CN212876488U

CN212876488U - Heat sink device

Info

Publication number: CN212876488U
Application number: CN202021877886.5U
Authority: CN
Inventors: 罗瑞
Original assignee: Shenzhen Ranvoo Technology Co Ltd
Current assignee: Shenzhen Ranvoo Technology Co Ltd
Priority date: 2020-08-31
Filing date: 2020-08-31
Publication date: 2021-04-02
Anticipated expiration: 2030-08-31

Abstract

The utility model provides a heat dissipation device, which is used for dissipating heat for a mobile terminal and comprises a heat radiator component and a fan component, wherein the fan component is detachably fixed on the heat radiator component or the mobile terminal; when the fan assembly is fixed on the mobile terminal, the fan assembly dissipates heat for the mobile terminal. Through the arrangement, the use scenes of the heat dissipation device are enriched, and a user can match different heat dissipation devices according to different heat dissipation requirements of the mobile terminal, so that energy is saved.

Description

Heat sink device

Technical Field

The utility model relates to a mobile terminal accessory technical field, in particular to can be radiating heat abstractor of mobile terminal.

Background

The heat dissipation structure and the heat dissipation mode of the conventional heat dissipation device are relatively fixed, and when the mobile terminal is fixed to the heat dissipation device, the heat dissipation device utilizes inherent fixed heat dissipation strength to dissipate heat for the mobile terminal regardless of the heat dissipation requirement of the mobile terminal. When the heat dissipation requirement of the mobile terminal is small, the energy waste can be caused to a certain extent by utilizing the large heat dissipation strength to dissipate heat of the mobile terminal; when the heat dissipation requirement of the mobile terminal is large, the heat dissipation strength is too small to meet the heat dissipation requirement of the mobile terminal, and the use scene of the heat dissipation device is limited.

SUMMERY OF THE UTILITY MODEL

In view of this, the utility model provides a heat abstractor with many use scenes.

The utility model provides a heat dissipation device, which is used for dissipating heat for a mobile terminal and comprises a heat radiator component and a fan component, wherein the fan component is detachably fixed on the heat radiator component or the mobile terminal; when the fan assembly is fixed on the mobile terminal, the fan assembly dissipates heat for the mobile terminal.

In an embodiment, the heat sink assembly includes a first housing, and a heat conducting sheet, a semiconductor refrigeration sheet and a heat dissipating member disposed on the first housing, the semiconductor refrigeration sheet is disposed between the heat conducting sheet and the heat dissipating member, a cold end surface of the semiconductor refrigeration sheet contacts the heat conducting sheet, a hot end surface of the semiconductor refrigeration sheet contacts the heat dissipating member, the heat conducting sheet is used for conducting heat generated by the mobile terminal to the heat dissipating member, the fan assembly includes a second housing and a fan disposed in the second housing, the second housing is detachably fixed to the first housing or the mobile terminal, and the fan is the heat dissipating member or the mobile terminal dissipates heat.

In an embodiment, the fan assembly further includes a circuit board disposed in the second housing, the fan is electrically connected to the circuit board, the circuit board is provided with a power interface, the power interface is used for conducting with an external power source, a first conductive portion is disposed on a side of the first housing facing the second housing, the first conductive portion is electrically connected to the semiconductor cooling plate, a second conductive portion is disposed on a side of the second housing facing the first housing, and the second conductive portion is electrically connected to the circuit board.

In an embodiment, one of the first conductive part and the second conductive part is a conductive sheet, and the other of the first conductive part and the second conductive part is a pogo pin; or, one of the first conductive part and the second conductive part is a USB plug, and the other of the first conductive part and the second conductive part is a USB socket.

In an embodiment, the fan assembly further includes a rechargeable battery disposed in the second housing and electrically connected to the circuit board.

