CN202076253U - 逆变焊机电源导热绝缘装置 - Google Patents

逆变焊机电源导热绝缘装置 Download PDF

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CN202076253U
CN202076253U CN 201120129403 CN201120129403U CN202076253U CN 202076253 U CN202076253 U CN 202076253U CN 201120129403 CN201120129403 CN 201120129403 CN 201120129403 U CN201120129403 U CN 201120129403U CN 202076253 U CN202076253 U CN 202076253U
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heat
radiator
power
conducting
discrete device
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苗华伟
李延军
刘晨
边乐民
徐圣新
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SHANDONG AOTAI ELECTRIC CO Ltd
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SHANDONG AOTAI ELECTRIC CO Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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Abstract

本实用新型涉及一种逆变焊机电源导热绝缘装置,包括功率半导体分立器件、散热器,功率半导体分立器件和散热器之间设有陶瓷基片隔离。所述的散热器、功率半导体分立器件它们与陶瓷基片相接的一侧涂有导热硅脂层。所述的陶瓷基片其与散热器、功率半导体分立器件相接的侧面分别涂有导热硅脂层。本实用新型导热率高和热阻系数低保证了功率元件和散热器之间传输热量效率,提高了功率元件散热效果,配合导热硅脂涂层,温升有效降低的同时,提高了焊接电源负载持续率和可靠性。

Description

逆变焊机电源导热绝缘装置
技术领域:
本实用新型涉及一种逆变焊机电源导热绝缘装置。
背景技术:
功率MOSFET(功率场效应晶体管)、IGBT(绝缘栅双极晶体管)、二极管等功率半导体分立器件在逆变焊接电源中广泛应用,当要求分立器件铜底板和散热器之间具有良好的导热绝缘性时,公知的安装工艺是在分立器件铜底板和散热器之间使用导热硅胶片(导热绝缘膜)隔离,现行使用的导热硅胶片(导热绝缘膜)因其导热率偏低及热阻系数偏高,故功率元件和散热器之间传输热量效率低,散热效果差,使功率元件温升较高,焊机的负载持续率较低,同时也降低了功率元件工作可靠性。
发明内容:
本实用新型的目的是提供一种逆变焊机电源导热绝缘装置,该装置提高了功率元件散热效果,温升有效降低的同时,提高了焊接电源负载持续率和可靠性。
本实用新型采取的技术方案为:
逆变焊机电源导热绝缘装置,包括功率半导体分立器件、散热器,功率半导体分立器件和散热器之间设有陶瓷基片隔离。
所述的散热器、功率半导体分立器件它们与陶瓷基片相接的一侧涂有导热硅脂层。
所述的陶瓷基片其与散热器、功率半导体分立器件相接的侧面分别涂有导热硅脂层。
陶瓷基片具有耐高温、电绝缘性能高、介电常数和介质损耗低、导热率高、热阻系数低、化学稳定性好、与元件的热膨胀系数相近等主要优点,导热率高和热阻系数低保证了功率元件和散热器之间传输热量效率,提高了功率元件散热效果,配合导热硅脂涂层,温升有效降低的同时,提高了焊接电源负载持续率和可靠性。
附图说明:
图1为本实用新型的结构示意图;
其中:1为功率半导体分立器件,2为散热器,3为陶瓷基片,4为导热硅脂层。
具体实施方式:
逆变焊机电源导热绝缘装置,包括功率半导体分立器件1、散热器2,功率半导体分立器件1和散热器2之间设有陶瓷基片3隔离。
所述的散热器2、功率半导体分立器件1它们与陶瓷基片3相接的一侧涂有导热硅脂层4。
所述的陶瓷基片3其与散热器2、功率半导体分立器件1相接的侧面分别涂有导热硅脂层4。

Claims (3)

1.逆变焊机电源导热绝缘装置,包括功率半导体分立器件、散热器,其特征是,功率半导体分立器件和散热器之间设有陶瓷基片隔离。
2.根据权利要求1所述的逆变焊机电源导热绝缘装置,其特征是,所述的散热器、功率半导体分立器件它们与陶瓷基片相接的一侧涂有导热硅脂层。
3.根据权利要求1所述的逆变焊机电源导热绝缘装置,其特征是,所述的陶瓷基片其与散热器、功率半导体分立器件相接的侧面分别涂有导热硅脂层。
CN 201120129403 2011-04-27 2011-04-27 逆变焊机电源导热绝缘装置 Expired - Lifetime CN202076253U (zh)

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CN 201120129403 CN202076253U (zh) 2011-04-27 2011-04-27 逆变焊机电源导热绝缘装置

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CN 201120129403 CN202076253U (zh) 2011-04-27 2011-04-27 逆变焊机电源导热绝缘装置

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