CN213388492U - Integrated high-elasticity adhesive tape for heat dissipation module - Google Patents
Integrated high-elasticity adhesive tape for heat dissipation module Download PDFInfo
- Publication number
- CN213388492U CN213388492U CN202022017619.7U CN202022017619U CN213388492U CN 213388492 U CN213388492 U CN 213388492U CN 202022017619 U CN202022017619 U CN 202022017619U CN 213388492 U CN213388492 U CN 213388492U
- Authority
- CN
- China
- Prior art keywords
- layer
- heat dissipation
- powder
- dissipation module
- elasticity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Adhesive Tapes (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The utility model relates to the technical field of adhesive tapes for LCD/OLED screens, in particular to an integrated high-elasticity adhesive tape for a heat dissipation module, which consists of a release layer, a first adhesive layer, a high-resilience foam layer, a second adhesive layer and a heat dissipation metal layer which are compounded in sequence, wherein the second adhesive layer is an acrylate pressure-sensitive adhesive layer doped with heat-conducting powder; need not extra manual work and apply the copper foil sticky tape, avoided traditional mode to produce bubble, pleat seal and influence sensitization effect and radiating effect, raise the efficiency, use manpower sparingly.
Description
Technical Field
The utility model relates to a sticky tape technical field for LCD OLED screen, concretely relates to high elasticity sticky tape of integration for heat dissipation module.
Background
The existing LCD/OLED screen is thin, screen breakage easily occurs in the process of assembly or use, foam is usually required to be added in the screen manufacturing process to serve as a buffer protection layer, but heat dissipation measures are required to be added due to the poor heat conduction performance of the foam.
Generally, a heat dissipation module of an LCD/OLED screen generally comprises a screen, an acrylic foam buffer layer and a copper foil tape, the number of materials is large, the process is complicated in the assembly process, the copper foil tape needs to be manually pasted on the acrylic foam buffer layer, bubbles and creases are easily generated between the acrylic foam buffer layer and the copper foil tape after the pasting, and the yield is difficult to improve.
Disclosure of Invention
In order to overcome the shortcoming and the deficiency that exist among the prior art, the utility model aims to provide an integration high elasticity sticky tape for heat dissipation module need not extra artifical laminating copper foil sticky tape, has avoided traditional mode to produce bubble, pleat seal and influences sensitization effect and radiating effect, raises the efficiency, uses manpower sparingly.
The purpose of the utility model is realized through the following technical scheme: the utility model provides an integration high elasticity sticky tape for heat dissipation module, by compound in proper order from type layer, first viscose layer, high resilience bubble cotton layer, second viscose layer and heat dissipation metal level constitute, the second viscose layer is for adulterating the acrylic ester pressure sensitive adhesive layer that has heat conduction powder.
Preferably, the heat conductive powder is alumina powder, magnesia powder, silica powder, aluminum hydroxide powder, antimony trioxide powder, graphite powder, carbon nanotube powder or graphene powder.
Preferably, the release layer is a reticulated release film.
Preferably, the first adhesive layer and the composite surface of the release layer are in a grid shape, and the first adhesive layer is an acrylate pressure sensitive adhesive layer or a PET double-sided adhesive layer.
Preferably, the high resilience foam layer is an acrylic foam layer, a polyurethane foam layer or an organosilicon foam layer.
Preferably, the heat dissipation metal layer is a copper foil, an aluminum foil, a nano carbon copper layer, a nano carbon aluminum layer, a nickel-plated copper foil, a gold-plated copper foil, a tin-plated copper foil, an ultra-thin stainless steel layer, an iron-copper alloy layer or a beryllium-copper alloy layer.
Preferably, the release layer has an average thickness of 50 to 100 μm.
Preferably, the average thickness of the first adhesive layer is 10-30 μm, and the thickness of the second adhesive layer is 10-35 μm.
Preferably, the thickness of the high resilience foam layer is 50-250 μm.
Preferably, the thickness of the heat dissipation metal layer is 10-75 μm.
The beneficial effects of the utility model reside in that: the utility model discloses an integration high elasticity sticky tape for heat dissipation module need not extra artifical subsides and applies the copper foil sticky tape, has avoided traditional mode gassing, pleat seal and has influenced sensitization effect and radiating effect, raises the efficiency, uses manpower sparingly, the heat dissipation module of specially adapted LCD/OLED screen. In addition, the second adhesive layer of the integrated high-elasticity adhesive tape is an acrylate pressure-sensitive adhesive layer doped with heat-conducting powder, and after the second adhesive layer is compounded with the heat-dissipation metal layer, the heat of the high-resilience foam layer is conducted to the heat-dissipation metal layer in time, so that the heat dissipation of the integrated high-elasticity adhesive tape is promoted, and the heat dissipation effect is further improved.
Drawings
Fig. 1 is a schematic structural diagram of the present invention;
the reference signs are: 1. a release layer; 2. a first adhesive layer; 3. a high resilience foam layer; 4. a second adhesive layer; 5. and the heat dissipation metal layer.
Detailed Description
In order to facilitate understanding of those skilled in the art, the present invention will be further described with reference to the following examples and accompanying drawings, which are not intended to limit the present invention.
As shown in fig. 1, an integrated high-elasticity adhesive tape for a heat dissipation module comprises a release layer 1, a first adhesive layer 2, a high-resilience foam layer 3, a second adhesive layer 4 and a heat dissipation metal layer 5 which are sequentially compounded, wherein the second adhesive layer 4 is an acrylate pressure sensitive adhesive layer doped with heat conduction powder.
The integrated high-elasticity adhesive tape for the heat dissipation module does not need to be additionally and manually pasted with a copper foil adhesive tape, avoids the influence on the photosensitive effect and the heat dissipation effect caused by bubbles and creases generated in the traditional mode, improves the efficiency, saves the labor and is particularly suitable for the heat dissipation module of an LCD/OLED screen. In addition, the second adhesive layer 4 of the integrated high-elasticity adhesive tape is an acrylate pressure-sensitive adhesive layer doped with heat-conducting powder, and after being compounded with the heat-dissipation metal layer 5, the heat of the high-resilience foam layer 3 is timely conducted to the heat-dissipation metal layer 5, so that the heat dissipation of the integrated high-elasticity adhesive tape is promoted, and the heat dissipation effect is further improved. The acrylate pressure-sensitive adhesive layer doped with the heat conduction powder is formed by coating commercially available acrylate pressure-sensitive adhesive doped with the heat conduction powder on the heat dissipation metal layer 5 conventionally and drying.
In this embodiment, the heat conductive powder is alumina powder, magnesia powder, silica powder, aluminum hydroxide powder, antimony trioxide powder, graphite powder, carbon nanotube powder, or graphene powder.
By adopting the technical scheme, the heat of the high-resilience foam layer 3 is conducted to the heat dissipation metal layer 5 by the second adhesive layer 4, so that the heat dissipation of the integrated high-elasticity adhesive tape is promoted, and the heat dissipation effect is further improved. Preferably, the heat conductive powder is alumina powder, aluminum hydroxide powder, graphite powder, carbon nanotube powder, or graphene powder, and more preferably, the heat conductive powder is graphene powder.
In this embodiment, the release layer 1 is a textured release film; first viscose layer 2 with it is latticed to be from the compound one side of type layer 1, first viscose layer 2 is acrylate pressure sensitive adhesive layer or PET double-sided adhesive layer.
Adopt above-mentioned technical scheme, set up the reticulation from type layer 1 to the reticulation and leave the type membrane, make first viscose layer 2 and be latticed with the one side of leaving the type layer 1 complex to tear the reticulation and lean on first viscose layer 2 from the type membrane to support to self-leveling and closely laminating behind the LCD/OLED screen when using. Further, the first adhesive layer 2 is formed by coating commercially available acrylate pressure-sensitive adhesive on the high-resilience foam layer 3 and then drying the commercially available acrylate pressure-sensitive adhesive, or is formed by adhering commercially available PET double-faced adhesive to the high-resilience foam layer 3. Preferably, the first adhesive layer 2 is formed by coating commercially available acrylate pressure-sensitive adhesive on the high-resilience foam layer 3 and drying the coated high-resilience foam layer
In this embodiment, the high resilience foam layer 3 is an acrylic foam layer, a polyurethane foam layer or a silicone foam layer.
By adopting the technical scheme, the acrylic acid foam cotton layer, the polyurethane foam cotton layer and the organic silicon foam cotton layer are high-resilience foam cotton sold on the market, and the acrylic acid foam cotton layer, the polyurethane foam cotton layer and the organic silicon foam cotton layer have super-softness and high resilience, play a good role in buffering protection and are only used as applications. Preferably, the high resilience foam layer 3 is an acrylic foam layer.
In this embodiment, the heat dissipation metal layer 5 is a copper foil, an aluminum foil, a nano carbon copper layer, a nano carbon aluminum layer, a nickel-plated copper foil, a gold-plated copper foil, a tin-plated copper foil, an ultra-thin stainless steel layer, an iron-copper alloy layer, or a beryllium-copper alloy layer.
By adopting the technical scheme, the copper foil, the aluminum foil, the nano carbon copper layer, the nano carbon aluminum layer, the nickel-plated copper foil, the gold-plated copper foil, the tin-plated copper foil, the ultrathin stainless steel layer, the iron-copper alloy layer or the beryllium-copper alloy layer are all the commercially available heat dissipation metal layers 5, and the integrated high-elasticity adhesive tape has high heat conductivity and promotes heat dissipation, and is only used as an application.
In this embodiment, the average thickness of the release layer 1 is 50 to 100 μm, the average thickness of the first adhesive layer 2 is 10 to 30 μm, the thickness of the high resilience foam layer 3 is 50 to 250 μm, the thickness of the second adhesive layer 4 is 10 to 35 μm, and the thickness of the heat dissipation metal layer 5 is 10 to 75 μm.
By adopting the technical scheme, the release layer 1 is ensured to have enough thickness to protect the integrated high-elasticity adhesive tape, and the viscosity of the first adhesive layer 2 is prevented from being reduced due to water or dust; the high-resilience foam layer 3 is ensured to have enough thickness to provide a buffer effect, and the screen is prevented from being cracked; ensuring that the second adhesive layer 4 has a sufficient thickness to provide adhesion while at the same time conducting heat more rapidly. Preferably, the release layer 1 has an average thickness of 50 μm, 55 μm, 60 μm, 65 μm, 70 μm, 75 μm, 80 μm, 85 μm, 90 μm or 100 μm, the first adhesive layer 2 has an average thickness of 10 μm, 12 μm, 15 μm, 18 μm, 20 μm, 23 μm, 25 μm, 28 μm or 30 μm, the high resilience foam layer 3 has a thickness of 50 μm, 55 μm, 60 μm, 65 μm, 70 μm, 75 μm, 80 μm, 85 μm, 90 μm, 100 μm, 120 μm, 150 μm, 180 μm, 200 μm, 220 μm or 250 μm, the second adhesive layer 4 has a thickness of 10 μm, 12 μm, 15 μm, 18 μm, 20 μm, 23 μm, 25 μm, 28 μm, 32 μm or 35 μm, and the metal layer 4 has a thickness of 10 μm, 15 μm, 20 μm, 25 μm, 15 μm or 5 μm, 25 μm, 30 μm, 38 μm, 42 μm, 53 μm, 58 μm, 61 μm, 65 μm, 68 μm, 70 μm or 75 μm. More preferably, the average thickness of the release layer 1 is 80 μm, the average thickness of the first adhesive layer 2 is 20 μm, the thickness of the high resilience foam layer 3 is 150 μm, the thickness of the second adhesive layer 4 is 22 μm, and the thickness of the heat dissipation metal layer 5 is 45 μm.
The above-mentioned embodiment is the utility model discloses the implementation of preferred, in addition, the utility model discloses can also realize by other modes, not deviating from the utility model discloses any obvious replacement is all within the protection scope under the prerequisite of design.
Claims (10)
1. The utility model provides an integration high elasticity sticky tape for heat dissipation module which characterized in that: the heat-conducting acrylic pressure-sensitive adhesive film is characterized by comprising a release layer, a first adhesive layer, a high-resilience foam layer, a second adhesive layer and a heat-radiating metal layer which are sequentially compounded, wherein the second adhesive layer is an acrylic ester pressure-sensitive adhesive layer doped with heat-conducting powder.
2. The integrated high-elasticity adhesive tape for the heat dissipation module as set forth in claim 1, wherein: the heat conducting powder is alumina powder, magnesia powder, silicon dioxide powder, aluminum hydroxide powder, antimony trioxide powder, graphite powder, carbon nanotube powder or graphene powder.
3. The integrated high-elasticity adhesive tape for the heat dissipation module as set forth in claim 1, wherein: the release layer is a reticulate release film.
4. The integrated high-elasticity adhesive tape for the heat dissipation module as set forth in claim 1, wherein: the first adhesive layer and the composite surface of the release layer are in a grid shape, and the first adhesive layer is an acrylate pressure sensitive adhesive layer or a PET double-sided adhesive layer.
5. The integrated high-elasticity adhesive tape for the heat dissipation module as set forth in claim 1, wherein: the high-resilience foam layer is an acrylic foam layer, a polyurethane foam layer or an organic silicon foam layer.
6. The integrated high-elasticity adhesive tape for the heat dissipation module as set forth in claim 1, wherein: the heat dissipation metal layer is a copper foil, an aluminum foil, a nano carbon copper layer, a nano carbon aluminum layer, a nickel-plated copper foil, a gold-plated copper foil, a tin-plated copper foil, an ultrathin stainless steel layer, an iron-copper alloy layer or a beryllium-copper alloy layer.
7. The integrated high-elasticity adhesive tape for the heat dissipation module as set forth in claim 1, wherein: the average thickness of the release layer is 50-100 μm.
8. The integrated high-elasticity adhesive tape for the heat dissipation module as set forth in claim 1, wherein: the average thickness of the first adhesive layer is 10-30 μm, and the thickness of the second adhesive layer is 10-35 μm.
9. The integrated high-elasticity adhesive tape for the heat dissipation module as set forth in claim 1, wherein: the thickness of the high resilience foam layer is 50-250 μm.
10. The integrated high-elasticity adhesive tape for the heat dissipation module as set forth in claim 1, wherein: the thickness of the heat dissipation metal layer is 10-75 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022017619.7U CN213388492U (en) | 2020-09-15 | 2020-09-15 | Integrated high-elasticity adhesive tape for heat dissipation module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022017619.7U CN213388492U (en) | 2020-09-15 | 2020-09-15 | Integrated high-elasticity adhesive tape for heat dissipation module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213388492U true CN213388492U (en) | 2021-06-08 |
Family
ID=76217168
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022017619.7U Active CN213388492U (en) | 2020-09-15 | 2020-09-15 | Integrated high-elasticity adhesive tape for heat dissipation module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213388492U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113801603A (en) * | 2021-10-20 | 2021-12-17 | 福建友谊胶粘带集团有限公司 | Ultrathin heat-conducting adhesive tape and preparation method thereof |
| CN116284976A (en) * | 2023-02-24 | 2023-06-23 | 苏州德佑新材料科技股份有限公司 | Acrylic ester foam and preparation method and application thereof |
-
2020
- 2020-09-15 CN CN202022017619.7U patent/CN213388492U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113801603A (en) * | 2021-10-20 | 2021-12-17 | 福建友谊胶粘带集团有限公司 | Ultrathin heat-conducting adhesive tape and preparation method thereof |
| CN116239963A (en) * | 2021-10-20 | 2023-06-09 | 福建友谊胶粘带集团有限公司 | Heat conduction adhesive tape and preparation method thereof |
| CN116239963B (en) * | 2021-10-20 | 2024-05-28 | 福建友谊胶粘带集团有限公司 | Heat conduction adhesive tape and preparation method thereof |
| CN116284976A (en) * | 2023-02-24 | 2023-06-23 | 苏州德佑新材料科技股份有限公司 | Acrylic ester foam and preparation method and application thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN213388492U (en) | Integrated high-elasticity adhesive tape for heat dissipation module | |
| TW201207606A (en) | Heat radiation tape and manufacturing method thereof | |
| CN113257138A (en) | Display module and display device | |
| TWI459090B (en) | Light emitted diode back light unit | |
| CN214164264U (en) | Combined type graphite copper foil diaphragm | |
| CN103031081A (en) | Shading thermal diffusion film | |
| CN215643441U (en) | Display module and display device | |
| CN212864644U (en) | High-viscosity composite adhesive tape | |
| CN210838228U (en) | TTL changes LVDS keysets | |
| CN207276539U (en) | A kind of conduction shading rubber belt | |
| CN216871498U (en) | LED flexible screen | |
| CN215627739U (en) | Be applied to heat dissipation of NVME interface SSD card and label | |
| CN219991474U (en) | Heat dissipation fixing adhesive tape for OLED high-brushing screen | |
| CN216775401U (en) | Conductive foam with good elastic stability | |
| CN210481276U (en) | Single-sided adhesive tape easy for coating heat-conducting silica gel | |
| CN210381717U (en) | Composite heat-conducting gasket | |
| CN112194987B (en) | Easily peel off outdoor advertisement automobile body subsides | |
| CN214361129U (en) | Integrated functional adhesive tape | |
| CN209741053U (en) | Dynamic black glue | |
| CN112194988B (en) | Preparation method of outdoor advertisement vehicle body sticker | |
| CN211847782U (en) | Be applied to silica gel damping fin structure of lid behind cell-phone battery | |
| CN213279732U (en) | Cell-phone OLED screen blotter | |
| CN214361128U (en) | Functional adhesive tape for AMOLED screen | |
| CN213060724U (en) | Reticulated foam adhesive tape | |
| CN211170565U (en) | High-compaction-degree connector compaction foam |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |