CN201918428U - Vulcanization-preventive surface-mounted LED - Google Patents
Vulcanization-preventive surface-mounted LED Download PDFInfo
- Publication number
- CN201918428U CN201918428U CN2010207008196U CN201020700819U CN201918428U CN 201918428 U CN201918428 U CN 201918428U CN 2010207008196 U CN2010207008196 U CN 2010207008196U CN 201020700819 U CN201020700819 U CN 201020700819U CN 201918428 U CN201918428 U CN 201918428U
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- CN
- China
- Prior art keywords
- led
- fluorescent glue
- cavity space
- chip
- vulcanization
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Led Device Packages (AREA)
Abstract
The utility model discloses a vulcanization-preventive surface-mounted LED, which comprises an LED support. The upper surface of the LED support is downwards sunken so as to form a cavity space, a chip is mounted at the bottom of the cavity space, fluorescent glue is packaged on the chip, and a vulcanization-preventive layer is packaged on the fluorescent glue. The surface-mounted LED is provided with the vulcanization-preventive layer, and external sulfur cannot permeate into the fluorescent glue and cannot reach the inside of a support cavity via the fluorescent glue by means of permeation, thereby effectively preventing the sulfur from being reacted with a metal plating layer at the bottom of the support to generate silver sulfide, and avoiding affecting light emergence of the LED and reliability of products.
Description
Technical field
The utility model relates to paster LED.
Background technology
LED because of have the life-span long, light efficiency is high, the radiationless and advantage of low power consumption conventional light source that substituted is gradually used widely, and the structure type of LED device is also varied, a kind of adopting surface mounted LED is wherein arranged, it comprises led support, the upper surface of led support has the cavity of holding to lower recess, the bottom that holds cavity is equipped with chip, is packaged with fluorescent glue on the chip.The defective that this adopting surface mounted LED exists is, because the structure and material characteristic of adopting surface mounted LED own, the gas permeability of fluorescent glue is strong, air-tightness is relatively poor relatively, extraneous element sulphur is easy to infiltration to be held in the cavity by fluorescent glue arrival, the element sulphur coat of metal easy and frame bottom installation chip reacts, generate silver sulfide, thereby influence LED bright dipping and product reliability.
Summary of the invention
The purpose of this utility model provides a kind of paster LED of vulcanizing of preventing, technical problem to be solved is to prevent that the element sulphur infiltration from arriving in the cavity space by fluorescent glue.
For achieving the above object, a kind of paster LED of vulcanizing of preventing comprises led support, and the upper surface of led support has cavity space to lower recess, and the bottom of cavity space is equipped with chip, is packaged with fluorescent glue on the chip, is packaged with anti-sulfuric horizon on the fluorescent glue.
Above-mentioned paster LED, owing to increased anti-sulfuric horizon on the fluorescent glue surface, element sulphur to external world has interception function, therefore, can prevent effectively that element sulphur infiltration from arriving in the cavity space and the coat of metal that chip the is installed generation silver sulfide that reacts by fluorescent glue, thereby improve the product reliability of paster LED.
As improvement, the cavity space of encapsulation fluorescent glue part is a truncated cone-shaped, and the cavity space of the anti-sulfuric horizon part of encapsulation is cylindrical.The spatial accommodation of encapsulation fluorescent glue part is designed to truncated cone-shaped, and when the encapsulation fluorescent glue, the tension force when flow to fluorescent glue in the inside of cavity space reduces, and has improved the flowability of fluorescent glue, has reduced the generation of bubble, has improved package quality.It is cylindrical that encapsulation is prevented that the cavity space of sulfuric horizon part is designed to, and manufacturing is simple on the one hand, makes on the other hand and prevent that sulfuric horizon is more evenly distributed, good airproof performance, further improves and prevent cure efficiency.
As improvement, led support comprises lower carriage and upper bracket, and the two opposite sides of lower carriage are enclosed with the PIN pin.The PIN pin is wrapped in the both sides of lower carriage, not only installs firmly, and be convenient to welding.
As improvement, the lateral surface top edge of upper bracket tilts tapered to the inside.Like this, when the moulding upper bracket, the demoulding is easy, reduces production costs.
Description of drawings
Fig. 1 is a structural representation of the present utility model.
Embodiment
Below in conjunction with the drawings and specific embodiments the utility model is further elaborated.
The paster LED that preventing as shown in Figure 1 vulcanized comprises led support 1; Led support 1 is made of upper bracket 11 and lower carriage 12; The lateral surface top edge of upper bracket 11 tilts tapered to the inside, and like this, when moulding upper bracket 11, the demoulding is easy; Lower carriage 12 is square, the middle part, bottom surface of lower carriage 12 has a downward projection 13, the two opposite sides of lower carriage 12 are enclosed with PIN pin 2, the upper end of PIN pin bends on the upper surface that attaches to lower carriage to the inside, the lower end of PIN pin bends on the lower surface that attaches to lower carriage to the inside, and the lower end of PIN pin is positioned at the both sides of projection.Upper surface at upper bracket 11 has cavity space 3 to lower recess, the upper surface of lower carriage 12 constitutes the bottom surface of cavity space, on the coat of metal of the bottom surface of cavity space, be mounted with led chip 4, led chip 4 electrically connects by gold thread 5 and PIN pin, on led chip 4, be positioned at cavity space and be packaged with fluorescent glue 6, be positioned at cavity space on the fluorescent glue 6 and be packaged with anti-sulfuric horizon 7, described anti-sulfuric horizon is a kind of transparent, low-viscosity, the coating liquid of low surface tension, it is a fluorinated polymer, when the material surface of coating clean exclusion such as copper, aluminium, pottery, iron and steel, tin or glass can form the layer of transparent film and good moisture resistance is arranged, anti-stickiness, anti-transfer printing and corrosion resistance, its low surface activity is for hydrocarbon oils, silicone oil, synthetic liquid and aqueous solvent all have splendid repellence, and element sulphur is had interception.Therefore, extraneous element sulphur can not be penetrated into fluorescent glue, and infiltration prevents effectively that by in the fluorescent glue arrival cavity space element sulphur and the frame bottom coat of metal from reacting, generation silver sulfide, thereby raising LED bright dipping and product reliability.
As shown in Figure 1, the cavity space of encapsulation fluorescent glue part is a truncated cone-shaped, and the cavity space of the anti-sulfuric horizon part of encapsulation is cylindrical.The cavity space of encapsulation fluorescent glue part is designed to truncated cone-shaped, and when the encapsulation fluorescent glue, the tension force when flow to fluorescent glue in the inside of cavity space reduces, and has improved the flowability of fluorescent glue, has reduced the generation of bubble, has improved package quality.It is cylindrical that encapsulation is prevented that the cavity space of sulfuric horizon part is designed to, and manufacturing is simple on the one hand, makes on the other hand and prevent that sulfuric horizon is more evenly distributed, good airproof performance, further improves and prevent cure efficiency.
Claims (4)
1. a paster LED that prevents to vulcanize comprises led support, and the upper surface of led support has cavity space to lower recess, and the bottom of cavity space is equipped with chip, is packaged with fluorescent glue on the chip, it is characterized in that: be packaged with anti-sulfuric horizon on the fluorescent glue.
2. the paster LED that vulcanizes of preventing according to claim 1 is characterized in that: the cavity space of encapsulation fluorescent glue part is a truncated cone-shaped, and the cavity space of the anti-sulfuric horizon part of encapsulation is cylindrical.
3. the paster LED that vulcanizes of preventing according to claim 1, it is characterized in that: led support comprises lower carriage and upper bracket, the two opposite sides of lower carriage are enclosed with the PIN pin.
4. according to the described paster LED that vulcanizes of preventing of claim 3, it is characterized in that: the lateral surface top edge of upper bracket tilts tapered to the inside.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010207008196U CN201918428U (en) | 2010-12-28 | 2010-12-28 | Vulcanization-preventive surface-mounted LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010207008196U CN201918428U (en) | 2010-12-28 | 2010-12-28 | Vulcanization-preventive surface-mounted LED |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201918428U true CN201918428U (en) | 2011-08-03 |
Family
ID=44418218
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010207008196U Expired - Fee Related CN201918428U (en) | 2010-12-28 | 2010-12-28 | Vulcanization-preventive surface-mounted LED |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201918428U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102798015A (en) * | 2012-07-12 | 2012-11-28 | 深圳市长运通光电技术有限公司 | Patch type LED (Light-Emitting Diode) luminescent device |
| CN104247055A (en) * | 2011-12-01 | 2014-12-24 | 克利公司 | Light emitting devices and components having excellent chemical resistance and related methods |
| US10008637B2 (en) | 2011-12-06 | 2018-06-26 | Cree, Inc. | Light emitter devices and methods with reduced dimensions and improved light output |
| US10490712B2 (en) | 2011-07-21 | 2019-11-26 | Cree, Inc. | Light emitter device packages, components, and methods for improved chemical resistance and related methods |
| US10686107B2 (en) | 2011-07-21 | 2020-06-16 | Cree, Inc. | Light emitter devices and components with improved chemical resistance and related methods |
-
2010
- 2010-12-28 CN CN2010207008196U patent/CN201918428U/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10211380B2 (en) | 2011-07-21 | 2019-02-19 | Cree, Inc. | Light emitting devices and components having improved chemical resistance and related methods |
| US10490712B2 (en) | 2011-07-21 | 2019-11-26 | Cree, Inc. | Light emitter device packages, components, and methods for improved chemical resistance and related methods |
| US10686107B2 (en) | 2011-07-21 | 2020-06-16 | Cree, Inc. | Light emitter devices and components with improved chemical resistance and related methods |
| US11563156B2 (en) | 2011-07-21 | 2023-01-24 | Creeled, Inc. | Light emitting devices and components having improved chemical resistance and related methods |
| CN104247055A (en) * | 2011-12-01 | 2014-12-24 | 克利公司 | Light emitting devices and components having excellent chemical resistance and related methods |
| US10008637B2 (en) | 2011-12-06 | 2018-06-26 | Cree, Inc. | Light emitter devices and methods with reduced dimensions and improved light output |
| CN102798015A (en) * | 2012-07-12 | 2012-11-28 | 深圳市长运通光电技术有限公司 | Patch type LED (Light-Emitting Diode) luminescent device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP03 | Change of name, title or address |
Address after: 510890 Huadu District, Guangdong, Guangzhou Flower Town, SAST Road, No. 1, No. 1 Patentee after: Hongli Newell group Limited by Share Ltd Address before: 510800 Dongfeng Road West, automobile city, Huadu District, Guangdong, Guangzhou Patentee before: Guangzhou Hongli Tronic Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110803 Termination date: 20171228 |
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| CF01 | Termination of patent right due to non-payment of annual fee |