CN208315540U - A kind of air cooling ceramic insulating radiation device - Google Patents
A kind of air cooling ceramic insulating radiation device Download PDFInfo
- Publication number
- CN208315540U CN208315540U CN201821077238.4U CN201821077238U CN208315540U CN 208315540 U CN208315540 U CN 208315540U CN 201821077238 U CN201821077238 U CN 201821077238U CN 208315540 U CN208315540 U CN 208315540U
- Authority
- CN
- China
- Prior art keywords
- porcelain core
- swivel nut
- heavy platform
- substrate
- air cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a kind of air cooling ceramic insulating radiation devices, including substrate, porcelain core, swivel nut, ceramic wafer and the cooling fin for being mounted on substrate back, the substrate front side is machined with the cuboid heavy platform being recessed backward for installing IGBT power device, porcelain core is mounted on bottom surface near the quadrangle of each heavy platform, swivel nut is connected on porcelain core, IGBT power device is mounted on swivel nut by bolt, and ceramic wafer is arranged between IGBT power device and substrate.The utility model is high pressure resistant, and insulation performance and hot property are reliable, while having good manufacture and assembly process process, having longer service life.The specific demand of multiple industry fields to radiator in terms of insulation such as it can meet requirement of the different industries to radiator in insulation performance under High Level DC Voltage environment, and power electronics, semiconductor, inverter current, rail traffic can be met.
Description
Technical field
The utility model relates to technical field of heat dissipation.
Background technique
At present in radiator industry, air-cooled radiator on aluminium alloy base plate frequently with using fashion of extrusion panelling cooling fin work
Skill is process with integral section mode.Spreader surface oxidation processes, it is corresponding by being installed in radiator element face
IGBT electronic device meets need of work.But when above structure radiator works to device under the special occasions with high voltage
Insulating requirements are not able to satisfy, the radiator that the country applies in terms of insulation is less, and mature and reliable is simultaneously engineered application product less
It is common.
The insulation measures of individual insulation air-cooled radiators are that one layer of insulating cement mode is coated under device blocks to expire at present
Sufficient insulation performance requirement, but differ greatly in insulating cement thermal coefficient itself and the capacity of heat transmission and bulk aluminum material conducts heat,
It not only will increase thermal contact resistance between device, be unfavorable for the conduction of power device heat, at the same the aging of glue have an effect on insulation can
It leans on and product insulation life.
In the prior art, application No. is the utility models of CN201721127547.3 to disclose a kind of ceramic heat sink, packet
Ceramics bracket, earthenware slab, earthenware duct and hair dryer are included, four angles of ceramics bracket bottom end is provided with contour pillar, ceramics
Cantilever tip is provided with groove, and groove is provided with earthenware slab, and four angles of groove and earthenware slab are respectively arranged between four angles
Spring, earthenware slab lower section are provided with earthenware duct, and earthenware duct is fixed on ceramics bracket, and earthenware duct passes through hose and connects
In hair dryer, hair dryer is located at outside ceramics bracket, and earthenware slab bottom end is provided with fin, and it is logical that ceramic tube is provided between fin
Road, is provided with earthenware duct in ceramic tube passage, earthenware duct at the middle and upper levels where section impartial setting there are three exhaust passage, rows
Gas channel discontinuity is equally spaced on earthenware duct.The above prior art, is not able to satisfy following requirements: in High Level DC Voltage ring
Under border, there is reliable pressure resistance and insulating capacity, while meeting heat dissipation performance when air-cooled radiator work again.
Utility model content
Technical problem to be solved by the utility model is: providing one in the engineering of aluminium alloy air-cooled radiator is used
Kind air cooling ceramic insulating radiation device has reliable pressure resistance and insulating capacity, while meeting again under High Level DC Voltage environment
Heat dissipation performance when air-cooled radiator works.
The technical solution of the utility model is: a kind of air cooling ceramic insulating radiation device, including substrate, porcelain core, swivel nut, pottery
Porcelain plate and the cooling fin for being mounted on substrate back, the substrate front side are machined with the recess backward for installing IGBT power device
Cuboid heavy platform, be mounted on porcelain core on the bottom surface near the quadrangle of each heavy platform, swivel nut, IGBT function be connected on porcelain core
Rate device is mounted on swivel nut by bolt, and ceramic wafer is arranged between IGBT power device and substrate.
Substrate front side is machined with heavy platform at 4, and one is respectively machined on the bottom surface near the quadrangle of each heavy platform for installing
The heavy platform threaded hole of porcelain core.
One is respectively machined on bottom surface near the quadrangle of each heavy platform for installing the heavy platform threaded hole of porcelain core；In porcelain core
Between be equipped with for assemble be vented small bottom outlet one；Porcelain core front is machined with porcelain core internal thread hole, and porcelain core lateral surface is machined with and sinks
The porcelain core external screw thread that platform threaded hole matches respectively is equipped with a porcelain core in each heavy platform threaded hole.
Locking glue is coated on porcelain core internal screw thread, porcelain core external screw thread；Porcelain core passes through the heavy platform on porcelain core external screw thread and substrate
Threaded hole connects and passes through locking glue locking.
The small bottom outlet two for assembling exhaust is equipped among swivel nut；Swivel nut front is equipped with swivel nut inner bolt hole, swivel nut lateral surface
Be machined with the swivel nut external screw thread to match with porcelain core internal thread hole, swivel nut is mounted in porcelain core internal thread hole, porcelain core internal screw thread with
Swivel nut external screw thread connects and passes through locking glue locking.
Swivel nut front is higher than porcelain core front, and IGBT power device is mounted in swivel nut inner bolt hole by bolt.
Porcelain core front is coated with structure glue, and structure glue is heat-conducting type two component, and heavy platform inner sidewall is equipped with step, knot
Structure glue front, swivel nut front are flushed with the cascaded surface on heavy platform inner sidewall, form ceramic wafer mounting surface, ceramic wafer passes through thermal conductive silicon
Rouge is mounted on the ceramic wafer mounting surface, is equipped with the through-hole passed through for bolt with swivel nut inner bolt hole corresponding position on ceramic wafer.
Gap, ceramic wafer are remained between the inner sidewall of heavy platform between adjacent ceramic wafer, on ceramic wafer side and substrate
Front is higher than substrate front side.
Substrate back is equipped with dummy slider boss, and heat dissipation film trap is machined on boss, and cooling fin is tight with substrate deformation mode is squeezed
Gu in heat dissipation film trap.
Substrate is manufactured using 6063 aluminium alloy plates, and porcelain core is made of aluminum oxide ceramic material, and swivel nut uses antirust
Aluminium 3A21 manufacture, ceramic wafer are al nitride ceramic board, and cooling fin uses fine aluminium plate material.
Using the utility model, it can solve current insulating radiation device and apply insulating cement mode bring thermal contact resistance increase shadow
The problem of pilot's hot property, prevents because the aging of insulating cement makes insulation performance failure to influence showing for radiator service life
As.Air cooling ceramic insulating radiation device provided by the utility model has novelty in structure design, high pressure resistant, insulation performance
It is reliable with hot property, while there is good manufacture and assembly process process, there is longer service life.In High Level DC Voltage ring
With excellent insulating reliability when working under border, different industries can be met under High Level DC Voltage environment to radiator in insulating properties
Requirement on energy, and power electronics, semiconductor, inverter current, rail traffic can be met etc. multiple industry fields exist to radiator
The specific demand for the aspect that insulate.Air cooling ceramic insulating radiation device in the present invention have passed through pressure-resistant 4Kv, and 1 minute without breakdown, leakage
Electric current is less than 20mA, and insulation resistance is greater than 1000 megaohms of test.
Detailed description of the invention
Fig. 1 is the schematic view of the front view of the air cooling ceramic insulating radiation device in the utility model；
Fig. 2 is the schematic cross-sectional view of the line A-A along Fig. 1；
Fig. 3 is the partial enlarged view in Fig. 2 at B；
Fig. 4 is the backsight structural representation of the air cooling ceramic insulating radiation device in the utility model；
Fig. 5 is the overlooking structure diagram of the air cooling ceramic insulating radiation device in the utility model；
Description of symbols: substrate 1, porcelain core 2, swivel nut 3, structure glue 4, ceramic wafer 5, cooling fin 6, heavy platform 7.
Specific embodiment
Please referring to Fig. 1 to Fig. 5, a kind of air cooling ceramic insulating radiation device includes substrate 1, porcelain core 2, swivel nut 3, structure glue 4,
Ceramic wafer 5, cooling fin 6.
Substrate is manufactured using 6063 aluminium alloy plates, has superior antiseptic property after high thermal conductivity coefficient and anodic oxidation, thereon
1060 cooling fin of pure aluminum plate is used embedded with cooling fin 6(), IGBT power device installation place processes on substrate mounting surface faces (front)
There is the heavy platform 7 of 4 director's cube shapes being recessed backward, one is respectively machined on the bottom surface near the quadrangle of each heavy platform for installing
The heavy platform threaded hole of porcelain core.
Porcelain core is internal and external screw thread structure, one aperture of medium design (small bottom outlet one).Porcelain core is machined with spiral shell in porcelain core on front
Pit, porcelain core lateral surface are machined with the porcelain core external screw thread to match with heavy platform threaded hole, are respectively equipped in each heavy platform threaded hole
One porcelain core.Locking glue is applied on porcelain core internal screw thread, porcelain core external screw thread.Porcelain core is made of aluminum oxide ceramic material, it
With excellent insulation performance and smaller dielectric constant and larger breakdown strength, pass through the heavy platform spiral shell on porcelain core external screw thread and substrate
Pit connects and uses locking glue locking, and aperture guarantees that porcelain core is bonded with substrate, bottom is small after porcelain core is packed into for assembling exhaust
Hole is filled with structure glue.
Swivel nut is manufactured using rustproof aluminum alloy 3A21, is internal and external screw thread structure, and centre has a bottom outlet (small bottom outlet two) for assembling
Exhaust.Swivel nut front is equipped with swivel nut inner bolt hole, and swivel nut lateral surface is machined with the swivel nut external screw thread to match with porcelain core internal screw thread, porcelain
Swivel nut is installed, porcelain core internal screw thread connect with swivel nut external screw thread and uses locking glue locking in in-core threaded hole.Swivel nut end face (front)
A little higher than porcelain core, the bolt-connection of swivel nut internal screw thread and installation IGBT power device.
Structure glue is to be locally filled with two component, and structure glue has certain capacity of heat transmission, for filling porcelain core and spiral shell
The localized voids of difference in height between set.Porcelain core front is coated with heat-conducting type bicomponent structural adhesive 4, and structure glue front is after hardening through adding
Work flushes completely with heavy platform cascaded surface, is convenient for subsequent installation al nitride ceramic board.Then pacify again after applying heat-conducting silicone grease in heavy platform
Fill ceramic wafer.
Ceramic wafer uses the al nitride ceramic board of good heat conductivity, and IGBT power device, ceramics are installed in ceramic wafer plane
It is equipped with the through-hole that passes through for bolt on plate with swivel nut inner bolt hole corresponding position, IGBT power device is finally by being bolted to spiral shell
It covers in inner bolt hole.Al nitride ceramic board has excellent heat conductivity performance and higher heat-conductivity, has good bending strength, higher hard concurrently
Degree and smaller surface roughness, flatness and smaller dielectric constant, while there is larger electrical breakdown strength, it is adjacent after assembly
Ceramic wafer and the substrate on ceramic wafer periphery have certain interval, for installing the front of IGBT power device slightly on ceramic wafer after assembly
Higher than radiator base plate front.
Dummy slider boss is had on the radiator base plate back side, and heat dissipation film trap, cooling fin extruding substrate are machined on boss
Mode of texturing is fastened in heat dissipation film trap.Cooling fin uses fine aluminium plate material.
The novel air-cooled ceramic wafer insulating radiation device have in power device band high pressure pressure resistance 4kV, do not puncture within 1 minute,
Leakage current is less than the ability of 20mA, while swivel nut inner bolt hole has reply cooling fin insulation resistance >=1000M Ω ability.
The utility model air cooling ceramic insulating radiation device is a kind of Novel ceramic plate insulating radiation device, high pressure resistant, insulation
Performance and hot property are reliable, while having good processing, assembly process process, having longer service life, are able to satisfy multiple
Specific demand of the industry to insulating radiation device.Insulation is reliable, processing technology is good, insulating capacity is strong, easy to assembly, product uses
Service life is long, is able to satisfy demand of the conglomerate client to insulating radiation device.Solve conventional air-cooled radiator at present be not able to satisfy it is resistance to
The problem of high pressure and insulation performance can not meet special requirement.
The above descriptions are merely preferred embodiments of the present invention, is not intended to limit the utility model, for this
For the technical staff in field, various modifications and changes may be made to the present invention.It is all in the spirit and principles of the utility model
Within, any modification, equivalent replacement, improvement and so on are included in the protection scope of the present invention.
Claims (10)
1. a kind of air cooling ceramic insulating radiation device, including substrate, it is mounted on the cooling fin of substrate back, characterized in that also wrap
Porcelain core, swivel nut, ceramic wafer are included, the substrate front side is machined with the cuboid being recessed backward for installing IGBT power device
Heavy platform is mounted on porcelain core on the bottom surface near the quadrangle of each heavy platform, swivel nut is connected on porcelain core, IGBT power device passes through
Bolt is mounted on swivel nut, and ceramic wafer is arranged between IGBT power device and substrate.
2. air cooling ceramic insulating radiation device according to claim 1, characterized in that substrate front side is machined with heavy platform at 4,
One is respectively machined on bottom surface near the quadrangle of each heavy platform for installing the heavy platform threaded hole of porcelain core.
3. air cooling ceramic insulating radiation device according to claim 1, characterized in that the bottom near the quadrangle of each heavy platform
One is respectively machined on face for installing the heavy platform threaded hole of porcelain core；The small bottom outlet one for assembling exhaust is equipped among porcelain core；
Porcelain core front is machined with porcelain core internal thread hole, and porcelain core lateral surface is machined with the porcelain core external screw thread to match with heavy platform threaded hole, often
One porcelain core is respectively installed in a heavy platform threaded hole.
4. air cooling ceramic insulating radiation device according to claim 3, characterized in that porcelain core internal screw thread, porcelain core external screw thread
On be coated with locking glue；Porcelain core is connect with the heavy platform threaded hole on substrate by porcelain core external screw thread and passes through locking glue locking.
5. air cooling ceramic insulating radiation device according to claim 3, characterized in that be equipped among swivel nut for the row of assembly
The small bottom outlet two of gas；Swivel nut front is equipped with swivel nut inner bolt hole, and swivel nut lateral surface is machined with the spiral shell to match with porcelain core internal thread hole
External screw thread is covered, swivel nut is mounted in porcelain core internal thread hole, and porcelain core internal screw thread connect with swivel nut external screw thread and passes through locking glue locking.
6. air cooling ceramic insulating radiation device according to claim 5, characterized in that swivel nut front is higher than porcelain core front,
IGBT power device is mounted in swivel nut inner bolt hole by bolt.
7. air cooling ceramic insulating radiation device according to claim 6, characterized in that porcelain core front is coated with structure glue, knot
Structure glue is heat-conducting type two component, and heavy platform inner sidewall is equipped with step, structure glue front, swivel nut front and heavy platform inner sidewall
On cascaded surface flush, form ceramic wafer mounting surface, ceramic wafer is mounted on the ceramic wafer mounting surface by heat-conducting silicone grease, ceramic
The through-hole passed through for bolt is equipped with swivel nut inner bolt hole corresponding position on plate.
8. air cooling ceramic insulating radiation device according to claim 5, characterized in that between adjacent ceramic wafer, ceramics
Gap is remained on plate side and substrate between the inner sidewall of heavy platform, ceramic wafer front is higher than substrate front side.
9. air cooling ceramic insulating radiation device according to claim 1, characterized in that substrate back is equipped with dummy slider boss,
Heat dissipation film trap is machined on boss, cooling fin is fastened in heat dissipation film trap with substrate deformation mode is squeezed.
10. air cooling ceramic insulating radiation device according to claim 1, characterized in that substrate uses 6063 aluminium alloy plates
Manufacture, porcelain core are made of aluminum oxide ceramic material, and swivel nut is manufactured using rustproof aluminum alloy 3A21, and ceramic wafer is aluminium nitride ceramics
Plate, cooling fin use fine aluminium plate material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821077238.4U CN208315540U (en) | 2018-07-09 | 2018-07-09 | A kind of air cooling ceramic insulating radiation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821077238.4U CN208315540U (en) | 2018-07-09 | 2018-07-09 | A kind of air cooling ceramic insulating radiation device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208315540U true CN208315540U (en) | 2019-01-01 |
Family
ID=64717457
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821077238.4U Active CN208315540U (en) | 2018-07-09 | 2018-07-09 | A kind of air cooling ceramic insulating radiation device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208315540U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110379783A (en) * | 2018-07-09 | 2019-10-25 | 株洲中车奇宏散热技术有限公司 | Promote the method and structure of the insulation of semiconductor devices opposite heat sink and heat dissipation performance |
-
2018
- 2018-07-09 CN CN201821077238.4U patent/CN208315540U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110379783A (en) * | 2018-07-09 | 2019-10-25 | 株洲中车奇宏散热技术有限公司 | Promote the method and structure of the insulation of semiconductor devices opposite heat sink and heat dissipation performance |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107039289B (en) | Thermal interface material with defined thermal, mechanical and electrical properties | |
| US10297523B2 (en) | Power module and method for manufacturing the same | |
| US8017446B2 (en) | Method for manufacturing a rigid power module suited for high-voltage applications | |
| CN208315540U (en) | A kind of air cooling ceramic insulating radiation device | |
| CN108695280A (en) | A kind of air cooling ceramic insulating radiation device and high pressure resistant insulation heat dissipating method | |
| CN201599745U (en) | LED lamp and substrate thereof | |
| JPWO2012081434A1 (en) | Semiconductor device | |
| TW201810560A (en) | Power module and manufacturing method thereof | |
| Al-Hinaai et al. | A novel packaging with direct dielectric liquid cooling for high voltage power electronics | |
| CN210668342U (en) | Radiator and radiating structure of semiconductor power module | |
| CN106505051B (en) | A kind of power device with graphene | |
| US9589863B2 (en) | Power module and thermal interface structure thereof | |
| CN109860382B (en) | Integrated ionic wind heat sink for power type LED heat dissipation | |
| CN109587940B (en) | High-heat-dissipation aluminum-based copper-clad plate | |
| CN209627219U (en) | The cooling mould group of power device and high-voltage frequency converter | |
| KR20150033829A (en) | IGBT module having circuit pattern fabricated using cold spray and its manufacturing method | |
| JP5875102B2 (en) | Manufacturing method of semiconductor module | |
| CN209708964U (en) | Power module and electronic equipment | |
| CN210840180U (en) | Stable in structure's multilayer PCB board | |
| CN114121850A (en) | Embedded liquid cooling micro-channel ceramic packaging structure, ceramic packaging shell and preparation method | |
| CN110164826A (en) | Power module and electronic equipment | |
| CN109103153A (en) | A kind of power device and preparation method thereof | |
| CN218647923U (en) | Heat radiation unit of chip, crimping type heat radiation device | |
| CN220830616U (en) | Heat dissipation device | |
| CN107611108A (en) | The method for packing of power semiconductor single tube |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |