CN208570533U - Chip bonding mechanism and chip package machine - Google Patents
Chip bonding mechanism and chip package machine Download PDFInfo
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- CN208570533U CN208570533U CN201820875725.9U CN201820875725U CN208570533U CN 208570533 U CN208570533 U CN 208570533U CN 201820875725 U CN201820875725 U CN 201820875725U CN 208570533 U CN208570533 U CN 208570533U
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Abstract
The utility model discloses a kind of chip bonding mechanism, including platform, it is provided with the cross track for the transverse direction that two are parallel to platform on platform, a transverse slider is slidably connected on each cross track, laterally driven component is for driving a transverse slider to reciprocatingly slide on cross track；Setting is parallel to the binding head long rails of the longitudinal direction of platform on each transverse slider, a binding head longitudinal sliding block is slidably connected on each binding head long rails, zigzag tread patterns component is for driving a binding head longitudinal sliding block to reciprocatingly slide on binding head long rails；The vertical track of vertical direction is provided on each binding head longitudinal sliding block, vertical driving assembly is for driving a vertical sliding block to reciprocatingly slide on vertical track；A binding head is fixedly connected on each vertical sliding block.Chip bonding mechanism and chip package machine including the chip bonding mechanism bind a column chip using double a bonding heads simultaneously, promote chip speed, and reducing mechanism manufacturing cost.
Description
Technical field
The utility model relates to semiconductor packaging device technical fields, more particularly to a kind of chip bonding mechanism and chip
Sealing machine.
Background technique
Chip bonding mechanism is by chip from taking on carrier (wafer or waffle disk etc.), and by chip in all kinds of chip mounters
It is placed on the mechanism that position is bound on lead frame or substrate.Current most of chip mounters using singly tying up a binding mechanism,
The UPH (post-chip quantity per hour) of equipment has arrived at bottleneck, is very difficult to improve the UPH of equipment again.
Summary of the invention
The purpose of the utility model is to provide a kind of chip bonding mechanism and chip package machines, to solve the above-mentioned prior art
There are the problem of, bind a column chip simultaneously using double a bonding heads, promote chip speed, and reducing mechanism manufacturing cost.
To achieve the above object, the utility model provides following scheme:
The utility model provides a kind of chip bonding mechanism, including platform, laterally driven component, zigzag tread patterns component, perpendicular
To driving assembly and two binding heads, the cross track for the transverse direction that two are parallel to the platform is provided on the platform,
A transverse slider is slidably connected on each cross track, the laterally driven component is provided with two groups, and every group of institute
Laterally driven component is stated to be used to that a transverse slider is driven to reciprocatingly slide on the cross track；It is each described laterally sliding
It is provided with the binding head long rails for being parallel to the longitudinal direction of the platform on block, is slided on each binding head long rails
Dynamic to be connected with a binding head longitudinal sliding block, the zigzag tread patterns component is provided with two groups, and zigzag tread patterns component described in every group
One binding head longitudinal sliding block of driving is used to reciprocatingly slide on the binding head long rails；Each binding head is vertical
It is provided with the vertical track of vertical direction on sliding block, slidably connects a vertical sliding block on each vertical track；It is described
Vertical driving assembly is provided with two groups, and vertical driving assembly described in every group is used to one vertical sliding block of driving described
It reciprocatingly slides on vertical track；The binding head is fixedly connected on each vertical sliding block.
Preferably, the laterally driven component includes horizontal drive motor and horizontal leading screw, the axial direction of the horizontal leading screw
It is parallel to the transverse direction of the platform, the horizontal drive motor is fixed on the platform by a motor fixing seat, the cross
It is connect to the output shaft of driving motor with one end of the horizontal leading screw, a transverse wire is threaded in the horizontal leading screw
Mother, the transverse direction screw are fixedly connected with the transverse slider.
Preferably, the zigzag tread patterns component includes longitudinal linear motor, and the stator of each longitudinal linear motor is fixed
It is connected on the transverse slider, the mover of the longitudinal direction linear motor is fixedly connected on the binding head longitudinal sliding block
To drive the binding head longitudinal sliding block to reciprocatingly slide on the binding head long rails.
Preferably, the vertical driving assembly includes vertical lines motor, and the stator of each vertical lines motor is fixed
It is connected on the transverse slider, the mover of the vertical lines motor is fixedly connected on the vertical sliding block to drive
The vertical sliding block reciprocatingly slides on the vertical track.
Preferably, the binding head longitudinal sliding block connects the vertical guide by a longitudinal connecting member.
Preferably, the vertical sliding block connects the binding head by a vertical connector.
