CN214078976U - Bending device for leading-out electrode of high-power semiconductor module - Google Patents
Bending device for leading-out electrode of high-power semiconductor module Download PDFInfo
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- CN214078976U CN214078976U CN202022974125.8U CN202022974125U CN214078976U CN 214078976 U CN214078976 U CN 214078976U CN 202022974125 U CN202022974125 U CN 202022974125U CN 214078976 U CN214078976 U CN 214078976U
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- bending
- power semiconductor
- semiconductor module
- extraction electrode
- moving mechanism
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Abstract
The utility model discloses a bending device of high-power semiconductor module extraction electrode belongs to the technical field of bending of high-power semiconductor module extraction electrode, including the device body and with device body sliding connection's moving mechanism, seted up a plurality of second spouts on the device body, the third spout has been seted up to one side of second spout, the inside sliding connection of third spout has the platform of bending, and the inside of second spout is equipped with the second lead screw, has seted up first spout on the moving mechanism, and the inside sliding connection of first spout has the connecting block. The utility model discloses a moving mechanism moves on the device body to the drive mechanism of bending removes, with this regulation bend the mechanism and bend the distance between the platform, make the device can be suitable for the high-power semiconductor module of different models, also can adjust the position of bending simultaneously, drive second lead screw corotation during second motor corotation, thereby drive the slider and remove.
Description
Technical Field
The utility model relates to a bending device of extraction electrode especially relates to a bending device of high-power semiconductor module extraction electrode, belongs to the technical field of bending of high-power semiconductor module extraction electrode.
Background
The power semiconductor module or power electronic module is designed for a circuit working at a relatively high voltage or a relatively high current, the power semiconductor module at least comprises a power semiconductor chip for switching, adjusting or rectifying the current, at present, the power semiconductor module, in particular to a high-power single-phase half-bridge fast recovery diode semiconductor module with a double-tube structure, is used in a plurality of power electronic circuits, in particular to circuits such as an inverter welding machine, an electroplating power supply, a frequency converter and the like, at present, when the high-power semiconductor module is produced, the leading-out electrode of the high-power semiconductor module is bent manually, and only one semiconductor module can be bent at a time, the mode not only reduces the efficiency, but also increases the labor intensity of workers, and simultaneously, the bending structure cannot be flexibly adjusted, so that the assembly error influences the quality of the product, the utility model discloses a new solution is proposed to above problem.
How to research a bending device of a high-power semiconductor module extraction electrode which is convenient to adjust is a problem which needs to be solved urgently at present.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving the defects of the prior art and providing a bending device of a high-power semiconductor module extraction electrode convenient to adjust.
The purpose of the utility model can be achieved by adopting the following technical scheme:
the utility model provides a bending device of high-power semiconductor module extraction electrode, including the device body and with device body sliding connection's moving mechanism, a plurality of second spouts have been seted up on the device body, the third spout has been seted up to one side of second spout, the inside sliding connection of third spout has the platform of bending, and the inside of second spout is equipped with the second lead screw, the last first spout of having seted up of moving mechanism, the inside sliding connection of first spout has the connecting block, the connecting block rotates and is connected with the mechanism of bending, the inside of moving mechanism is equipped with first lead screw.
Preferably, the back of the device body is provided with a plurality of second motors, and output ends of the second motors are inserted into the second sliding grooves and connected with the second screw rods.
Preferably, one side of the moving mechanism is provided with a first motor, and an output end of the first motor is inserted into the first sliding groove and connected with the first screw rod.
Preferably, the bottom of the moving mechanism is fixedly connected with sliding blocks with the same number as the second sliding grooves.
Preferably, the sliding block is sleeved on the second screw rod.
Preferably, the length of the slide block is smaller than the width of the moving mechanism.
Preferably, the bending mechanism comprises a connecting plate, the top of the connecting plate is fixedly connected with a handle, the bottom of the connecting plate is fixedly connected with a plurality of bending blocks, and through holes are formed in the bending blocks.
Preferably, a plurality of uniformly arranged grooves are formed in the bending table.
Preferably, a plurality of electric push rods are arranged inside the third sliding groove and connected with the bottom of the bending table.
Preferably, the connecting block is sleeved on the first screw rod.
