CN211133986U - Multi-electrode spring thimble connector and micro-fluidic chip with electrode array - Google Patents

Multi-electrode spring thimble connector and micro-fluidic chip with electrode array Download PDF

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Publication number
CN211133986U
CN211133986U CN201921812311.2U CN201921812311U CN211133986U CN 211133986 U CN211133986 U CN 211133986U CN 201921812311 U CN201921812311 U CN 201921812311U CN 211133986 U CN211133986 U CN 211133986U
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China
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micro
spring thimble
fluidic chip
electrode
connector
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CN201921812311.2U
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Chinese (zh)
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陈勇
石剑
汪莉
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Wuhan Mesobiosys Technology Co ltd
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Wuhan Mesobiosys Technology Co ltd
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Abstract

The utility model provides a multi-electrode spring thimble connector and a micro-fluidic chip with an electrode array, which comprises a chip base frame and a micro-fluidic chip body arranged on the chip base frame, wherein the surface of the micro-fluidic chip body is exposed with the multi-electrode array, and the multi-electrode spring thimble connector is arranged on the exposed multi-electrode array in a matching way; the spring thimble and the micro-fluidic chip of the integral type structure that connect through the spring thimble expose outside the corresponding butt of multiple electrode array to utilize the locking bolt to fix the contact of pressure spring thimble and multiple electrode array, the transmission of accomplishing the signal of telecommunication is switched on each other through pegging graft of spring thimble and multiple electrode array with the pencil winding displacement of installing at the spring thimble other end like this to the micro-fluidic chip, with the convenience of realizing that the user inserts and uses promptly, and the utility model discloses a simple structure, the preparation is simple and convenient, and compact structure low cost.

