CN201259889Y - Heat radiator used for electric electronic thyristor - Google Patents

Heat radiator used for electric electronic thyristor Download PDF

Info

Publication number
CN201259889Y
CN201259889Y CNU2008201094735U CN200820109473U CN201259889Y CN 201259889 Y CN201259889 Y CN 201259889Y CN U2008201094735 U CNU2008201094735 U CN U2008201094735U CN 200820109473 U CN200820109473 U CN 200820109473U CN 201259889 Y CN201259889 Y CN 201259889Y
Authority
CN
China
Prior art keywords
copper
heat
panels
thyristor
panel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNU2008201094735U
Other languages
Chinese (zh)
Inventor
黄志宏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to CNU2008201094735U priority Critical patent/CN201259889Y/en
Application granted granted Critical
Publication of CN201259889Y publication Critical patent/CN201259889Y/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Landscapes

  • Rectifiers (AREA)

Abstract

The utility model relates to a radiator used in a power electronic thyristor, comprising a plurality of copper panels and at least one heat-conducting copper column; wherein, each copper panel corresponding to the number of the heat-conducting copper column is provided with a penetrating hole; the heat-conducting copper column is arranged in the penetrating hole in a penetrating way; the copper panels are connected in series; one end surface of the heat-conducting copper column is protruded out of the copper panels for carrying out heat contact with a heat radiating surface of the thyristor; the copper panels are welded with the heat-conducting copper column, and a heat-conducting copper column for air flow passing through is arranged between every two adjacent copper panels. A plurality of the copper panels are used for replacing blocky copper heat-radiating panels in the prior art, the heat-radiating area of the utility model is much larger than that of the prior art; on the premise that the same heat-radiating effect is achieved, the copper material can be saved, thus reducing production cost and saving social resource.

Description

Power electronics thyristor radiator
Technical field
The utility model relates to a kind of radiator, particularly a kind of radiator for the thyristor use.
Background technology
Thyristor (Thyristor) is the abbreviation of thyratron transistor, can be called silicon controlled rectifier again, is called controllable silicon in the past for short.Thyristor has the characteristic of silicon rectification device, can work under high voltage, big current condition, and its course of work can control, and is widely used in the electronic circuits such as controlled rectification, AC voltage adjusting, contactless electronic beam switch, inversion and frequency conversion.And general small power thysistor does not need radiation fin, for high-power thyristor, then must install heat abstractor additional, and the temperature during with the assurance pipe work is no more than rated temperature.
The present thyristor radiator that uses, as shown in Figure 1 and Figure 2, usually paste respectively on upper and lower two heat-delivery surfaces of thyristor 12 and touch one and be block copper heating panel 11, the heat that thyristor 12 produces conducts to copper heating panel 11, by copper heating panel 11 heat is distributed again.
Yet, find that in use also there are the following problems for prior art.
1, the thickness of copper heating panel 11 generally can reach 20 millimeters, and monoblock adopts copper product to make, and along with the rise of copper product price, the manufacturing cost height must be difficult to accept.
2, the surface area of copper heating panel 11 is limited, so area of dissipation is limited, only mainly takes conduction and radiation and convection simultaneously, and radiating efficiency is low.
Summary of the invention
At the deficiencies in the prior art, the purpose of this utility model is: a kind of power electronics thyristor radiator is provided, to reduce the use of copper product, reduces manufacturing cost.
For achieving the above object, the technical solution adopted in the utility model is:
A kind of power electronics thyristor radiator is characterized in that: comprise a plurality of copper panels and at least one heat conduction copper post, wherein:
Each described copper panel is provided with a perforation corresponding to the quantity of heat conduction copper post;
Described heat conduction copper post is located in the described perforation, and described copper panel is chained together, and an end face of described heat conduction copper post is stretched on outside the copper panel, is used for carrying out thermo-contact with the radiating surface of thyristor; Described copper panel all adopts the mode of welding to be connected with described heat conduction copper post, but and has the spacing distance that an air feed stream passes through between per two adjacent copper panels.
In the preferable technical scheme: the number of described copper panel is more than three or three.
In the preferable technical scheme: the number of described heat conduction copper post is two.
Compared with prior art, adopt the advantage that the utlity model has of technique scheme to be:
1. the utility model is compared with existing radiator owing to taked the thin copper heating panel of multi-disc as fin, has increased area of dissipation, has improved radiating efficiency.
2. owing to be provided with spacing distance between the copper panel, thereby copper heating panel is heated because of conduction its ambient air temperature is raise, and the radiator air outside can be because temperature be lower with copper heating panel near form convection current than hot gas, form the many places convection current around a plurality of copper panels, radiating efficiency is far above an independent copper heating panel.
3. owing to adopt a plurality of thin copper heating panels, compare with original thick copper heating panel as fin, the raw material of use still less, cost is lower.
Description of drawings
Fig. 1 is the occupation mode schematic diagram of existing thyristor radiator;
Fig. 2 is the plane graph of the copper heating panel of existing thyristor radiator;
Fig. 3 is a structural representation of the present utility model;
Fig. 4 is the plane graph of copper panel of the present utility model.
The copper heating panel of description of reference numerals: 11-; The 12-thyristor; The copper panel of 21-; The 22-perforation; 23-heat conduction copper post; The 231-end face; The 24-spacing distance.
Embodiment
For shape of the present utility model, structure and characteristics can be understood better, below will and be elaborated to the utility model in conjunction with the accompanying drawings by preferred embodiment.In order to make structure of the present utility model more clear, described accompanying drawing might change actual proportionate relationship in drawing process, and this is not appreciated that the qualification to present patent application.
With reference to Fig. 3, Fig. 4, be the structural representation of a preferred embodiment of the utility model, wherein, described power electronics thyristor comprises a plurality of copper panels 21 and two heat conduction copper posts 23 with radiator, wherein:
The number of described copper panel 21 can be two, and being advisable more than three or three, and the opposite position place on each copper panel 21 is provided with two perforation 22;
Described heat conduction copper post 23 is located in the described perforation 22, and described copper panel 21 is chained together, and an end face 231 of described heat conduction copper post 23 is stretched on outside the copper panel 21, is used for carrying out thermo-contact with the radiating surface of thyristor; In the present embodiment, described copper panel 21 all adopts the mode of welding to be connected with described heat conduction copper post 23, and between per two adjacent copper panels 21, have a spacing distance 24, but described hole 24 air feed streams pass through, to increase the area of heat loss through convection.
Among the above embodiment, be to be that example illustrates structure of the present utility model with two heat conduction copper posts 23, and in fact, the number of heat conduction copper post 23 can be according to the number of thyristor 12 and position and is decided, change to one, more than three or three, simultaneously, the quantity of the perforation 22 that is provided with on the copper panel 21 also is to change in company with the number of heating column.
As shown in Figure 3, the utility model when in use, be respectively to establish a described radiator thyristor 12 upper and lower, the end face 231 of two heating columns 23 of each radiator contacts with a radiating surface of a thyristor 12 respectively, thereby the heat that thyristor 12 sends is constantly conducted to copper panel 21, under the thermal radiation and cross-ventilation effect by copper panel 21, heat is distributed again.
As seen, adopt structure of the present utility model, can bring following technique effect:
1. because adopt a plurality of copper panels 21 to substitute copper radiation panel 11, and the upper and lower surface of a plurality of copper panels 21 all forms heat-delivery surface, so its surface area is far longer than the single copper heating panel 11 of prior art, after cooling surface area increases, no matter be all corresponding raising of efficient of radiation or convection effects heat radiation, so radiating effect is better than prior art.
2. because adopt a plurality of copper panels 21 to substitute copper radiation panel 11,, can save copper product, thereby reduce production costs, save social resources reaching under the prerequisite of same radiating effect.
More than explanation is just illustrative for the utility model; and nonrestrictive, those of ordinary skills understand, under the situation of the spirit and scope that do not break away from claim and limited; can make many modifications, variation or equivalence, but all will fall within the protection range of the present utility model.

Claims (3)

1, a kind of power electronics thyristor radiator is characterized in that: comprise a plurality of copper panels and at least one heat conduction copper post, wherein:
Each described copper panel is provided with a perforation corresponding to the quantity of heat conduction copper post;
Described heat conduction copper post is located in the described perforation, and described copper panel is chained together, and an end face of described heat conduction copper post is stretched on outside the copper panel, is used for carrying out thermo-contact with the radiating surface of thyristor; Described copper panel all adopts the mode of welding to be connected with described heat conduction copper post, but and has the spacing distance that an air feed stream passes through between per two adjacent copper panels.
2, power electronics thyristor radiator according to claim 1, it is characterized in that: the number of described copper panel is more than three or three.
3, power electronics thyristor radiator according to claim 1, it is characterized in that: the number of described heat conduction copper post is two.
CNU2008201094735U 2008-07-28 2008-07-28 Heat radiator used for electric electronic thyristor Expired - Fee Related CN201259889Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNU2008201094735U CN201259889Y (en) 2008-07-28 2008-07-28 Heat radiator used for electric electronic thyristor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNU2008201094735U CN201259889Y (en) 2008-07-28 2008-07-28 Heat radiator used for electric electronic thyristor

Publications (1)

Publication Number Publication Date
CN201259889Y true CN201259889Y (en) 2009-06-17

Family

ID=40774125

Family Applications (1)

Application Number Title Priority Date Filing Date
CNU2008201094735U Expired - Fee Related CN201259889Y (en) 2008-07-28 2008-07-28 Heat radiator used for electric electronic thyristor

Country Status (1)

Country Link
CN (1) CN201259889Y (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105915118A (en) * 2016-05-25 2016-08-31 东屋电气(天津)有限公司 Thyristor intelligent module specially for soft starter and work method thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105915118A (en) * 2016-05-25 2016-08-31 东屋电气(天津)有限公司 Thyristor intelligent module specially for soft starter and work method thereof
CN105915118B (en) * 2016-05-25 2019-01-15 东屋电气(天津)有限公司 Soft activator Thyristor Special intelligent object and its control method

Similar Documents

Publication Publication Date Title
CN102299614A (en) Semiconductor-refrigeration-based inverter radiating system
CN203279343U (en) Electric apparatus with heat dissipation function
CN201259889Y (en) Heat radiator used for electric electronic thyristor
CN202196771U (en) Novel two-side cooler used for electromobile semiconductor
CN102163928A (en) Special ultrahigh-power rectification power electronic device module for ultrasonic welding machine
CN207664185U (en) A kind of heat management system of cylindrical battery PACK structures
CN202813503U (en) Radiating structure and electromagnetic oven
CN205622978U (en) Electronic circuit board convenient to heat dissipation
CN204696102U (en) A kind of heat radiating installation construction of power device
CN205488102U (en) High -power plate thyristor heat pipe cooling ware for device
CN201269666Y (en) Semiconductor refrigerator
CN201285191Y (en) Novel semiconductor refrigeration apparatus
CN109245555B (en) Synchronous rectification high-frequency switch power supply
CN202205731U (en) Heat radiating module for IGBT (Insulated Gate Bipolar Transistor) module superconductive heat pipe
CN203720769U (en) Heat source separated cooling fin for computer
CN205209315U (en) Water conservancy diversion formula aluminum alloy heat sink profile is covered in area
CN204857705U (en) Silicon controlled rectifier radiator
CN205209317U (en) Components of a whole that can function independently water conservancy diversion formula aluminum alloy heat sink profile
CN211792083U (en) Electric heating plate for laminator
CN205071581U (en) Power electronic device natural cooling structure of generating heat
CN203734984U (en) Radiator for large-power electronic device
CN201312252Y (en) Installation structure of IGBT contravariant component and input rectification bridge in switch power supply
CN103363836A (en) Heat dissipating device for oil-immersed transformer
CN203025634U (en) Display card radiating device
CN203336546U (en) High-power LED lamp cooling device

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20090617

Termination date: 20140728

EXPY Termination of patent right or utility model