In one embodiment, the heat dissipating member includes a heat dissipating substrate and a plurality of heat dissipating fins extending from the heat dissipating substrate toward a side away from the semiconductor chilling plate, a heat dissipating passage is formed between two adjacent heat dissipating fins, the first housing includes a first front shell and a first rear shell that are butted with each other, the first front shell is provided with a receiving groove, the semiconductor chilling plate is disposed in the receiving groove, a partition plate is disposed in the first rear shell, the partition plate partitions a space in the first rear shell into a first chamber and a second chamber, the heat dissipating member is disposed in the first chamber, the first housing is provided with a hot air outlet and a cold air outlet, the hot air outlet is communicated with the heat dissipating passage, the cold air outlet is communicated with the second chamber, the heat conducting plate is disposed on a side of the first front shell away from the first rear shell and covers the second chamber, one side of the first rear shell, which is far away from the first front shell, is provided with an opening communicated with the first cavity and the second cavity.

In an embodiment, an air inlet and an air outlet are respectively disposed on two sides of the second housing corresponding to the opening position, the fan is disposed between the air inlet and the air outlet, so that air generated by the fan enters the first chamber and the second chamber through the air outlet and the opening, the second housing includes a second front shell and a second rear shell that are butted with each other, the air outlet is disposed on the second front shell, and the air inlet is disposed on the second rear shell.

In some embodiments, the first housing is provided with a first claw and a second claw for clamping the mobile terminal, the first claw is disposed at the top end of the first housing, the second claw is movably disposed at the bottom end of the first housing through a first elastic member, and the first elastic member applies an elastic bias to the second claw to move the second claw towards the first claw, and the elastic bias provides a clamping pre-load force.

In some embodiments, the second housing is provided with a third jaw and a fourth jaw, the third jaw is disposed at the top end of the second housing, the fourth jaw is movably disposed at the bottom end of the second housing through a second elastic member, the second elastic member applies another elastic bias to the fourth jaw to move the fourth jaw toward the third jaw, and the another elastic bias provides clamping preload; when the fan assembly is fixed on the radiator assembly, the third clamping jaw and the fourth clamping jaw are clamped on the first shell; when the fan assembly is fixed on the mobile terminal, the third jaw and the fourth jaw are clamped on the mobile terminal.

In some embodiments, the second housing is provided with a third jaw and a fourth jaw, the third jaw is disposed at the top end of the second housing, the fourth jaw is movably disposed at the bottom end of the second housing through a second elastic member, the second elastic member applies another elastic bias to the fourth jaw to move the fourth jaw toward the third jaw, and the another elastic bias provides clamping preload; when the fan assembly is fixed to the radiator assembly, the third clamping jaw and the fourth clamping jaw respectively protrude forwards from the front end face of the heat conducting fin, so that the mobile terminal is clamped between the third clamping jaw and the fourth clamping jaw.

To sum up, the utility model provides a heat abstractor sets up fan assembly on detachably is fixed in radiator assembly or mobile terminal, when needs dispel the heat for mobile terminal by a wide margin, is fixed in the radiator assembly with radiator assembly on, on mobile terminal was fixed in radiator assembly, radiator assembly dispels the heat for mobile terminal, and fan assembly dispels the heat for radiator assembly to satisfy the heat dissipation demand by a wide margin. When the mobile terminal does not need to be greatly cooled, the mobile terminal can be directly fixed on the fan assembly, the radiator assembly is not arranged, and the fan assembly is only used for cooling. The utility model discloses a heat abstractor simple structure, convenient operation has richened heat abstractor's use scene, and the user can be according to the different heat abstractor of the different heat dissipation demand collocation of mobile terminal, the energy can be saved.

Drawings

Fig. 1 is a perspective view of a heat dissipation device at an angle.

Fig. 2 is an exploded view of the heat dissipation device in fig. 1.

Fig. 3 is an exploded view of the heat sink assembly of fig. 2.

Fig. 4 is an exploded view of the fan assembly of fig. 2.

Fig. 5 is a perspective view of the heat dissipation device at another angle.

Fig. 6 is an exploded view of the heat dissipation device in fig. 5.

Fig. 7 is an exploded view of the heat sink assembly of fig. 6.

Fig. 8 is an exploded view of the fan assembly of fig. 6.

Fig. 9 is a side cross-sectional view of a heat sink.

