CN206992107U - A kind of small spacing LED component and the display screen being produced from it - Google Patents
A kind of small spacing LED component and the display screen being produced from it Download PDFInfo
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- CN206992107U CN206992107U CN201720511692.5U CN201720511692U CN206992107U CN 206992107 U CN206992107 U CN 206992107U CN 201720511692 U CN201720511692 U CN 201720511692U CN 206992107 U CN206992107 U CN 206992107U
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Abstract
It the utility model is related to a kind of small spacing LED component, including substrate, at least one thin-film LED, at least one inverted structure chip, at least one horizontal structure chip, wire and packing colloid on the inverted structure chip on the substrate on the substrate；The maximum length of the inverted structure chip is more than or equal to the maximum length of the horizontal structure chip, and the Breadth Maximum of the inverted structure chip is more than or equal to the Breadth Maximum of the horizontal structure chip；Accordingly, the invention also discloses the display screen by the small spacing LED component manufacture.Small spacing LED component provided by the utility model, solve big visual angle viewing display screen and the phenomenon of red shift or color distortion occur.
Description
Technical field
It the utility model is related to a kind of LED encapsulation technologies field, more particularly to a kind of small spacing LED component and be produced from it
Display screen.
Background technology
LED as light source of new generation, have energy-saving and environmental protection, safety, long lifespan, low-power consumption, low-heat, high brightness, waterproof,
The features such as miniature, shockproof, easy light modulation, light beam are concentrated, easy maintenance, it can be widely applied to various instructions, display, decoration, the back of the body
The fields such as light source, general lighting.
Existing small spacing light-emitting diode display part encapsulation is mainly horizontal using flip-chip, thin-film LED, horizontal chip
Arrangement, mainly faces problems with：
First, chip level is arranged, it is desirable to provide larger chip mounting area could accommodate the chips of red, green, blue three,
Package dimension reduces very difficult.
Secondly, existing small pitch packages need the red, green, blue three primary colours chip to do especially small, chip too it is small not only
Bring great challenge for chip manufacture, meanwhile, chip it is too small encapsulation when can cause die bond, bonding wire yield significantly under
Drop, and larger reliability hidden danger be present, easily there is electric leakage, punch-through in chip.
Again, chip level is arranged, even if package substrate can provide enough chip mounting areas, package substrate surface
Most of area is covered by chip, and device light-emitting zone accounting is big, and this can substantially reduce packaging and small spacing is made
Contrast after display screen.
Finally, in the encapsulation of small spacing display device, the spread pattern of chip mainly has（Class）Isosceles triangle,（Class）One word
Shape, because the red light chips in current three primary colours chip are mainly manufactured using nontransparent substrate, red light chips can block other face
The emergent ray of color chip, and visual angle is bigger, the phenomenon that red chip blocks other color chips emergent rays is more violent, therefore device
Easily there is red shift or figure color distortion phenomenon in big view directions in part.Therefore, it is necessary to propose a kind of small spacing LED component
With the display screen being produced from it, solves disadvantages described above.
The utility model proposes a kind of small spacing LED component and the display screen being produced from it, LED component chi can be reduced
Very little, light-emitting zone area accounting is small, and can alleviate it and red shift or color distortion occur applied to big view directions in display screen
Phenomenon.
The content of the invention
The technical problems to be solved in the utility model is to provide a kind of small spacing LED component and the display screen being produced from it,
LED component size can be reduced, light-emitting zone area accounting is small, and can alleviate it and occur applied to big view directions in display screen
Red shift or the phenomenon of color distortion.
In order to solve the above-mentioned technical problem, the utility model proposes a kind of small spacing LED component, including substrate, at least one
It is individual thin-film LED on the substrate, at least one inverted structure chip on the substrate, at least one
Horizontal structure chip, wire and packing colloid on the inverted structure chip；
The maximum length of the inverted structure chip be more than or equal to the horizontal structure chip maximum length, it is described fall
The Breadth Maximum of assembling structure chip is more than or equal to the Breadth Maximum of the horizontal structure chip.
