CN212230441U

CN212230441U - BIPV assembly

Info

Publication number: CN212230441U
Application number: CN202020726997.XU
Authority: CN
Inventors: 蒋建彗; 倪志春; 魏青竹; 蔡霞; 石刚; 柯坡; 陆文华; 曹海波; 余嫦; 吴镇
Original assignee: Suzhou Talesun Solar Technologies Co Ltd
Current assignee: Suzhou Talesun Solar Technologies Co Ltd
Priority date: 2020-05-06
Filing date: 2020-05-06
Publication date: 2020-12-25
Anticipated expiration: 2030-05-06

Abstract

The utility model discloses a BIPV subassembly, including front bezel, backplate and encapsulate in the front bezel with battery piece layer between the backplate, battery piece layer includes solar wafer, BIPV subassembly still including be used for with solar wafer produces the wiring row subassembly that current transmission goes out, wiring row subassembly set up in the front bezel with between the backplate. The utility model provides a satisfy mechanical properties's requirement when the too big problem of terminal box volume.

Description

BIPV assembly

Technical Field

The utility model belongs to brilliant silicon solar cell field relates to a BIPV subassembly.

Background

Solar energy is a green renewable resource. The conversion of solar energy into electric energy can save energy, relieve the problem of power supply shortage and reduce environmental pollution. Solar cells are made of materials that produce the photovoltaic effect, such as silicon, gallium arsenide, copper indium selenide, or other materials, thereby converting light energy into electrical energy using the photovoltaic effect. At present, solar module products are rapidly developed, and meanwhile, as green zero-energy-consumption building engineering is promoted globally, photovoltaic modules and buildings are further combined to generate building integrated photovoltaic modules (BIPV modules). BIPV modules are currently available for most buildings, and can be installed in flat roofs, pitched roofs, curtain walls, ceilings, and the like.

With the rapid development of the photovoltaic industry, BIPV modules occupy an increasing market share. Compared with the conventional photovoltaic module, the BIPV module has the advantages that the service life is longer, and the aesthetic, mechanical and electrical properties are perfectly matched with those of a building besides the reliable performance of the conventional photovoltaic module. The appearance effect of the building is generally high from the aesthetic point of view, and the full coordination is achieved, the junction box of the conventional photovoltaic module is generally adhered to the back of the battery panel, and the junction box is large, so that the integral coordination sense of the building is easily damaged, and the junction box is generally not accepted. Chinese patent application CN103825547A discloses a small-sized BIPV module junction box, which has a small contact area when connected with a BIPV module. Although the junction box has the advantages of small volume, capability of being hidden in a curtain wall framework structure and the like. But because the junction box protrudes out of the surface of the assembly, the junction box has a great risk of falling off during installation and transportation. Meanwhile, according to experimental data of the junction box adopted by the BIPV assembly in the last two years, the current junction box needs to accommodate diodes with fixed volumes while ensuring small volumes, so that the junction box is made of thin materials, the mechanical performance cannot meet the actual requirements, and the service life of the building is ensured to be 50 years.

SUMMERY OF THE UTILITY MODEL

To the technical problem, the utility model provides a BIPV subassembly satisfies mechanical properties's requirement when solving the too big problem of terminal box volume.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

the utility model provides a BIPV subassembly, includes front bezel, backplate and encapsulate in the front bezel with battery piece layer between the backplate, battery piece layer includes solar wafer, BIPV subassembly still including be used for with solar wafer produces the line bank subassembly that current transmission goes out, the line bank subassembly set up in the front bezel with between the backplate.

Herein, "between the front plate and the back plate" encompasses portions of the front plate and/or the back plate, i.e. as long as they are located between the outer side surface of the front plate and the outer side surface of the back plate, they can be considered as being between the front plate and the back plate.

Preferably, the terminal block assembly is disposed between an edge portion of the front plate and an edge portion of the rear plate.

In an embodiment, the wiring bar assembly includes a circuit board provided with a diode and a pair of lead-out cables having one ends electrically connected to the circuit board, and the other ends of the lead-out cables are led out from between the front plate and the back plate to the outside of the BIPV assembly.

Furthermore, the front plate and the back surface are respectively provided with inner side surfaces, the two inner side surfaces are opposite to each other, the inner side surface of the back plate is provided with a back surface accommodating groove matched with the circuit board, and part of the circuit board is embedded in the back surface accommodating groove.

Furthermore, the inner side surface of the front plate is provided with a front accommodating groove matched with the circuit board, and part of the circuit board is embedded in the front accommodating groove.

Furthermore, the current generated by the solar cell is collected through the bus bar, the back plate is also provided with a through hole for leading out the bus bar, the circuit board is provided with a leading-out hole for leading the bus bar to pass through, and the leading-out hole is at least aligned with part of the through hole.

Furthermore, a cable leading-out groove matched with the leading-out cable is formed in the front plate and/or the back plate, the cable leading-out groove extends to the outer edge of the front plate and/or the back plate, and the leading-out cable is embedded in the wire groove.

Furthermore, the other end of each lead-out cable is electrically connected with the connector lug respectively.

Furthermore, the solar cell pieces and the wiring bar assemblies are bonded on the inner side surface of the front plate through front glue layers, and the solar cell pieces and the wiring bar assemblies are bonded on the inner side surface of the back plate through back glue layers.

The front side adhesive layer and/or the back side adhesive layer are adhesive films.

The utility model adopts the above scheme, compare prior art and have following advantage:

the utility model discloses a BIPV subassembly will connect the row and set up between front bezel and the backplate, have small, pleasing to the eye, long service life, diode heat dispersion is good, the sealed glue of terminal box reduces, reduces advantages such as terminal box cost.

Drawings

In order to more clearly illustrate the technical solution of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

Fig. 1 is a schematic view of a terminal block assembly according to an embodiment of the present invention;

fig. 2 is a schematic view of an inside surface of a front plate according to an embodiment of the present invention;

fig. 3 is a schematic view of an inner side surface of a back plate according to an embodiment of the present invention;

FIG. 4 is an enlarged view of a portion of FIG. 3;

fig. 5 is a schematic view of a backplane equipped with a terminal block assembly according to an embodiment of the present invention.

Wherein,

1. a terminal block assembly; 11. a circuit board; 111. a diode; 112. an exit aperture; 12. leading out a cable; 13. a connector lug;

2. a front plate; 20. an inner side surface; 21. a front accommodating groove; 22. a cable leading-out groove;

3. a back plate; 30. an inner side surface; 31. back face accommodating grooves; 32. a cable leading-out groove; 33. and a through hole.

Detailed Description

The following detailed description of the preferred embodiments of the invention, taken in conjunction with the accompanying drawings, enables the advantages and features of the invention to be more readily understood by those skilled in the art. It should be noted that the description of the embodiments is provided to help understanding of the present invention, but the present invention is not limited thereto. Furthermore, the technical features mentioned in the embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.

The present embodiment provides a BIPV module, of which fig. 1 shows a terminal block module 1, fig. 2 shows an inner side surface of a front panel 2, and fig. 3 shows an inner side surface of a back panel 3. The BIPV assembly mainly comprises the wiring bar assembly 1, the front plate 2, the back plate 3 and a battery sheet layer which is packaged between the front plate 2 and the back plate 3 by packaging materials. The wiring row assembly 1 is arranged on the front plate 2 and the back plate 3 and is packaged between the front plate and the back plate. Further, the terminal block assembly 1 is disposed between an edge portion of the front plate 2 and an edge portion of the rear plate 3. Herein, "between the front panel 2 and the back panel 3" covers a portion of the front panel 2 and/or the back panel 3, i.e., as long as it is located between the outer side surface of the front panel 2 and the outer side surface of the back panel 3, it can be regarded as between the front panel 2 and the back panel 3.

The wiring bar assembly 1 is used for transmitting the current collected by the cell sheet layers, such as to a photovoltaic energy storage system. As shown in fig. 1, the terminal block assembly 1 specifically includes a circuit board 11 provided with a diode 111, and a pair of lead-out cables 12 having one end electrically connected to the circuit board 11, and the other end of each lead-out cable 12 is led out from between the front plate 2 and the back plate 3 to the outside of the BIPV assembly. Specifically, in the present embodiment, three diodes 111 are disposed on the circuit board 11, and four lead-out holes 112 for leading out the bus bars are disposed on the upper portion of the circuit board 11. A pair of outgoing cables 12 are respectively located on two opposite sides of the circuit board 11, one end of each outgoing cable 12 is electrically connected to the circuit board 11 (preferably, the lower portion of the circuit board 11) by soldering or the like, and the other end is electrically connected to a connector 13, where the connector 13 may be an MC4 connector 13.

The front plate 2 is transparent and preferably made of glass to allow light to impinge on the cell layers. As shown in fig. 2, the front plate 2 has an inner side surface 20, specifically, the inner side surface 20 refers to a side surface of the front plate 2 closer to the cell sheet layers. The inner side surface 20 of the front plate 2 is provided with a front accommodating groove 21 matched with the circuit board 11, and part of the circuit board 11 is embedded in the front accommodating groove 21. In this embodiment, the shape of the front accommodating groove 21 is a rectangle matching with the shape of the battery piece. The inner side surface 20 of the front plate 2 is further provided with a pair of cable leading-out grooves 22 matched with the leading-out cables 12, two sides of the front accommodating groove 21 are respectively provided with one cable leading-out groove 22, and the two cable leading-out grooves 22 extend along a straight line and the central lines of the two cable leading-out grooves are overlapped. One end of the cable drawing groove 22 communicates with the front receiving groove 21 and the other end extends to the outer edge of the front plate 2. In this embodiment, the cable drawing groove 22 has an arc-shaped cross section. Portions of the outgoing cables 12 are fitted in the respective cable outgoing grooves 22.

The back plate 3 is preferably made of glass. As shown in fig. 3, the back sheet 3 has an inner side surface 30, specifically, the inner side surface 30 refers to a side surface of the back sheet 3 closer to the cell sheet layers; further, the inner side surface 20 of the front plate 2 and the inner side surface 30 of the rear plate 3 are opposed to each other, and the cell sheet layer is sealed between the inner side surface 20 of the front plate 2 and the inner side surface 30 of the rear plate 3. The inner surface 30 of the back plate 3 is provided with a back accommodating groove 31 matched with the circuit board 11, and part of the circuit board 11 is embedded in the back accommodating groove 31. In this embodiment, the shape of the back accommodating groove 31 is a rectangle matching with the shape of the battery piece. The inner side surface 30 of the back plate 3 is further provided with a pair of cable leading-out grooves 32 matched with the leading-out cables 12, two sides of the back accommodating groove 31 are respectively provided with one cable leading-out groove 32, and the two cable leading-out grooves 32 extend along a straight line and have center lines overlapped with each other. One end of the cable drawing groove 32 communicates with the rear receiving groove 31 and the other end extends to the outer edge of the rear panel 3. In this embodiment, the cable drawing groove 32 has an arc-shaped cross section. Portions of the outgoing cables 12 are fitted in the respective cable outgoing grooves 32.

In addition, as shown in fig. 3 and 4, the back plate 3 is further provided with a through hole 33 for leading out the bus bar, and the leading-out hole 112 is aligned with at least a part of the through hole 33 to allow the bus bar to sequentially pass through the leading-out hole 112 and the through hole 33.

The cell layer comprises a plurality of solar cells, the solar cells are welded in series through bus bars to form a cell string, and the current generated by each solar cell is collected through the bus bars.

The packaging material specifically comprises a front adhesive layer and a back adhesive layer, which are used for respectively fixing the battery sheet layer on the inner side surface 20 of the front plate 2 and the inner side surface 30 of the back plate 3. The front glue layer and the back glue layer are preferably glue films. A glue film is arranged between the front plate 2 and the front surface of the battery sheet layer, and a glue film is arranged between the back plate 3 and the back surface of the battery sheet layer. The adhesive Film in this embodiment is preferably a PVB adhesive Film (Poly Vinyl butyl Film).

Further, the depth of the front receiving groove 21 and the depth of the rear receiving groove 31 are about 1mm, respectively, and the thickness of the circuit board 11 with the diode 111 is small, about 3 mm. Therefore, sufficient PVB adhesive films are filled in the front holding groove 21 and the back holding groove 31, the circuit board 11 is placed, and after lamination, the thickness of the prepared BIPV assembly is about 5mm, so that the thickness requirement of the BIPV assembly is met, and good mechanical performance is guaranteed.

The BIPV assembly solves the problems of existing aesthetics, reliability and the like of the two-generation junction box of the conventional BIPV assembly, the glass-junction box integrated design is carried out, meanwhile, the junction box shell is saved, the cost of the BIPV assembly is integrally reduced, and the reliability and the heat dissipation performance are further optimized. This technique unites two into one traditional glass and terminal box, rejects conventional terminal box body, only remains circuit board and cable, can guarantee that the BIPV subassembly is more pleasing to the eye, reduces sealed glue pouring volume simultaneously. Simultaneously because diode, circuit board, cable etc. all encapsulate inside sealed subassembly, can have better weatherability, increase life. And because the glass has good heat dissipation performance, the heat dissipation of the diode is facilitated, and the temperature saving of the diode is reduced. Besides, the box body structure of the conventional junction box is eliminated, and the glue is only filled in the groove of the back glass, so that the using amount of the sealing glue is greatly reduced. The cost of the junction box can be further reduced.

The preparation method of the BIPV assembly comprises the following steps

A. Providing a front plate 2 provided with a front accommodating groove 21, and enabling a side surface provided with the front accommodating groove 21 to face upwards;

B. an adhesive film or an adhesive coating is laid on the upper surface of the front plate 2, and the adhesive film or the adhesive at least covers the region of the front plate 2 where the solar cell is to be placed and the front accommodating groove 21;

C. forming a cell sheet layer on the upper surface of the front plate 2, placing the terminal block assembly 1 in the front-face accommodation groove 21;

D. laying a glue film or coating an adhesive on the battery sheet layer and the wiring bar assembly 1;

E. placing the back plate 3 glass provided with the back accommodating groove 31 on the battery sheet layer and the wiring bar assembly 1 in a manner that the surface provided with the back accommodating groove 31 faces downwards, and enabling part of the wiring bar assembly 1 to be located in the back accommodating groove 31;

F. and (6) laminating.

In the step C, the circuit board 11 is placed in the front face accommodating groove 21, and the lead-out cable 12 is also placed in the cable lead-out groove 22 on the front plate 2; in step E, a portion of the circuit board 11 is positioned in the rear receiving groove 31, and a portion of the lead-out cable 12 is also positioned in the cable lead-out groove 32 on the rear panel 3.

In the step C, the bus bars of the battery sheet layer also pass through the leading-out holes 112 on the wiring bar; in the step E, the bus bar penetrates out of the through hole 33 formed in the back plate 3; the preparation method also comprises the following steps after the step E: the bus bar is soldered and glue is poured into the through hole 33.

The specific implementation process of the preparation method is as follows:

carrying out procedures of front plate placement, front PVB (polyvinyl butyral) adhesive film laying, battery string arrangement, bus bar welding and the like according to a conventional BIPV assembly; firstly, accurate calculation is carried out, and sufficient PVB adhesive films are additionally added to the front holding groove and the cable leading-out groove so as to prevent bubbles from being formed in the groove and ensure that the groove is completely filled, and the mechanical performance of the cable leading-out groove is improved. The circuit board and the outgoing line thereof are placed in the front accommodating groove and the cable outgoing groove, and the outgoing line can be fixed by high-temperature adhesive tape in order to prevent the outgoing line from deviating. When the wiring bar is placed, the assembly bus bar needs to pass through a bus bar leading-out port on the circuit board, then, sufficient PVB adhesive films are correspondingly paved above the wiring bar, the PVB adhesive films on the back surface are paved, and the back plate is placed. Note that the bus bars are led out from the through holes of the back plate when the back plate is placed, and the back plate is fixed and laminated after being placed, as shown in fig. 5. After lamination, the bus bar welding, the back side opening glue filling and other processes are carried out at the through hole, and the assembly is put into use after being cooled.

The above embodiments are only for illustrating the technical concept and features of the present invention, and are preferred embodiments, which are intended to enable persons skilled in the art to understand the contents of the present invention and to implement the present invention, and thus, the protection scope of the present invention cannot be limited thereby. All equivalent changes or modifications made according to the principles of the present invention are intended to be covered by the scope of the present invention.

Claims

1. A BIPV subassembly, includes front bezel, backplate and encapsulates in the front bezel with the battery piece layer between the backplate, the battery piece layer includes solar wafer, its characterized in that: the BIPV assembly further comprises a wiring bar assembly used for transmitting current generated by the solar cell pieces, and the wiring bar assembly is arranged between the front plate and the back plate.

2. The BIPV assembly of claim 1, wherein: the wiring bar assembly comprises a circuit board provided with a diode and a pair of lead-out cables, one ends of the lead-out cables are electrically connected with the circuit board, and the other ends of the lead-out cables are led out of the BIPV assembly from the space between the front plate and the back plate.

3. The BIPV assembly of claim 2, wherein: the front plate and the back plate are respectively provided with inner side surfaces, the two inner side surfaces are opposite to each other, the inner side surface of the back plate is provided with a back accommodating groove matched with the circuit board, and part of the circuit board is embedded in the back accommodating groove; and/or the inner side surface of the front plate is provided with a front accommodating groove matched with the circuit board, and part of the circuit board is embedded in the front accommodating groove.

4. The BIPV assembly of claim 2, wherein: the current generated by the solar cell is collected through the bus bar, the back plate is also provided with a through hole for leading out the bus bar, the circuit board is provided with a leading-out hole for leading the bus bar to pass through, and the leading-out hole is at least aligned with part of the through hole.

5. The BIPV assembly of claim 2, wherein: the front plate and/or the back plate are/is provided with a cable leading-out groove matched with the leading-out cable, the cable leading-out groove extends to the outer edge of the front plate and/or the back plate, and the leading-out cable is embedded in the cable leading-out groove.

6. The BIPV assembly of claim 2, wherein: the other end of each leading-out cable is electrically connected with the connector lug respectively.

7. The BIPV assembly of claim 1, wherein: the solar cell piece reaches the connection row subassembly through the front glue film bond in on the inboard surface of front bezel, the solar cell piece reaches the connection row subassembly through the back glue film bond in on the inboard surface of backplate.

8. The BIPV assembly of claim 7, wherein: the front side adhesive layer and/or the back side adhesive layer are adhesive films.

9. The BIPV assembly of claim 1, wherein: the wiring bar assembly is arranged between the edge part of the front plate and the edge part of the back plate.