CN212569729U

CN212569729U - Conductive film

Info

Publication number: CN212569729U
Application number: CN202020927277.XU
Authority: CN
Inventors: 基亮亮; 刘麟跃; 周小红; 赵云龙
Original assignee: Weiyeda Technology Jiangsu Co ltd; Ivtouch Co ltd
Current assignee: Suzhou Weiyeda Technology Co ltd; Weiyeda Technology Jiangsu Co ltd
Priority date: 2020-05-27
Filing date: 2020-05-27
Publication date: 2021-02-19
Anticipated expiration: 2030-05-27

Abstract

The utility model provides a conductive film, including the substrate, be equipped with the structural layer including a plurality of figure recesses on the substrate, the structural layer includes induction zone and is located induction zone edge's lead wire region, the lead wire region includes lead wire portion and electric connection portion, all be equipped with a plurality of figure recesses in lead wire portion and the electric connection portion, induction zone, be equipped with first conducting layer in lead wire portion and electric connection portion's the figure recess, be equipped with the second conducting layer in electric connection portion's the figure recess, the second conducting layer overlaps and sets up on first conducting layer, induction zone passes through electric connection portion and external circuit electricity is connected. The utility model discloses a conducting film not only can save the step of filling conducting material many times, has promoted the stability of electricity connection moreover.

Description

Conductive film

Technical Field

The utility model relates to a conductive film technical field especially relates to a conductive film.

Background

With the development of science and technology, more and more terminal devices with touch functions are developed towards flexibility, lightness and thinness. The transparent conductive film has high transmittance and good conductivity, is widely applied to the fields of flat panel display, photovoltaic devices, touch panels, electromagnetic shielding and the like, and has wide market space.

In the prior art, a metal grid type transparent conductive film is generally manufactured on a transparent substrate to form a conductive layer, which generally includes a transparent substrate layer and a related metal buried layer, a patterned and communicated groove grid is formed on the surface of the transparent substrate layer, and a conductive material is filled in the groove grid to form the conductive film. However, in order to increase the stability of the electrical connection between the circuit and the outside, the conventional embedded metal grid conductive film needs to satisfy the filling amount of the conductive material, and since the groove can be filled to a depth of 2 μm in general once, the groove with a depth of more than 5 μm needs to be filled with the conductive material for many times, which also increases the loss of the conductive material.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a conductive film can save the step of filling conductive material many times to the stability of electricity connection has been promoted.

The utility model provides a conductive film, which comprises a substrate, be equipped with the structural layer including a plurality of figure recesses on the substrate, the structural layer includes induction zone and is located induction zone edge's lead wire region, lead wire region includes lead wire portion and electric connection portion, lead wire portion with all be equipped with a plurality ofly in the electric connection portion the figure recess induction zone lead wire portion with the electric connection portion be equipped with first conducting layer in the figure recess electric connection portion be equipped with the second conducting layer in the figure recess, the second conducting layer overlaps and sets up on the first conducting layer, induction zone passes through electric connection portion is connected with the external circuit electricity.

Further, the second conductive layer is formed on the first conductive layer by printing.

Further, the lead region is provided with a plurality of leads insulated from each other at intervals, each of the leads including the lead portion and the electrical connection portion.

Further, the electric connection part is arranged at one end of the lead area close to the sensing area and used for electrically connecting the sensing area and the lead area.

Further, the electric connection part is arranged at one end of the lead area far away from the induction area and used for electrically connecting the lead area with a circuit board.

Further, the thickness of the first conducting layer is smaller than the depth of the pattern groove, and the second conducting layer is at least partially arranged in the pattern groove.

Furthermore, the width of the pattern groove is 1-20 μm, and the depth is 2-15 μm.

Further, the first conductive layer and the second conductive layer adopt one or more of silver nano slurry, copper nano slurry or graphene slurry.

Further, the first conductive layer is a nanoparticle-scale slurry, and the second conductive layer is a micron-scale slurry.

The utility model provides a conductive film, be equipped with first conducting layer in the figure recess of its lead wire regional lead wire portion and electric connection portion, be equipped with the second conducting layer in the figure recess of electric connection portion, and the second conducting layer overlaps and sets up on first conducting layer, the induction zone is connected with external circuit electricity through electric connection portion, the filling amount of the conducting layer in induction zone and external circuit electricity junction has been satisfied, the stability of electricity connection has been promoted, when the preparation, adopt the mode of printing to fill the second conducting layer in electric connection portion, conductive material's filling number of times has been reduced, and the cost is reduced.

Drawings

Fig. 1 is a schematic structural diagram of a sensing region and a lead region of a conductive film in an embodiment of the present invention;

fig. 2 is a schematic cross-sectional structure diagram of a lead region of a conductive film according to an embodiment of the present invention;

fig. 3a to fig. 3d are schematic diagrams illustrating steps of a method for manufacturing a conductive film according to an embodiment of the present invention.

Detailed Description

The following detailed description of the embodiments of the present invention is provided with reference to the accompanying drawings and examples. The following examples are intended to illustrate the invention, but are not intended to limit the scope of the invention.

As shown in fig. 1 and fig. 2, the embodiment of the present invention provides a conductive film, which includes a substrate 1, a structural layer 2 including a plurality of pattern grooves 201 is disposed on the substrate 1, the substrate 1 is used for bearing the structural layer 2, and the light transmittance of the substrate 1 is relatively high. Specifically, the substrate 1 may be made of PET, PC, or flexible glass.

The structure layer 2 includes a sensing region 21 and a lead region 22 located at an edge of the sensing region 21, and the lead region 22 is located at least on one side of the sensing region 21 to implement signal conduction of the conductive film. The sensing area 21 is provided with a sensing line (not shown), the lead area 22 is provided with a plurality of leads 3 insulated from each other at intervals, and the sensing line is correspondingly connected with the leads 3. Each lead 3 includes a lead portion 31 and an electrical connection portion 32, a plurality of the pattern grooves 201 are disposed in the lead portion 31 and the electrical connection portion 32, and the pattern grooves 201 are in a grid-shaped patterned structure.

In the present embodiment, taking a single-layer conductive film as an example, a first conductive layer 310 is disposed in the pattern groove 201 of the sensing region 21, the lead portion 31 and the electrical connection portion 32, a second conductive layer 320 is disposed in the pattern groove 201 of the electrical connection portion 32, the second conductive layer 320 is overlapped on the first conductive layer 310 located on the electrical connection portion 32, and the sensing region 21 is electrically connected to an external circuit through the electrical connection portion 32. The first conductive layer 310 and the second conductive layer 320 are stacked, so that the filling amount in the pattern groove 201 is satisfied, and the stability of the electrical connection of the conductive film is improved. And the electric connection part 32 is a component of the lead 3, only the second conductive layer 320 superposed on the first conductive layer 310 needs to be arranged in a partial area of the lead 3, and the lead 3 does not need to be completely filled in the second conductive layer 320, so that the filling amount of conductive materials is saved, and the cost is reduced.

In the case of a double-layer conductive film in another embodiment, the lead portions 31 of the two conductive layers are provided with the electrical connection portion 32, and the conductive layers in the pattern groove 201 of the electrical connection portion 32 are provided in the same manner as the conductive layers of the electrical connection portion 32 of the single-layer conductive film, that is, both the first conductive layer 310 and the second conductive layer 320 are provided in the pattern groove 201 of the electrical connection portion 32.

Since the general area of the electrical connection between the sensing region 21 and the external circuit is small, it is preferable that the electrical connection portions 32 are disposed at two ends of the lead region 22, that is, the electrical connection portions 32 are respectively connected to two ends of the lead portion 31, for example, the electrical connection portions 32 are disposed at one end of the lead region 22 close to the sensing region 21 for electrically connecting the sensing region 21 and the lead region 22; an electrical connection portion 32 is disposed at an end of the lead region 22 away from the sensing region 21, such as a gold finger, i.e., an end close to an external circuit, for electrically connecting the lead region 22 with the circuit board 4.

In the present embodiment, the thickness of the first conductive layer 310 is smaller than the depth of the pattern groove 201, and the width is equal to the width of the pattern groove 201, wherein the depth of each pattern groove 201 is the same. The second conductive layer 320 is at least partially disposed within the pattern groove 201, and optionally, the thickness of the second conductive layer 320 may be greater than the thickness of the first conductive layer 310 filled within the pattern groove 201, and it is understood that the thickness of the second conductive layer 320 may be greater than the remaining depth of the pattern groove 201 having the first conductive layer 310, and the width is the same as the width of the pattern groove 201, that is, the thickness of the second conductive layer 320 exceeds the top of the pattern groove 201.

Furthermore, the width of the pattern groove 201 is 1 to 20 μm, and the depth is 2 to 15 μm.

In other embodiments, the opening end width of the pattern groove 201 of the electrical connection portion 32 is larger than the bottom width thereof, for example, the cross-sectional shape of the pattern groove 201 of the electrical connection portion 32 is an inverted trapezoid, an inverted triangle, or the like. This has the advantage that when the second conductive layer 320 is formed by printing, the width of the open end is large to facilitate printing.

In other embodiments, the depth and/or width of the pattern groove 201 of the electrical connection portion 32 is greater than the depth and/or width of the pattern groove 201 of the remaining region, for example, the depth and/or width of the pattern groove 201 of the electrical connection portion 32 is greater than the depth and/or width of the sensing region 21 and the lead portion 31. The advantage of this arrangement is that the depth of the pattern groove 201 of the electrical connection portion 32 is greater than that of the pattern groove 201 of the rest area, which is beneficial to disposing more conductive material, thereby improving the stability of electrical connection with the external circuit; the width of the pattern groove 201 of the electrical connection portion 32 is larger than that of the pattern groove 201 of the remaining region, which facilitates printing.

The first conductive layer 310 and the second conductive layer 320 adopt one or more conductive pastes of silver nano paste, copper nano paste or graphene paste. Preferably, the first conductive layer 310 is a nanoparticle-level paste and the second conductive layer 320 is a micron-level paste, and since the coverage of the second conductive layer 320 is smaller than that of the first conductive layer 310, the micron-level conductive paste is cheaper to use, thereby also reducing the cost of the conductive paste.

As shown in fig. 3a to 3d, an embodiment of the present invention further provides a method for manufacturing a conductive film, the method for manufacturing the conductive film includes:

s1: providing a substrate 1, forming a structural layer 2 on the substrate 1, forming a plurality of pattern grooves 201 in the structural layer 2, wherein the structural layer 2 comprises a sensing area 21 and a lead area 22 located at the edge of the sensing area 21, the lead area 22 comprises a lead portion 31 and an electrical connection portion 32, and the plurality of pattern grooves 201 are formed in the lead portion 31 and the electrical connection portion 32.

Specifically, as shown in fig. 3a and 3b, a layer of UV light-curing adhesive 20 is coated on a substrate 1, a mold 5 with patterns of conductive layers is used to perform primary imprinting on the UV light-curing adhesive 20 to form a plurality of pattern grooves 201 with the same depth, and then curing is performed; after curing, the UV light curing glue 20 forms the structural layer 2. The pattern formed by the plurality of pattern grooves 201 is a grid.

S2: conductive material is filled in the pattern grooves 201 of the sensing region 21, the lead part 31 and the electrical connection part 32 by means of blade coating, and a first conductive layer 310 is formed after curing.

Specifically, as shown in fig. 3c, the pattern groove 201 is filled with a conductive material only once by blade coating, the thickness of the filled conductive material is smaller than the depth of the pattern groove 201, for example, 2 μm, and after curing, the first conductive layer 310 is formed, that is, formed as a conductive line.

S3: conductive material is filled in the pattern groove 201 of the electrical connection portion 32 by printing, a second conductive layer 320 is formed after curing, the second conductive layer 320 is overlapped on the first conductive layer 310, and the sensing region 21 is electrically connected with an external circuit through the electrical connection portion 32.

Specifically, as shown in fig. 3d, a conductive material is filled in a portion of the pattern groove 201 by printing, wherein the width of the second conductive layer 320 printed by precision printing may be 1-10 μm, and the width of the second conductive layer 320 printed by screen printing may be 10-20 μm. Since the printed conductive material can flow to fill the pattern groove 201 when cured at a high temperature, the pattern groove 201 of the electrical connection portion 32 can be filled by one-time printing process after the first conductive layer 310 is formed, so that the filling amount of the conductive material in the pattern groove 201 is satisfied, and the filling times of the conductive material are reduced, thereby reducing the cost.

Preferably, the conductive material filled when the first conductive layer 310 is formed is a nanoparticle-level conductive paste, and the conductive material filled when the second conductive layer 320 is formed is a micron-level conductive paste, and since the coverage of the second conductive layer 320 is smaller than that of the first conductive layer 310, the micron-level conductive paste is cheaper to use, thereby also reducing the cost of the conductive paste.

The embodiment of the utility model provides a conductive film, be equipped with first conducting layer 310 in the pattern recess 201 of its lead wire region 22's lead wire portion 31 and electric connection portion 32, be equipped with second conducting layer 320 in electric connection portion 32's pattern recess 201, and second conducting layer 320 overlaps and sets up on first conducting layer 310, response region 21 is connected with external circuit electricity through electric connection portion 32, the filling amount of the conducting layer in response region 21 and external circuit electricity junction has been satisfied, the stability of electricity connection has been promoted, when the preparation, adopt the mode of printing to fill second conducting layer 320 in electric connection portion 32, utilize conductive material flowable filling pattern recess 201 when high temperature curing in the printing mode, replaced the current mode that just can satisfy the filling amount with the blade coating filling many times conductive material, conductive material's filling number has been reduced, the cost is reduced.

In the drawings, the size and relative sizes of layers and regions may be exaggerated for clarity. It will be understood that when an element such as a layer, region or substrate is referred to as being "formed on," "disposed on" or "located on" another element, it can be directly on the other element or intervening elements may also be present. In contrast, when an element is referred to as being "directly formed on" or "directly disposed on" another element, there are no intervening elements present.

In this document, the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", "vertical", "horizontal", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for the sake of clarity and convenience of description of the technical solutions, and thus, should not be construed as limiting the present invention.

As used herein, the meaning of "a plurality" or "a plurality" is two or more unless otherwise specified.

As used herein, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, including not only those elements listed, but also other elements not expressly listed.

The above description is only for the specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art can easily think of the changes or substitutions within the technical scope of the present invention, and all should be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims

1. The utility model provides a conductive film, includes the substrate, its characterized in that, be equipped with the structural layer including a plurality of figure recesses on the substrate, the structural layer is including the response region and being located the lead wire region at response region edge, the lead wire region includes lead wire portion and electric connection portion, lead wire portion with all be equipped with a plurality ofly in the electric connection portion the figure recess the response region lead wire portion with the electric connection portion be equipped with first conducting layer in the figure recess be equipped with the second conducting layer in the electric connection portion the figure recess, the second conducting layer overlaps and sets up on the first conducting layer, the response region passes through electric connection portion is connected with external circuit electricity.

2. The conductive film according to claim 1, wherein the second conductive layer is formed on the first conductive layer by printing.

3. The conductive film according to claim 1, wherein the lead region is provided with a plurality of leads insulated from each other at intervals, each of the leads including the lead portion and the electrical connection portion.

4. The conductive film according to claim 1, wherein the electrical connection portion is provided at an end of the lead region near the sensing region to electrically connect the sensing region and the lead region.

5. The conductive film according to claim 1 or 4, wherein the electrical connection portion is provided at an end of the lead region remote from the sensing region for electrically connecting the lead region with a circuit board.

6. The conductive film according to claim 1, wherein a thickness of the first conductive layer is smaller than a depth of the pattern groove, and the second conductive layer is at least partially disposed in the pattern groove.

7. The conductive film according to claim 1, wherein the pattern groove has a width of 1 to 20 μm and a depth of 2 to 15 μm.

8. The conductive film of claim 1, wherein the first conductive layer and the second conductive layer employ one or more of silver nanopaste, copper nanopaste, or graphene nanopaste.

9. The conductive film of claim 8, wherein the first conductive layer is a nanoparticle-scale paste and the second conductive layer is a micron-scale paste.