CN207146503U - A kind of high heat conduction thin type dry ground heating module - Google Patents
A kind of high heat conduction thin type dry ground heating module Download PDFInfo
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- CN207146503U CN207146503U CN201720855239.6U CN201720855239U CN207146503U CN 207146503 U CN207146503 U CN 207146503U CN 201720855239 U CN201720855239 U CN 201720855239U CN 207146503 U CN207146503 U CN 207146503U
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- heat
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Abstract
The utility model discloses a kind of high heat conduction thin type dry ground heating module, including thermal insulation board, link span, heat-insulation layer and high thermal conductivity layer and heating tube, the link span is provided with tube seat, heat-insulation layer and high thermal conductivity layer are laid on link span successively, with being provided with heating tube at tube seat position correspondence above high thermal conductivity layer, the thermal insulation board includes skid resistant course, damp-proof layer, bottom plate and boss, the damp-proof layer is set below daughter backplane, skid resistant course is provided with below damp-proof layer, the boss is arranged in above bottom plate, and reinforcement is provided between the adjacent lands.Fine aluminium heat-conducting layer is used on the utility model link span, comprehensive heat conduction, its heat-conducting effect is traditional more than 5 times, and heat radiates upwards comprehensively, and radiating is uniform, and the thermal efficiency is higher, is backfilled instead of traditional silt, and integral thickness is thin.
Description
Technical field
It the utility model is related to heating control field, and in particular to a kind of high heat conduction thin type dry ground heating module.
Background technology
Floor heating is the abbreviation of floor panel heating, be using whole ground as radiator, by the heating agent in flooring radiation layer,
Uniformly heat whole ground, the even whole ground of heating, using the rule that the accumulation of heat and heat on ground itself radiate upwards by it is lower extremely
On conducted, to reach the purpose of heating.Dry floor heating is also known as ultra-thin ground-warming, relative to common floor heating mounting means without ground
Warm backfill, therefore it is named dry floor heating.
Compared with traditional heating system, floor heating has radiating, and uniformly, comfortably cleaning health, environmental protection and energy saving are elegant in appearance,
Securely and reliably, extra long life and the advantages that efficient sound insulation.As the improvement of people's living standards, increasing family's winter
Begin to use floor heating to heat.Current electric heating film floor heating is constructed by the way of wet-laying, i.e., electric heating film floor heating is whole
It is embedded under cement flooring, ceramic tile is pasted on upper strata again.When upper strata is timber floor, if using wet-laying mode, will raise entirely
The height in face, influence the use of building.If upper strata is timber floor, extruded sheet is used as thermal insulation layer, without cement screed-coat,
Extruded sheet and heater are easily affected by the external environment, in fact it could happen that floating dust etc., are unfavorable for heat-insulated.
Utility model content
Purpose of utility model：For above-mentioned existing problem and shortage of the prior art, the purpose of this utility model is
A kind of high heat conduction thin type dry ground heating module is provided.
Technical scheme：To reach above-mentioned purpose, a kind of high heat conduction thin type dry ground heating module described in the utility model, bag
Thermal insulation board, link span, heat-insulation layer and high thermal conductivity layer and heating tube are included, the link span is provided with tube seat, spread successively on link span
If heat-insulation layer and high thermal conductivity layer, with being provided with heating tube at tube seat position correspondence above high thermal conductivity layer, the thermal insulation board includes anti-skidding
Layer, damp-proof layer, bottom plate and boss, the damp-proof layer are set below daughter backplane, and skid resistant course, the boss row are provided with below damp-proof layer
It is listed in above bottom plate, reinforcement is provided between the adjacent lands.
Further, the tube seat is in the type of falling Ω, and its depth is more than the diameter of heating tube.
Further, the high thermal conductivity layer is the soft state pure aluminum plate of heat conduction, and the thickness of the soft state pure aluminum plate of heat conduction is 0.2-
1mm。
Further, the link span surface is located at tube seat periphery and is also molded with circular protrusions.Between adjacent circular projection
Provided with pipeline limited block.The design of circular protrusions is higher by the height of heating tube, can prevent laying floor or ground above heating tube
Heating tube is formed after brick and extruded.
Further, the link span left and right ends are provided with the attachment structure for the splicing of adjacent link span.
Further, the damp-proof layer is thermoplastic polyurethane and the mixture of hydrophobic thermoplastic polyurethane.Can have
Effect reduces the situation that floor heating module makes moist when not in use and occurred.
Above-mentioned technical proposal can be seen that the beneficial effects of the utility model：
（1）A kind of high heat conduction thin type dry ground heating module described in the utility model, fine aluminium heat-conducting layer is used on link span,
Comprehensive heat conduction, its heat-conducting effect are traditional more than 5 times, and heat radiates upwards comprehensively, and radiating is uniform, and the thermal efficiency is higher, generation
Backfilled for traditional silt, integral thickness is thin.
（2）A kind of high heat conduction thin type dry ground heating module described in the utility model, link span surface are located at tube seat periphery
Also be molded with circular protrusions, the design of circular protrusions is higher by the height of heating tube, can prevent above heating tube laying floor or
Heating tube is formed after floor tile and extruded, pipeline limited block is provided between adjacent circular projection, contributes to the spacing fixation of heating tube
In tube seat, prevent heating tube from being skidded off in tube seat.
Brief description of the drawings
Fig. 1 is the utility model overall structure decomposing schematic representation；
Fig. 2 is the structural representation of the link span in the utility model.
Embodiment
Below in conjunction with the accompanying drawings and specific embodiment, the utility model is furtherd elucidate.
A kind of high heat conduction thin type dry ground heating module as shown in Figure 1, including thermal insulation board 1, link span 2, heat-insulation layer 3 and height
Heat-conducting layer 4 and heating tube 5, the link span 2 are provided with tube seat 6, heat-insulation layer 3 and high thermal conductivity layer 4 are laid successively on link span 2,
The top of high thermal conductivity layer 4 includes skid resistant course 11, damp-proof layer 12, bottom with being provided with heating tube 5, the thermal insulation board 1 at the position correspondence of tube seat 6
Plate 13 and boss 14, the damp-proof layer 12 set the lower section of daughter backplane 13, and the lower section of damp-proof layer 12 is provided with skid resistant course 11, the boss 14
The top of bottom plate 13 is arranged in, reinforcement 15 is provided between the adjacent lands 14.The tube seat 6 is in the type of falling Ω, and its depth is more than
The diameter of heating tube.The high thermal conductivity layer 4 is the soft state pure aluminum plate of heat conduction, and the thickness of the soft state pure aluminum plate of heat conduction is 0.2-1mm.
The surface of link span 2 is located at the periphery of tube seat 6 and is also molded with circular protrusions 7, and it is spacing to be provided with pipeline between adjacent circular projection 7
Block 8.The left and right ends of link span 2 are provided with the attachment structure 9 for the splicing of adjacent link span 2.The damp-proof layer 12 is thermoplastic poly ammonia
The mixture of ester and hydrophobic thermoplastic polyurethane.
A kind of high heat conduction thin type dry ground heating module and preparation method thereof, it is characterised in that：Specific preparation method is as follows：
1）Thermal insulation board 1 is made, damp-proof layer 12 is pasted onto the lower section of bottom plate 13, skid resistant course 11 is pasted onto the lower section of damp-proof layer 12,
Then boss 14 is made above bottom plate 11, is coupled between boss 14 by reinforcement 15 and fixed；
2）Link span 2 is made, carries out tube seat 6, circular protrusions 7 and limited block processing 8 respectively on the surface of link span 2；
3) prepare heat-insulation layer 3, heat-insulation layer 3 is laid on link span 2 first, and the position progress of corresponding tube seat 6 is recessed
Fall into processing；
4）Prepare high thermal conductivity layer 4, high thermal conductivity layer 4 is laid on to the top of heat-insulation layer 3, and the position of corresponding tube seat 6 is entered
Row depression treatment；
5）The link span 2 for having attached heat-insulation layer 3 and high thermal conductivity layer 4 is fixed on the top of thermal insulation board 1；
6) heating tube 5 is laid in tube seat 6 and realizes positioning.
Embodiment is merely to illustrate the utility model rather than limitation the scope of the utility model, is reading this practicality
After new, those skilled in the art fall within what the application appended claims were limited to various equivalences of the present utility model
Scope.
Claims (6)
- A kind of 1. high heat conduction thin type dry ground heating module, it is characterised in that：Including thermal insulation board（1）, link span（2）, heat-insulation layer（3） And high thermal conductivity layer（4）And heating tube（5）, the link span（2）It is provided with tube seat（6）, link span（2）On lay heat-insulation layer successively （3）And high thermal conductivity layer（4）, high thermal conductivity layer（4）Top and tube seat（6）Heating tube is provided with position correspondence（5）, the thermal insulation board （1）Including skid resistant course（11）, damp-proof layer（12）, bottom plate（13）And boss（14）, the damp-proof layer（12）Daughter backplane is set（13） Lower section, damp-proof layer（12）Lower section is provided with skid resistant course（11）, the boss（14）It is arranged in bottom plate（13）Top, the adjacent lands （14）Between be provided with reinforcement（15）.
- A kind of 2. high heat conduction thin type dry ground heating module according to claim 1, it is characterised in that：The tube seat（6）It is in The type of falling Ω, its depth are more than the diameter of heating tube.
- A kind of 3. high heat conduction thin type dry ground heating module according to claim 1, it is characterised in that：The high thermal conductivity layer （4）For the soft state pure aluminum plate of heat conduction, the thickness of the soft state pure aluminum plate of heat conduction is 0.2-1mm.
- A kind of 4. high heat conduction thin type dry ground heating module according to claim 1, it is characterised in that：The link span（2） Surface is located at tube seat（6）Periphery is additionally provided with circular protrusions（7）, adjacent circular projection（7）Between be provided with pipeline limited block（8）.
- A kind of 5. high heat conduction thin type dry ground heating module according to claim 4, it is characterised in that：The link span（2） Left and right ends, which are provided with, supplies adjacent link span（2）The attachment structure of splicing（9）.
- A kind of 6. high heat conduction thin type dry ground heating module according to claim 1, it is characterised in that：The damp-proof layer（12） For thermoplastic polyurethane and the mixture of hydrophobic thermoplastic polyurethane.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720855239.6U CN207146503U (en) | 2017-07-14 | 2017-07-14 | A kind of high heat conduction thin type dry ground heating module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720855239.6U CN207146503U (en) | 2017-07-14 | 2017-07-14 | A kind of high heat conduction thin type dry ground heating module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207146503U true CN207146503U (en) | 2018-03-27 |
Family
ID=61675122
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720855239.6U Expired - Fee Related CN207146503U (en) | 2017-07-14 | 2017-07-14 | A kind of high heat conduction thin type dry ground heating module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207146503U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107238127A (en) * | 2017-07-14 | 2017-10-10 | 苏州灵均暖通科技有限公司 | A kind of high heat conduction thin type dry ground heating module and preparation method thereof |
| CN110486782A (en) * | 2019-09-16 | 2019-11-22 | 张家港市科兴炭纤维制品有限公司 | One kind is based on high efficiency energy saving new floor heating line after graphene and polyethylene mixing |
-
2017
- 2017-07-14 CN CN201720855239.6U patent/CN207146503U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107238127A (en) * | 2017-07-14 | 2017-10-10 | 苏州灵均暖通科技有限公司 | A kind of high heat conduction thin type dry ground heating module and preparation method thereof |
| CN110486782A (en) * | 2019-09-16 | 2019-11-22 | 张家港市科兴炭纤维制品有限公司 | One kind is based on high efficiency energy saving new floor heating line after graphene and polyethylene mixing |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180327 Termination date: 20190714 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |