CN201779623U - LED lamp radiator structure with micro-nano metal and graphite - Google Patents

LED lamp radiator structure with micro-nano metal and graphite Download PDF

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Publication number
CN201779623U
CN201779623U CN2010202837022U CN201020283702U CN201779623U CN 201779623 U CN201779623 U CN 201779623U CN 2010202837022 U CN2010202837022 U CN 2010202837022U CN 201020283702 U CN201020283702 U CN 201020283702U CN 201779623 U CN201779623 U CN 201779623U
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China
Prior art keywords
led lamp
heat
lamp panel
micro
heat dissipation
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Expired - Fee Related
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CN2010202837022U
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Chinese (zh)
Inventor
林振孟
李曼君
曾宪中
郑泽明
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Individual
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Abstract

An LED lamp radiator structure with micro-nano metal and graphite comprises an LED lamp panel and a radiating fin seat. A heat conducting layer, an insulating layer and a circuit board are sequentially combined to form the LED lamp panel, at least one LED lamp is attached onto the circuit board, and a plurality of projecting posts are arranged on the heat conducting layer. The radiating fin seat is provided with a plurality of radiating fins, and a joint surface arranged in the center of the radiating fin seat is provided with a plurality of grooves corresponding to the projecting posts of the LED lamp panel. The projecting posts is embedded in the grooves so that the LED lamp panel is combined on the radiating fin seat, accordingly the contact area of the LED lamp panel with the radiating fin seat is increased, and heat can be rapidly transmitted from the LED lamp panel to the radiating fins so as to be dissipated.

Description

LED lamp radiator structure with micro-nano metal and graphite
Technical Field
The present invention relates to a heat sink structure for LED lamps, and more particularly to a heat sink structure for LED lamps with micro-nano metal and graphite, which increases contact area by combining a protrusion and a groove.
Background
Accordingly, Light Emitting Diode (LED) devices are widely used in indicator lamps of household appliances, backlight sources of liquid crystal displays, graphic displays, and third brake lights of automobiles due to low power consumption, small size, and long service life, and in recent years, since light emitting diode materials such as aluminum gallium indium phosphide (AlGaInP) and aluminum gallium indium nitride (AlGaInN) have been successfully developed, they can replace conventional incandescent bulbs with light emitting diode devices in many applications.
However, only 15-20% of the input power of the high power LED is converted into light, and the remaining 80-85% of the input power is converted into heat, which is not discharged to the outside in time, and thus the temperature of the LED die interface is too high, and the light emitting efficiency and the lifetime are reduced.
Therefore, in order to effectively dissipate the heat generated by the led during use and further improve the lifetime and the light emitting efficiency of the led, how to design the led heat dissipation module capable of effectively dissipating heat is an important key.
Referring to fig. 5, which is an exploded view of a general LED heat sink module, a circuit board 51 with an LED lamp 50 is usually combined with a heat sink fin base 52 to quickly dissipate heat generated by the LED lamp 50 through the heat sink fin base 52, but since the contact area between the circuit board 51 and the heat sink fin base 52 is limited, the heat is guided from the circuit board 51 to the heat sink fin base 52 and then encounters a bottleneck.
Disclosure of Invention
An object of the utility model is to provide a LED lamps and lanterns radiator structure of utensil nanometer metal and graphite, it improves heat radiating area for the radiating rate to effective reduce temperature improves life and luminous efficacy.
In order to achieve the above object, the utility model discloses a LED lamp radiator structure with micro-nano metal and graphite, which is characterized in that it comprises:
the LED lamp panel is formed by combining a heat conduction layer, an insulating layer and a circuit board in sequence, at least one LED lamp is attached to the circuit board, and a plurality of convex columns protruding out of the LED lamp panel are arranged on the heat conduction layer;
the heat dissipation fin seat is provided with a plurality of heat dissipation fins, the center of the heat dissipation fin seat is provided with a joint surface, the joint surface is provided with a plurality of grooves which are corresponding to the plurality of convex columns of the LED lamp panel and are embedded with the convex columns so that the LED lamp panel is combined on the heat dissipation fin seat, and therefore the contact area of the LED lamp panel and the heat dissipation fin seat is increased, and heat is quickly transferred from the LED lamp panel to a plurality of heat dissipaters on the heat dissipation fins.
And heat conducting paste is arranged between the heat conducting layer of the LED lamp panel and the joint surface of the radiating fin seat and comprises a plane joint and an embedded part of the convex column and the groove.
Wherein, the heat dissipation fin base and the heat conduction layer are made by injection molding after mixing graphite powder, resin emulsion and micro-nano metal powder.
Wherein, the LED lamp radiator structure with micro-nano metal and graphite is combined with a lampshade.
By the structure, the LED lamp radiator structure with micro-nano metal and graphite of the utility model forms a wide contact area with the heat dissipation fin seat through the embedding of the plurality of convex columns and the plurality of grooves, thereby achieving rapid heat dissipation, thereby avoiding the overhigh temperature of the grain interface of the LED, increasing the luminous efficiency and prolonging the service life.
Drawings
FIG. 1: the utility model discloses the three-dimensional exploded view of its one embodiment.
FIG. 2: the utility model discloses LED lamp plate cross-sectional view of its one embodiment.
FIG. 3: the utility model discloses the LED lamp plate of its one embodiment combines the section view with heat radiation fin seat.
FIG. 4: the utility model discloses the three-dimensional outward appearance picture of its one of which embodiment.
FIG. 5: the conventional LED heat dissipation module is exploded.
Detailed Description
Referring to fig. 1 to 4, the present invention provides a heat sink structure of LED lamp with micro-nano metal and graphite, including:
the LED lamp panel 10 is formed by combining a heat conduction layer 11, an insulation layer 12 and a circuit board 13 in sequence, at least one LED lamp 131 is attached to the circuit board 13, and a plurality of convex columns 111 protruding out of the LED lamp panel 10 are arranged on the heat conduction layer 11;
a heat dissipating fin base 20, the heat dissipating fin base 20 having a plurality of heat dissipating fins 21 and a joint surface 22 at the center, the joint surface 22 having a plurality of grooves 221 corresponding to the plurality of posts 111 of the LED lamp panel 10, through the engagement of the posts 111 and the grooves 221, the LED lamp panel 10 is combined on the heat dissipating fin base 20, thereby increasing the contact area between the LED lamp panel 10 and the heat dissipating fin base 20, and rapidly transferring heat from the LED lamp panel 10 to the heat dissipating fins 21 for heat dissipation.
The insulating layer 12 can prevent the current from flowing to the heat conducting layer 11 after the circuit board 13 is powered on and forming a short circuit (the heat conducting layer 11 may be made of a conductive material such as metal or graphite).
A heat conductive paste 30 is disposed between the heat conductive layer 11 of the LED lamp panel 10 and the joint surface 22 of the heat dissipation fin base 20, that is, between the joint including the plane and the fitting between the convex pillar 111 and the concave groove 221.
Wherein the heat dissipation fin base 20 and the heat conduction layer 11 are made by mixing graphite powder, resin emulsion and micro-nano metal powder and then injection molding, and the weight percentage of the graphite powder, the resin emulsion and the micro-nano metal powder is 86-94 percent, 3-7 percent and 3-7 percent.
Wherein the resin latex is polyvinyl acetate latex or acrylic resin.
Wherein,the micro-nano metal powder is aluminum oxide (Al)2O3)。
Wherein, the LED lamp radiator structure with micro-nano metal and graphite can be combined with a lampshade 40 to have beautiful appearance.

Claims (4)

1. A LED lamp radiator structure with micro-nano metal and graphite is characterized by comprising:
the LED lamp panel is formed by combining a heat conduction layer, an insulating layer and a circuit board in sequence, at least one LED lamp is attached to the circuit board, and a plurality of convex columns protruding out of the LED lamp panel are arranged on the heat conduction layer;
the heat dissipation fin seat is provided with a plurality of heat dissipation fins, the center of the heat dissipation fin seat is provided with a joint surface, the joint surface is provided with a plurality of grooves which are corresponding to the plurality of convex columns of the LED lamp panel and are embedded with the convex columns so that the LED lamp panel is combined on the heat dissipation fin seat, and therefore the contact area of the LED lamp panel and the heat dissipation fin seat is increased, and heat is quickly transferred from the LED lamp panel to a plurality of heat dissipaters on the heat dissipation fins.
2. The heat sink structure of claim 1, wherein a heat conductive paste is disposed between the heat conductive layer of the LED lamp panel and the joint surface of the heat sink fin base, including a planar joint and an engagement between the protrusion and the groove.
3. The heat sink structure of claim 1, wherein the heat sink fin base and the heat conductive layer are made of graphite powder, resin emulsion and micro-nano metal powder by mixing and injection molding.
4. The heat sink structure of claim 1, wherein the heat sink structure is combined with a lampshade.
CN2010202837022U 2010-08-06 2010-08-06 LED lamp radiator structure with micro-nano metal and graphite Expired - Fee Related CN201779623U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2010202837022U CN201779623U (en) 2010-08-06 2010-08-06 LED lamp radiator structure with micro-nano metal and graphite

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2010202837022U CN201779623U (en) 2010-08-06 2010-08-06 LED lamp radiator structure with micro-nano metal and graphite

Publications (1)

Publication Number Publication Date
CN201779623U true CN201779623U (en) 2011-03-30

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010202837022U Expired - Fee Related CN201779623U (en) 2010-08-06 2010-08-06 LED lamp radiator structure with micro-nano metal and graphite

Country Status (1)

Country Link
CN (1) CN201779623U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102345842A (en) * 2010-08-06 2012-02-08 林振孟 Heat radiator structure of LED (light emitting diode) lamp fitting with micro nano metal and graphite
CN102759078A (en) * 2011-04-28 2012-10-31 东莞勤上光电股份有限公司 Light source module and medicinal lamp
CN113321928A (en) * 2021-06-02 2021-08-31 深圳市黑金工业制造有限公司 Preparation method of graphene insulation heat-conducting sheet for electric vehicle power supply

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102345842A (en) * 2010-08-06 2012-02-08 林振孟 Heat radiator structure of LED (light emitting diode) lamp fitting with micro nano metal and graphite
CN102759078A (en) * 2011-04-28 2012-10-31 东莞勤上光电股份有限公司 Light source module and medicinal lamp
CN102759078B (en) * 2011-04-28 2014-10-29 东莞勤上光电股份有限公司 Light source module and medicinal lamp
CN113321928A (en) * 2021-06-02 2021-08-31 深圳市黑金工业制造有限公司 Preparation method of graphene insulation heat-conducting sheet for electric vehicle power supply

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Granted publication date: 20110330

Termination date: 20130806