CN209355207U - The heat-dissipating luminous component of copper core - Google Patents

The heat-dissipating luminous component of copper core Download PDF

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Publication number
CN209355207U
CN209355207U CN201920385056.1U CN201920385056U CN209355207U CN 209355207 U CN209355207 U CN 209355207U CN 201920385056 U CN201920385056 U CN 201920385056U CN 209355207 U CN209355207 U CN 209355207U
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CN
China
Prior art keywords
layer
integrated circuit
circuit board
line layer
led array
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201920385056.1U
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Chinese (zh)
Inventor
徐正保
刘勇
夏杏军
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ZHEJIANG WANZHENG ELECTRONICS SCIENCE AND TECHNOLOGY Co Ltd
Original Assignee
ZHEJIANG WANZHENG ELECTRONICS SCIENCE AND TECHNOLOGY Co Ltd
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Application filed by ZHEJIANG WANZHENG ELECTRONICS SCIENCE AND TECHNOLOGY Co Ltd filed Critical ZHEJIANG WANZHENG ELECTRONICS SCIENCE AND TECHNOLOGY Co Ltd
Priority to CN201920385056.1U priority Critical patent/CN209355207U/en
Application granted granted Critical
Publication of CN209355207U publication Critical patent/CN209355207U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

A kind of heat-dissipating luminous component of copper core, including integrated circuit board, integrated circuit board includes copper base, the first polyimides glass layer of cloth and the second polyimides glass layer of cloth, first line layer, the second line layer, run through on integrated circuit board and offers the second through-hole, conductive layer is provided on the inner sidewall of second through-hole, conductive layer connects first line layer and the second line layer, polyimides ring is provided between conductive layer and copper base, LED array is provided on first line layer, driving circuit is provided on second line layer, driving circuit drives LED array by conductive layer.Such good heat dissipation effect, small volume and higher without conducting wire, entire normalization, integrated level.

Description

The heat-dissipating luminous component of copper core
Technical field
The utility model relates to the technical field of electric appliances that shines, especially a kind of heat-dissipating luminous components of copper core.
Background technique
Light emitting diode for luminaire using more and more common, set compared to illuminations such as original incandescent lamps It is standby, with lower energy consumption the 1/10 of incandescent lamp (energy consumption of white light LEDs be), longer service life (can to 100,000 hours with On), the advantages such as quick response (quick-replaceable work and off state).This luminaire is provided with LED array.Existing production The heat dissipation problem of LED array is difficult to solve in product.In addition existing LED array and LED drive circuit are respectively arranged at two pieces On circuit board, volume is larger and the connection of the two is connected by conducting wire, is easy to interfere with other objects, irregular, integrated It spends lower.
Utility model content
In view of this, the present invention provides a kind of good heat dissipation effect, small volume and without conducting wire, entire normalization, The heat-dissipating luminous component of the higher copper core of integrated level, to solve the above problems.
A kind of heat-dissipating luminous component of copper core, including integrated circuit board, integrated circuit board include copper base, are respectively arranged at copper The first polyimides glass layer of cloth and the second polyimides glass layer of cloth on the two sides up and down of substrate are set to the first polyamides Imines glass fabric layer far from the lateral surface of copper base first line layer, be set to the second polyimides glass layer of cloth far from copper The second line layer on the lateral surface of substrate, through offering at least two second through-holes on integrated circuit board, the second through-hole Conductive layer is provided on inner sidewall, conductive layer connects first line layer and the second line layer, is arranged between conductive layer and copper base There is polyimides ring, LED array is provided on first line layer, driving circuit is provided on the second line layer, driving circuit is logical Cross conductive layer driving LED array.
It further, further include at least two power supply terminal columns being connect with integrated circuit board, power supply terminal column includes leading Battery core column, the interconnecting piece being provided projectingly on conductive core pole end face and the insulation sleeve being coated on the outside of conductive core pole, driving circuit The outer circumferential of first through hole is provided with power supply terminal, first through hole there are two opening up, interconnecting piece are run through on integrated circuit board Across first through hole, and the end face of power supply terminal and conductive core pole is welded.
Further, the shape of the integrated circuit board is circle.
Further, the LED array includes several outer ring LED light circumferential on first line layer and several The circumferential inner ring LED light on first line layer, inner ring LED light are less than outer ring at a distance from the center of integrated circuit board LED light is at a distance from the center of integrated circuit board.
Further, several outer ring LED light are serially connected to form outer ring LED array, and several inner ring LED light are mutually gone here and there Connection forms inner ring LED array, and outer ring LED array is in parallel with inner ring LED array.
Compared with prior art, the heat-dissipating luminous component of the copper core of the utility model sets LED array and driving circuit respectively Be placed in the two sides of integrated circuit board and by conductive layer connect, integrated circuit board middle part be arranged copper base, good heat dissipation effect, Small volume and higher without conducting wire, entire normalization, integrated level.
Detailed description of the invention
The embodiments of the present invention are described below in conjunction with attached drawing, in which:
Fig. 1 is the stereoscopic schematic diagram of the heat-dissipating luminous component of copper core provided by the utility model.
Fig. 2 is the side sectional view of the integrated circuit board in Fig. 1.
Fig. 3 is the schematic top plan view of the integrated circuit board in Fig. 1.
Specific embodiment
Specific embodiment of the utility model is further elaborated below based on attached drawing.It should be understood that The explanation of the utility model embodiment is not used to herein to limit the protection scope of the utility model.
Please refer to Fig. 1 and Fig. 2, the heat-dissipating luminous component of copper core provided by the utility model include integrated circuit board 10 and with collection At least two power supply terminal columns 20 connected at wiring board 10.
Integrated circuit board 10 includes copper base 11, the first polyamides being respectively arranged on the two sides up and down of copper base 11 Asia Amine glass fabric layer 12 and the second polyimides glass layer of cloth 13 are set to the first polyimides glass layer of cloth 12 far from copper base 11 Lateral surface on first line layer 41, be set on 13 lateral surface far from copper base 11 of the second polyimides glass layer of cloth Second line layer 42.Copper base 11 can improve the heat dissipation effect of entire integrated circuit board 10.
Through opening up, there are two first through hole 31 on integrated circuit board 10;Power supply terminal column 20 includes conductive core pole 21, dashes forward The interconnecting piece 22 being set on 21 end face of conductive core pole out and the insulation sleeve 23 being coated on the outside of conductive core pole 21.Conductive core pole 21 End face form connection step in the external of interconnecting piece 22;Driving electricity is provided on second line layer 42 of integrated circuit board 10 Road, driving circuit are provided with power supply terminal in the outer circumferential of first through hole 31, and interconnecting piece 22 passes through first through hole 31, power end Son and the connection step of the end face of conductive core pole 21 weld.To realize the installation and power supply connection of integrated circuit board 10 simultaneously.
It is also extended through on integrated circuit board 10 and offers at least two second through-holes 32, be arranged on the inner sidewall of the second through-hole 32 There is conductive layer 321, conductive layer 321 connects first line layer 41 and the second line layer 42.
Polyimides ring 14 is provided between conductive layer 321 and copper base 11.Polyimides ring 14 realize conductive layer 321 with Being dielectrically separated between copper base 11 avoids copper base 11 from charging, influences the work of electronic component.
Referring to FIG. 3, being provided with LED array on first line layer 41.Driving circuit drives LED times by conductive layer 321 Column.
In present embodiment, integrated circuit board 10 be circle, LED array include it is several on first line layer 41 circumferentially The outer ring LED light 411 of distribution and several inner ring LED light 412 circumferential on first line layer 41, inner ring LED light 412 With at a distance from the center of integrated circuit board 10 be less than outer ring LED light 411 at a distance from the center of integrated circuit board 10.
Several outer ring LED light 411 are serially connected to form outer ring LED array, and several inner ring LED light 412 are serially connected to be formed Inner ring LED array, outer ring LED array are in parallel with inner ring LED array.So that the distribution of the LED light on first line layer 41 More uniformly, it shines more uniformly, and convenient for heat dissipation.
The heat-dissipating luminous component of the copper core of the utility model makes as follows:
Step S1: carrying out first time drilling on copper base 11, forms third through-hole;
Step S2: it filled polyimide resin and is dried in third through-hole;
Step S3: the extra polyimide resin that third through-hole both ends are higher than about 11 two sides of copper base, shape are removed At polyimides ring 14;
Step S4: carrying out roughening to about 11 two sides of copper base, increases when subsequent and polyimides glass cloth presses Binding force;
Step S5: by the first polyimides glass layer of cloth 12 and the second polyimides glass layer of cloth under high temperature and high pressure environment 13 are pressed from upper and lower two sides and the two sides up and down of copper base 11 respectively, while two layers of electrolytic copper foil is pressed together on respectively The outside of one polyimides glass layer of cloth 12 and the second polyimides glass layer of cloth 13 forms primary wire plate;
Step S6: the position that third through-hole is corresponded on primary wire plate carries out second and drills, and forms the second through-hole 32, The diameter of second through-hole 32 be less than third through-hole diameter, such as the second through-hole 32 diameter it is smaller than the diameter of third through-hole by 0.6~ 0.8 millimeter;
Step S7: to the second through-hole 32, the first lateral surface and second of the polyimides glass layer of cloth 12 far from copper base 11 Polyimides glass layer of cloth 13 carries out copper facing far from the lateral surface of copper base 11, forms first line layer 41, the second line layer 42 And conductive layer 321;
Step S8: the route of needs is etched on first line layer 41 and the second line layer 42;
Step S9: outer ring LED light 411 and inner ring LED light 412 are installed on first line layer 41, in the second line layer 42 Electronic component needed for upper installation driving circuit.
Compared with prior art, the heat-dissipating luminous component of the copper core of the utility model includes integrated circuit board 10, integrated circuit Plate 10 includes copper base 11, the first polyimides glass layer of cloth 12 for being respectively arranged on the two sides up and down of copper base 11 and the Two polyimides glass fabric layers 13, first be set on 12 lateral surface far from copper base 11 of the first polyimides glass layer of cloth Line layer 41, the second line layer 42 being set on 13 lateral surface far from copper base 11 of the second polyimides glass layer of cloth, collection At least two second through-holes 32 are offered at running through on wiring board 10, are provided with conductive layer 321 on the inner sidewall of the second through-hole 32, Conductive layer 321 connects first line layer 41 and the second line layer 42, is provided with polyimides between conductive layer 321 and copper base 11 Ring 14 is provided with LED array on first line layer 41, driving circuit is provided on the second line layer 42, driving circuit is by leading Electric layer 321 drives LED array.Such LED array and driving circuit are respectively arranged at the two sides of integrated circuit board 10 and by leading Electric layer 321 connects, and is arranged copper base 11 at the middle part of integrated circuit board 10, good heat dissipation effect, small volume and without conducting wire, whole Body is regular, integrated level is higher.
The above is only the preferred embodiments of the utility model, are not used to the limitation protection scope of the utility model, any Modification, equivalent replacement or improvement within the spirit of the present invention etc. are all covered in the scope of the claims of the utility model.

