CN202303069U - Large-size LED (light-emitting diode) backlight with high heat dissipation - Google Patents

Large-size LED (light-emitting diode) backlight with high heat dissipation Download PDF

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Publication number
CN202303069U
CN202303069U CN2011204431200U CN201120443120U CN202303069U CN 202303069 U CN202303069 U CN 202303069U CN 2011204431200 U CN2011204431200 U CN 2011204431200U CN 201120443120 U CN201120443120 U CN 201120443120U CN 202303069 U CN202303069 U CN 202303069U
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CN
China
Prior art keywords
led
aluminum alloy
alloy frame
heat dissipation
backlight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2011204431200U
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Chinese (zh)
Inventor
严幸生
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DONGGUAN NEW ORIENTAL PHOTOELECTRIC TECHNOLOGY Co Ltd
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DONGGUAN NEW ORIENTAL PHOTOELECTRIC TECHNOLOGY Co Ltd
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Priority to CN2011204431200U priority Critical patent/CN202303069U/en
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Publication of CN202303069U publication Critical patent/CN202303069U/en
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Abstract

The utility model discloses a large-size LED (light-emitting diode) backlight with high heat dissipation, which sequentially comprises an aluminum alloy frame, a reflective sheet, a light guide plate, a rubber frame, a diffusion sheet, a lower brightness intensifying sheet, an upper brightness intensifying sheet and a shielding sheet, as well as an LED light-emitting assembly at the side, which are arranged from the back surface to the front surface, wherein the LED light-emitting assembly is clung to the inner surface of one side of the aluminum alloy frame; a heat-resisting double-faced adhesive tape is arranged between the LED light-emitting assembly and the inner surface of the aluminum alloy frame; and the thickness of the aluminum alloy frame is 0.25mm to 0.35mm. Compared with the prior art, the large-size LED backlight with high heat dissipation has a simple structure, is installed conveniently, has stable quality and an obvious heat dissipation effect, well meets the heat dissipation requirement of the large-size LED backlight and effectively protects stability and durability of the LED backlight.

Description

A kind of large scale LED-backlit source of high-cooling property
Technical field
The utility model relates to a kind of LED-backlit source, particularly relates to a kind of large scale LED-backlit source of high-cooling property.
Background technology
Characteristics such as the LED-backlit source is meant the backlight that is used as LCDs with LED, compares with traditional CCFL (cold-cathode tube) backlight, and LED has low-power consumption, lower calorific value, brightness is high, the life-span is long.LED is the use that can replace colored filter as the advantage of backlight.Improving LED brightness at present has dual mode, is respectively modes such as increasing wafer brightness and many dense arrangement, and these methods all need be imported the more energy of high power; And the energy of input LED, about 20% can convert light source to, and remaining 80% all changes into heat energy; The right electric current of in single encapsulation, sending into multiplication, the heating nature also can double, and heat dissipation problem can run down; As be applied on LCD TV backlight; Both the use high-brightness LED also wanted dense arrangement also to light for a long time, therefore in limited heat-dissipating space, was difficult to outside in good time these heat are excluded in.When crystal grain interface temperature raises, can cause luminous intensity to descend, and also can and then descend in the life-span; The radiation wavelength shift makes color stability reduce; The coefficient of expansion because of unlike material when being heated is different, has the thermal stress accumulation product reliability is reduced, and also can reduce service life.And the light that LED produces is distributed in visible light or ultraviolet light in the majorityly mostly, can not help heat radiation with radiation mode; Less because of the LED package area again; Be difficult to heat is shed, cause the LED quality to have very big problem to produce, learn that thus the LED heat dissipation problem is suddenly to wait to be solved at present.
The utility model content
The purpose of the utility model is to above-mentioned technical problem, and a kind of simple in structure, easy to process, with low cost, the high-cooling property large scale LED-backlit source that can effectively satisfy the heat radiation requirement is provided.
In order to achieve the above object; The technical scheme that the utility model adopts is: a kind of large scale LED-backlit source of high-cooling property; Comprise aluminum alloy frame, reflector plate, LGP, glue frame, diffusion sheet, following brightening piece successively, go up brightening piece, anti-dazzling screen from back-to-front; And the LED luminescence component of side, the setting of said LED luminescence component also is close to the inner surface of aluminum alloy frame one side.
Be provided with heat-resisting double faced adhesive tape between said LED luminescence component and the aluminum alloy frame inner surface.
It is the aluminium alloy of 0.25mm-0.35mm that said aluminum alloy frame adopts thickness.
Compared with prior art, the utility model is simple in structure, and is easy for installation, of fine qualities, and radiating effect is remarkable, satisfied the radiating requirements in large scale LED-backlit source well, effectively protects the stability and the durability in LED-backlit source.
Description of drawings
Fig. 1 is the exploded perspective view of the utility model;
Fig. 2 is the partial structurtes sketch map of the utility model.
Shown in the figure: the 1-aluminum alloy frame; The 2-reflector plate; The 3-LGP; 4-glue frame; The 5-LED luminescence component; The 6-diffusion sheet; Brightening piece under the 7-; The last brightening piece of 8-; The 9-anti-dazzling screen.
The specific embodiment
Be elaborated with reference to accompanying drawing below in conjunction with embodiment, so that the technical characterictic and the advantage of the utility model are carried out more deep annotation.
The structural representation of the utility model such as Fig. 1, shown in Figure 2; A kind of large scale LED-backlit source of high-cooling property; Comprise aluminum alloy frame 1, reflector plate 2, LGP 3, glue 4 frames, diffusion sheet 6, following brightening piece 7 successively, go up brightening piece 8, anti-dazzling screen 9 from back-to-front; And the LED luminescence component 5 on limit then, the setting of said LED luminescence component also is close to the inner surface of aluminum alloy frame 1 one sides.
The light that LED produces is distributed in visible light or ultraviolet light in the majorityly mostly, can not directly help heat radiation with radiation mode, and is less because of the LED package area again; Be difficult to heat is shed, cause the LED quality to have very big problem to produce, especially for some large-sized LED-backlit sources; Power is big, and thermal source is many, and the heat that the short time assembles is more; In order to improve radiating effect, the chase that the utility model is practical with conventional LED-backlit on the one hand replaces with the high-quality 1070 type aluminium alloys of thickness 0.25mm-0.3mm, and this model aluminum alloy heat coefficient of conductivity is up to 226W/mK; Have the good heat transfer performance, on the other hand, the LED-backlit source is when assembling; With heat-resisting double faced adhesive tape LED luminescence component 5 is close to aluminum alloy frame 1 inner surface, is convenient to heat and directly transmits, reduce thermal resistance to aluminum alloy frame 1.
The LED-backlit source is after energized; The heat that the LED luminescence component is produced is directly delivered on aluminum alloy frame 1 inner surface, because of the excellent heat conductivity property of aluminum alloy frame through the conduction-type radiating mode mostly; Heat is passed to whole aluminum alloy frame 1 in a horizontal manner rapidly; Utilize aluminum alloy frame 1 large-area surface and air heat exchange convection current and radiation to accomplish heat radiation at last, with good conditionsi, can also utilize fan forced convection to accelerate speed air flow heat is taken away.
Because of the density of aluminum alloy material is low, the employing of aluminum alloy frame also can be played the beneficial effect that alleviates the product deadweight to a certain extent.
The content of mentioning in the foregoing description is not to be the qualification to the utility model, and under the prerequisite of the inventive concept that does not break away from the utility model, and any conspicuous replacement is all within the protection domain of the utility model.

Claims (3)

1. the large scale LED-backlit source of a high-cooling property; Comprise aluminum alloy frame (1), reflector plate (2), LGP (3), glue frame (4), diffusion sheet (6), following brightening piece (7) successively, go up brightening piece (8), anti-dazzling screen (9) from back-to-front; And the LED luminescence component (5) of side, it is characterized in that: said LED luminescence component (5) is provided with and is close to the inner surface of aluminum alloy frame (1) one side.
2. the large scale LED-backlit source of high-cooling property according to claim 1 is characterized in that: be provided with heat-resisting double faced adhesive tape between said LED luminescence component (5) and aluminum alloy frame (1) inner surface.
3. the large scale LED-backlit source of high-cooling property according to claim 2 is characterized in that: it is the aluminium alloy of 0.25mm-0.35mm that said aluminum alloy frame (1) adopts thickness.
CN2011204431200U 2011-11-10 2011-11-10 Large-size LED (light-emitting diode) backlight with high heat dissipation Expired - Fee Related CN202303069U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2011204431200U CN202303069U (en) 2011-11-10 2011-11-10 Large-size LED (light-emitting diode) backlight with high heat dissipation

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2011204431200U CN202303069U (en) 2011-11-10 2011-11-10 Large-size LED (light-emitting diode) backlight with high heat dissipation

Publications (1)

Publication Number Publication Date
CN202303069U true CN202303069U (en) 2012-07-04

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN2011204431200U Expired - Fee Related CN202303069U (en) 2011-11-10 2011-11-10 Large-size LED (light-emitting diode) backlight with high heat dissipation

Country Status (1)

Country Link
CN (1) CN202303069U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106876512A (en) * 2017-03-06 2017-06-20 广州供电局有限公司 The aeration radiation system and method for solar panel

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106876512A (en) * 2017-03-06 2017-06-20 广州供电局有限公司 The aeration radiation system and method for solar panel
CN106876512B (en) * 2017-03-06 2018-10-23 广州供电局有限公司 The aeration radiation system and method for solar panel

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CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20120704

Termination date: 20151110

EXPY Termination of patent right or utility model