The utility model has the advantages of: according to the bending device of the high-power semiconductor module extraction electrode of the utility model, the bending device of the high-power semiconductor module extraction electrode, the moving mechanism moves on the device body, thereby driving the bending mechanism to move, thereby adjusting the distance between the bending mechanism and the bending platform, so that the device can be suitable for high-power semiconductor modules of different models, and simultaneously can adjust the bending position, the second motor drives the second lead screw to rotate forward when rotating forward, thereby driving the sliding block to move, further driving the moving mechanism to move towards the direction close to the bending platform, the second motor drives the second lead screw to rotate backward when rotating backward, thereby driving the sliding block to move, further driving the moving mechanism to move towards the direction far away from the bending platform, the forward and backward rotation of the first motor drives the first lead screw to rotate forward and backward, thereby driving the connecting block to move left and right, thereby realizing two-dimensional movement on the device body by the bending mechanism, therefore, the position of the bending mechanism can be flexibly adjusted, the electrode can be conveniently bent, the product quality is improved, meanwhile, manual adjustment is not needed, the labor intensity of workers is reduced, and the working efficiency is improved.
Drawings
Fig. 1 is a schematic overall structural view of a preferred embodiment of a bending apparatus for a high-power semiconductor module extraction electrode according to the present invention;
fig. 2 is a schematic structural view of a device body according to a preferred embodiment of the bending device for the extraction electrode of the high-power semiconductor module of the present invention;
fig. 3 is a schematic structural view of a bending mechanism according to a preferred embodiment of the bending apparatus for the extraction electrode of the high-power semiconductor module of the present invention;
fig. 4 is a schematic structural view of a moving mechanism of a preferred embodiment of a bending device for a high-power semiconductor module extraction electrode according to the present invention;
fig. 5 is a top view of the overall structure of a preferred embodiment of a bending apparatus for a lead-out electrode of a high-power semiconductor module according to the present invention;
fig. 6 is a schematic diagram of the internal structure of a third chute according to a preferred embodiment of the bending apparatus for the extraction electrode of the high-power semiconductor module of the present invention.
In the figure: 1-device body, 2-moving mechanism, 3-bending mechanism, 4-bending table, 5-first chute, 6-first motor, 7-first screw rod, 8-second chute, 9-third chute, 10-second screw rod, 11-connecting plate, 12-bending block, 13-through hole, 14-handle, 15-sliding block, 16-second motor, 17-electric push rod, 18-groove and 19-connecting block.
Detailed Description
In order to make the technical solutions of the present invention clearer and clearer for those skilled in the art, the present invention will be described in further detail with reference to the following embodiments and the accompanying drawings, but the embodiments of the present invention are not limited thereto.
As shown in fig. 1-6, the bending device for the extraction electrode of the high-power semiconductor module provided in this embodiment includes a device body 1 and a moving mechanism 2 slidably connected to the device body 1, the device body 1 is provided with a plurality of second chutes 8, one side of each second chute 8 is provided with a third chute 9, the inside of each third chute 9 is slidably connected to a bending platform 4, the inside of each second chute 8 is provided with a second lead screw 10, the moving mechanism 2 is provided with a first chute 5, the inside of each first chute 5 is slidably connected to a connecting block 19, the connecting block 19 is rotatably connected to a bending mechanism 3, and the inside of the moving mechanism 2 is provided with a first lead screw 7. The moving mechanism 2 moves on the device body 1 to drive the bending mechanism 3 to move, so as to adjust the distance between the bending mechanism 3 and the bending table 4, so that the device can be suitable for high-power semiconductor modules of different models, and can also adjust the bending position, the second motor 16 drives the second lead screw 10 to rotate forward when rotating forward, so as to drive the sliding block 15 to move, so as to drive the moving mechanism 2 to move towards the direction close to the bending table 4, the second motor 16 drives the second lead screw 10 to rotate backward when rotating backward, so as to drive the sliding block 15 to move, so as to drive the moving mechanism 2 to move towards the direction far away from the bending table 4, the forward and backward rotation of the first motor 6 drives the first lead screw to rotate forward and backward, so as to drive the connecting block 19 to move left and right, so that the bending mechanism 3 can realize two-dimensional movement on the device body 1, so as to flexibly adjust the position of the bending mechanism 3, the electrode of being convenient for bend has improved the quality of product, does not need manual regulation simultaneously, has reduced staff's intensity of labour, has improved work efficiency.
In this embodiment, as shown in fig. 1, a first motor 6 is disposed at one side of the moving mechanism 2, and an output end of the first motor 6 is inserted into the first sliding slot 5 and connected to a first lead screw 7. The sliding block 15 is sleeved on the second screw rod 10. The bending table 4 is provided with a plurality of grooves 18 which are uniformly arranged. The connecting block 19 is sleeved on the first screw rod 7. The first motor 6 drives the first lead screw 7 to rotate, so that the connecting block 19 is driven to reciprocate, the distance between the bending mechanism 3 and the bending table 4 is adjusted, the sliding block 15 is sleeved on the second lead screw 10, the sliding block 15 is driven to move when the second lead screw 10 rotates, the front-back distance between the bending mechanism 3 and the bending table 4 is adjusted, the uniformly-arranged grooves 18 facilitate positioning of the extraction electrodes, and the accuracy of the extraction electrodes is improved.
In the present embodiment, as shown in fig. 3 and 4, the bending mechanism 3 includes a connecting plate 11, a handle 14 is fixedly connected to a top of the connecting plate 11, a plurality of bending blocks 12 are fixedly connected to a bottom of the connecting plate 11, and through holes 13 are formed in the bending blocks 12. The bottom of the moving mechanism 2 is fixedly connected with sliding blocks 15 with the same number as the second sliding chutes 8. The length of the slide block 15 is smaller than the width of the moving mechanism 2. A plurality of bending blocks 12 of connecting plate 11 fixed connection can increase the quantity that extraction electrode was bent, and then improves the efficiency of bending, drives through turning handle 14 and bends 12 a plurality of extraction electrodes, easy operation, convenience, and second spout 8 is the same with the quantity of sliding block 15, the assembly of being convenient for, and the width of moving mechanism 2 is greater than the length of sliding block 15, and the moving mechanism 2 of being convenient for is close to the platform 3 of bending.
In the present embodiment, as shown in fig. 5 and 6, a plurality of second motors 16 are provided on the back surface of the apparatus body 1, and output ends of the second motors 16 are inserted into the second sliding grooves 8 and connected to the second lead screws 10. A plurality of electric push rods 17 are arranged inside the third sliding chute 9, and the electric push rods 17 are connected with the bottom of the bending table 4. The second motor 16 drives the second screw rod 10 to rotate, so as to drive the sliding block 15 to move, so that the moving mechanism 2 is close to or far away from the bending table 4, the electric push rod 17 pushes the bending table 4 to move up and down, and the up-and-down position of the extraction electrode is adjusted, so that the three-dimensional linkage of the device is realized.
In this embodiment, as shown in fig. 1 to fig. 6, the working process of the bending apparatus for the extraction electrode of the power semiconductor module provided in this embodiment is as follows:
step 1: installing the extraction electrode in the groove 18, starting a second motor to drive a second screw rod to rotate to adjust the front-back distance between the moving mechanism 2 and the bending table 4, and starting a first motor 6 to drive a first screw rod 7 to rotate to adjust the left-right distance between the bending mechanism 3 and the bending table 4;
step 2: and starting the electric push rod 17 to adjust the vertical height of the bending mechanism, and after the adjustment is finished, rotating the handle 14 to drive the bending block 12 to bend the extraction electrode.
In summary, in the embodiment, according to the bending apparatus for the extraction electrode of the high power semiconductor module of the embodiment, the first motor 6 drives the first lead screw 7 to rotate, so as to drive the connecting block 19 to reciprocate, and further adjust the distance between the bending mechanism 3 and the bending table 4, the second lead screw 10 is sleeved with the sliding block 15, and when the second lead screw 10 rotates, the sliding block 15 is driven to move, so as to adjust the front-back distance between the bending mechanism 3 and the bending table 4, and the plurality of uniformly arranged grooves 18 facilitate the positioning of the extraction electrode, thereby improving the accuracy of the bending of the extraction electrode; the bending blocks 12 fixedly connected with the connecting plate 11 can increase the bending number of the extraction electrodes, so that the bending efficiency is improved, the bending blocks 12 are driven by the rotating handle 14 to bend the extraction electrodes, the operation is simple and convenient, the second sliding grooves 8 and the sliding blocks 15 are the same in number and are convenient to assemble, the width of the moving mechanism 2 is larger than the length of the sliding blocks 15, and the moving mechanism 2 is convenient to approach the bending table 3; the second motor 16 drives the second screw rod 10 to rotate, so as to drive the sliding block 15 to move, so that the moving mechanism is close to or far away from the bending table, the electric push rod 17 pushes the bending table 4 to move up and down, the up-and-down position of the extraction electrode is adjusted, and therefore three-dimensional linkage of the device is achieved.
The above description is only a further embodiment of the present invention, but the scope of protection of the present invention is not limited thereto, and any person skilled in the art can replace or change the technical solution and the concept of the present invention within the scope of the present invention.
Claims (10)
1. The bending device for the extraction electrode of the high-power semiconductor module is characterized by comprising a device body (1) and a moving mechanism (2) which is connected with the device body (1) in a sliding mode, wherein a plurality of second sliding grooves (8) are formed in the device body (1), a third sliding groove (9) is formed in one side of the second sliding groove (8), a bending table (4) is connected to the inside of the third sliding groove (9) in a sliding mode, a second lead screw (10) is arranged inside the second sliding groove (8), a first sliding groove (5) is formed in the moving mechanism (2), a connecting block (19) is connected to the inside of the first sliding groove (5) in a sliding mode, the connecting block (19) is connected with a bending mechanism (3) in a rotating mode, and a first lead screw (7) is arranged inside the moving mechanism (2).
2. The bending device for the extraction electrode of the high power semiconductor module according to claim 1, wherein a plurality of second motors (16) are arranged on the back surface of the device body (1), and the output ends of the second motors (16) are inserted into the second sliding grooves (8) and connected with the second lead screws (10).
3. The device for bending the extraction electrode of the high power semiconductor module according to claim 1, wherein a first motor (6) is disposed at one side of the moving mechanism (2), and an output end of the first motor (6) is inserted into the first sliding groove (5) and connected to the first lead screw (7).
4. The bending device for the extraction electrode of the high-power semiconductor module as claimed in claim 1, wherein the bottom of the moving mechanism (2) is fixedly connected with the same number of sliding blocks (15) as the second sliding grooves (8).
5. The device according to claim 4, wherein the sliding block (15) is sleeved on the second lead screw (10).
6. A bending device for leading-out electrodes of power semiconductor modules according to claim 4, characterized in that the length of the sliding block (15) is smaller than the width of the moving mechanism (2).
7. The bending device for the extraction electrode of the high-power semiconductor module as claimed in claim 1, wherein the bending mechanism (3) comprises a connecting plate (11), a handle (14) is fixedly connected to the top of the connecting plate (11), a plurality of bending blocks (12) are fixedly connected to the bottom of the connecting plate (11), and through holes (13) are formed in the bending blocks (12).
8. The bending device for the extraction electrode of the high-power semiconductor module as claimed in claim 1, wherein the bending table (4) is provided with a plurality of uniformly arranged grooves (18).
9. The device for bending the extraction electrode of the high-power semiconductor module according to claim 1, wherein a plurality of electric push rods (17) are arranged inside the third sliding chute (9), and the electric push rods (17) are connected with the bottom of the bending table (4).
10. The bending device for the extraction electrode of the high-power semiconductor module as claimed in claim 1, wherein the connecting block (19) is sleeved on the first lead screw (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022974125.8U CN214078976U (en) | 2020-12-12 | 2020-12-12 | Bending device for leading-out electrode of high-power semiconductor module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022974125.8U CN214078976U (en) | 2020-12-12 | 2020-12-12 | Bending device for leading-out electrode of high-power semiconductor module |
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| Publication Number | Publication Date |
|---|---|
| CN214078976U true CN214078976U (en) | 2021-08-31 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022974125.8U Active CN214078976U (en) | 2020-12-12 | 2020-12-12 | Bending device for leading-out electrode of high-power semiconductor module |
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| Country | Link |
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| CN (1) | CN214078976U (en) |
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- 2020-12-12 CN CN202022974125.8U patent/CN214078976U/en active Active
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