Claims (5)

1. a kind of heat-dissipating luminous component of copper core, it is characterised in that: including integrated circuit board, integrated circuit board includes copper base, divides The the first polyimides glass layer of cloth and the second polyimides glass layer of cloth that are not set on the two sides up and down of copper base, setting In on the first lateral surface of the polyimides glass layer of cloth far from copper base first line layer, be set to the second polyimides glass Layer of cloth is far from the second line layer on the lateral surface of copper base, through offering at least two second through-holes on integrated circuit board, Be provided with conductive layer on the inner sidewall of second through-hole, conductive layer connects first line layer and the second line layer, conductive layer with it is copper-based It is provided with polyimides ring between plate, LED array is provided on first line layer, is provided with driving circuit on the second line layer, Driving circuit drives LED array by conductive layer.
2. the heat-dissipating luminous component of copper core as described in claim 1, it is characterised in that: further include connect with integrated circuit board to Few two power supply terminal columns, power supply terminal column includes conductive core pole, the interconnecting piece and packet that are provided projectingly on conductive core pole end face The insulation sleeve being overlying on the outside of conductive core pole, driving circuit are provided with power supply terminal, integrated circuit in the outer circumferential of first through hole Through opening up there are two first through hole on plate, interconnecting piece passes through first through hole, and the end face of power supply terminal and conductive core pole is welded.
3. the heat-dissipating luminous component of copper core as described in claim 1, it is characterised in that: the shape of the integrated circuit board is circle Shape.
4. the heat-dissipating luminous component of copper core as claimed in claim 3, it is characterised in that: the LED array includes several first Circumferential outer ring LED light and several inner ring LED light circumferential on first line layer, inner ring on line layer LED light is less than outer ring LED light at a distance from the center of integrated circuit board at a distance from the center of integrated circuit board.
5. the heat-dissipating luminous component of copper core as claimed in claim 4, it is characterised in that: several outer ring LED light are serially connected Outer ring LED array is formed, several inner ring LED light are serially connected to form inner ring LED array, outer ring LED array and inner ring LED array It is in parallel.
CN201920385056.1U 2019-03-25 2019-03-25 The heat-dissipating luminous component of copper core Expired - Fee Related CN209355207U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201920385056.1U CN209355207U (en) 2019-03-25 2019-03-25 The heat-dissipating luminous component of copper core

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201920385056.1U CN209355207U (en) 2019-03-25 2019-03-25 The heat-dissipating luminous component of copper core

Publications (1)

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CN209355207U true CN209355207U (en) 2019-09-06

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109882817A (en) * 2019-03-25 2019-06-14 浙江万正电子科技有限公司 Heat-dissipating luminous component of copper core and preparation method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109882817A (en) * 2019-03-25 2019-06-14 浙江万正电子科技有限公司 Heat-dissipating luminous component of copper core and preparation method thereof

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CF01 Termination of patent right due to non-payment of annual fee
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Granted publication date: 20190906

Termination date: 20210325