Preferably, inverted structure chip includes the first transparent substrates, first be arranged under first transparent substrates hair
Photosphere, high reflection layer and weld layer, the high reflection layer is between first luminescent layer and the weld layer；
The horizontal structure chip includes the second transparent substrates, the second luminescent layer being arranged in second transparent substrates
And electrode layer, the electrode layer are located at the upper surface of second luminescent layer.
Preferably, the substrate includes four welding zones, respectively the first welding zone, the second welding zone, the 3rd welding zone and the 4th
Welding zone；
First welding zone is public area；
The thin-film LED is located on second welding zone, and the other end is electrically connected by wire and first welding zone
Connect；
The inverted structure chip is located on first welding zone and the 3rd welding zone；
The horizontal structure chip is located on the inverted structure chip, and its one end passes through wire and first welding zone electricity
Connection, the other end are electrically connected by wire with the 4th welding zone.
Preferably, the minimum spacing between first welding zone, the second welding zone, the 3rd welding zone and the 4th welding zone be more than or
Equal to 60 μm.
Preferably, the minimum spacing between first welding zone, the second welding zone, the 3rd welding zone and the 4th welding zone is 80 μm
-150μm。
Preferably, the area of first welding zone and first welding zone, the second welding zone, the 3rd welding zone and the 4th welding zone
The ratio of area summation is more than 0.3.
Preferably, the horizontal structure chip is fixed on the inverted structure chip by transparent epoxy or transparent organic silicon
On.
Preferably, the high reflection layer is Bragg reflecting layer, silver layer or aluminium lamination.
Preferably, the welding zone is the metal level for being arranged at the substrate front side, and the back side of the substrate is provided with and institute
State the metal level that substrate front side metal level position matches；
Metal level positioned at the substrate front side passes through internal via or edge with the metal level positioned at the substrate back
Via electrically connects.
A kind of display screen manufactured by described small spacing LED component, including at least one small spacing LED component.
Compared with prior art, the beneficial effects of the utility model are：
1st, small spacing LED component provided by the utility model, the volume of inverted structure chip are significantly greater than vertical stratification core
Piece, inverted structure chip and thin-film LED of the present utility model may be contained within the substrate, therefore thin-film LED is only
Only fraction blocks inverted structure chip light-emitting；Secondly, horizontal structure chip is located above the inverted structure chip, Gu Shui
Higher than the thin-film LED highly, therefore, thin-film LED can not block horizontal structure chip light-emitting to flat structure chip,
Finally, the inverted structure chip and horizontal structure chip are transparent chips, therefore will not block thin-film LED light extraction, because
This, the display screen that the utility model is manufactured by the small spacing LED component, solve big visual angle viewing display screen occur red shift or
The phenomenon of color distortion.
2nd, small spacing LED component provided by the utility model, the horizontal structure on the inverted structure chip
All edges of chip are no more than the edge of the inverted structure chip, avoid the horizontal structure chip hanging, on the one hand,
During preventing wire bonding, hanging horizontal structure chip is damaged, so as to influence the horizontal structure chip
Luminous efficiency, or even destroy the horizontal structure chip；On the other hand, it is easy to during die bond to all chip edges
Identification.
3rd, small spacing LED component provided by the utility model, the high reflection layer are located at the weld layer and described first
Between luminescent layer, for improving the light extraction efficiency of the inverted structure chip.
Brief description of the drawings
Fig. 1 is the top view of the small spacing LED component of the utility model；
Fig. 2 is the cross-sectional view of the small spacing LED component of the utility model；
Fig. 3 is the top view of the substrate of the small spacing LED component of the utility model；
Fig. 4 is the structural representation of the inverted structure chip of the small spacing LED component of the utility model；
Fig. 5 is the structural representation of the horizontal structure chip of the small spacing LED component of the utility model；
Fig. 6 is the structural representation of another embodiment of the small spacing LED component of the utility model；
Fig. 7 is the cross-sectional view of another embodiment of the small spacing LED component of the utility model；
Fig. 8 is the flow chart of the small spacing LED component method for packing of the utility model；
Fig. 9 is the flow chart of another embodiment of the small spacing LED component method for packing of the utility model.
Embodiment
In order that those skilled in the art more fully understands the technical solution of the utility model, below in conjunction with the accompanying drawings with it is excellent
Selecting embodiment, the utility model is described in further detail.
As Figure 1-5, the utility model provides a kind of small spacing LED component, including substrate 1, at least one is located at institute
State the thin-film LED 2 on substrate 1, at least one inverted structure chip 3 on the substrate 1, at least one be located at
Horizontal structure chip 4, wire 5 and packing colloid 6 on the inverted structure chip 3；
The maximum length of the inverted structure chip 3 is more than or equal to the maximum length of the horizontal structure chip 4, described
The Breadth Maximum of inverted structure chip 3 is more than or equal to the Breadth Maximum of the horizontal structure chip 4；
Inverted structure chip 3 comprises at least the first transparent substrates 31, and it is transparent that the horizontal structure chip 4 comprises at least second
Substrate 41.
The substrate 1 includes at least four welding zones 11, the thin-film LED 2 be located in one of welding zone and with it is another
Welding zone electrically connects, and the inverted structure chip 3 is on two welding zones, the horizontal structure chip 4 and two of which welding zone electricity
Connection；
The welding zone 11 is is arranged at the 1 positive metal level of substrate, and further, the back side of the substrate 1 is also set
The metal level to match with the front metal layer position of substrate 1 is equipped with, to form the pin of the small spacing LED component,
The side that metal level positioned at the substrate front side passes through internal via or edge via with the metal level positioned at the substrate back
Formula realizes electrical connection, and the technological means is the utility model routine techniques feature, and here is omitted.
In the present embodiment, the substrate 1 includes four welding zones 11, respectively the first welding zone 111, the second welding zone the 112, the 3rd
The welding zone 114 of welding zone 113 and the 4th, wherein, first welding zone 111 is public area；The thin-film LED 2 is positioned at described
Second welding zone 112, it is electrically connected by wire 5 with first welding zone 111；One end of the inverted structure chip 3 is located at institute
The first welding zone 111 is stated, the other end is located at the 3rd welding zone 113；The horizontal structure chip 4 is located at the inverted structure chip
On 3, its one end is electrically connected by wire 5 with first welding zone 111, and the other end passes through wire 5 and the electricity of the 4th welding zone 114
Connection.
Further, the minimum spacing between first welding zone, the second welding zone, the 3rd welding zone and the 4th welding zone is more than
Or equal to 60 μm, preferably 80 μm -150 μm, the area of first welding zone welds with first welding zone, the second welding zone, the 3rd
The ratio of the area summation of area and the 4th welding zone is more than 0.3, sets above parameter herein, LED component is reduced as far as possible, and
The reliability of LED component is not influenceed.
Thin-film LED 2 is usually red LED chip, and two electrode is respectively positioned at the thin-film LED 2
Upper and lower surface, therefore the thin-film LED 2 is fixed on second welding zone 112 by conductive silver paste, positioned at upper table
Another electrode in face realizes the electrical connection between first welding zone 111 by wire.
The inverted structure chip 3 is usually blue-light LED chip or green LED chip, and it includes the first transparent substrates 31；
Specifically, the inverted structure chip 3 includes weld layer 32, the first luminescent layer 33 on the weld layer and is located at
The first transparent substrates 31 on first luminescent layer 33, herein because first luminescent layer 33 is transparent positioned at described first
Under substrate 31, first transparent substrates 31 are arranged to transparent, are easy to the first luminescent layer 33 of the inverted structure chip 3
The light sent can be transmitted away smoothly.
The weld layer 32 includes the first electrode 321 and second electrode 322 of mutually insulated, and the first electrode is positive electricity
Pole or negative electrode, the second electrode are negative electrode or positive electrode, and the first electrode 321 is consolidated by conductive silver paste or tin alloy
Due to first welding zone 111, the second electrode 322 is fixed on the 3rd welding zone 113 by conductive silver paste or tin alloy.
More preferably, the inverted structure chip 3 also includes high reflection layer 34, and the high reflection layer 34 is located at the weld layer
Between 32 and first luminescent layer 33, for improving the light extraction efficiency of the assembling structure chip 3；Specifically, the high reflection
Layer 34 can be DBR（Distributed bragg reflection Bragg reflecting layers）, silver layer or aluminium lamination, in this implementation,
The high reflection layer 34 is aluminium lamination.
The maximum length of the horizontal structure chip 4 is less than or equal to the maximum length of the inverted structure chip 3, described
The Breadth Maximum of horizontal structure chip 4 is less than or equal to the Breadth Maximum of the inverted structure chip 3, i.e., positioned at the upside-down mounting knot
All edges of the horizontal structure chip 4 on structure chip 3 are no more than the edge of the inverted structure chip 4, avoid institute
It is hanging to state horizontal structure chip 4, on the one hand, during preventing wire bonding, hanging horizontal structure chip 4 is caused brokenly
It is bad, so as to influence the luminous efficiency of the horizontal structure chip 4, or even destroy the horizontal structure chip 4；On the other hand, just
In the identification during die bond to all chip edges.
The horizontal structure chip 4 is usually blue-light LED chip or green LED chip, and it is consolidated by transparent die bond material
Due on the inverted structure chip 3, transparent die bond material can be transparent epoxy or transparent organic silicon herein, using transparent solid
Brilliant material is used to prevent from fixing the light that inverted structure chip described in material blocks is sent；The horizontal structure chip 4 includes second
Transparent substrates 41, the second luminescent layer 42 on second transparent substrates and on second luminescent layer
Electrode layer 43, the electrode layer include the first electrode layer 431 and the second electrode lay 432 of mutually insulated, the first electrode layer
431 are electrically connected by wire with first welding zone 111 realization, and the second electrode lay 432 passes through wire 5 and the 4th welding zone
114 realize electrical connection.
The wire 5 is gold thread, copper cash or alloy wire, is configured with specific reference to being actually needed, described in the present embodiment
Wire 5 is gold thread, for realizing the electrical connection between chip and welding zone.
The packing colloid 6 covers all thin-film LEDs 2, inverted structure chip 3, horizontal structure chip in installing zone
4 and wire 5, the packing colloid 6 is the mixture of epoxy resin, scattering powder and extinction powder, wherein, the scattering powder is
One or more in titanium oxide, titanium dioxide, silica, the extinction powder are carbon dust or one kind or several in graphite powder
Kind.
Accordingly, as shown in figs 1-9, the invention also discloses the method for packing of the small spacing LED component, its
In, Fig. 8 is the flow chart of the utility model method for packing, and Fig. 9 is the flow of another embodiment method for packing of the utility model
Figure, the method for packing comprise the following steps：
S1 prepared substrates：Substrate 1 is ready to, wherein, the substrate 1 includes at least four welding zones 11；
S2 die bonds：At least one thin-film LED 2 is fixed on one of welding zone, by least one upside-down mounting knot
Structure chip 3 is fixed on two welding zones, and at least one horizontal structure chip 4 is fixed on the inverted structure chip 3, its
In, inverted structure chip 3 comprises at least the first transparent substrates 31, and the horizontal structure chip 4 comprises at least the second transparent substrates
41；The maximum length of the inverted structure chip 3 is more than or equal to the maximum length of the horizontal structure chip 4, the upside-down mounting
The Breadth Maximum of fabric chip 3 is more than or equal to the Breadth Maximum of the horizontal structure chip 4；
S3 wire bondings：The upper surface of thin-film LED and one of welding zone are connected using wire 5, using wire 5
The both ends of horizontal structure chip 4 are electrically connected with two welding zones respectively；
S4 is encapsulated：It is packaged using packing colloid 6, the packing colloid 6 covers all thin-film LEDs 2, upside-down mounting
Fabric chip 3, horizontal structure chip 4 and wire 5, obtain at least one small spacing LED component；
Herein it should be noted that the substrate 1 includes at least four welding zones, an installing zone 10 or multiple installations are formed
Area 10, i.e., an installing zone 10 can be set on described substrate 1, multiple installing zones 10, an installing zone can also be set
10 include at least four welding zones 11, if multiple installing zones 10 are set on the substrate 1, in addition to S5 separation：Will be packaged small
Spacing LED component is separated into single small spacing LED component using the blade of rotation at a high speed.
At least two installing zones 10 will be included with the substrate 1 below, an installing zone 10 includes four welding zones 11
It is specifically described, a kind of method for packing of small spacing LED component, the method for packing comprises the following steps：
S1 prepared substrates：Substrate is ready to, wherein, the substrate 1 includes at least two installing zones 10, described in one
Installing zone 100 includes four welding zones, respectively the first welding zone 111, the second welding zone 112, the 3rd welding zone 113 and the 4th welding zone
114, wherein the first welding zone 111 is public area；
The welding zone 11 is the metal level for being arranged at the substrate front side, and further, the back side of the substrate 1 is also provided with
There is the metal level to match with the substrate front side metal level position, to form the pin of the small spacing LED component, be located at
The 1 positive metal level of substrate is with the metal level positioned at the back side of substrate 1 by way of internal via or edge via
Realize electrical connection.
S2 die bonds：In one installing zone, a thin-film LED 2 is fixed on one of welding zone, will at least one
Individual inverted structure chip 3 is fixed on two welding zones, and at least one horizontal structure chip 4 is fixed on into the inverted structure chip
On 3, wherein, inverted structure chip 3 comprises at least the first transparent substrates 31, and it is saturating that the horizontal structure chip 4 comprises at least second
Bright substrate 41；The maximum length of the inverted structure chip 3 is more than or equal to the maximum length of the horizontal structure chip 4, institute
The Breadth Maximum for stating inverted structure chip 2 is more than or equal to the Breadth Maximum of the horizontal structure chip 4；
Thin-film LED 2 is usually red LED chip, and two electrode is respectively positioned at the upper of the thin-film LED
Surface and lower surface, the thin-film LED 2 are fixed on second welding zone by conductive silver paste.
The inverted structure chip 3 is usually blue-light LED chip or green LED chip, and it includes weld layer 32, positioned at institute
State the first luminescent layer 33 on weld layer and the first transparent substrates 31 on first luminescent layer 33, herein by
Be located in first luminescent layer 33 under first transparent substrates 31, first transparent substrates 31 are provided with it is transparent,
The light for being easy to the first luminescent layer of the inverted structure chip 3 to send can be transmitted away smoothly.
The weld layer 31 includes first electrode 321 and second electrode 322, and the first electrode 321 passes through conductive silver paste
Or tin alloy is fixed on first welding zone 111, the second electrode 322 is fixed on described by conductive silver paste or tin alloy
Three welding zones 113.
More preferably, the inverted structure chip 3 also includes high reflection layer 34, and the high reflection layer 34 is located at the weld layer
Between 32 and first luminescent layer 33, for improving the light extraction efficiency of the assembling structure chip；Specifically, the high reflection layer
34 can be Bragg reflecting layer, silver layer or aluminium lamination, and in this implementation, the high reflection layer is aluminium lamination.
All edges of the horizontal structure chip 4 on the inverted structure chip 3 are no more than the upside-down mounting
The edge of fabric chip, avoid the horizontal structure chip 4 hanging, on the one hand, during preventing wire bonding, to hanging
Horizontal structure chip damage, so as to influence the luminous efficiency of the horizontal structure chip, or even destroy the horizontal junction
Structure chip；On the other hand, it is easy to the identification to all chip edges during die bond.
The horizontal structure chip 4 is usually blue-light LED chip or green LED chip, and it is consolidated by transparent die bond material
Due on the inverted structure chip 3, transparent die bond material can be epoxy or organosilicon herein, be used using transparent die bond material
In the light for preventing from fixing inverted structure chip described in material blocks and sending；The horizontal structure chip 4 includes the second transparent substrates
41st, the second luminescent layer 42 on second transparent substrates 41 and the electrode on second luminescent layer 42
Layer 43, the electrode layer 43 includes first electrode layer 431 and the second electrode lay 432.
S3 wire bondings：Upper surface and the first welding zone 111 of thin-film LED 2 are connected using wire 5, using wire 5
Connect the welding zone 111 of first electrode layer 431 and first of horizontal structure chip 4, the welding zone 114 of the second electrode lay 432 and the 4th；
S4 is encapsulated：It is packaged using packing colloid 6, the packing colloid 6 covers all vertical stratification cores in installing zone
Piece 2, inverted structure chip 3, horizontal structure chip 4 and wire 5, obtain at least two small spacing LED components；Wherein, it is described
Packing colloid 6 is the mixture of epoxy resin, scattering powder and extinction powder, and the scattering powder is titanium oxide, titanium dioxide, two
One or more in silica, the extinction powder are the one or more in carbon dust or graphite powder.
S5 is separated：The blade that at least two packaged small spacing LED components are rotated using high speed is separated into single small
Spacing LED component.
Accordingly, a kind of display screen by the small spacing LED component manufacture, the display screen is also disclosed in the utility model
Including at least one LED component, the LED component is above-mentioned small spacing LED component, and the LED component is on the display screen
It is arranged in array, for forming image.
Herein it should be noted that under normal circumstances, the volume of inverted structure chip is significantly greater than thin-film LED, this
The inverted structure chip and thin-film LED of utility model may be contained within the substrate, therefore thin-film LED only small portion
Divide and block inverted structure chip light-emitting；Secondly, horizontal structure chip is located above the inverted structure chip, therefore horizontal structure
Higher than the thin-film LED highly, therefore, thin-film LED can not block horizontal structure chip light-emitting to chip, finally,
The inverted structure chip and horizontal structure chip are transparent chips, therefore will not block thin-film LED light extraction, therefore, this
Utility model is solved big visual angle viewing display screen and red shift or color is occurred by the display screen of the small spacing LED component manufacture
The phenomenon of distortion.
Compared with prior art, the beneficial effects of the utility model are：
1st, small spacing LED component provided by the utility model, the volume of inverted structure chip are significantly greater than vertical stratification core
Piece, inverted structure chip and thin-film LED of the present utility model may be contained within the substrate, therefore thin-film LED is only
Only fraction blocks inverted structure chip light-emitting；Secondly, horizontal structure chip is located above the inverted structure chip, Gu Shui
Higher than the thin-film LED highly, therefore, thin-film LED can not block horizontal structure chip light-emitting to flat structure chip,
Finally, the inverted structure chip and horizontal structure chip are transparent chips, therefore will not block thin-film LED light extraction, because
This, the display screen that the utility model is manufactured by the small spacing LED component, solve big visual angle viewing display screen occur red shift or
The phenomenon of color distortion.
2nd, small spacing LED component provided by the utility model, the horizontal structure on the inverted structure chip
All edges of chip are no more than the edge of the inverted structure chip, avoid the horizontal structure chip hanging, on the one hand,
During preventing wire bonding, hanging horizontal structure chip is damaged, so as to influence the horizontal structure chip
Luminous efficiency, or even destroy the horizontal structure chip；On the other hand, it is easy to during die bond to all chip edges
Identification.
3rd, small spacing LED component provided by the utility model, the high reflection layer are located at the weld layer and described first
Between luminescent layer, for improving the light extraction efficiency of the assembling structure chip.
Described above is preferred embodiment of the present utility model, it is noted that for the ordinary skill of the art
For personnel, on the premise of the utility model principle is not departed from, some improvements and modifications can also be made, these are improved and profit
Decorations are also considered as the scope of protection of the utility model.