Fig. 10 is a cross-sectional view of a heat sink.

Detailed Description

Before the embodiments are described in detail, it is to be understood that the invention is not limited in its application to the details of construction and the arrangements of components set forth in the following description or illustrated in the drawings. The utility model discloses can be the embodiment that other modes realized. Also, it is to be understood that the phraseology and terminology used herein is for the purpose of description and should not be regarded as limiting. The use of "including," "comprising," "having," and the like, herein is meant to encompass the items listed thereafter and equivalents thereof as well as additional items. In particular, when "a certain element" is described, the present invention is not limited to the number of the element being one, and may include a plurality of the elements.

As shown in fig. 1-10, the present invention provides a heat dissipation apparatus 10 for dissipating heat for a mobile terminal, wherein the heat dissipation apparatus 10 can be used for a heat dissipation bracket for clamping and fixing the mobile terminal and dissipating heat for the mobile terminal. The mobile terminal is, for example, a mobile phone, a tablet computer, etc., and the present invention is described by taking a mobile phone as an example.

The heat dissipating device 10 includes a heat sink assembly 12 and a fan assembly 14, the handset is detachably secured to the heat sink assembly 12 or the fan assembly 14, and the heat sink assembly 12 is detachably secured to the fan assembly 14. In some embodiments, when the handset is removably secured to the heat sink assembly 12 and the heat sink assembly 12 is removably secured to the fan assembly 14, the heat sink assembly 12 dissipates heat from the handset and the fan assembly 14 dissipates heat from the heat sink assembly 12. In other embodiments, when the handset is removably secured to the fan assembly 14, the heat sink assembly 12 may be eliminated and the fan assembly 14 may be utilized to dissipate heat from the handset.

Fig. 1-10 illustrate an embodiment of a heat dissipation device 10 that utilizes both a heat sink assembly 12 and a fan assembly 14 for heat dissipation.

Specifically, the heat sink assembly 12 includes a first housing 16, and a heat conducting sheet 18, a semiconductor cooling sheet 20 and a heat dissipating member 22 disposed on the first housing 16, wherein the semiconductor cooling sheet 20 is located between the heat conducting sheet 18 and the heat dissipating member 22. The semiconductor refrigeration piece 20 has a cold end face and a hot end face which are opposite to each other, the cold end face of the semiconductor refrigeration piece 20 is in contact with the heat conduction piece 18, and the hot end face of the semiconductor refrigeration piece 20 is in contact with the heat dissipation piece 22. Preferably, the cold end surface of the semiconductor refrigeration sheet 20 is provided with a heat-conducting glue to contact with the heat-conducting sheet 18, and the hot end surface of the semiconductor refrigeration sheet 20 is also provided with a heat-conducting glue to contact with the heat dissipation member 22, so that the contact reliability of the semiconductor refrigeration sheet 20 with the heat-conducting sheet 18 and the heat dissipation member 22 is ensured. The first casing 16 is provided with a first conductive part at a side facing the fan assembly 14, and the first conductive part is electrically connected with the semiconductor cooling plate 20. The heat conducting sheet 18 is used for contacting with the back of a mobile phone, for example, the mobile phone, and the heat conducting sheet 18 is cooled rapidly under the action of the cold end surface of the semiconductor refrigeration sheet 20 to become cold, so as to cool the mobile phone and lead out heat emitted by the mobile phone. The heat emitted from the mobile phone is conducted to the heat sink 22 through the heat conducting sheet 18 and the semiconductor cooling sheet 20, and the heat is dissipated by the heat sink 22, so that the mobile phone is cooled.

In the illustrated embodiment, the heat dissipating member 22 includes a heat dissipating substrate 24 and a plurality of heat dissipating fins 26 extending from the heat dissipating substrate 24 toward a side away from the semiconductor cooling plate 20, the plurality of heat dissipating fins 26 are spaced apart, and a heat dissipating passage 28 is formed between two adjacent heat dissipating fins 26 for dissipating heat generated by the heat dissipating member 22 through the heat dissipating passage 28.

More specifically, the first housing 16 includes a first front shell 30 and a first rear shell 32 that are butted against each other, and the first front shell 30 and the first rear shell 32 are connected by, for example, a snap connection. The first front case 30 is provided with an accommodating groove 34, the semiconductor chilling plate 20 is accommodated in the accommodating groove 34, and the cold end surface and the hot end surface of the semiconductor chilling plate respectively protrude from two sides of the accommodating groove 34 to respectively contact with the heat conducting plate 18 and the heat dissipation substrate 24 of the heat dissipation member 22. Two partition plates 36 extending in the vertical direction and arranged at intervals are arranged in the first rear case 32, and the two partition plates 36 divide the space in the first rear case 32 into a first chamber 38 located between the two partition plates 36 and second chambers 40 located at two sides of the two partition plates 36, so that the first chamber 38 and the second chambers 40 are arranged in a mutually separated manner. The first front shell 30 covers the first cavity 38, the heat sink 22 is accommodated in the first cavity 38 and fixed to the first front shell 30, the heat conducting strip 18 is disposed on a side of the first front shell 30 away from the first rear shell 32 and covers the first front shell 30, a rear end surface of the heat conducting strip 18 is in butt joint with a front end surface of the first rear shell 32, the heat conducting strip 18 covers the second cavity 40, and the heat conducting strip 18 is located on an airflow flow path of the second cavity 40.

In other embodiments, only one or more than two partition boards 36 may be disposed in the receiving space of the first rear housing 32, as long as the receiving space can be divided into the first chamber 38 and the second chamber 40, and the number of the partition boards 36 is not limited too much.

The first housing 16 is provided with a hot air outlet 42 and a cold air outlet 44, the hot air outlet 42 extends in the up-down direction and is communicated with the heat dissipation channel 28, the cold air outlet 44 extends in the left-right direction and is communicated with the second chamber 40, and the hot air outlet 42 and the cold air outlet 44 are arranged in a mutually separated manner, so that mutual interference between hot air from the hot air outlet 42 and cold air from the cold air outlet 44 is avoided. The hot air outlet 42 is provided at least one of the top end and the bottom end of the first casing 16 and extends in the up-down direction, and the cold air outlet 44 is provided at least one of the left and right sides of the first casing 16 and extends in the left-right direction. In the illustrated embodiment, the hot air outlets 42 are disposed at the top and bottom rear sides of the first rear case 32 corresponding to the first chamber 38, and the cold air outlets 44 are disposed at opposite sides of the first rear case 32. An upper region of the first rear case 32 on a side facing away from the first front case 30 is provided with an opening 46 communicating with the first and

second chambers

38 and 40, so that wind blown by the fan assembly 14 can enter the first and

second chambers

38 and 40 through the opening 46. The wind entering the first chamber 38 directly acts on the heat dissipating member 22, and the heat generated by the heat dissipating member 22 is blown out from the hot wind outlet 42 through the heat dissipating passage 28 extending up and down, so that the hot wind blown out from the hot wind outlet 42 does not interfere with the normal use of the mobile phone by the user. The air entering the second chamber 40 directly acts on the heat conducting sheet 18, and the heat conducting sheet 18 becomes cold under the action of the semiconductor refrigerating sheet 20, so that the air entering the second chamber 40 acts on the heat conducting sheet 18 and then is cooled into cold air, and the cold air is blown out through the cold air outlet 44, so that heat can be dissipated to the rest areas on the back of the mobile phone, which are not in contact with the heat conducting sheet 18. The first conductive part is disposed on the back surface of the first rear case 32 in a region located at the bottom side of the opening 46.

The first shell 16 is provided with a first claw 48 and a second claw 50 for clamping the mobile phone, the first claw 48 is arranged at the top end of the first shell 16, the second claw 50 is movably arranged at the bottom end of the first shell 16 through a first elastic piece 52, for example, the second claw 50 moves up and down relative to the first shell 16, so as to adjust the size of the clamping space between the first claw 48 and the second claw 50, and the mobile phone can be conveniently loaded in and taken out. The first resilient member 52 exerts a resilient bias on the second pawl 50 to move it towards the first pawl 48, the resilient bias providing the clamping preload.

In the illustrated embodiment, the first latch 48 is disposed at a top front side of the first rear case 32, for example, the first latch 48 is fixedly mounted with the first rear case 32. The bottom of the first front housing 30 is provided with a notch 54 for the second jaw 50 to move up and down, the upper region of the heat sink 22 corresponding to the notch 54 is provided with two fixing holes 56, such as screw holes, the two fixing members 58, such as screws, are fixed to the two fixing holes 56, the first elastic members 52 are provided with two springs, the top ends of the two first elastic members 52 are respectively sleeved on the two fixing members 58, and the bottom ends are respectively fixedly connected to the top ends of the second jaw 50, so that the second jaw 50 can move up and down. When the heat sink assembly 12 does not clamp the mobile phone, the hook portion of the second clamping jaw 50 abuts against the bottom of the heat conducting strip 18, for example, a bayonet is correspondingly arranged at the bottom of the heat conducting strip 18, and the hook portion of the second clamping jaw 50 is clamped in the bayonet to limit the second clamping jaw 50 and prevent the second clamping jaw from sliding left and right. In other embodiments, the first latch 48 may be configured to move up and down.

Specifically, the fan assembly 14 includes a second housing 60, and a fan 62 and a circuit board 64 disposed in the second housing 60, wherein the fan 62 is electrically connected to the circuit board 64, a power interface 66 is disposed at a bottom of the circuit board 64, and the power interface 66 is located at the bottom of the second housing 60 for connecting to an external power source. The second housing 60 is provided with an air inlet 68 and an air outlet 70 at two sides corresponding to the position of the opening 46, respectively, and the fan 62 is disposed between the air inlet 68 and the air outlet 70, so that the wind generated by the fan 62 can enter the first chamber 38 and the second chamber 40 through the air outlet 70 and the opening 46. The side of the second housing 60 facing the first housing 16 is provided with a second conductive portion for electrically connecting with the first conductive portion, and the second conductive portion is electrically connected with the circuit board 64, so as to supply power to the heat sink assembly 12 when the first conductive portion and the second conductive portion are electrically connected. In the present embodiment, the first conductive portion is implemented as a conductive sheet 72, and the second conductive portion is implemented as a pogo pin 74 engageable with the conductive sheet 72. In other embodiments, it may be provided that the first conductive part is implemented as the pogo pin 74 and the second conductive part is implemented as the conductive sheet 72, or the first conductive part and the second conductive part may be implemented as other conductive structures, such as a USB plug and a USB socket, which are mated with each other.

In other embodiments, the fan assembly 14 may further include a rechargeable battery disposed within the second housing 60 and electrically connected to the circuit board 64, such that the heat sink 10 may be internally powered for increased endurance in operation of the fan 62.

In the illustrated embodiment, the second housing 60 includes a second front shell 76 and a second rear shell 78 that interface with each other, such as a snap-fit connection. The air outlet 70 is disposed on the front end surface of the second front case 76, the air inlet 68 is disposed on the rear end surface of the second rear case 78, and the second conductive portion is disposed on the front end surface of the second front case 76 in a region on the bottom side of the air outlet 70.

The second housing 60 is provided with a third jaw 80 and a fourth jaw 82, the third jaw 80 is disposed at the top end of the second housing 60, and the fourth jaw 82 is movably disposed at the bottom end of the second housing 60 through a second elastic member 84, for example, the fourth jaw 82 moves up and down relative to the second housing 60, so as to adjust the size of the clamping space between the third jaw 80 and the fourth jaw 82, thereby facilitating clamping the heat sink assembly 12 or the mobile phone. The second resilient member 84 exerts another resilient bias on the fourth jaw 82 to move it toward the third jaw 80, the other resilient bias providing a clamping preload.

In the illustrated embodiment, the third claws 80 are provided on the tip front side of the second front case 76, for example, the third claws 80 are integrally formed with the second front case 76. The fourth jaw 82 is movably disposed at the bottom of the second front housing 76, specifically, two connecting members 86 extending in the vertical direction are disposed at the rear side of the top end of the fourth jaw 82, the connecting members 86 are, for example, columnar, the top end of the connecting members 86 is provided with an enlarged limiting portion 88, the second elastic members 84 are, for example, springs, and the two second elastic members 84 are respectively sleeved on the connecting members 86. Two sliding grooves 90 extending in the vertical direction are formed in the inner side wall of the second front shell 76 corresponding to the two connecting pieces 86, the bottom of the second front shell 76 contracts inwards to form two platforms corresponding to the two sliding grooves 90, the top ends of the two connecting pieces 86 penetrate through the two platforms respectively to enable the two limiting portions 88 to be arranged in the two sliding grooves 90 in a sliding mode respectively, the two sliding grooves 90 can further limit the stroke of the connecting pieces 86 moving up and down, one end of each second elastic piece 84 abuts against the bottom of the corresponding limiting portion 88, and the other end of each second elastic piece 84 abuts against the corresponding platform. The fourth jaw 82 is provided with an avoiding gap which corresponds to the part of the bottom of the second front shell 76 protruding between the two platforms, so that the up-and-down movement of the fourth jaw 82 is prevented from being influenced. In other embodiments, the third jaw 80 may be configured to move up and down.

When the heat sink assembly 12 is clamped to the fan assembly 14, the third and fourth clamping

claws

80 and 82 are clamped to the first housing 16, and correspondingly, clamping positions for clamping the third and fourth clamping

claws

80 and 82 may be respectively disposed at the top end and the bottom end of the first housing 16. When the handset is clamped to the fan assembly 14, the third and

fourth jaws

80, 82 are clamped to the handset.

In other embodiments, when the heat sink assembly 12 is detachably fixed to the fan assembly 14, the heat sink assembly 12 may not be provided with the first latch 48 and the second latch 50, but the third latch 80 and the fourth latch 82 respectively protrude forward from the front end surface of the heat conducting fin 18, that is, extend forward and lengthen by a sufficient length, or move forward by a sufficient length, so that the mobile phone is clamped between the third latch 80 and the fourth latch 82, the heat sink assembly 12 is located between the mobile phone and the fan assembly 14, and the heat sink assembly 12 and the fan assembly 14 may be relatively fixed by a detachable fixing structure such as a snap structure or a magnetic attraction structure.

In the illustrated embodiment, the inner sides of the first jaw 48, the second jaw 50, the third jaw 80 and the fourth jaw 82 are respectively provided with a soft rubber pad 92, so as to prevent damage to the mobile phone when the mobile phone is clamped, and simultaneously, the soft rubber pad can play a role in buffering and improving clamping stability.

The concepts described herein may be embodied in other forms without departing from the spirit or characteristics thereof. The particular embodiments disclosed should be considered illustrative rather than limiting. The scope of the invention is, therefore, indicated by the appended claims rather than by the foregoing description. Any changes which come within the meaning and range of equivalency of the claims are to be embraced within their scope.

Claims

1. A heat dissipation device is used for dissipating heat of a mobile terminal and is characterized by comprising a heat sink component and a fan component, wherein the fan component is detachably fixed on the heat sink component or the mobile terminal; when the fan assembly is fixed on the mobile terminal, the fan assembly dissipates heat for the mobile terminal.

2. The heat dissipation device according to claim 1, wherein the heat sink assembly includes a first housing, and a heat conducting sheet, a semiconductor refrigeration sheet and a heat dissipation member disposed in the first housing, the semiconductor refrigeration sheet is disposed between the heat conducting sheet and the heat dissipation member, a cold end surface of the semiconductor refrigeration sheet contacts with the heat conducting sheet, a hot end surface of the semiconductor refrigeration sheet contacts with the heat dissipation member, the heat conducting sheet is configured to conduct heat generated by the mobile terminal to the heat dissipation member, the fan assembly includes a second housing and a fan disposed in the second housing, the second housing is detachably fixed to the first housing or the mobile terminal, and the fan dissipates heat for the heat dissipation member or the mobile terminal.

3. The heat dissipating device as claimed in claim 2, wherein the fan assembly further comprises a circuit board disposed in the second housing, the fan is electrically connected to the circuit board, the circuit board has a power interface for conducting with an external power source, a first conductive portion is disposed on a side of the first housing facing the second housing, the first conductive portion is electrically connected to the semiconductor cooling plate, a second conductive portion is disposed on a side of the second housing facing the first housing, the second conductive portion is electrically connected to the circuit board.

4. The heat dissipating device of claim 3, wherein one of said first conductive portion and said second conductive portion is a conductive tab and the other of said first conductive portion and said second conductive portion is a pogo pin; or, one of the first conductive part and the second conductive part is a USB plug, and the other of the first conductive part and the second conductive part is a USB socket.

5. The heat dissipating device of claim 3, wherein said fan assembly further comprises a rechargeable battery disposed within said second housing and electrically connected to said circuit board.

6. The heat dissipating device according to claim 2, wherein the heat dissipating member comprises a heat dissipating base plate and a plurality of heat dissipating fins extending from the heat dissipating base plate toward a side away from the semiconductor chilling plate, a heat dissipating passage is formed between two adjacent heat dissipating fins, the first housing comprises a first front shell and a first rear shell which are butted against each other, the first front shell is provided with a receiving groove, the semiconductor chilling plate is disposed in the receiving groove, a partition plate is disposed in the first rear shell, the partition plate divides a space in the first rear shell into a first chamber and a second chamber, the heat dissipating member is disposed in the first chamber, the first housing is provided with a hot air outlet and a cold air outlet, the hot air outlet is communicated with the heat dissipating passage, the cold air outlet is communicated with the second chamber, the heat conducting fin is disposed on a side of the first front shell away from the first rear shell and covers the second chamber, one side of the first rear shell, which is far away from the first front shell, is provided with an opening communicated with the first cavity and the second cavity.

7. The heat dissipating device according to claim 6, wherein the second housing has an air inlet and an air outlet on two sides corresponding to the opening, the fan is disposed between the air inlet and the air outlet, so that the air generated by the fan enters the first chamber and the second chamber through the air outlet and the opening, the second housing includes a second front shell and a second rear shell that are butted with each other, the air outlet is disposed on the second front shell, and the air inlet is disposed on the second rear shell.

8. The heat dissipating device as claimed in any one of claims 2 to 7, wherein the first housing is provided with a first claw and a second claw for clamping the mobile terminal, the first claw is disposed at a top end of the first housing, the second claw is movably disposed at a bottom end of the first housing by a first elastic member, and the first elastic member applies an elastic bias to the second claw to move toward the first claw, the elastic bias providing a clamping preload.

9. The heat dissipating device of any one of claims 2 to 7, wherein the second housing has a third jaw and a fourth jaw, the third jaw is disposed at the top end of the second housing, the fourth jaw is movably disposed at the bottom end of the second housing by a second elastic member, the second elastic member exerts another elastic bias on the fourth jaw to move toward the third jaw, and the another elastic bias provides a clamping preload; when the fan assembly is fixed on the radiator assembly, the third clamping jaw and the fourth clamping jaw are clamped on the first shell; when the fan assembly is fixed on the mobile terminal, the third jaw and the fourth jaw are clamped on the mobile terminal.

10. The heat dissipating device of any one of claims 2 to 7, wherein the second housing has a third jaw and a fourth jaw, the third jaw is disposed at the top end of the second housing, the fourth jaw is movably disposed at the bottom end of the second housing by a second elastic member, the second elastic member exerts another elastic bias on the fourth jaw to move toward the third jaw, and the another elastic bias provides a clamping preload; when the fan assembly is fixed to the radiator assembly, the third clamping jaw and the fourth clamping jaw respectively protrude forwards from the front end face of the heat conducting fin, so that the mobile terminal is clamped between the third clamping jaw and the fourth clamping jaw.