CN203721708U - Radio frequency chip connection sheet assembly - Google Patents
Radio frequency chip connection sheet assembly Download PDFInfo
- Publication number
- CN203721708U CN203721708U CN201420107497.2U CN201420107497U CN203721708U CN 203721708 U CN203721708 U CN 203721708U CN 201420107497 U CN201420107497 U CN 201420107497U CN 203721708 U CN203721708 U CN 203721708U
- Authority
- CN
- China
- Prior art keywords
- radio frequency
- chip
- chip connection
- frequency chip
- brace
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/66—High-frequency adaptations
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
- H01L2223/66—High-frequency adaptations
- H01L2223/6661—High-frequency adaptations for passive devices
- H01L2223/6677—High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16245—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/8138—Bonding interfaces outside the semiconductor or solid-state body
- H01L2224/81399—Material
- H01L2224/814—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2224/81417—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
- H01L2224/81424—Aluminium [Al] as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/8138—Bonding interfaces outside the semiconductor or solid-state body
- H01L2224/81399—Material
- H01L2224/814—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2224/81438—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/81447—Copper [Cu] as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L24/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Support Of Aerials (AREA)
- Details Of Aerials (AREA)
Abstract
The utility model provides a radio frequency chip connection sheet assembly. The radio frequency chip connection sheet assembly includes a radio frequency chip, chip connection sheets and a chip connection sheet bottom film; the radio frequency chip is encapsulated on the chip connection sheets; the radio frequency chip is provided with four wire-lead pins; two pairs of chip connection sheets exist; the two pairs of chip connection sheets are distributed in a manner that the two pairs of chip connection sheets can form an X-shaped structure; the two pairs of chip connection sheets tilt by an angle in a range of 30 degrees to 50 degrees relative to a horizontal direction; the centers of the chip connection sheets are corresponding to the positions of the four wire-lead pins of the radio frequency chip; and one side of the aluminum foil chip connection sheets is provided with a positioning hole. With the radio frequency chip connection sheet assembly of the utility model adopted, a traditional radio frequency chip connection sheet assembly is only applicable to a radio frequency antenna having a radio frequency resonant cavity with a longitudinal opening and cannot be applicable to a radio frequency antenna having a radio frequency resonant cavity with a transverse opening, and cannot be used for a radio frequency chip with four effective wiring pins, and synchronous alignment of a plurality of columns of chip connection sheet assemblies and a plurality of columns of radio frequency installation positions is very difficult, while, with the radio frequency chip connection sheet assembly of the utility model adopted, the above problems can be solved. The radio frequency chip connection sheet assembly is advantageous in wide application range and higher encapsulation efficiency.
Description
Technical field
The utility model relates to a kind of radio frequency chip brace assembly.
Background technology
1) volume of radio frequency chip is little, the wide 0.4x of long 0.4x is high 0.1 millimeter, and chip lead suspension column, directly through only having 0.018 millimeter, needs special chip to fall to encapsulate side locking equipment, chip lead suspension column is downward, through conducting resinl and aluminium (copper) pool radio-frequency antenna layer, be fixed together.
2) because the kind of radio-frequency antenna is many, overall dimensions difference is large, chip falls sealed in unit and technique and follows radio-frequency antenna size and change, thereby has affected chip and fall the production efficiency of encapsulation side locking equipment.
3) in order to improve chip side, determine efficiency, chip is encapsulated in to a standard-sized chip lead and extends on brace, become chip brace assembly.Referring to Fig. 1, Fig. 2.Chip brace assembly can be fast and the electrical connection of different size radio-frequency antenna, greatly enhances productivity.This chip brace assembly is commonly referred to as STRAP in the world, and overall dimensions are 4x9 millimeter, aluminium foil scope 3x7 millimeter.
4) defect of traditional chip brace assembly (STRAP):
[1] be only applicable to have the radio frequency chip of two effective wiring pins, can not be for thering is the radio frequency chip of 4 effective wiring pins.
[2] two aluminium (copper) of traditional chip brace pool is landscape layout, can only be applicable to the radio-frequency antenna (referring to Fig. 3) of radio-frequency cavity longitudinal opening, can not be for the radio-frequency antenna (referring to Fig. 4) of radio-frequency cavity transverse opening.
[3] traditional chip brace assembly be designed for single-row radio-frequency antenna by dress, if multiple row chip brace assembly and multiple row radio-frequency antenna are by dress, how to guarantee that the synchronous alignment in multiple row chip brace assembly position is very difficult, traditional chip brace assembly can not be installed for multiple row antenna.
Summary of the invention
Of the present utility model for above-mentioned deficiency, a kind of radio frequency chip brace assembly is provided, the utility model has solved conventional radio frequency chip brace assembly can not be for having the radio frequency chip of four effective wiring pins, can not be for the radio-frequency antenna of resonator transverse opening, and multiple row chip brace assembly and multiple row antenna are installed and are synchronizeed the very difficult problem of aliging, application surface is more extensive, and packaging efficiency is higher.
The technical solution of the utility model is as described below: a kind of radio frequency chip brace assembly, comprise radio frequency chip, chip brace and chip brace counterdie, described radio frequency chip is encapsulated on chip brace, described radio frequency chip has four terminal pins, it is characterized in that: described chip brace has two pairs, layout is " X " shape, and relative level direction tilts 45 ° ± 15 °, and described each chip brace center is corresponding with 4 terminal pin positions of radio frequency chip respectively.
It also comprises the location hole arranging at a distance of chip brace one side place, and described location hole diameter is at 1.5-2.0mm.
Described chip brace is aluminium foil or Copper Foil.
Described chip brace is of a size of 3 * 3mm, and width is 1mm-1.5mm.
Compared with prior art, the utility model has solved conventional radio frequency chip brace assembly can not be for having the radio frequency chip of four effective wiring pins, Copper Foil aluminium foil is layout longitudinally, and multiple row chip brace assembly installs with multiple row antenna the very difficult problem of aliging, application surface is more extensive, packaging efficiency is higher, more accurate.
Accompanying drawing explanation
Fig. 1 is that prior art chip and chip brace counterdie are in conjunction with schematic diagram;
Fig. 2 is prior art chip and stem leg structure schematic diagram thereof;
Fig. 3 is radio-frequency cavity antenna and the chip brace assembly scheme of installation of longitudinal opening;
Fig. 4 be transverse opening radio-frequency cavity antenna cannot with chip brace assembly scheme of installation;
Fig. 5 is two pin radio frequency chip encapsulating structure figure of the utility model;
Fig. 6 is the utility model Fig. 2 chip and chip brace junction enlarged drawing;
Chip brace counterdie in the drawings, 1; 2, chip brace; 2 ', aluminium foil; 3, chip bonding identification witness marker; 4, chip body; 5, the chip suspension column that effectively goes between; 5 ', the invalid lead-in wire suspension column of chip; 6, the location hole of chip brace.
Embodiment
Below in conjunction with accompanying drawing and execution mode, the utility model is conducted further description:
As shown in Figure 5, Figure 6, a kind of radio frequency chip brace assembly, comprise radio frequency chip 4, chip brace 2 and chip brace counterdie 1, radio frequency chip 4 is encapsulated on chip brace 2, and radio frequency chip 4 has four terminal pins, and chip brace 2 has two pairs, layout is " X " shape, relatively vertical or horizontal direction tilts 45 ° ± 15 ° respectively, and each chip brace center is corresponding with 4 terminal pin positions of radio frequency chip respectively, and described chip brace 2 is aluminium foil or Copper Foil.
It also comprises the location hole 6 arranging at a distance of chip brace 3.5mm place, and location hole 6 diameters are at 1.5-2.0mm, and the size range of chip brace 2 is 3 * 3mm, and width is 1mm-1.5mm.
The utility model adopts following steps to make:
1) use traditional etching method, on PET aluminium foil layer, make chip lead suspension column brace.
2) in counterdie upper punch, determine location hole.
3) as shown in Figure 4, adopt traditional radio frequency chip to fall sealed in unit, chip side is fixed on to chip lead and extend on brace, then cut into single chip brace assembly, and be wound into dish.
4) a plurality of dish cartridge chip pins being extended to brace assembly is contained on radio-frequency antenna packaging machine, chip pin is extended to location hole on brace corresponding with the salient point on synchronous locating wheel on antenna packaging machine, multiple row chip brace assembly synchronously moves ahead, and guarantees the accuracy of installing with multiple row radio-frequency antenna.
Should be understood that, for those of ordinary skills, can be improved according to the above description or convert, and all these improvement and conversion all should belong to the protection range of the utility model claims.
By reference to the accompanying drawings the utility model patent has been carried out to exemplary description above; obviously the realization of the utility model patent is not subject to the restrictions described above; as long as adopted the method design of the utility model patent and the various improvement that technical scheme is carried out; or without improving, the design of the utility model patent and technical scheme are directly applied to other occasion, all in protection range of the present utility model.
Claims (4)
1. a radio frequency chip brace assembly, comprise radio frequency chip, chip brace and chip brace counterdie, described radio frequency chip is encapsulated on chip brace, described radio frequency chip has four terminal pins, it is characterized in that: described chip brace has two pairs, layout is " X " shape, and relative level direction tilts 45 ° ± 15 °, and described each chip brace center is corresponding with 4 terminal pin positions of radio frequency chip respectively.
2. a kind of radio frequency chip brace assembly according to claim 1, is further characterized in that: it also comprises the location hole arranging at a distance of chip brace one side place, and described location hole diameter is at 1.5-2.0mm.
3. a kind of radio frequency chip brace assembly according to claim 1, is further characterized in that: described chip brace is aluminium foil or Copper Foil.
4. according to a kind of radio frequency chip brace assembly described in claim 1 or 2 or 3, be further characterized in that: the size range of described chip brace is 3 * 3mm, width is 1mm-1.5mm.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420107497.2U CN203721708U (en) | 2014-03-11 | 2014-03-11 | Radio frequency chip connection sheet assembly |
| PCT/CN2015/072886 WO2015135412A1 (en) | 2014-03-11 | 2015-02-12 | Radio-frequency chip connection strap assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420107497.2U CN203721708U (en) | 2014-03-11 | 2014-03-11 | Radio frequency chip connection sheet assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203721708U true CN203721708U (en) | 2014-07-16 |
Family
ID=51160844
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420107497.2U Expired - Fee Related CN203721708U (en) | 2014-03-11 | 2014-03-11 | Radio frequency chip connection sheet assembly |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN203721708U (en) |
| WO (1) | WO2015135412A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015135412A1 (en) * | 2014-03-11 | 2015-09-17 | 田艺儿 | Radio-frequency chip connection strap assembly |
| WO2022056680A1 (en) * | 2020-09-15 | 2022-03-24 | 焦林 | Radio frequency chip having pressure balance pin short-circuit line |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7262701B1 (en) * | 2005-05-23 | 2007-08-28 | National Semiconductor Corporation | Antenna structures for RFID devices |
| US7589419B2 (en) * | 2006-08-07 | 2009-09-15 | Rcd Technology, Inc. | Side connectors for RFID chip |
| JP5547952B2 (en) * | 2009-11-30 | 2014-07-16 | アピックヤマダ株式会社 | RFID tag manufacturing method and mold |
| FR2972324B1 (en) * | 2011-03-01 | 2013-04-12 | Commissariat Energie Atomique | METHOD FOR ASSEMBLING ELECTRONIC COMPONENTS ON A SUPPORT |
| CN203721708U (en) * | 2014-03-11 | 2014-07-16 | 深圳市骄冠科技实业有限公司 | Radio frequency chip connection sheet assembly |
-
2014
- 2014-03-11 CN CN201420107497.2U patent/CN203721708U/en not_active Expired - Fee Related
-
2015
- 2015-02-12 WO PCT/CN2015/072886 patent/WO2015135412A1/en active Application Filing
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015135412A1 (en) * | 2014-03-11 | 2015-09-17 | 田艺儿 | Radio-frequency chip connection strap assembly |
| WO2022056680A1 (en) * | 2020-09-15 | 2022-03-24 | 焦林 | Radio frequency chip having pressure balance pin short-circuit line |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2015135412A1 (en) | 2015-09-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140716 Termination date: 20190311 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |