CN206405561U - A kind of semiconductor devices automatic soldering device - Google Patents

Abstract

A kind of semiconductor devices automatic soldering device, belongs to welding semiconductor devices apparatus field.It is characterized in that：Described frame（6）It is provided with heating arrangements（7）And cooling body（8）, cooling body（8）Discharge end be provided with chip cassette loading mechanism（17）, pass through manipulator of unloading（9）By cooling body（8）The chip of discharge end is delivered to chip cassette loading mechanism（17）Complete mounted box；Heating arrangements（7）And cooling body（8）Lower section provided with lifting travel mechanism（3）, lift travel mechanism（3）Mobile terminal lift semiconductor devices（11）Bottom surface.The utility model directly holds semiconductor devices from below by lifting travel mechanism, it is to avoid gripping mode causes damage to semiconductor device surface, and positioning of the fixture to station it is inaccurate the problem of.Meanwhile, manipulator is set respectively in the feed end of heating arrangements and the discharge end of cooling body, handling material automation is realized, labor intensity is not only reduced, moreover, improving the precision that solid accumulation is put.

Description

A kind of semiconductor devices automatic soldering device

Technical field

A kind of semiconductor devices automatic soldering device, belongs to welding semiconductor devices apparatus field.

Background technology

With the development of modern science and technology, semiconductor devices and component are in engineering, extensive use available commercially.It is in thunder Reach, the extensive application of remote-control romote-sensing, Aero-Space etc. proposes higher and higher requirement to its reliability.And because of chip welding （Paste）The bad failure caused also increasingly causes the attention of people, irreversible because this failure is often fatal 's.

When assembling semiconductor devices, the process that circuit portion is heated, fixed with peripheral housing using bonding agent, it Afterwards, carry out by using soldering paste（Scolding tin）Welding be formed in connection in the portion of terminal of peripheral housing and the distribution of insulated substrate Process.In the case of bonding circuit portion with peripheral housing, in circuit portion or peripheral housing adhesive-applying, and with appropriate pressure Caking face in the state of the peripheral housing of power pressing, thus solidifies bonding agent, affixed circuit portion and peripheral housing.

At present, semiconductor devices is that multiple, marshalling semiconductor crystal block is welded on bottom plate to be made, existing In technology, the welder of used semiconductor devices is electric heating plate；In use, the bottom plate for being placed with crystal block is placed on On electric heating plate, crystal block is pressed using press tool with hand, makes crystal block together with bottom plate sweat soldering, reaches the mesh of welding 's；Such device has the shortcomings that labor strength is big, efficiency is low, precision is low, qualification rate is low, energy consumption is big.Heated Heating-up temperature must be accurately controlled in journey, while ensureing heating effect again, welding effect is not influenceed.But it has been found that Current welded plate is generally integral structure, and the side or top of welded plate are provided with heater strip or heating tube, and such a structure is formed Heating surface it is not uniform enough, heating effect is simultaneously bad, have impact on the welding effect of semiconductor devices；Moreover, semiconductor devices exists Conveying between each process is generally artificial or apparatus clamping, is easily destroyed semiconductor device surface, or cause one to human body Setting loss does harm to.Moreover, in existing semiconductor welding equipment, it is also no to realize full automatic pipeline system mode of operation.

The content of the invention

Technical problem to be solved in the utility model is：Overcome the deficiencies in the prior art there is provided a kind of Full-automatic welding, Mounted box, it is to avoid device damage, the semiconductor devices automatic soldering device for being easy to convey, improve welding effect.

The utility model solves the technical scheme that its technical problem used：The semiconductor devices automatic soldering device, Including frame, it is provided with below frame above switch board, frame provided with welding gland, it is characterised in that：In described frame according to Process is sequentially provided with heating arrangements and cooling body, and the discharge end of cooling body is provided with chip cassette loading mechanism, chip mounted box Mechanism is fixedly connected on described switch board side, and the feed end of heating arrangements is provided with loading machine hand, the discharging of cooling body The chip of cooling body discharge end is delivered to chip cassette loading mechanism provided with unloading manipulator, by manipulator of unloading and completes dress by end Box；Lifting travel mechanism of the lower section of heating arrangements and cooling body provided with the horizontal direction displacement of conveying semiconductor devices, lifting The bottom surface of semiconductor devices is lifted in the mobile terminal of travel mechanism, and the bottom of heating arrangements is provided with atmosphere conveying mechanism.

The lifting moving machine of conveying semiconductor devices horizontal direction displacement is set in the lower section of heating arrangements and cooling body Structure, directly holds semiconductor devices by lifting travel mechanism, will directly complete the semiconductor devices support of previous process from below Next station is delivered to, without mobile heating plate, moreover, from the delivery directly below of semiconductor devices, gripping mode pair can be avoided Cause the problem of damage, and positioning of the fixture to station are forbidden in semiconductor device surface.

Manipulator is set respectively in the feed end of heating arrangements and the discharge end of cooling body, the whole of full name process is realized Automatic paste handling and transfer, not only reduce labor intensity, use manpower and material resources sparingly, moreover, improving the essence that solid accumulation is put Degree.

Described heating arrangements include multiple heating plates being laid side by side in frame top, and each heating plate top surface is single respectively Semiconductor device is solely placed, heating plate includes the upper plate body and lower body of spelling group up and down, between upper plate body and lower body Provided with heater and thermometric thermal resistance.

The plate body of traditional integral type is changed to the assembled structure of two-piece unit formula, then installs and adds between plate body up and down Thermal, and equipped thermometric thermal resistance, ensure that the overall heating effect of plate body, thoroughly prevent plate body to semiconductor devices The uneven phenomenon of heating surface, while real time temperature measurement is carried out using thermal resistance, so that the heating-up temperature of flexible modulation heater, Further ensure plate body heating uniformity and heating-up temperature it is constant.Furthermore, plate body be divided into above and below two parts, be more convenient for peace Assembly and disassembly, are easy to maintenance, replacing, Embedded inner mounting structure of the later stage to heater and thermal resistance, it is ensured that plus The flatness of hot plate top surface, is further ensured that welding effect.

Described upper plate body top surface is provided with a plurality of longitudinally disposed handling slot, and the clutch end of lifting travel mechanism is worn It is enclosed in described handling slot, and in the lifting of handling slot and can moves forward and backward.It is preferred that, load and unload slot setting direction with The width of upper plate body is consistent, can be by loading and unloading slot from below by semiconductor devices when needing transfer semiconductor devices Lifting transfer, it is convenient and swift, avoid causing semiconductor device surface damage again.

The bottom of described upper plate body and the top of lower body correspond to the electrical heating peace for offering and matching along its length Tankage, two groups of electrical heating mounting grooves dock the installation through-hole to be formed and place heater.By inside upper plate body and lower body Electrical heating mounting groove is set, the passage of a plurality of installation heater, the passage and plate body are formed between upper plate body and lower body Length match, fully ensured that the overall heating of upper plate body, it is ensured that overall temperature rise it is uniform.Simultaneously, moreover it is possible to ensure heating Smooth, the placement compression of device.

The bottom surface of described upper plate body is correspondingly provided with installation provided with the fixing hole for installing Thermistor Temperature Measurement end, lower body top surface The thermal resistance mounting groove of thermal resistance body and circuit.Thermal resistance is also hidden in by upper plate body and lower body by thermal resistance mounting groove Inside, saves overall structure space, more compact structure.

Heating plate base is provided with below described lower body, lower body bottom surrounding passes through latch grafting heating plate base top The grafting endoporus in face, and cover sleeved on latch.By setting heating plate base, the height of heating plate is slightly lifted, Certain space formed below of lower body, when the space is used to weld, the circulation of anti-oxidation atmosphere, it is ensured that welding effect.

Described lifting travel mechanism include end plate, lifting movable plate and lifting assembly and translation component, lifting assembly and The top of translation component connects described lifting movable plate respectively.

Described lifting assembly includes lift arm and lifter slide, and lift arm includes telescopic cylinder and the cylinder bottom on top What movable end was connected walks wheel, walks slipping and is arranged on the lifter slide of domatic setting；Translating component includes translation motor, translation Arm and leading screw, translation motor output end connection leading screw, and pass through the bottom of threads of lead screw connection translation arms.

Described chip cassette loading mechanism includes porch in the double-deck mounted box flat board set, lower floor's mounted box flat board and is provided with chip Box translation mechanism, is provided between lower floor's mounted box flat board exit and upper strata mounted box flat board and lifts chip cartridges and push upper strata mounted box to The chip cartridges lifting ejecting mechanism of flat board.In the discharge end of cooling body, the chip cassette loading mechanism of full-automatic mounted box pattern is set, The full-automatic mounted box of chip is realized, the trouble of artificial mounted box is eliminated, also improve the mounted box efficiency of chip, it is to avoid people's frock The damage that box is caused to chip.

Described atmosphere conveying mechanism includes downward projection of arc atmosphere baffle plate and through atmosphere baffle plate setting in heating Nitrogen delivery pipe below plate.By setting atmosphere conveying mechanism, the lower section of heating plate and around form oxidation resistant atmosphere, Prevent that semiconductor devices surface metal is aoxidized after welding, and then influence its performance.

Described loading machine hand includes two clamping plates be arrangeding in parallel, above and below the lower inside of the clamping plate of both sides is provided with The lifting boss and correction boss be arrangeding in parallel.By the setting for lifting boss and correction boss so that the clamping plate of manipulator When gripping layers of chips, without realizing positioning, you can complete the calibration actions of layers of chips, when saving processing step and work Between, it is further ensured that welding effect.

Compared with prior art, the utility model is had an advantageous effect in that：The utility model is in heating arrangements and cold But the lower section of mechanism sets the lifting travel mechanism of conveying semiconductor devices horizontal direction displacement, by lifting travel mechanism under Semiconductor devices is directly held by side, directly adds the semiconductor devices delivery for completing previous process without mobile to next station Hot plate, moreover, from the delivery directly below of semiconductor devices, gripping mode can be avoided to cause damage to semiconductor device surface, with And fixture it is inaccurate to the positioning of station the problem of.Meanwhile, set respectively in the feed end of heating arrangements and the discharge end of cooling body Manipulator is put, handling material automation is realized, labor intensity is not only reduced, moreover, improving the precision that solid accumulation is put.

Brief description of the drawings

Fig. 1 is semiconductor devices automatic soldering device axonometric drawing schematic diagram.

Fig. 2 is that semiconductor devices automatic soldering device removes the side view schematic diagram after switch board.

Fig. 3 is heating arrangements explosive view schematic diagram.

Fig. 4 is Fig. 3 front view schematic diagram.

Fig. 5 is Fig. 1 part A close-up schematic view.

Fig. 6 is Fig. 1 rearview schematic diagram.

Fig. 7 is Fig. 6 part B close-up schematic view.

Wherein, 1, switch board 2, portal frame 3, lifting travel mechanism 301, end plate 302, lifting movable plate 303, carry Rise arm 304, lifter slide 305, translation motor 306, translation arms 307, leading screw 4, loading machine hand 401, lifting boss 402nd, correction boss 403, clamping plate 5, welding gland 6, frame 601, longitudinal baffle 602, horizontal baffle 7, heater Structure 701, lower body 7011, latch 7012, mounting groove 7013, thermal resistance mounting groove 702, heating muff on heating wire 7021st, mounting groove 7032, handling slot 7033, fixing hole 704, installation under heating wire 703, upper plate body 7031, heating wire Hole 8, cooling body 9, unloading manipulator 10, connection pivoted arm 11, semiconductor devices 12, atmosphere baffle plate 13, nitrogen delivery pipe 14th, heating plate base 1401, grafting endoporus 15, sleeve 16, thermal resistance 17, chip cassette loading mechanism 1701, mounted box flat board 1702nd, riser 18, chip cartridges translation mechanism 19, chip cartridges 1901, chip packing groove 20, chip cartridges lifting ejecting mechanism 2001st, lifting motor 2002, hoisting frame 2003, lift rail 2004, riser 2005, release motor 2006, push-off pin 21st, chip 22, chip extract disk 23, chip ejecting mechanism 24, chip car location in tridimensional.

Embodiment

Fig. 1 ~ 7 are most preferred embodiments of the present utility model, and 1 ~ 7 pair of the utility model is done furtherly below in conjunction with the accompanying drawings It is bright.

Referring to the drawings 1 ~ 7：A kind of semiconductor devices automatic soldering device, including frame 6, the lower section of frame 6 are placed on control The top of cabinet 1, the top surface of switch board 1 is operating platform, and inside is provided with the device such as circuit control device and atmosphere occurring source.In frame 6 Side is provided with is sequentially provided with heating arrangements 7 and cold in the welding gland 5 that pivoted arm 10 is connected, frame 6 by connecting according to process But mechanism 8, the feed end of heating arrangements 7 is provided with loading machine hand 4, and the discharge end of cooling body 8 is provided with unloading manipulator 9, dress Goods manipulator 4 and unloading manipulator 9 pass through the slip rail of the horizontal component installation manipulator at the top of respective portal frame 2 respectively Road；Lifting travel mechanism 3 of the lower section of heating arrangements 7 and cooling body 8 provided with the horizontal direction displacement of conveying semiconductor devices, plus The bottom of heat engine structure 7 is provided with atmosphere conveying mechanism.

Heating arrangements 7 include multiple heating plates being laid side by side at the top of frame 6, and each heating plate top surface is individually put Semiconductor device 11 is put, heating plate includes the upper plate body 703 and lower body 701 of spelling group up and down, upper plate body 703 and lower plate Heater and thermometric thermal resistance 16 are provided between body 701.The top surface of upper plate body 703 is provided with a plurality of longitudinally disposed handling slot 7032, the clutch end of lifting travel mechanism 3 is set in handling slot 7032, and can be lifted and preceding in handling slot 7032 After move, i.e., a plurality of lifting movable plate 302 is set in handling slot 7032, and lifting movable plate 302 longitudinal length is less than dress Unload the depth of slot 7032.The bottom of upper plate body 703 and the top of lower body 701 correspond to offer what is matched along its length Electrical heating mounting groove, two groups of electrical heating mounting grooves dock the installation through-hole to be formed and place heater.The bottom surface of upper plate body 703 is set There is the fixing hole 7033 for installing the thermometric end of thermal resistance 16, the top surface of lower body 701 is correspondingly provided with the installation body of thermal resistance 16 and circuit Thermal resistance mounting groove 7013.The lower section of lower body 701 is provided with heating plate base 14, and the bottom surrounding of lower body 701 passes through latch The grafting endoporus 1401 of the top surface of 7011 grafting heating plate base 14, and cover sleeved on latch 7011.

Lifted travel mechanism 3 include end plate 301, lifting movable plate 302 and lifting assembly and translation component, lifting assembly and The top of translation component connects lifting movable plate 302 respectively, and lifting movable plate 302 is a plurality of provided with horizontal parallel setting, a plurality of Lift the two ends of movable plate 302 and fixation is encapsulated by end plate 301 respectively.Lifting assembly includes lift arm 303 and lifter slide 304, What the telescopic cylinder and cylinder lower removable telescopic end that lift arm 303 includes top were connected walks wheel, walks slipping and is arranged on domatic On the lifter slide 304 of setting；Translating component includes translation motor 305, translation arms 306 and leading screw 307, and translation motor 305 is defeated Go out end connection leading screw 307, and pass through the bottom of the threaded connection translation arms 306 of leading screw 307.

Operationally, after semiconductor devices 11 completes the operational sequence at heating plate, start translation motor 305, put down Moving motor 305 drives leading screw 307 to rotate, and drives translation arms 306 to realize by leading screw 307 and translates, translation arms 306 drive multiple supports Lift the one or more stations of the synchronizing moving of semiconductor devices 11 on lifting movable plate 302, during movement, lift arm 303 follow the lifting synchronizing moving of movable plate 302, and the telescopic cylinder telescopic end being equally connected with lifting movable plate 302 stretches out, and leads to Cross away wheel gradually to glide along lifter slide 304, after the completion of station, lifting movable plate 302 declines one under the drive of telescopic cylinder Fixed position, departs from the contact with semiconductor devices 11, then, translation motor 305 is overturn, and translation arms 306 reversely translate back original Position, similarly, telescopic cylinder telescopic end are gradually retracted original position, and are slided by walking wheel along lifter slide 304 is gradually upper.

As shown in Figure 6 and Figure 7, chip cassette loading mechanism 17 includes the double-deck mounted box flat board 1701 set, two layers of mounted box flat board 1701 sides are connected by riser 1702, and porch is provided with chip cartridges translation mechanism 18, chip cartridges in lower floor's mounted box flat board 1701 Translation mechanism 18 can use rack as shown in Figure 7, also can use belt or chain, and be equipped with corresponding gear, belt pulley or Sprocket wheel, then motor is connected by gear, belt pulley or sprocket wheel；The exit of lower floor's mounted box flat board 1701 with upper strata mounted box flat board It is provided between 1701 and chip cartridges 19 is lifted and push the chip cartridges lifting ejecting mechanism 20 of upper strata mounted box flat board 1701 to.Chip cartridges Lifting ejecting mechanism 20 includes lifting motor 2001, hoisting frame 2002, lift rail 2003, riser 2004, release motor 2005 and push-off pin 2006, lifting motor 2001, lift rail 2003, riser 2004, release motor 2005 and push-off pin 2006 are separately mounted to the two sides of hoisting frame 2002, and lifting motor 2001 drives chip cartridges 19 to be lifted by transmission mechanism connection Riser 2004, release motor 2005 connection push-off pin 2006, push-off pin 2006 through hoisting frame 2002 connect riser 2004, riser 2004 can be laterally urged.In the length direction side of chip cartridges 19, provided with chip ejecting mechanism 23, chip is pushed away Disk 22 is extracted provided with chip in the lower section for going out mechanism 23.

Specifically, operationally, first pass through unloading manipulator 9 and will cool down the chip that completes and be placed in and be arranged on switch board 1 The portable chip car location in tridimensional 24 of side, then extracts disk 22 by chip and extracts chip one by one, and be moved to chip mounted box At mechanism 17, now, chip cartridges 19 are placed on the porch of lower floor's mounted box flat board 1701, are delivered to by chip cartridges translation mechanism 18 Inner side, is then pushed into the top chip of chip cartridges 19 by chip by chip ejecting mechanism 23 and dispenses in groove 1901, Ran Houxin Film magazine lifting ejecting mechanism 20 drives the height of the Move Up One Layer chip of chip cartridges 19 packing groove 1901, by that analogy, until, Whole chip cartridges 19 are filled, and then riser 2004 are promoted by releasing motor 2005 and push-off pin 2006, by the chip filled Box 19 is pushed out on upper strata mounted box flat board 1701, and fully automatic integral is realized in whole mounted box action.

Atmosphere conveying mechanism includes downward projection of arc atmosphere baffle plate 12 and is arranged on heating plate through atmosphere baffle plate 12 The nitrogen delivery pipe 13 of lower section.Loading machine hand 4 includes two clamping plates 403 be arrangeding in parallel, the inner side of the clamping plate 403 of both sides Bottom is provided with the lifting boss 401 be arrangeding in parallel up and down and correction boss 402.By lifting boss 401 and correcting boss 402 Set so that the clamping plate 403 of manipulator is when gripping layers of chips, without realizing positioning, you can complete the school of layers of chips Quasi- action, saves processing step and working time, is further ensured that welding effect.

It is described above, only it is preferred embodiment of the present utility model, is not that other forms are made to the utility model Limitation, any those skilled in the art are changed or are modified as possibly also with the technology contents of the disclosure above equivalent The equivalent embodiment of change.But it is every without departing from technical solutions of the utility model content, it is real according to technology of the present utility model Any simple modification, equivalent variations and remodeling that confrontation above example is made, still fall within the guarantor of technical solutions of the utility model Protect scope.

Claims (10)

1. a kind of semiconductor devices automatic soldering device, including frame（6）, frame（6）Lower section is provided with switch board（1）, frame（6） Top is provided with welding gland（5）, it is characterised in that：Described frame（6）On be sequentially provided with heating arrangements according to process（7） And cooling body（8）, cooling body（8）Discharge end be provided with chip cassette loading mechanism（17）, chip cassette loading mechanism（17）It is fixed to connect It is connected on described switch board（1）Side, heating arrangements（7）Feed end be provided with loading machine hand（4）, cooling body（8）Go out Expect end provided with unloading manipulator（9）, pass through manipulator of unloading（9）By cooling body（8）The chip of discharge end is delivered to chip dress Case structure（17）Complete mounted box；Heating arrangements（7）And cooling body（8）Lower section moved provided with conveying semiconductor devices horizontal direction The lifting travel mechanism of position（3）, lift travel mechanism（3）Mobile terminal lift semiconductor devices（11）Bottom surface, heating arrangements （7）Bottom be provided with atmosphere conveying mechanism.

2. a kind of semiconductor devices automatic soldering device according to claim 1, it is characterised in that：Described heating arrangements （7）It is laid side by side including multiple in frame（6）The heating plate at top, each heating plate top surface individually places semiconductor device Part（11）, the upper plate body of heating plate spelling group including above and below（703）And lower body（701）, upper plate body（703）And lower body （701）Between be provided with heater and thermometric thermal resistance（16）.

3. a kind of semiconductor devices automatic soldering device according to claim 2, it is characterised in that：Described upper plate body （703）Top surface is provided with a plurality of longitudinally disposed handling slot（7032）, lift travel mechanism（3）Clutch end be set on institute The handling slot stated（7032）It is interior, and can be in handling slot（7032）Lift and movable.

4. a kind of semiconductor devices automatic soldering device according to claim 2, it is characterised in that：Described upper plate body （703）Bottom and lower body（701）Top correspond to offer the electrical heating mounting groove that matches along its length, two groups of electricity Heating mounting groove docks the installation through-hole to be formed and place heater；Described upper plate body（703）Bottom surface provided with install thermoelectricity Resistance（16）The fixing hole of thermometric end（7033）, lower body（701）Top surface is correspondingly provided with installation thermal resistance（16）Body and circuit Thermal resistance mounting groove（7013）.

5. a kind of semiconductor devices automatic soldering device according to claim 2, it is characterised in that：Described lower body （701）Lower section is provided with heating plate base（14）, lower body（701）Bottom surrounding passes through latch（7011）Grafting heating plate base （14）The grafting endoporus of top surface（1401）, and in latch（7011）Upper set is sleeved.

6. a kind of semiconductor devices automatic soldering device according to claim 1, it is characterised in that：Described lifting movement Mechanism（3）Including end plate（301）, lifting movable plate（302）With lifting assembly and translation component, lifting assembly and translation component Top connects described lifting movable plate respectively（302）.

7. a kind of semiconductor devices automatic soldering device according to claim 6, it is characterised in that：Described lifting assembly Including lift arm（303）And lifter slide（304）, lift arm（303）Telescopic cylinder and cylinder lower removable end including top What is connected walks wheel, walks the lifter slide that slipping is arranged on domatic setting（304）On；Translating component includes translation motor（305）、 Translation arms（306）And leading screw（307）, translation motor（305）Output end connects leading screw（307）, and pass through leading screw（307）Screw thread connects Connect translation arms（306）Bottom.

8. a kind of semiconductor devices automatic soldering device according to claim 1, it is characterised in that：Described chip mounted box Mechanism（17）The mounted box flat board set including bilayer（1701）, lower floor's mounted box flat board（1701）Interior porch is translated provided with chip cartridges Mechanism（18）, lower floor's mounted box flat board（1701）Exit and upper strata mounted box flat board（1701）Between be provided with chip cartridges（19）Lifting And push upper strata mounted box flat board to（1701）Chip cartridges lifting ejecting mechanism（20）.

9. a kind of semiconductor devices automatic soldering device according to claim 2, it is characterised in that：Atmosphere conveying mechanism bag Include downward projection of arc atmosphere baffle plate（12）With through atmosphere baffle plate（12）It is arranged on the nitrogen delivery pipe below heating plate （13）.

10. a kind of semiconductor devices automatic soldering device according to claim 1, it is characterised in that：Described loading machine Tool hand（4）Including two clamping plates be arrangeding in parallel（403）, the clamping plate of both sides（403）Lower inside provided with parallel setting up and down The lifting boss put（401）With correction boss（402）.