It preferably, further include the binding position identification device and identification device linear motor for binding position for identification,
An identification device track along the longitudinal direction for being parallel to the platform, the identification device track are additionally provided on the platform
On slidably connect identification device sliding block, the stator of the identification device linear motor is fixed on the platform, the identification
The mover of device linear motor is fixedly connected on the identification device sliding block to drive the identification device sliding block in the knowledge
It reciprocatingly slides on other device track.
Preferably, the binding position identification device includes the camera, camera lens and light source from top to bottom set gradually, described
Camera and the light source are fixedly connected on the identification device sliding block, and the camera lens, and the camera are installed on the camera
Above the light source.
The utility model also provides a kind of chip package machine, including chip bonding according to any one of claims 1 to 6
Mechanism.
The utility model achieves following technical effect compared with the existing technology:
Chip bonding mechanism provided by the utility model and chip package machine have two sets of crawl binding mechanisms, and two are tied up
Determine head alternately to pick up chip and driven by laterally driven component, zigzag tread patterns component and vertical driving assembly to matrix or lead frame
Above frame and a column chip is bound simultaneously, chip bonding efficiency can be greatly improved.
Detailed description of the invention
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Needed in attached drawing be briefly described, it should be apparent that, the accompanying drawings in the following description is only the utility model
Some embodiments for those of ordinary skill in the art without creative efforts, can also be according to this
A little attached drawings obtain other attached drawings.
Fig. 1 is the shaft side figure of chip bonding mechanism provided by the utility model；
Fig. 2 is the main view of chip bonding mechanism provided by the utility model；
Fig. 3 is the left view of the chip bonding mechanism in Fig. 2；
Fig. 4 is the top view of the chip bonding mechanism in Fig. 2；
Fig. 5 is that the coupling of the longitudinal linear motor and vertical lines motor of chip bonding mechanism provided by the utility model is shown
It is intended to；
Fig. 6 is the structural schematic diagram of the binding position identification device of chip bonding mechanism provided by the utility model；
Fig. 7 is the first binding head and the second binding head binding chip process of chip bonding mechanism provided by the utility model
Schematic diagram；
In figure: 1- platform；11- cross track；12- transverse slider；13- horizontal drive motor；14- horizontal leading screw；15- electricity
Machine fixing seat；2- binding head；The first binding head of 21-；The second binding head of 22-；The longitudinal direction 3- linear motor；The longitudinal direction 31- linear motor
Mover；32- binding head longitudinal sliding block；321- longitudinal connecting member；4- vertical lines motor；41- vertical lines electric mover；42-
Vertical track；The vertical sliding block of 43-；The vertical connector of 431-；5- binds position identification device；51- camera；52- camera lens；53- light
Source；54- identification device track；6- identification device linear motor；7- same row binds position；8- wafer；81- wafer identifies camera
Know；9- lead frame.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
The purpose of the utility model is to provide a kind of chip bonding mechanism and chip package machines, to solve the above-mentioned prior art
There are the problem of, bind a column chip simultaneously using double a bonding heads, promote chip speed, and reducing mechanism manufacturing cost.
To keep the above objects, features, and advantages of the utility model more obvious and easy to understand, with reference to the accompanying drawing and have
Body embodiment is described in further detail the utility model.
The utility model provides a kind of chip bonding mechanism, in one specific embodiment of the utility model, such as Fig. 1~5
Shown, chip bonding mechanism includes platform 1, laterally driven component, zigzag tread patterns component, vertical driving assembly and two binding heads
2, it is provided with the cross track 11 for the transverse direction that two are parallel to platform 1 on platform 1, is slidably connected on each cross track 11
One transverse slider 12, laterally driven component is provided with two groups, and every group of laterally driven component is used to driving one and laterally slides
Block 12 reciprocatingly slides on cross track 11；The binding head for being parallel to the longitudinal direction of platform is provided on each transverse slider 12
Long rails slidably connect a binding head longitudinal sliding block 32 on each binding head long rails, and zigzag tread patterns component is provided with
Two groups, and every group of zigzag tread patterns component is used to one binding head longitudinal sliding block 32 of driving and back and forth slides on binding head long rails
It is dynamic；It is provided with the vertical track 42 of vertical direction on each binding head longitudinal sliding block 32, slidably connects one on each vertical track 42
A vertical sliding block 43；Vertical driving assembly is provided with two groups, and every group of vertical driving assembly is used to one vertical sliding block of driving
43 reciprocatingly slide on vertical track 42；A binding head 2 is fixedly connected on each vertical sliding block 43, binding head 2 is for grabbing
Coring piece and be placed in chip has been put on lead frame or matrix with or coated with colloid.
Chip bonding mechanism provided by the utility model, has two sets of crawl binding mechanisms, and two binding heads 2 alternately pick up
Chip is simultaneously driven by laterally driven component, zigzag tread patterns component and vertical driving assembly to matrix or lead frame top and to one
Column chip is bound simultaneously, can greatly improve chip bonding efficiency.
In another specific embodiment of the utility model, chip bonding mechanism further include one for identification bind position
Position identification device 5 and identification device linear motor are bound, one is additionally provided on platform 1 along the longitudinal direction for being parallel to platform
Identification device track 54 slidably connects identification device sliding block, the stator of identification device linear motor 6 on identification device track 54
It fixes on the platform 1, the mover of identification device linear motor 6 is fixedly connected on identification device sliding block to drive identification device sliding
Block reciprocatingly slides on identification device track 54.
Using longitudinal direction as Y-direction, laterally be X to, be vertically Z-direction, the chip bonding mechanism provided by the utility model course of work
It is as follows:
1, it resets: two binding heads 2 being made to return origin in tri- directions X, Y, Z, initialization moves two binding heads 2
To position of readiness, two binding heads 2 in Y-direction on the same line, i.e., in same row.
2, it runs: lead frame or matrix is put into 2 lower section of binding head, mobility binding position identification device 5 to lead frame
9 top of frame is simultaneously located at 2 top of binding head, as shown in fig. 7, using binding 5 pairs of binding position vision positionings of position identification device, and
Two binding heads 2 are made to replace binding chip on same row binding position 7.Two binding heads 2 are respectively 21 He of the first binding head
Second binding head 22, the first binding head 21 are put into the location A of lead frame 9 from grab chips on wafer 8, the second binding head 22 from
Upper grab chips are put into the B location of lead frame 9 on wafer 8, and so on, the first binding head 21 is from grab chips on wafer 8
It is successively put into the position C, E, G of lead frame 9, the first binding head 21 8 grab chips from wafer are successively put into lead frame 9
D, the position F, H, until right head completes the binding of chip on 8 positions on lead frame 9.First binding head 21 and the second binding
First 22 identify that camera knows 81 other wafer positions with grab chips by wafer.
In another specific embodiment of the utility model, the laterally driven component of chip bonding mechanism includes laterally driven
Motor 13 and horizontal leading screw 14, the transverse direction for being axially parallel to platform 1 of horizontal leading screw 14, horizontal drive motor 13 pass through a motor
Fixing seat 15 is fixed on platform 1, and the output shaft of horizontal drive motor 13 is connect with one end of horizontal leading screw 14, horizontal leading screw 14
On be threaded with a lateral screw, lateral screw is fixedly connected with transverse slider 12, can be with after the energization of horizontal drive motor 13
The driving rotation of horizontal leading screw 14 is to drive transverse slider 12 to reciprocatingly slide on cross track 11.
In another specific embodiment of the utility model, the zigzag tread patterns component of chip bonding mechanism includes longitudinal straight line
The stator of motor 3, each longitudinal direction linear motor 3 is fixedly connected on a transverse slider 12, and longitudinal linear motor rotor 31 is fixed
It is connected on binding head longitudinal sliding block 32, after longitudinal linear motor 3 is powered, binding head longitudinal sliding block 32 can be driven in binding head
It reciprocatingly slides on long rails.
As shown in figure 5, the vertical driving assembly of chip bonding mechanism includes vertical lines motor 4, each vertical lines motor 4
Stator be fixedly connected on transverse slider 12, vertical lines electric mover 41 is fixedly connected on a vertical sliding block 43, erect
After being powered to linear motor 4, vertical sliding block 43 can be driven to reciprocatingly slide on vertical track 42.
The longitudinal linear motor 3 and vertical lines motor 4 of chip bonding mechanism in the present embodiment, which are combined into, to be electrically coupled directly
Line electric machine structure, longitudinal linear motor 3 and vertical lines motor 4, which pass through to be electrically coupled, realizes longitudinal and vertical movement, and effectively
The volume of reduced mechanism.
In another specific embodiment of the utility model, binding head longitudinal sliding block 32 is solid by a longitudinal connecting member 321
Surely it is connected to vertical guide 42.
Vertical sliding block 43 is fixedly connected on binding head 2 by a vertical connector 431.
In another specific embodiment of the utility model, as shown in fig. 6, binding position identification device 5 include by up to
Under the camera 51, camera lens 52 and the light source 53 that set gradually, camera 51 and light source 52 be fixedly connected on identification device sliding block, camera
Camera lens 52 is installed, and camera 51 is located at 53 top of light source on 51, light source 53 is taken pictures for camera 51 and provided for irradiating dispensing position
Enough light.
The utility model also provides a kind of chip package machine, including the chip bonding mechanism in any of the above-described embodiment.
Specific case is applied in the utility model to be expounded the principles of the present invention and embodiment, it is above
The explanation of embodiment is merely used to help understand the method and its core concept of the utility model；Meanwhile for the one of this field
As technical staff, based on the idea of the present invention, there will be changes in the specific implementation manner and application range.To sum up
Described, the content of the present specification should not be construed as a limitation of the present invention.
Claims (9)
1. a kind of chip bonding mechanism, it is characterised in that: include:
Platform is provided with the cross track for the transverse direction that two are parallel to the platform, each cross track on the platform
On slidably connect a transverse slider,
Laterally driven component, the laterally driven component is provided with two groups, and laterally driven component described in every group is used to drive
One transverse slider reciprocatingly slides on the cross track；
Zigzag tread patterns component, be provided on each transverse slider be parallel to the longitudinal direction of the platform binding head it is longitudinal
Track slidably connects a binding head longitudinal sliding block, the zigzag tread patterns component setting on each binding head long rails
There are two groups, and zigzag tread patterns component described in every group is used to one binding head longitudinal sliding block of driving in the binding head longitudinal direction
It reciprocatingly slides on track；
Vertical driving assembly is provided with the vertical track of vertical direction, each vertical rail on each binding head longitudinal sliding block
A vertical sliding block is slidably connected on road；The vertical driving assembly is provided with two groups, and vertical driving assembly described in every group
One vertical sliding block of driving is used to reciprocatingly slide on the vertical track；And
Two binding heads are fixedly connected to the binding head on each vertical sliding block.
2. chip bonding mechanism according to claim 1, it is characterised in that: the laterally driven component includes laterally driven
Motor and horizontal leading screw, the transverse direction for being axially parallel to the platform of the horizontal leading screw, the horizontal drive motor pass through one
Motor fixing seat is fixed on the platform, and the output shaft of the horizontal drive motor is connect with one end of the horizontal leading screw,
A lateral screw is threaded in the horizontal leading screw, the transverse direction screw is fixedly connected with the transverse slider.
3. chip bonding mechanism according to claim 1, it is characterised in that: the zigzag tread patterns component includes longitudinal straight line
The stator of motor, each longitudinal linear motor is fixedly connected on the transverse slider, the longitudinal direction linear motor
Mover is fixedly connected on the binding head longitudinal sliding block to drive the binding head longitudinal sliding block in binding head longitudinal direction rail
It reciprocatingly slides on road.
4. chip bonding mechanism according to claim 3, it is characterised in that: the vertical driving assembly includes vertical lines
The stator of motor, each vertical lines motor is fixedly connected on the transverse slider, the mover of the vertical lines motor
It is fixedly connected on the vertical sliding block to drive the vertical sliding block to reciprocatingly slide on the vertical track.
5. chip bonding mechanism according to claim 4, it is characterised in that: the binding head longitudinal sliding block is longitudinal by one
Connector connects the vertical track.
6. chip bonding mechanism according to claim 5, it is characterised in that: the vertical sliding block passes through a vertical connector
Connect the binding head.
7. chip bonding mechanism according to claim 1, it is characterised in that: further include one binding position for identification and tying up
Determine position identification device and identification device linear motor, one is additionally provided on the platform along the longitudinal direction side for being parallel to the platform
To identification device track, slidably connect identification device sliding block, the identification device straight-line electric on the identification device track
The stator of machine is fixed on the platform, and the mover of the identification device linear motor is fixedly connected on the identification device sliding block
On to drive the identification device sliding block to reciprocatingly slide on the identification device track.
8. chip bonding mechanism according to claim 5, it is characterised in that: the binding position identification device includes by upper
Camera, camera lens and the light source set gradually under, the camera and the light source are fixedly connected on the identification device sliding block,
The camera lens is installed, and the camera is located above the light source on the camera.
9. a kind of chip package machine, it is characterised in that: including chip bonding mechanism according to any one of claims 1 to 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820875725.9U CN208570533U (en) | 2018-06-07 | 2018-06-07 | Chip bonding mechanism and chip package machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820875725.9U CN208570533U (en) | 2018-06-07 | 2018-06-07 | Chip bonding mechanism and chip package machine |
Publications (1)
| Publication Number | Publication Date |
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| CN208570533U true CN208570533U (en) | 2019-03-01 |
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ID=65485730
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| Application Number | Title | Priority Date | Filing Date |
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| CN201820875725.9U Active CN208570533U (en) | 2018-06-07 | 2018-06-07 | Chip bonding mechanism and chip package machine |
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| CN (1) | CN208570533U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108766912A (en) * | 2018-06-07 | 2018-11-06 | 大连佳峰自动化股份有限公司 | Chip bonding mechanism and chip package machine |
-
2018
- 2018-06-07 CN CN201820875725.9U patent/CN208570533U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108766912A (en) * | 2018-06-07 | 2018-11-06 | 大连佳峰自动化股份有限公司 | Chip bonding mechanism and chip package machine |
| CN108766912B (en) * | 2018-06-07 | 2024-04-26 | 大连佳峰自动化股份有限公司 | Chip binding mechanism and chip packaging machine |
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