CN203423858U - Fusion auxiliary tool capable of preventing corner warp and stagger of circuit boards - Google Patents
Fusion auxiliary tool capable of preventing corner warp and stagger of circuit boards Download PDFInfo
- Publication number
- CN203423858U CN203423858U CN201320487315.4U CN201320487315U CN203423858U CN 203423858 U CN203423858 U CN 203423858U CN 201320487315 U CN201320487315 U CN 201320487315U CN 203423858 U CN203423858 U CN 203423858U
- Authority
- CN
- China
- Prior art keywords
- fusion
- circuit board
- cover plate
- circuit boards
- angle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The utility model relates to a fusion auxiliary tool capable of preventing corner warp and stagger of circuit boards. The tool comprises a cover plate which is arranged above multiple layers of circuit boards and capable of flattening the circuit boards. The cover plate is provided with a plurality of position grooves at positions corresponding to that of fusion points of a fusion machine. Eight fusion positions corresponding to eight fusion points of the fusion machine are arranged on the multiple layers of circuit boards to be fused, and fusion positions on the circuit boards are disposed correspondingly. According to the utility model, the defects of corner warp and stagger of the circuit boards in the conventional fusion method are overcome, and the fusion auxiliary tool is simple in operation, and is provided with the cover plate to flatten the fusion circuit boards, thereby preventing corner warp and stagger, and improving the quality of the circuit boards.
Description
[technical field]
The utility model relates to a kind of anti-circuit board angle and sticks up the fusion aid with interior mistake.
[background technology]
Under prior art, in six layers of above multilayer circuit board production process, need first by internal layer Core(inner core plates) and P sheet (prepreg) by fusion, fuse together, then enter subsequent processing.Known fusion method is by internal layer Core(inner core plates) on establish 3-8 and complete fusion with 8 fusions of Heat sealing machine corresponding fusion position.Such way has following defect: warpage easily occurs at plate angle, and interior mistake has a big risk, and affects quality of circuit board, occurs the defects such as dislocation short circuit, causes blackboard newspaper useless.
[utility model content]
The utility model object is overcome deficiency of the prior art and provide a kind of simple to operate, and the fusion aid with interior mistake is stuck up at anti-circuit board angle cheaply.
The utility model design is achieved through the following technical solutions:
The fusion aid with interior mistake is stuck up at circuit board angle, it is characterized in that: include the cover plate that is placed on multilayer circuit board and can flattens multilayer circuit board, be on the cover board provided with a plurality of position grooves corresponding with each fusion points position of Heat sealing machine.
The fusion aid with interior mistake is stuck up at a kind of anti-circuit board as above angle, it is characterized in that: described cover plate is the plate that insulation and the material with rigidity are made.
The fusion aid with interior mistake is stuck up at a kind of anti-circuit board as above angle, it is characterized in that: described cover plate is tabula rasa, and thickness is 0.5-1mm.
The fusion aid with interior mistake is stuck up at a kind of anti-circuit board as above angle, it is characterized in that: the position groove arranging on described cover plate is long-pending larger than the fusion plane of multilayer circuit board to be fused.
The fusion aid with interior mistake is stuck up at a kind of anti-circuit board as above angle, it is characterized in that: the position groove arranging on described cover plate is than long-pending large 1 times of the fusion plane of multilayer circuit board to be fused.
The fusion aid with interior mistake is stuck up at a kind of anti-circuit board as above angle, it is characterized in that: institute's rheme groove relative set is to the both sides of cover plate, and the quantity of each side is 4.
The utility model compared with prior art has the following advantages: the utility model newly increases a cover plate on circuit board to be fused, and the effect of cover plate is to flatten underlaid circuit board to be fused.Can address the problem like this: cover plate flattens circuit board to be fused, can prevent that plate angle from sticking up and interior mistake, improve quality of circuit board.
[accompanying drawing explanation]
Fig. 1 is schematic diagram of the present utility model.
[embodiment]
Below in conjunction with accompanying drawing, the utility model is described in detail:
The fusion aid with interior mistake is stuck up at anti-circuit board of the present utility model angle, includes cover plate 3, in cover plate 3 arranged on left and right sides, is respectively equipped with 4 position grooves 4 corresponding with fusion points position on Heat sealing machine.Multilayer circuit board 1 to be fused is by Core(inner core plates) and P sheet (prepreg) formation, with Heat sealing machine by internal layer Core(inner core plates) and P sheet (prepreg) by fusion position, fuse together, on multilayer circuit board 1 to be fused, be provided with 8 fusion positions 2 corresponding with 8 fusion points of Heat sealing machine, certainly, if use other Heat sealing machine, when Heat sealing machine fusion points position and quantity change, the fusion position on multilayer circuit board 1 is corresponding corresponding setting also.In alloying process, described in cover plate 3 is placed in, multilayer circuit board to be fused 1 above and flatten multilayer circuit board 1, the effect of cover plate 3 is to flatten multilayer circuit board 1 to be fused, and a groove 4 is set is the fusion that contacts of not blocking Heat sealing machine and circuit board to be fused for cover plate 3, does not affect fusion quality.The position groove 4 arranging on described cover plate 3 is corresponding with the fusion position 2 on fusion points position on Heat sealing machine and multilayer circuit board 1.
Described cover plate 3 is insulate and have rigidity, the plate that the material of difficult bending distortion is made, and this place can be the tabula rasa of the rear formation of P sheet sclerosis, thickness preferably controls to 0.5-1mm.
The position groove 4 of emptying on described cover plate 3 is more bigger than fusion position 2 areas of multilayer circuit board 1 to be fused, and this place area can be large 1 times, to guarantee that cover plate does not block the fusion between Heat sealing machine and plywood fusion.So both guaranteed the precision of fusion, and can play again and to prevent that circuit board angle from sticking up the effect with interior mistake.
Claims (6)
1. the fusion aid with interior mistake is stuck up at an anti-circuit board angle, it is characterized in that: include and be placed in the upper cover plate (3) that also can flatten multilayer circuit board (1) of multilayer circuit board (1), on cover plate (3), be provided with a plurality of position grooves (4) corresponding with each fusion points position of Heat sealing machine.
2. the fusion aid with interior mistake is stuck up at a kind of anti-circuit board according to claim 1 angle, it is characterized in that: described cover plate (3) is for insulation and have the plate that the material of rigidity is made.
3. the fusion aid with interior mistake is stuck up at a kind of anti-circuit board according to claim 2 angle, it is characterized in that: described cover plate (3) is tabula rasa, and thickness is 0.5-1mm.
4. the fusion aid with interior mistake is stuck up at a kind of anti-circuit board according to claim 1 angle, it is characterized in that: the upper position groove (4) arranging of described cover plate (3) is larger than fusion position (2) area of multilayer circuit board to be fused (1).
5. the fusion aid with interior mistake is stuck up at a kind of anti-circuit board according to claim 4 angle, it is characterized in that: the upper position groove (4) arranging of described cover plate (3) is than large 1 times of fusion position (2) area of multilayer circuit board to be fused (1).
6. the fusion aid with interior mistake is stuck up at a kind of anti-circuit board according to claim 1 angle, it is characterized in that: institute's rheme groove (4) relative set is to the both sides of cover plate (3), and the quantity of each side is 4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320487315.4U CN203423858U (en) | 2013-08-09 | 2013-08-09 | Fusion auxiliary tool capable of preventing corner warp and stagger of circuit boards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320487315.4U CN203423858U (en) | 2013-08-09 | 2013-08-09 | Fusion auxiliary tool capable of preventing corner warp and stagger of circuit boards |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203423858U true CN203423858U (en) | 2014-02-05 |
Family
ID=50022947
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320487315.4U Expired - Lifetime CN203423858U (en) | 2013-08-09 | 2013-08-09 | Fusion auxiliary tool capable of preventing corner warp and stagger of circuit boards |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203423858U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111885856A (en) * | 2020-08-07 | 2020-11-03 | 博敏电子股份有限公司 | Fusion method and tool for improving interlayer alignment precision of multilayer circuit board |
-
2013
- 2013-08-09 CN CN201320487315.4U patent/CN203423858U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111885856A (en) * | 2020-08-07 | 2020-11-03 | 博敏电子股份有限公司 | Fusion method and tool for improving interlayer alignment precision of multilayer circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140205 |