CN1938598B - 适于老化测试的***和方法 - Google Patents
适于老化测试的***和方法 Download PDFInfo
- Publication number
- CN1938598B CN1938598B CN2005800097627A CN200580009762A CN1938598B CN 1938598 B CN1938598 B CN 1938598B CN 2005800097627 A CN2005800097627 A CN 2005800097627A CN 200580009762 A CN200580009762 A CN 200580009762A CN 1938598 B CN1938598 B CN 1938598B
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- China
- Prior art keywords
- bias voltage
- tested device
- tested
- nmos
- voltage
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2879—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to electrical aspects, e.g. to voltage or current supply or stimuli or to electrical loads
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
- G01R31/2817—Environmental-, stress-, or burn-in tests
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
- G01R31/2875—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to heating
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/317—Testing of digital circuits
- G01R31/31721—Power aspects, e.g. power supplies for test circuits, power saving during test
Landscapes
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
Description
Claims (18)
Applications Claiming Priority (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/791,459 | 2004-03-01 | ||
US10/791,241 | 2004-03-01 | ||
US10/791,099 | 2004-03-01 | ||
US10/791,459 US6900650B1 (en) | 2004-03-01 | 2004-03-01 | System and method for controlling temperature during burn-in |
US10/791,241 US6897671B1 (en) | 2004-03-01 | 2004-03-01 | System and method for reducing heat dissipation during burn-in |
US10/791,099 US7248988B2 (en) | 2004-03-01 | 2004-03-01 | System and method for reducing temperature variation during burn in |
PCT/US2005/006814 WO2005085887A1 (en) | 2004-03-01 | 2005-03-01 | System and method pertaining to burn-in testing |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1938598A CN1938598A (zh) | 2007-03-28 |
CN1938598B true CN1938598B (zh) | 2010-06-09 |
Family
ID=34592685
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2005800097627A Active CN1938598B (zh) | 2004-03-01 | 2005-03-01 | 适于老化测试的***和方法 |
Country Status (3)
Country | Link |
---|---|
US (3) | US6897671B1 (zh) |
CN (1) | CN1938598B (zh) |
WO (1) | WO2005085887A1 (zh) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7248988B2 (en) * | 2004-03-01 | 2007-07-24 | Transmeta Corporation | System and method for reducing temperature variation during burn in |
US6900650B1 (en) * | 2004-03-01 | 2005-05-31 | Transmeta Corporation | System and method for controlling temperature during burn-in |
US6897671B1 (en) * | 2004-03-01 | 2005-05-24 | Transmeta Corporation | System and method for reducing heat dissipation during burn-in |
CN102081138B (zh) * | 2009-12-01 | 2012-11-28 | 中芯国际集成电路制造(上海)有限公司 | 对半导体器件进行晶圆级老化测试的方法 |
US8519729B2 (en) * | 2010-02-10 | 2013-08-27 | Sunpower Corporation | Chucks for supporting solar cell in hot spot testing |
CN102650678B (zh) * | 2012-05-04 | 2014-07-23 | 惠州市蓝微电子有限公司 | 电量管理ic多通道校准校验的方法 |
US10101382B2 (en) * | 2016-12-30 | 2018-10-16 | Texas Instruments Incorporated | Systems and methods for dynamic Rdson measurement |
Citations (6)
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EP0292136A1 (en) * | 1987-05-18 | 1988-11-23 | Hewlett-Packard Company | Method and process for testing the reliability of integrated circuit (IC) chips and novel IC circuitry for accomplishing same |
US5701666A (en) * | 1994-08-31 | 1997-12-30 | Motorola, Inc. | Method for manufacturing a stimulus wafer for use in a wafer-to-wafer testing system to test integrated circuits located on a product wafer |
US5995428A (en) * | 1997-11-22 | 1999-11-30 | United Microelectronics Corp. | Circuit for burn-in operation on a wafer of memory devices |
US6455336B1 (en) * | 2001-08-27 | 2002-09-24 | International Business Machines Corporation | Power reduction method and design technique for burn-in |
CN1392569A (zh) * | 2001-06-13 | 2003-01-22 | 精工爱普生株式会社 | 半导体存储器及其老化筛选方法 |
CN1448907A (zh) * | 2002-03-29 | 2003-10-15 | 东北先锋公司 | 老化显示装置的方法和使用该方法的电子设备 |
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US3244267A (en) * | 1963-08-01 | 1966-04-05 | Merck & Co Inc | Convergence apparatus |
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US4265356A (en) * | 1979-08-20 | 1981-05-05 | The Lodge & Shipley Company | Apparatus for combining articles from plural lanes into a single lane |
CH631108A5 (fr) * | 1979-10-09 | 1982-07-30 | Motosacoche Sa | Installation de production de recipients par etirage-soufflage de preformes en matiere plastique. |
US4313720A (en) * | 1980-03-03 | 1982-02-02 | Emhart Industries, Inc. | Parison transfer means |
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CA1340569C (en) | 1987-05-05 | 1999-06-01 | Sungho Jin | Superconductive body having improved properties, and apparatus and systems comprising such a body |
US4938636A (en) * | 1988-11-14 | 1990-07-03 | Aidlin Automation Corp. | Method and apparatus for feeding container bodies |
JPH07105160B2 (ja) * | 1989-05-20 | 1995-11-13 | 東芝マイクロエレクトロニクス株式会社 | 半導体記憶装置 |
US5309090A (en) * | 1990-09-06 | 1994-05-03 | Lipp Robert J | Apparatus for heating and controlling temperature in an integrated circuit chip |
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FR2675481B1 (fr) * | 1991-04-16 | 1993-08-20 | Sidel Sa | Dispositif de convoyage de preformes agence pour eliminer des preformes emboitees les unes dans les autres. |
CA2073916A1 (en) * | 1991-07-19 | 1993-01-20 | Tatsuya Hashinaga | Burn-in apparatus and method |
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KR0179820B1 (ko) * | 1996-02-01 | 1999-04-15 | 문정환 | 반도체 메모리의 번인 감지 회로 |
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US6476627B1 (en) * | 1996-10-21 | 2002-11-05 | Delta Design, Inc. | Method and apparatus for temperature control of a device during testing |
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US6967522B2 (en) * | 2001-04-17 | 2005-11-22 | Massachusetts Institute Of Technology | Adaptive power supply and substrate control for ultra low power digital processors using triple well control |
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US6957163B2 (en) * | 2002-04-24 | 2005-10-18 | Yoshiyuki Ando | Integrated circuits having post-silicon adjustment control |
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DE10255665B4 (de) * | 2002-11-28 | 2008-05-08 | Qimonda Ag | Schaltung und Verfahren zur Bestimmung wenigstens eines Spannungs-, Strom- und/oder Leistungswerts einer integrierten Schaltung |
US6989684B2 (en) * | 2002-12-04 | 2006-01-24 | Hewlett-Packard Development Company, L.P. | System for and method of assessing chip acceptability and increasing yield |
US7141953B2 (en) * | 2003-09-04 | 2006-11-28 | Intel Corporation | Methods and apparatus for optimal voltage and frequency control of thermally limited systems |
US6956437B2 (en) * | 2003-12-23 | 2005-10-18 | Agere Systems Inc. | Metal-oxide-semiconductor device having integrated bias circuit |
US7248988B2 (en) * | 2004-03-01 | 2007-07-24 | Transmeta Corporation | System and method for reducing temperature variation during burn in |
US6897671B1 (en) * | 2004-03-01 | 2005-05-24 | Transmeta Corporation | System and method for reducing heat dissipation during burn-in |
US6900650B1 (en) * | 2004-03-01 | 2005-05-31 | Transmeta Corporation | System and method for controlling temperature during burn-in |
US7376849B2 (en) * | 2004-06-30 | 2008-05-20 | Intel Corporation | Method, apparatus and system of adjusting one or more performance-related parameters of a processor |
-
2004
- 2004-03-01 US US10/791,241 patent/US6897671B1/en not_active Expired - Lifetime
-
2005
- 2005-03-01 WO PCT/US2005/006814 patent/WO2005085887A1/en active Application Filing
- 2005-03-01 CN CN2005800097627A patent/CN1938598B/zh active Active
- 2005-05-23 US US11/136,038 patent/US7242205B1/en not_active Expired - Lifetime
-
2007
- 2007-07-10 US US11/827,290 patent/US7595652B2/en not_active Expired - Lifetime
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0292136A1 (en) * | 1987-05-18 | 1988-11-23 | Hewlett-Packard Company | Method and process for testing the reliability of integrated circuit (IC) chips and novel IC circuitry for accomplishing same |
US5701666A (en) * | 1994-08-31 | 1997-12-30 | Motorola, Inc. | Method for manufacturing a stimulus wafer for use in a wafer-to-wafer testing system to test integrated circuits located on a product wafer |
US5995428A (en) * | 1997-11-22 | 1999-11-30 | United Microelectronics Corp. | Circuit for burn-in operation on a wafer of memory devices |
CN1392569A (zh) * | 2001-06-13 | 2003-01-22 | 精工爱普生株式会社 | 半导体存储器及其老化筛选方法 |
US6455336B1 (en) * | 2001-08-27 | 2002-09-24 | International Business Machines Corporation | Power reduction method and design technique for burn-in |
CN1448907A (zh) * | 2002-03-29 | 2003-10-15 | 东北先锋公司 | 老化显示装置的方法和使用该方法的电子设备 |
Also Published As
Publication number | Publication date |
---|---|
US20080024152A1 (en) | 2008-01-31 |
US7595652B2 (en) | 2009-09-29 |
CN1938598A (zh) | 2007-03-28 |
WO2005085887A1 (en) | 2005-09-15 |
US7242205B1 (en) | 2007-07-10 |
US6897671B1 (en) | 2005-05-24 |
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Effective date of registration: 20090911 Address after: Nevada Applicant after: TRANSMETA Corp. Address before: California, USA Applicant before: Qualcomm LLC Effective date of registration: 20090911 Address after: California, USA Applicant after: Qualcomm LLC Address before: California, USA Applicant before: Transmeta Corp. |
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