Description

Multi-electrode spring thimble connector and micro-fluidic chip with electrode array
Technical Field
The utility model relates to a little control chip reaches receives device technical field a little, concretely relates to many electrode spring thimble connects and takes electrode array's micro-fluidic chip.
Background
The micro-fluidic chip technology integrates basic operation units of sample preparation, reaction, separation, detection and the like in the biological, chemical and medical analysis process into a micron-scale chip, and automatically completes the whole analysis process.
When the array electrode of the micro-flow control chip is connected with the external electrode connector, the external electrode connector and the array electrode of the micro-flow control chip are required to be correspondingly inserted, matched and fixed, but the traditional electrode connector is complicated in the process of inserting the micro-flow control chip, plug and play cannot be achieved, the electrode connector structure is complex, the manufacturing cost is low, the use is not convenient, and the multi-electrode spring thimble connector and the micro-flow control chip with the electrode array are designed by the company so as to effectively overcome the defects of the current situation.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to overcome the not enough of above-mentioned technique, provide a multi-electrode spring thimble joint and take electrode array's micro-fluidic chip, it is loaded down with trivial details with micro-fluidic chip grafting process to aim at solving traditional electrode joint, and the operator of being not convenient for is plug-and-play and electrode joint structure is complicated, problem that the cost of manufacture is high.
In order to realize above-mentioned technical purpose, the utility model provides a multi-electrode spring thimble connects and takes electrode array's micro-fluidic chip, include the chip bed frame and install the micro-fluidic chip body on the chip bed frame, the surface of micro-fluidic chip body exposes there is multi-electrode array, and exposes outside multi-electrode array is gone up the cooperation and is installed spring thimble and connect.
Furthermore, the multi-electrode spring thimble connector comprises a connector base with a cavity, and spring thimbles which are of an integrated structure and can be matched with the multi-electrode array exposed outside the micro-fluidic chip body are embedded in the cavity of the connector base.
Furthermore, the connector base is provided with a locking bolt, and the connector base is detachably connected with the microfluidic chip body through the locking bolt.
And furthermore, one side of the micro-fluidic chip body is also provided with a flexible electrode joint, one end of the flexible electrode joint is electrically connected with the micro-fluidic chip body, and the other end of the flexible electrode joint is connected with an external signal processing device.
Furthermore, the spring thimble is made of copper alloy material with good conductivity.
The utility model discloses compare in prior art following beneficial effect as follows: the utility model discloses a spring thimble and the micro-fluidic chip of the integral type structure that the spring thimble connects expose outside the corresponding butt of multiple electrode array to utilize the locking bolt to fix the contact of pressure spring thimble and multiple electrode array, micro-fluidic chip and the pencil winding displacement of installing at the spring thimble other end switch on the transmission of accomplishing the signal of telecommunication each other through the grafting of spring thimble and multiple electrode array like this, with the convenience of realizing that the user inserts and uses promptly, and the utility model discloses a simple structure, the preparation is simple and convenient, and compact structure low cost.
Drawings
The invention will be further explained with reference to the following figures and examples:
FIG. 1 is an overall perspective view of the present invention;
FIG. 2 is a front view of FIG. 1;
FIG. 3 is a top view of FIG. 1;
fig. 4 is a perspective view of the middle plug connector of the present invention;
fig. 5 is a top view of fig. 4.
The list of components represented by the various reference numbers in the figures is as follows: 1. the micro-fluidic chip comprises a micro-fluidic chip body, 2 parts of a chip base frame, 3 parts of a cavity, 4 parts of a multi-electrode spring thimble connector, 5 parts of a flexible electric connector, 6 parts of a locking bolt, 40 parts of a connector base and 41 parts of a spring thimble.
Detailed Description
To further illustrate the technical means and effects of the present invention adopted to achieve the above objects, the following detailed description of the embodiments, structures, features and effects of the present invention will be made with reference to the accompanying drawings and preferred embodiments, it should be understood that the embodiments described in the present invention are only used for explaining the present invention, and are not used for limiting the present invention.
Referring to fig. 1-5, the utility model provides a multi-electrode spring thimble connects and takes micro-fluidic chip of electrode array, include chip bed frame 2 and install the micro-fluidic chip body 1 on chip bed frame 2, the surface of micro-fluidic chip body 1 exposes there is multi-electrode array (not mark in the figure), and expose and go up the cooperation and install multi-electrode spring thimble and connect 4 in outer multi-electrode array (not mark in the figure), wherein this multi-electrode spring thimble connects 4 including the joint base 40 that has cavity 3, the embedding has the spring thimble 41 that can expose the integral type structure of multi-electrode array (not mark in the figure) looks adaptation with micro-fluidic chip body 1 in the cavity 3 of joint base 40. Adopt the above-mentioned structure to expose the corresponding butt of the multi-electrode array (not mark in the picture) outside through the spring thimble 41 of the integral type structure of multi-electrode spring thimble joint 4 and micro-fluidic chip to utilize locking bolt 6 to come the contact of fixed pressure spring thimble 41 and multi-electrode array (not mark in the picture), micro-fluidic chip and the pencil winding displacement of installing at the spring thimble 41 other end switch on the transmission of accomplishing the signal of telecommunication each other through the grafting of spring thimble 41 and multi-electrode array (not mark in the picture), with the convenience of the plug and play of realization user, and the utility model has the advantages of simple structure, the preparation is simple and convenient, and compact structure low cost.
Specifically, in order to facilitate plug and play of an operator and realize one-to-one correspondence between the microfluidic chip 1 and the wiring harness for electrical signal transmission, a spring thimble 41 of an integrated structure is embedded in the cavity 3 of the connector base 40, and the spring thimble can be adapted to a multi-electrode array (not labeled in the figure) of the microfluidic chip body 1 exposed outside.
Specifically, in order to facilitate the insertion and replacement of the multi-electrode spring thimble connector 4 and a multi-electrode array (not labeled in the figure) exposed outside the microfluidic chip body 1 by an operator, the complex operation degree is simplified, and the convenience of operation is improved, so that the locking bolt 6 is arranged on the connector base 40, and the connector base 40 is detachably connected with the microfluidic chip body 1 through the locking bolt 6.
Specifically, in order to transmit and analyze the acquired signal of the microfluidic chip, a flexible electrode connector 5 is further disposed on one side of the microfluidic chip body 1, one end of the flexible electrode connector 5 is electrically connected to the microfluidic chip body 1, and the other end of the flexible electrode connector is connected to an external signal processing device.
Specifically, in order to improve the probability of contact and conduction between the spring thimble 41 and the exposed multi-electrode array (not labeled in the figure) of the microfluidic chip body 1 when the multi-electrode spring thimble connector 4 is inserted, the spring thimble 41 is made of a copper alloy material with good conductivity.
The utility model discloses the theory of operation:
during operation, firstly, the locking bolt 6 is manually unscrewed, then, the spring thimble 41 of the multi-electrode spring thimble connector 4 and the exposed multi-electrode array (not marked in the figure) of the micro-fluidic chip arranged on the chip base frame 2 are correspondingly spliced together one by one, and then, after the multi-electrode array (not marked in the figure) of the spring thimble 41 is well butted, finally, the locking bolt 6 is manually screwed again, and finally, the plug and play of the multi-electrode spring thimble connector 4 and the multi-electrode array (not marked in the figure) of the micro-fluidic chip are completed, so that the splicing efficiency is greatly improved.
The utility model provides a multi-electrode spring thimble connects and takes micro-fluidic chip of electrode array, spring thimble 41 and the micro-fluidic chip of the integral type structure through multi-electrode spring thimble joint 4 expose the corresponding butt of multi-electrode array (not mark in the picture) outside, and utilize locking bolt 6 to fix the contact of pressure spring thimble 41 and multi-electrode array (not mark in the picture), micro-fluidic chip and the pencil winding displacement of installing at the spring thimble 41 other end pass through the grafting of spring thimble 41 and multi-electrode array (not mark in the picture) and switch on the transmission of accomplishing the signal of telecommunication each other like this, with the convenience of realizing the plug-and-play of user, and the utility model has the advantages of simple structure, the preparation is simple and convenient, and compact structure low cost.
The above-mentioned embodiments are merely preferred embodiments of the present invention, and should not be considered as limitations of the present invention, and the protection scope of the present invention should be defined by the technical solutions described in the claims, and includes equivalent alternatives of technical features in the technical solutions described in the claims. Namely, equivalent alterations and modifications within the scope of the invention are also within the scope of the invention.

Claims (5)

1. The utility model provides a micro-fluidic chip of multielectrode spring thimble joint and electrified electrode array, includes chip bed frame (2) and installs micro-fluidic chip body (1) on chip bed frame (2), its characterized in that, the surface of micro-fluidic chip body (1) exposes and has multielectrode array, and exposes outside the multielectrode array is gone up the cooperation and is installed multielectrode spring thimble joint (4).
2. The multi-electrode spring thimble connector and the micro-fluidic chip with the electrode array according to claim 1, wherein the spring thimble connector (4) comprises a connector base (40) with a cavity (3), and spring thimbles (41) of an integrated structure capable of being matched with the multi-electrode array exposed outside the micro-fluidic chip body (1) are embedded in the cavity (3) of the connector base (40).
3. The multi-electrode spring thimble connector and the micro-fluidic chip with the electrode array as claimed in claim 2, wherein the connector base (40) is provided with a locking bolt (6), and the connector base (40) is detachably connected with the micro-fluidic chip body (1) through the locking bolt (6).
4. The multi-electrode spring thimble connector and the micro-fluidic chip with the electrode array according to claim 1, wherein a flexible electrode connector (5) is further disposed on one side of the micro-fluidic chip body (1), one end of the flexible electrode connector (5) is electrically connected to the micro-fluidic chip body (1), and the other end of the flexible electrode connector is connected to an external signal processing device.
5. The multi-electrode spring thimble connector and the micro-fluidic chip with the electrode array according to claim 2, wherein the spring thimble (41) is made of copper alloy material with good electrical conductivity.
CN201921812311.2U 2019-10-26 2019-10-26 Multi-electrode spring thimble connector and micro-fluidic chip with electrode array Active CN211133986U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201921812311.2U CN211133986U (en) 2019-10-26 2019-10-26 Multi-electrode spring thimble connector and micro-fluidic chip with electrode array

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201921812311.2U CN211133986U (en) 2019-10-26 2019-10-26 Multi-electrode spring thimble connector and micro-fluidic chip with electrode array

Publications (1)

Publication Number Publication Date
CN211133986U true CN211133986U (en) 2020-07-31

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201921812311.2U Active CN211133986U (en) 2019-10-26 2019-10-26 Multi-electrode spring thimble connector and micro-fluidic chip with electrode array

Country Status (1)

Country Link
CN (1) CN211133986U (en)

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