CN207800581U - A kind of self-test large scale semiconductor base component - Google Patents
A kind of self-test large scale semiconductor base component Download PDFInfo
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- CN207800581U CN207800581U CN201820332325.3U CN201820332325U CN207800581U CN 207800581 U CN207800581 U CN 207800581U CN 201820332325 U CN201820332325 U CN 201820332325U CN 207800581 U CN207800581 U CN 207800581U
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- positioning plate
- positioning
- integrally formed
- opened
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Abstract
The utility model is related to a kind of self-test large scale semiconductor base components, it includes：Base body；Cubing component, the cubing component are set to the upper surface of the upper backup pad, including the first positioning board group, the second positioning plate, third positioning board group and the 4th positioning board group；The first positioning board group includes the first positioning plate, is opened in the first evacuation hole in the first positioning plate center, is opened on first positioning plate and positioned at multiple first lightening holes of first evacuation hole both sides and multiple first detection holes for being opened on first positioning plate and avoiding hole around described first.It can realize in this way and position detection is carried out to base body upper surface mounting hole, base body is qualified when being fitted without hole and deviateing each detection hole of cubing component, to realize the quick judgement to pedestal weight.
Description
Technical field
The utility model is related to a kind of semiconductor bases, and in particular to a kind of self-test large scale semiconductor base component.
Background technology
The integrated and encapsulation of LED is usually carried out by large-scale automated production equipment；And before large scale semiconductor base is
State the basic part of automated production equipment, play the role of support, it is fixed, it is therefore desirable to opened up on pedestal location-specific
Mounting hole is to meet the assembling of automated production equipment.Mounting hole on existing pedestal can not be carried out at the same time position detection, therefore
The position that may have certain mounting holes deviates and influences the precision of automated production equipment, so influence the integrated of LED or
The precision of encapsulation and influence product quality.
Invention content
The utility model aim is to provide a kind of self-test large scale semiconductor base for overcome the deficiencies in the prior art
Component.
In order to achieve the above objectives, the technical solution adopted in the utility model is：A kind of self-test large scale semiconductor base group
Part, it includes：
Base body, the base body include upper backup pad, are integrally formed at the adjacent two corners in the upper backup pad upper surface
Clamping bump, the support frame that is integrally formed at the upper backup pad bottom surface and connects with the clamping bump and integrally set
It is placed in the side positioning frame of the support frame side；
Cubing component, the cubing component are set to the upper surface of the upper backup pad, including the first positioning board group, second
Positioning plate, third positioning board group and the 4th positioning board group；The first positioning board group includes the first positioning plate, is opened in described the
The first evacuation hole in one positioning plate center is opened on first positioning plate and avoids the multiple of hole both sides positioned at described first
First lightening hole and multiple first detection holes for being opened on first positioning plate and avoiding hole around described first；It is described
Second positioning plate is integrally formed at the middle part of first positioning plate side and corresponding with the clamping bump, offers thereon
Multiple second detection holes and with extending to the positioning inclined-plane of its side by free end；The third positioning board group and the side are fixed
Position frame matches, including is fixed on support riser at the first positioning plate bottom edge, is fixed on the support riser bottom
Portion and the third positioning plate parallel with first positioning plate, multiple second lightening holes being opened on the third positioning plate
And it is opened in multiple third detection holes on the third positioning plate；The 4th positioning board group is described including being integrally formed at
First positioning plate another side and first extension board perpendicular with it, be integrally formed at first positioning plate another side and
The second extension board for being obliquely installed is integrally formed at first extension board end and the 4th of second extension board end the fixed
Position plate, multiple third lightening holes for being opened on the 4th positioning plate and be opened on the 4th positioning plate multiple the
Four detection holes.
Optimally, the inner surface of the clamping bump offers the first clamping groove.
Optimally, the side positioning frame includes being integrally formed at the support frame side and extending to above the upper branch
The framework of fagging upper surface and the supporting rack for being integrally formed at the framework bottom surface.
Optimally, the first positioning board group further includes being extended in first evacuation hole by first positioning plate
Locating convex block, the third positioning board group further include being integrally formed at the clamping protrusion of the third positioning plate outer end face both sides.
Since above-mentioned technical proposal is used, the utility model has following advantages compared with prior art：The utility model
Self-test large scale semiconductor base component, by base body upper surface install specific structure and with the matched cubing of base body
Component can be realized carry out position detection to base body upper surface mounting hole in this way, deviate cubing component when being fitted without hole
Base body is qualified when each detection hole, to realize the quick judgement to pedestal weight.
Description of the drawings
Attached drawing 1 is the structural schematic diagram of the utility model self-test large scale semiconductor base component.
Specific implementation mode
Embodiment shown in below in conjunction with the accompanying drawings is further described the utility model.
Self-test large scale semiconductor base component as shown in Figure 1 includes mainly base body 1 and cubing component 2 etc..
Wherein, base body 1 includes upper backup pad 11（The upper surface of upper backup pad 11 need to open up multiple mounting holes for
It is attached with other components, and the position of these mounting holes needs to ensure accurately）, be integrally disposed upon 11 upper table of upper backup pad
Clamping bump 12 at the adjacent two corners in face, the support frame for being integrally disposed upon 11 bottom surface of upper backup pad and connecting with clamping bump 12
14 and it is integrally disposed upon the side positioning frame 13 of 14 side of support frame；Clamping bump 12 leans on the another side of proximally-oriented frame 13
（The side is corresponding with former side face）.In the present embodiment, the inner surface of clamping bump 12（Two clamping bumps 12 are opposite
Side）Offer the first clamping groove 121.Side positioning frame 13 includes being integrally disposed upon 14 side of support frame and extending to above
The framework 131 of 11 upper surface of upper backup pad and the supporting rack 132 for being integrally disposed upon 131 bottom surface of framework.
And cubing component 2 is arranged in the upper surface of upper backup pad 11, including first positioning board group 21, the second positioning plate 22,
Third positions board group 23 and the 4th and positions board group 24.First positioning board group 21 includes the first positioning plate 211, is opened in the first positioning
The first evacuation hole 212 in the center of plate 211 is opened on the first positioning plate 211 and positioned at multiple the of the first evacuation 212 both sides of hole
One lightening hole 213 and multiple first detection holes 215 for being opened on the first positioning plate 211 and avoiding hole 212 around first；The
The size in one evacuation hole 212 is larger, and width is about the half of 211 width of the first positioning plate, and length is about the first positioning plate 211 length
The 3/4 of degree；Multiple first lightening holes 213 it is not of uniform size, can be arranged as required to；The side of first positioning plate 211 and frame
Body 131 is in contact higher than the part of 11 upper surface of upper backup pad and realizes clamping.Second positioning plate 22 is then integrally disposed upon first
The middle part of 211 side of positioning plate and corresponding with clamping bump 12（That is the another side of the second positioning plate 22 and one of card
Convex block 12 is connect to be in contact）, multiple second detection holes 222 are offered thereon and with the positioning inclined-plane 221 being obliquely installed, the positioning
Inclined-plane 221 is from the free end of the second positioning plate 22 to its side（Side corresponding with third positioning board group 23）Extend and and its
Intersection.Third positioning board group 23 is matched with side positioning frame 13, it includes the branch being fixed at 211 bottom edge of the first positioning plate
Support riser 231（I.e. support riser 231 be mounted on at the adjacent side in installation 22 side of the second positioning plate, the side be higher than
The framework 131 of 11 upper surface of upper backup pad is in contact）, be fixed on support 231 bottom of riser and parallel with the first positioning plate 211
Third positioning plate 232, multiple second lightening holes 234 for being opened on third positioning plate 232 and be opened in third positioning plate
Multiple third detection holes 235 on 232.4th positioning board group 24 includes being integrally disposed upon 211 another side of the first positioning plate（I.e.
The side being oppositely arranged with 22 side of the second positioning plate of installation）And first extension board 242 perpendicular with it, it is integrally disposed upon
One positioning plate, 211 another side and be obliquely installed the second extension board 241, be integrally disposed upon 242 end of the first extension board and
4th positioning plate 243 of two extension boards, 241 end（First extension board 242, the second extension board 241 and the 4th positioning plate 243 surround
The second larger evacuation hole of area, the 4th positioning plate 243 are in contact with another clamping bump 12）, be opened in the 4th positioning plate
Multiple third lightening holes 244 on 243 and multiple 4th detection holes 245 being opened on the 4th positioning plate 243.By will be special
The first positioning board group 21, the second positioning plate 22, the third positioning board group 23 and the 4th for determining structure position board group 24 and are combined, energy
Enough be connected in semiconductor base to using respective detection hole to the mounting hole each self-test of progress in semiconductor base with
Ensure to be fitted without hole deviation.
In the present embodiment, third positioning board group 23 further includes two clamping protrusions 233, and it is fixed that they are integrally disposed upon third
The both sides of position 232 outer end face of plate（That is, the end of 232 two sides of third positioning plate）, it is clamped to coordinate with side positioning frame 13.
First positioning board group 21 further includes the locating convex block 214 extended to by the first positioning plate 211 in first evacuation hole 212（Position
Convex block 214 is located in the first positioning plate 211 and from the edge in the first evacuation hole 212 to its internal stretch）, it can be with semiconductor
Base member carries out positioning alignment.
Above-described embodiment is only the technical concepts and features for illustrating the utility model, and its object is to allow be familiar with technique
Personage can understand the content of the utility model and implement according to this, the scope of protection of the utility model can not be limited with this.
It is all according to equivalent change or modification made by the spirit of the present invention essence, should all cover the scope of protection of the utility model it
It is interior.
Claims (4)
1. a kind of self-test large scale semiconductor base component, which is characterized in that it includes：
Base body（1）, the base body（1）Including upper backup pad（11）, be integrally formed at the upper backup pad（11）Upper surface
Clamping bump at adjacent two corners（12）, be integrally formed at the upper backup pad（11）Bottom surface and with the clamping bump（12）Phase
The support frame connect（14）And it is integrally formed at the support frame（14）The side positioning frame of side（13）；
Cubing component（2）, the cubing component（2）It is set to the upper backup pad（11）Upper surface, including the first positioning plate
Group（21）, the second positioning plate（22）, third position board group（23）With the 4th positioning board group（24）；The first positioning board group（21）
Including the first positioning plate（211）, be opened in first positioning plate（211）The first evacuation hole in center（212）, be opened in it is described
First positioning plate（211）Above and positioned at described first avoid hole（212）Multiple first lightening holes of both sides（213）And it is opened in
First positioning plate（211）Above and around described first avoid hole（212）Multiple first detection holes（215）；Described second
Positioning plate（22）It is integrally formed at first positioning plate（211）The middle part of side and with the clamping bump（12）It is corresponding,
Multiple second detection holes are offered thereon（222）And with the positioning inclined-plane for extending to its side by free end（221）；Described
Three positioning board groups（23）With the side positioning frame（13）It matches, including is fixed on first positioning plate（211）Bottom edge
The support riser at place（231）, be fixed on the support riser（231）Bottom and with first positioning plate（211）Parallel
Third positioning plate（232）, be opened in the third positioning plate（232）On multiple second lightening holes（234）And it is opened in institute
State third positioning plate（232）On multiple third detection holes（235）；The 4th positioning board group（24）Including being integrally formed at
State the first positioning plate（211）Another side and first extension board perpendicular with it（242）, be integrally formed at it is described first positioning
Plate（211）Another side and the second extension board being obliquely installed（241）, be integrally formed at first extension board（242）End
With second extension board（241）4th positioning plate of end（243）, be opened in the 4th positioning plate（243）On it is multiple
Third lightening hole（244）And it is opened in the 4th positioning plate（243）On multiple 4th detection holes（245）.
2. self-test large scale semiconductor base component according to claim 1, it is characterised in that：The clamping bump（12）
Inner surface offer the first clamping groove（121）.
3. self-test large scale semiconductor base component according to claim 1, it is characterised in that：The side positioning frame（13）
Including being integrally formed at the support frame（14）Side and extend to above the upper backup pad（11）The framework of upper surface
（131）And it is integrally formed at the framework（131）The supporting rack of bottom surface（132）.
4. self-test large scale semiconductor base component according to claim 1, it is characterised in that：The first positioning board group
（21）Further include by first positioning plate（211）Extend to first evacuation hole（212）Interior locating convex block（214）, institute
State third positioning board group（23）Further include being integrally formed at the third positioning plate（232）The clamping protrusion of outer end face both sides
（233）.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820332325.3U CN207800581U (en) | 2018-03-12 | 2018-03-12 | A kind of self-test large scale semiconductor base component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820332325.3U CN207800581U (en) | 2018-03-12 | 2018-03-12 | A kind of self-test large scale semiconductor base component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207800581U true CN207800581U (en) | 2018-08-31 |
Family
ID=63275520
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820332325.3U Active CN207800581U (en) | 2018-03-12 | 2018-03-12 | A kind of self-test large scale semiconductor base component |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207800581U (en) |
-
2018
- 2018-03-12 CN CN201820332325.3U patent/CN207800581U/en active Active
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