CN204315572U - 一种三杯支架封装的多色led灯 - Google Patents
一种三杯支架封装的多色led灯 Download PDFInfo
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- CN204315572U CN204315572U CN201420832351.4U CN201420832351U CN204315572U CN 204315572 U CN204315572 U CN 204315572U CN 201420832351 U CN201420832351 U CN 201420832351U CN 204315572 U CN204315572 U CN 204315572U
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- 238000005538 encapsulation Methods 0.000 title claims abstract description 20
- 239000000463 material Substances 0.000 claims abstract description 10
- 239000003086 colorant Substances 0.000 claims abstract description 8
- 238000009472 formulation Methods 0.000 claims abstract description 6
- 239000000203 mixture Substances 0.000 claims abstract description 6
- 229920000715 Mucilage Polymers 0.000 claims abstract description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 4
- 239000000853 adhesive Substances 0.000 claims abstract description 4
- 239000011521 glass Substances 0.000 claims abstract description 4
- 238000007789 sealing Methods 0.000 claims abstract description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 4
- 239000003292 glue Substances 0.000 claims description 11
- 238000001746 injection moulding Methods 0.000 claims description 8
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Led Device Packages (AREA)
Abstract
本实用新型涉及一种三杯支架封装的多色LED灯,具体而言,将LED支架制作成三个相互隔离分开的凹杯,在每个杯里封装至少一个LED芯片,在其中的两个杯里分别用不同配方的荧光粉胶水封装成两种颜色的白光,在另一个杯里用不含荧光粉的胶水封装成其它颜色的色光,使其在使用时通过控制LED芯片的发光数量和发光强度来达到不同的色光的需求,形成一种具有多种功能的多色LED灯。
Description
技术领域
本实用新型涉及LED灯饰照明领域,具体涉及一种三杯支架封装的多色LED灯。
背景技术
现在市面上有一种双杯支架的LED灯珠,只能做两种单一的白光,不能在做两种白光的同时再加其他颜色的光,不能满足市场上对一灯多色的需求。
为了克服以上的缺陷和不足,本实用新型的三杯支架LED灯,不但在两种白光的基础上增加了其他颜色的色光,并且通过控制LED芯片的发光数量和发光强度而能发出更多的混合色光。
发明内容
本实用新型涉及一种三杯支架封装的多色LED灯,具体而言,将LED支架制作成三个相互隔离分开的凹杯,在每个杯里封装至少一个LED芯片,在其中的两个杯里分别用不同配方的荧光粉胶水封装成两种颜色的白光,在另一个杯里用不含荧光粉的胶水封装成其它颜色的色光,使其在使用时通过控制LED芯片的发光数量和发光强度来达到不同的色光的需求,形成一种具有多种功能的多色LED灯。
本实用新型的三杯支架LED灯与现有的双杯支架LED灯相比,不但在两种白光的基础上增加了其他颜色的色光,并且通过控制LED芯片的发光数量和发光强度而能发出更多的混合色光。
根据本实用新型,提供了一种三杯支架封装的多色LED灯,其特征在于,包括:三个相互隔离的凹杯LED支架;每个凹杯里至少封装一个LED芯片;三个杯里相互隔开的封装胶水;其中,在三个相互隔离分开的凹杯里,其中的两个杯里分别用不同配方的荧光粉胶水封装成两种颜色的白光,在另一个杯里用不含荧光粉的胶水封装成其它颜色的色光。
根据本实用新型的一实施例,所述的一种三杯支架封装的多色LED灯,其特征在于,所述的LED支架是采用PPA注塑的LED支架、或者是采用PCT注塑的LED支架、或者是采用EMC注塑的LED支架、或者是采用LCP注塑的LED支架。
根据本实用新型的一实施例,所述的一种三杯支架封装的多色LED灯,其特征在于,所述的LED灯是一灯多色的LED灯。
根据本实用新型的一实施例,所述的一种三杯支架封装的多色LED灯,其特征在于,所述的LED灯,是按不同发光要求,分类对应封装不同配方的荧光粉胶水、或者是不含荧光粉的胶水,同时不同的胶水被分隔开,形成不同的色光。
在以下对附图和具体实施方式的描述中,将阐述本实用新型的一个或多个实施例的细节。从这些描述、附图以及权利要求中,可以清楚本实用新型的其它特征、目的和优点。
附图说明
图1为三杯支架封装的多色LED灯的平面示意图。
图2为“图1”的A-A剖面示意图。
图3为“图1”的B-B剖面示意图。
具体实施方式
下面将以优选实施例为例来对本实用新型进行详细的描述。
但是本领域技术人员应当理解,以下所述仅仅是举例说明和描述一些优选实施方式,对本实用新型的权利要求并不具有任何限制。
如图1至图3所示,在LED支架的塑胶体1.4上,制作有三个相互隔离分开的凹杯1.1、1.2、1.3,在凹杯1.1里设有导电脚1.1.1和1.1.2,在凹杯1.2里设有导电脚1.2.1和1.2.2,在凹杯1.3里设有导电脚1.3.1和1.3.2,LED芯片2固晶在每个凹杯里,LED芯片2的两电极用金属焊线3分别焊接在导电脚1.1.1和1.1.2、1.2.1和1.2.2、1.3.1和1.3.2上(如图1所示),在凹杯1.1里封装能让LED芯片2发正白色光的荧光粉胶水,在凹杯1.3里封装能让LED芯片2发暧白色光的荧光粉胶水,在凹杯1.2里封装透明胶水,使LED芯片2发出本来的蓝色光,当然,在凹杯1.2里也可以封装红光的LED芯片、或者绿光的LED芯片、或者黄光的LED芯片,或者蓝光的LED芯片、红光的LED芯片、绿光的LED芯片、黄光的LED芯片中任意两种或两种以上芯片的组合,这样制作成一种三杯支架封装的多色LED灯,并且在使用时可通过控制LED芯片的发光数量和发光强度来达到更多的不同色光的需求。
本实用新型的三杯支架LED灯与现有的双杯支架LED灯相比,不但在两种白光的基础上增加了其他颜色的色光,并且通过控制LED芯片的发光数量和发光强度而能发出更多的混合色光。
以上结合附图将一种三杯支架封装的多色LED灯的具体实施例对本实用新型进行了详细的描述。但是,本领域技术人员应当理解,以上所述仅仅是举例说明和描述一些具体实施方式,对本用新型的范围,尤其是权利要求的范围,并不具有任何限制。
Claims (4)
1.一种三杯支架封装的多色LED灯,其特征在于,包括:
三个相互隔离的凹杯LED支架;
每个凹杯里至少封装一个LED芯片;
三个杯里相互隔开的封装胶水;
其中,在三个相互隔离分开的凹杯里,其中的两个杯里分别用不同配方的荧光粉胶水封装成两种颜色的白光,在另一个杯里用不含荧光粉的胶水封装成其它颜色的色光。
2.根据权利要求1所述的一种三杯支架封装的多色LED灯,其特征在于,所述的LED支架是采用PPA注塑的LED支架、或者是采用PCT注塑的LED支架、或者是采用EMC注塑的LED支架、或者是采用LCP注塑的LED支架。
3.根据权利要求1所述的一种三杯支架封装的多色LED灯,其特征在于,所述的LED灯是一灯多色的LED灯。
4.根据权利要求3所述的一种三杯支架封装的多色LED灯,其特征在于,所述的LED灯,是按不同发光要求,分类对应封装不同配方的荧光粉胶水、或者是不含荧光粉的胶水,同时不同的胶水被分隔开,形成不同的色光。
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109461722A (zh) * | 2018-10-16 | 2019-03-12 | 江苏稳润光电科技有限公司 | 一种双色植物灯照明led光源 |
CN110190171A (zh) * | 2019-04-27 | 2019-08-30 | 深圳市长方集团股份有限公司 | 一种smd-rgbwy多色十脚光源 |
WO2020232668A1 (en) * | 2019-05-22 | 2020-11-26 | Cree Huizhou Solid State Lighting Company Limited | Arrangements for light emitting diode packages |
-
2014
- 2014-12-20 CN CN201420832351.4U patent/CN204315572U/zh not_active Expired - Fee Related
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109461722A (zh) * | 2018-10-16 | 2019-03-12 | 江苏稳润光电科技有限公司 | 一种双色植物灯照明led光源 |
CN110190171A (zh) * | 2019-04-27 | 2019-08-30 | 深圳市长方集团股份有限公司 | 一种smd-rgbwy多色十脚光源 |
WO2020232668A1 (en) * | 2019-05-22 | 2020-11-26 | Cree Huizhou Solid State Lighting Company Limited | Arrangements for light emitting diode packages |
CN113875026A (zh) * | 2019-05-22 | 2021-12-31 | 惠州科锐半导体照明有限公司 | 用于发光二极管封装件的布置 |
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