tectorial membrane (81), cutting assembly (3) are including cutting gyro wheel (32), cutting assembly (3) with be equipped with between frame (1) and be used for injecing the rotation piece (4) that cutting assembly (3) made circular motion.

2. The wafer film cutting machine according to claim 1, wherein: rotate piece (4) dwang (41) including the L shape, dwang (41) include axis of rotation (411) and head rod (413), frame (1) top articulates there is cover (2), axis of rotation (411) revolute axis of rotation (411) center pin rotate set up in cover (2) center, head rod (413) one end with axis of rotation (411) bottom is connected, head rod (413) are kept away from the one end of axis of rotation (411) with cutting component (3) are connected.

3. The wafer film cutting machine according to claim 2, wherein: the cutting assembly (3) further comprises a cutting head (31), the cutting head (31) is arranged on the first connecting rod (413) in a sliding mode along the length direction of the first connecting rod (413), a positioning bolt (311) is connected to the cutting head (31) in a threaded mode, and a first screw hole (414) and a second screw hole (415) which are matched with the positioning bolt (311) in a threaded mode are formed in the first connecting rod (413).

4. The wafer film cutting machine according to claim 3, wherein: be equipped with on cutting bed (5) and supply the waiting to cut tectorial membrane (81) place with rotation axis (411) round boss (51) as the centre of a circle, seted up on round boss (51) with rotation axis (411) first ring channel (511) and second ring channel (512) as the centre of a circle, first ring channel (511) with cutting gyro wheel (32) gomphosis cooperation when positioning bolt (311) are located first screw (414), second ring channel (512) with cutting gyro wheel (32) gomphosis cooperation when positioning bolt (311) are located second screw (415).

5. The wafer film cutting machine according to claim 2, wherein: the cutting table (5) is connected with a first strip-shaped boss (52) used for bearing a film (81) to be cut, and a second strip-shaped boss (23) corresponding to the first strip-shaped boss (52) is arranged on the bottom surface of the cover (2).

6. The wafer film cutting machine according to claim 2, wherein: the bottom end of the rotating shaft (411) is further connected with a second connecting rod (416), and one end, far away from the rotating shaft (411), of the second connecting rod (416) is connected with a sliding wheel (417) used for pressing the to-be-cut coating (81).

7. The wafer film cutting machine according to claim 1, wherein: put membrane frame (6) including supplying tectorial membrane to roll up tectorial membrane roller (61) that (8) wore to establish, tectorial membrane roller (61) are worn to locate frame (1) lateral wall, still wear to be equipped with on frame (1) and be used for adjusting deflector roll (63) of waiting to cut tectorial membrane (81) transmission orbit, deflector roll (63) with tectorial membrane roller (61) are parallel, tectorial membrane roller (61) keep away from with one side of frame (1) junction is equipped with rotor plate (62), rotor plate (62) articulate in on frame (1), rotor plate (62) with the position that tectorial membrane roller (61) contacted is equipped with support ring (621) that supply tectorial membrane roller (61) to set up.

8. The wafer film cutting machine according to claim 2, wherein: put on frame (1) put membrane frame (6) with be equipped with cutter (7) that are used for the transverse cutting to wait to cut tectorial membrane (81) between cutting bed (5), be connected with installation piece (72) on cutter (7), install and seted up on piece (72) and slided groove (73), slide groove (73) with cover (2) looks gomphosis, installation piece (72) top surface is connected with and is used for the pulling pull handle (71) of cutter (7).

9. The wafer film cutting machine according to claim 2, wherein: frame (1) with be equipped with telescopic link (21) between cover (2), telescopic link (21) are including interior pole (213) and urceolus (211), urceolus (211) articulate in frame (1) lateral wall, interior pole (213) articulate in cover (2) lateral wall.

10. The wafer film cutting machine according to claim 2, wherein: an observation port (22) for observing the cutting state of the to-be-cut coating (81) is formed in the machine cover (2).

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