Claims (10)
1. a kind of small spacing LED component, it is characterised in that including substrate, at least one vertical stratification on the substrate
Chip, at least one inverted structure chip, at least one water on the inverted structure chip on the substrate
Flat structure chip, wire and packing colloid；
The maximum length of the inverted structure chip is more than or equal to the maximum length of the horizontal structure chip, the upside-down mounting knot
The Breadth Maximum of structure chip is more than or equal to the Breadth Maximum of the horizontal structure chip.
2. small spacing LED component according to claim 1, it is characterised in that inverted structure chip includes the first transparent lining
Bottom, the first luminescent layer, high reflection layer and the weld layer being arranged under first transparent substrates, the high reflection layer is positioned at described
Between first luminescent layer and the weld layer；
The horizontal structure chip include the second transparent substrates, the second luminescent layer for being arranged in second transparent substrates and
Electrode layer, the electrode layer are located at the upper surface of second luminescent layer.
3. small spacing LED component according to claim 1, it is characterised in that the substrate includes four welding zones, is respectively
First welding zone, the second welding zone, the 3rd welding zone and the 4th welding zone；
First welding zone is public area；
The thin-film LED is located on second welding zone, and the other end is electrically connected by wire with first welding zone；
The inverted structure chip is located on first welding zone and the 3rd welding zone；
The horizontal structure chip is located on the inverted structure chip, and its one end is electrically connected by wire and first welding zone
Connect, the other end is electrically connected by wire with the 4th welding zone.
4. small spacing LED component according to claim 3, it is characterised in that first welding zone, the second welding zone, the 3rd
Minimum spacing between welding zone and the 4th welding zone is more than or equal to 60 μm.
5. small spacing LED component according to claim 3, it is characterised in that first welding zone, the second welding zone, the 3rd
Minimum spacing between welding zone and the 4th welding zone is 80 μm -150 μm.
6. small spacing LED component according to claim 3, it is characterised in that the area of first welding zone and described the
One welding zone, the second welding zone, the ratio of area summation of the 3rd welding zone and the 4th welding zone are more than 0.3.
7. small spacing LED component according to claim 1, it is characterised in that the horizontal structure chip passes through transparent ring
Oxygen or transparent organic silicon are fixed on the inverted structure chip.
8. small spacing LED component according to claim 2, it is characterised in that the high reflection layer be Bragg reflecting layer,
Silver layer or aluminium lamination.
9. small spacing LED component according to claim 3, it is characterised in that the welding zone is to be arranged at the substrate just
The metal level in face, the back side of the substrate are provided with the metal level to match with the substrate front side metal level position；
Metal level positioned at the substrate front side passes through internal via or edge via with the metal level positioned at the substrate back
Electrical connection.
10. a kind of display screen manufactured by any described small spacing LED components of claim 1-9, it is characterised in that including extremely
A few small spacing LED component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720511692.5U CN206992107U (en) | 2017-05-10 | 2017-05-10 | A kind of small spacing LED component and the display screen being produced from it |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720511692.5U CN206992107U (en) | 2017-05-10 | 2017-05-10 | A kind of small spacing LED component and the display screen being produced from it |
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| Publication Number | Publication Date |
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| CN206992107U true CN206992107U (en) | 2018-02-09 |
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ID=61392159
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107195624A (en) * | 2017-05-10 | 2017-09-22 | 佛山市国星光电股份有限公司 | A kind of small spacing LED component and its method for packing and the display screen being produced from it |
| CN108695305A (en) * | 2018-05-17 | 2018-10-23 | 山西高科华兴电子科技有限公司 | Four crystalline substance LED show lamp bead structure |
-
2017
- 2017-05-10 CN CN201720511692.5U patent/CN206992107U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107195624A (en) * | 2017-05-10 | 2017-09-22 | 佛山市国星光电股份有限公司 | A kind of small spacing LED component and its method for packing and the display screen being produced from it |
| CN107195624B (en) * | 2017-05-10 | 2023-09-15 | 佛山市国星光电股份有限公司 | Small-spacing LED device, packaging method thereof and display screen manufactured by same |
| CN108695305A (en) * | 2018-05-17 | 2018-10-23 | 山西高科华兴电子科技有限公司 | Four crystalline substance LED show lamp bead structure |
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