CN1875438A - Lamination-type resistance element - Google Patents
Lamination-type resistance element Download PDFInfo
- Publication number
- CN1875438A CN1875438A CNA2004800320644A CN200480032064A CN1875438A CN 1875438 A CN1875438 A CN 1875438A CN A2004800320644 A CNA2004800320644 A CN A2004800320644A CN 200480032064 A CN200480032064 A CN 200480032064A CN 1875438 A CN1875438 A CN 1875438A
- Authority
- CN
- China
- Prior art keywords
- internal electrode
- electrode
- internal
- lamination
- group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/18—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material comprising a plurality of layers stacked between terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/04—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Ceramic Engineering (AREA)
- Thermistors And Varistors (AREA)
Abstract
This invention provides a multilayer resistive element for which the resistance value can be finely adjusted. The multilayer resistive element comprises a multilayer sintered body (23) having a first group of inner electrodes (27a, 27b) and a second group of inner electrodes (24a, 24b, 25a, 25b). The first group of the inner electrodes have inner electrodes (24b, 25a) opposed to each other with a ceramic resistive layer interposed therebetween. A resistor unit is formed at a portion where the inner electrodes (24b, 25a) are opposed. One end of the resistor unit is connected to a first outer electrode (29), and the other is connected to a second outer electrode (30). The second group of the inner electrodes have pairs of the inner electrodes (27a, 27b) having their inner ends opposed to one another in the same plane in the multilayer sintered body, with gaps defined among the inner ends. The pairs of gaps between the pairs of inner electrodes (27a, 27b) are in the same position when viewed from one stack direction of the multilayer sintered body.
Description
(1) technical field
The present invention relates to lamination-type resistance element, relate in particular to internal electrode and be arranged on lamination sintered body inside to allow to the lamination-type resistance element of semifixed resistor value.
(2) background technology
So far, the resistive element such as PTC thermistor and NTC thermistor has been used for temperature-compensating and temperature detection.In such resistive element, a kind of lamination-type resistance element that is installed in above the printed circuit board (PCB) etc. is arranged.Hereinafter, will the example of relevant lamination-type resistance element be described.
Fig. 7 illustrates wherein that resistive element is the cutaway view of first related example of NTC thermistor.
In the cascade type thermistor 1 shown in Fig. 7, the first internal electrode 4a and 4b and the second internal electrode 5a and 5b are arranged on lamination sintered body 3 inside, and in lamination sintered body 3, a plurality of thermal resistor layer 2 are by integral sintered. Outer electrode 7 and 8 is arranged on outer surface, more particularly, is arranged on the two ends of lamination sintered body 3.
The end of the end of the first internal electrode 4a and the second internal electrode 5a is faced at grade mutually, has gap 6a between them.The other end of the first internal electrode 4a and outer electrode 7 are electrically connected, and the other end of the second internal electrode 4b and outer electrode 8 are electrically connected.
In addition, the end of the end of the first internal electrode 4b and the second internal electrode 5b is faced at grade mutually, has gap 6b between them.The other end of the first internal electrode 4b and outer electrode 7 are electrically connected, and the other end of the second internal electrode 5b and outer electrode 8 are electrically connected.
In lamination sintered body 3, gap 6a and 6b are arranged alternately along the direction of a plurality of thermal resistor layer 2 laminations.In addition, gap 6a is arranged in and the vertical substantially direction of the stack direction of lamination sintered body 3 with 6b.
Fig. 8 is the cutaway view that second related example is shown, and has identical mode with Fig. 7, and this resistive element is the NTC thermistor.
In the lamination NTC thermistor 11 shown in Fig. 8, first internal electrode 14 and the second internal electrode 14b are arranged on lamination sintered body 13 inside, and in lamination sintered body 3, a plurality of thermal resistor layer 12 are by integral sintered.In addition, be provided with internal electrode 16 so that via thermal resistor layer 12 towards the first internal electrode 14a and the second internal electrode 14b. Outer electrode 17 and 18 is arranged on lamination sintered body 12 outer surfaces, more particularly, is arranged on two end portions.
The end of the first internal electrode 14a and the end of the second internal electrode 14b are arranged to face mutually at grade, and between them, have gap 15.The other end of the first internal electrode 4a and outer electrode 17 are electrically connected, and the other end of the second internal electrode 14b and outer electrode 18 are electrically connected.
First is determined by the size of the gap 6b between size, the first internal electrode 4b and the second internal electrode 5b of the gap 6a between the first internal electrode 4a and the second internal electrode 5a and the overlapping region between the first internal electrode 4a and the second internal electrode 5b and the interval between them about the resistance value of lamination-type resistance element.
In addition, second about the resistance value of lamination-type resistance element by the size in the gap 15 between the first internal electrode 14a and the second internal electrode 14b, the first internal electrode 14a and the not overlapping region between the connecting-type electrode 16 and the interval between them and the second internal electrode 14b and the overlapping region between the connecting-type electrode 16 and the interval between them are not determined.
In 2000-124008 Japanese unexamined patent specification, disclosed the 3rd relevant lamination-type resistance element.In the resistive element that 2000-124008 Japanese unexamined patent specification discloses, at the negative-characteristic thermistor element internal, be provided with first and second internal electrodes so that they are positioned at each other top, it between them the thermistor element layer, an internal electrode extends outwardly into an end of negative-characteristic thermistor element, and another internal electrode extends outwardly into the other end.Then, first and second outer electrodes are arranged in the two ends of thermistor element.In addition, the resistive layer of making by the resistance material that is different from the material of determining thermistor element be stacked in thermistor element above.Then, pair of internal electrodes is arranged on resistive layer inside, an end of each electrode is relative with an end of another electrode, has the gap at grade between them.In the internal electrode one is electrically connected with first outer electrode, and another and second outer electrode are electrically connected.
Here, not only pass through to regulate the material behavior and the shape of above-mentioned resistive layer, and resistance value can be set by the figure of regulating pair of electrodes in the resonant layer.Thus, can increase the degree of freedom that resistance value is set.
In addition, in 6-34201 Japanese unexamined utility model registration application specification, disclosed according to the NTC thermistor of the 4th example as lamination-type resistance element.That is, be provided with manyly to internal electrode in lamination-type resistor inside, one inside end in the pair of electrodes has with gap at grade towards the NTC thermistor of another inside end.Here, in every pair of internal electrode, internal electrode is electrically connected with first outer electrode that is arranged on resistor one end surfaces, and another internal electrode be arranged on lip-deep second outer electrode of the resistor other end and be electrically connected.Then, when when seeing perpendicular to the direction of resistor upper surface, in many each to electrode, an internal electrode and another internal electrode are configured to not be positioned at top each other.In this NTC temperature-sensitive element, determine by the size in gap between the pair of internal electrodes that is arranged on the same plane owing to resistance value, might reduce the variation of resistance value.
When in first and second lamination-type resistance elements, regulating resistance value, can increase and reduce the lamination quantity of each internal electrode.But under the situation of regulating resistance value, in first related example, owing to increase or reduce via the quantity of thermal resistor layer 2 internal electrode 4a respect to one another, 4b, 5a and 5b, wider range of resistance change and semifixed resistor value be difficulty.In the second relevant embodiment, the quantity of the unit of making via thermistor 12 internal electrode 14a respect to one another, 14b and internal electrode 16 increases or minimizing.Therefore, the excursion of resistance value is broad also, and the semifixed resistor value is also difficult.
On the other hand, in the lamination-type resistance element of the 3rd related example, because resistive layer is made by the material that use is different from the negative-characteristic thermistor element, it is complicated that manufacturing process becomes, nature, and cost also must increase.In addition, because the thickness that requires resistive layer is fully less than the thickness of thermistor element, the design of resistor and internal electrode is limited naturally.Therefore, reduce resistance and the semifixed resistor value is difficult.
In addition, in the NTC thermistor that above-mentioned 6-34201 Japanese unexamined utility model registration application specification is described, although can reduce the variation of resistance value, the reducing of resistance value is restricted.When every pair of inner gaps between electrodes on being arranged at same plane reduces, might reduce resistance value.But when the gap reduced, owing to more likely be short-circuited, the reduction of resistance was restricted.
(3) summary of the invention
For overcoming the problems referred to above, preferred embodiment of the present invention has the lamination-type resistance element of following structure, wherein uses the lamination-type sintered body with internal electrode to finely tune the resistance value of lamination-type resistance element.
According to preferred embodiment of the present invention, can provide to comprise that having a plurality of ceramic electrical resistance layers and a plurality of internal electrode is stacked in lamination sintered body wherein and is arranged in first outer electrode on this lamination sintered body outer surface and the lamination-type resistance element of second outer electrode.In this lamination-type resistance element, a plurality of internal electrodes comprise a plurality of internal electrodes of first group and a plurality of internal electrodes of second group, a plurality of internal electrodes of first group comprise resistance unit, at least two internal electrodes are configured to face one another via the ceramic electrical resistance layer in this resistance unit, one end and first outer electrode of resistance unit are electrically connected, and the other end and second outer electrode are electrically connected.Second group internal electrode comprises many to internal electrode, relative on one end of each internal electrode and the same plane of an end of another internal electrode in the lamination sintered body, and between two ends, has the gap, each internal electrode and first outer electrode to electrode are electrically connected, and another internal electrode and second outer electrode are electrically connected.
In the specific preferred embodiment according to the lamination-type element of this preferred embodiment, a plurality of gaps of second group are aligned in the lamination sintered body along stack direction and are positioned at each other top.
In another specific preferred embodiment of the lamination-type resistance element according to the present invention, each internal electrode of first group comprise with first outer electrode be electrically connected first separate internal electrode be electrically connected with second outer electrode second separate internal electrode, and first end that separates internal electrode separates internal electrode with second a end faces one another at grade, and has the gap between them.Every pair of internal electrode about the second internal electrode group, another internal electrode that is electrically connected as the 3rd internal electrode with second outer electrode at the internal electrode that is electrically connected with first outer electrode is during as the 4th internal electrode, aligns with second group of nethermost gap in first group of uppermost gap.
In the present invention, can make different the modification to the structure of above-mentioned first group internal electrode.
That is, in another specific preferred embodiment of the present invention, manyly separate internal electrodes by lamination to first and second, and when when a side of stack direction is seen, the gap of adjacent pairs of electrodes is arranged on different positions along stack direction.
In addition, in another certain preferred embodiment, in first group internal electrode, also provide the not connecting-type internal electrode that is arranged on the first and second separation internal electrode tops via the ceramic electrical resistance layer according to lamination-type resistance element of the present invention.
In another certain preferred embodiment according to lamination-type resistance element of the present invention, first group internal electrode comprises first internal electrode that is electrically connected with first outer electrode and second internal electrode that is electrically connected with second outer electrode, and first and second internal electrodes are arranged to be positioned at each other top via being arranged at ceramic layer between them.
Above-mentioned three kind of first mutually different lamination-type resistance element of internal electrode structure can be described as first to the 3rd preferred embodiment hereinafter.
Comprise that as the lamination-type resistance element of first preferred embodiment of the invention having a plurality of ceramic electrical resistance layers and a plurality of internal electrode is stacked in lamination sintered body wherein and is arranged on first outer electrode and second outer electrode on this lamination sintered body outer surface.In this lamination-type resistance element, a plurality of internal electrodes comprise a plurality of internal electrodes of first group and a plurality of internal electrodes of second group, wherein each of a plurality of internal electrodes of first group comprises first internal electrode and second internal electrode, one end of each electrode is aligned on the same plane of an end in the lamination sintered body with another electrode relative, between them, has the gap, and the other end is connected with second outer electrode with first outer electrode respectively, when the stack direction of lamination sintered body was seen, the adjacent segment between first and second internal electrodes was arranged in diverse location along the stack direction of lamination sintered body.Second group internal electrode comprises the 3rd internal electrode and the 4th internal electrode, relative on one end of each electrode and the same plane of an end of another electrode in the lamination sintered body, between them, has the gap, and the other end is connected with second external electrical with first outer electrode respectively, and the gap between the 3rd internal electrode and the 4th internal electrode is in identical position along the stack direction of lamination sintered body.
In addition, second preferred embodiment that is used to address the above problem is to comprise that having a plurality of ceramic electrical resistance layers and a plurality of internal electrode is stacked in lamination sintered body wherein and is arranged on first outer electrode on this lamination sintered body outer surface and the lamination-type resistance element of second outer electrode.In this lamination-type resistance element, a plurality of internal electrodes comprise a plurality of internal electrodes of first group and a plurality of internal electrodes of second group, wherein each of a plurality of internal electrodes of first group comprises first internal electrode and second internal electrode, one end of each electrode is aligned on the same plane of an end in the lamination sintered body with another electrode relative, between them, has the gap, and the other end is connected with second outer electrode with first outer electrode respectively, the connecting-type internal electrode is not arranged in the top that is positioned at first internal electrode and second internal electrode along the stack direction of lamination sintered body via the ceramic electrical resistance layer, and is not connected with first and second outer electrodes.Each of a plurality of internal electrodes of second group comprises the 3rd internal electrode and the 4th internal electrode, relative on one end of each electrode and the same plane of an end of another electrode in the lamination sintered body, between them, has the gap, and the other end is connected with second external electrical with first outer electrode respectively, and the gap between the 3rd internal electrode and the 4th internal electrode is in identical position along the stack direction of lamination sintered body.
The lamination-type resistance element of the 3rd preferred embodiment comprises that having a plurality of ceramic electrical resistance layers and a plurality of internal electrode is stacked in lamination sintered body wherein and is arranged on first outer electrode and second outer electrode on this lamination sintered body outer surface.In this lamination-type resistance element, a plurality of internal electrodes comprise a plurality of internal electrodes of first group and a plurality of internal electrodes of second group, wherein each of a plurality of internal electrodes of first group comprises first internal electrode that is connected with first outer electrode and second internal electrode that is connected with second outer electrode, and they via the ceramic electrical resistance layer toward each other.Each of a plurality of internal electrodes of second group comprises the 3rd internal electrode and the 4th internal electrode, relative on one end of each electrode and the same plane of an end of another electrode in the lamination sintered body, between them, has the gap, and the other end is connected with second outer electrode with first outer electrode respectively, and the gap between the 3rd internal electrode and the 4th internal electrode is in identical position along the stack direction of lamination sintered body.
In the lamination-type resistance element of the preferred embodiment of the present invention,, second group internal electrode can make fine setting in the lamination sintered body to resistance value by being provided.That is, the internal electrode of determining second group many to internal electrode in, every pair of internal electrode is arranged on the same plane in the lamination sintered body and has the gap between electrode.Since less by the resistance value that the gap is determined, by changing many gap size and many logarithms, can make fine setting to the resistance value of lamination-type resistance element to electrode to internal electrode.That is, can not influence first group of determined resistance value of the residing part of internal electrode very greatly, can make fine setting resistance value by regulating second group of residing part of internal electrode.
In addition, owing to can design the lamination sintered body, that is, design and be provided with resistance value, can easily make fine setting resistance value with the identical technology of technology of multi-layered ceramic resistive layer and internal electrode.
With reference to accompanying drawing, to a plurality of detailed description of preferred embodiment of the present invention, it is more obvious that further feature of the present invention, element, step, characteristic and advantage will become according to following.
(4) description of drawings
Fig. 1 is the cutaway view that first preferred embodiment of lamination-type resistance element of the present invention is shown.
Fig. 2 is the cutaway view that second preferred embodiment of lamination-type resistance element of the present invention is shown.
Fig. 3 is the cutaway view that the 3rd preferred embodiment of lamination-type resistance element of the present invention is shown.
Fig. 4 is the front sectional elevation that the modification example of lamination-type resistance element is shown, and the lamination-type resistance element that is used to describe the application of the invention comes resistance value is made the processing of fine setting.
Fig. 5 is the front sectional elevation of the lamination-type resistance element that obtains of the lamination quantity by the second group of internal electrode that increases the lamination-type resistance element shown in Fig. 4.
Fig. 6 is the front sectional elevation of the lamination-type resistance element that obtains of the lamination quantity by the second group of internal electrode that reduces the lamination-type resistance element shown in Fig. 4.
Fig. 7 is the profile that first example of relevant lamination-type resistance element is shown.
Fig. 8 is the profile that second example of relevant lamination-type resistance element is shown.
(5) embodiment
Fig. 1 is the profile that first preferred embodiment of lamination-type resistance element is shown.
Lamination-type resistance element 21 shown in Figure 1 comprise lamination wherein and integrally sintering as the lamination sintered body 23 of a plurality of NTC thermal resistor layer 22 of a plurality of ceramic electrical resistance layers.The first internal electrode 24a and 24b and the second internal electrode 25a and 25b are arranged on the inside of lamination sintered body 23. Outer electrode 29 and 30 is provided with on the outer surface, specifically, is arranged on the two ends of lamination sintered body 23.
As the first first internal electrode 24a that separates internal electrode be provided with by this way as the second second internal electrode 25a that separates internal electrode, be the end of internal electrode 24a and internal electrode 25a an end at grade toward each other, and between them, have gap 26a.The other end of the first internal electrode 24a and outer electrode 29 are electrically connected, and the other end of the second internal electrode 25a and outer electrode 30 are electrically connected.
In addition, when electrode at grade was regarded as unified electrode, the internal electrode of separation represented that an electrode opened by separated.For example, internal electrode 24a and internal electrode 25a are considered to unified electrode at grade, and will be called separation internal electrode 24a with each electrode of separated and separate internal electrode 25a.In addition, for example, when internal electrode 25a and internal electrode 24b are positioned at each other top via thermal resistor layer, can abbreviate internal electrode 25a as internal electrode.
In addition, be provided with by this way as the first internal electrode 24b and the second internal electrode 25b that separate internal electrode, promptly the end of the end of internal electrode 24b and internal electrode 25b and has gap 26b at grade toward each other between them.The other end of the first internal electrode 24b and outer electrode 29 are electrically connected, and the other end of the second internal electrode 25b and outer electrode 30 are electrically connected.
Gap 26a and 26b are arranged on the inside of sintered body 23, and follow mutually along the stack direction of a plurality of thermistors 22.In addition, gap 26a and 26b are arranged at the diverse location perpendicular to the direction of sintered body 23 stack directions, and the direction that connects at the two ends of sintered body 23.The structure of above-mentioned first internal electrode 24a and 24b is corresponding to the first internal electrode group A of the present invention.Here be the resistance unit that makes up, wherein two internal electrode 24b and 24b be arranged in the top of internal electrode 25a and below so that have lap with internal electrode 25a.One end of resistance unit is connected with first outer electrode 29, and the other end is connected with second outer electrode 30.In addition, in a preferred embodiment of the invention, in the above-mentioned resistance unit of the first internal electrode group A, internal electrode 24b and 24b and internal electrode 25a, that is, three internal electrodes are placed on top each other, and are provided with thermal resistor layer between them.But, in a preferred embodiment of the invention,, be not subjected to specific limited via the lamination quantity of ceramic electrical resistance layer internal electrode respect to one another because to have at least two be enough via ceramic electrical resistance layer internal electrode respect to one another.
Lamination-type thermistor 21 also comprises following structure.That is,, on the first internal electrode group A, be provided with the second internal electrode group B in sintered body 23 inside.
The second internal electrode group B has following structure.The 3rd internal electrode 27a and the 4th internal electrode 27b are arranged on the inside of lamination sintered body 23, and a plurality of thermal resistor layer 22 are by integral sintered in lamination sintered body 23.The 3rd internal electrode 27a and the 4th internal electrode 27b arrange by this way, and promptly the end of the end of internal electrode 27a and internal electrode 27b is arranged relative to each other at grade, and have gap 28 between them.The other end of the 3rd internal electrode 27a and outer electrode 29 are electrically connected, and the other end of the 4th internal electrode 27b and outer electrode 30 are electrically connected.
When an end of the stack direction of a plurality of thermal resistor layer 22 is seen, for example, when the upper interior of lamination sintered body 23 was seen, the gap 28 of the second internal electrode group B was arranged on identical position.
In addition, when when an end of the stack direction of thermal resistor layer is seen, gap 28 is arranged on the position of the gap 26a that is different from the first internal electrode group A.More particularly, be arranged on the diverse location of the direction at the two ends that connect lamination sintered body 23.In addition, in the second internal electrode group B shown in Figure 1, three groups of electrodes being made up of the 3rd internal electrode 27a and the 4th internal electrode 27b are placed on top each other, but the number of plies of combination can design according to target resistance values.In addition, in Fig. 1, the NTC thermal resistor layer 22a between the first internal electrode group A and the second internal electrode group B is preferably greater than the thickness of another thermal resistor layer 22, but also can make their thickness identical.
In lamination resistive element, determine resistance value with following mode according to first preferred embodiment.Promptly, in the first internal electrode group A, determine resistance value by between the first internal electrode 24a and the 25a and overlapping region between the size of gap 26a between the second internal electrode 24b and the 25b and 26b and the first internal electrode 24a and the second internal electrode 25b and interval respectively.In addition, in the second internal electrode group B, determine resistance value by the gap between the 3rd internal electrode 27a and the 4th internal electrode 27b 28.Therefore, the resistance value of lamination-type resistance element becomes the combined resistance value of the resistance value of the first internal electrode group A and the second internal electrode group B.In the second internal electrode group B,, less by the resistance value that gap 28 produces although determine resistance value by the size in gap 28.
In addition, in first preferred embodiment, because three groups of internal electrodes 27 and internal electrode 27b lamination in internal electrode group B, when when an end of stack direction is seen, follow each other at the stack direction of thermal resistor layer 22 in three gaps 28, and be arranged to be positioned at top each other.That is, gap 28 and 28 via one deck thermal resistor layer 22 toward each other.In this way, because a plurality of gaps 28 are arranged among the second internal electrode group B and a plurality of gap is configured to be positioned at each other top, not only the resistance value of being set up by the size in a gap 28 is less, and also less by the resistance value of the determined second internal electrode group B in the interval between a plurality of gaps 28.Therefore, utilize the second internal electrode group that the resistance value of whole lamination-type resistance element is made fine setting and become possibility.
In addition, in the lamination-type thermistor 21 of first preferred embodiment, not only can make fine setting to resistance value, and have the advantage that to make fine setting more accurately to resistance value with aforesaid way.Promptly, in the lamination-type thermistor 21 of first preferred embodiment, gap 26b between the first internal electrode group, the first internal electrode 24b and the second internal electrode 25b is arranged in identical position with gap 28 between the second internal electrode group the 3rd internal electrode 27a and the 4th internal electrode 27b, promptly, when when stack direction is seen, be positioned at top each other, follow each other via thermal resistor layer 22a in gap 26b and gap 28.In order more clearly it to be illustrated, in Fig. 1, the gap is provided label X and Y, when when above-mentioned stack direction is seen, can make the gap just as the position closer to each other.
Clear in Fig. 1, when when stack direction is seen, the gap Y of the most close first internal electrode group in the gap X of the most close second internal electrode group of the gap 26b of the first internal electrode group and the gap 28 of the second internal electrode group is arranged on identical position.
This means, be used for determining that the first internal electrode 24b of gap X can make identical shape with the 3rd internal electrode 27a and the 4th internal electrode 27b that are used for definite gap Y with the second internal electrode 25b.In this preferred embodiment, because when a side of stack direction is seen, identical at the internal electrode figure on the upper surface of thermal resistor layer 22 with internal electrode figure on the lower surface, and gap X and Y are in identical position, so can make more accurate fine setting to resistance value.This is because of the inner end of internal electrode 24b that determines gap X in the first internal electrode group and 25b and determines that in the second internal electrode group the third and fourth internal electrode 27a of gap Y and the inner end of 27b are unified on the position, therefore current path becomes unified, and can reduce the variation of resistance value more.
Therefore, when the first internal electrode group and the second internal electrode group be arranged in parallel and above-mentioned gap when being arranged in the internal electrode of the first internal electrode group and the second internal electrode group at stack direction close to each otherly, it is desirable to, when when stack direction is seen, in identical position the gap is set, that is, the gap is arranged to be positioned at each other top.
But, in this preferred embodiment, do not need with the second internal electrode group be placed on abreast the top of the first electrode group or below, and the first internal electrode group can be arranged on the part that the second internal electrode group is provided.
Fig. 2 is the profile of second preferred embodiment of lamination-type resistance element.
Lamination-type resistance element 31 preferably includes lamination sintered body 33, and in the lamination sintered body, a plurality of NTC temperature-sensitive element layers 32 are by lamination and integral sintered.The first internal electrode 34a and the second internal electrode 34b are included in the lamination sintered body 33.In addition, internal electrode 36 is arranged in via thermal resistor layer 32 towards the first internal electrode 34a and the second internal electrode 34b.Outer electrode 39 and 40 is arranged on the outer surface of lamination sintered body 33, specifically, and at its two ends.
To be arranged at grade toward each other in lamination sintered body 33 with a end as the end of the first internal electrode 34a that separates internal electrode, and between them, have gap 35 as the second internal electrode 34b that separates internal electrode.The other end of the first internal electrode 34a and outer electrode 39 are electrically connected, and the other end of the second internal electrode 34b and outer electrode 40 are electrically connected.
In addition, in the first internal electrode group C, the first internal electrode 34a and the second internal electrode 34b and not connecting-type electrode 36 be positioned at each other top via thermal resistor layer.That is, produced and had internal electrode 34a, 34b and the resistance unit of connecting-type electrode 36 not.One end of resistance unit is connected with first outer electrode 39, and the other end is connected with second outer electrode 40.
In addition, equally in this preferred embodiment, it is enough making at least two internal electrodes be arranged on each other top and have thermal resistor layer between them, that is, the quantity that is clipped in the ceramic electrical resistance layer between the internal electrode be one or more and quantity not to be subjected to specific limited be enough.
Lamination-type thermistor 31 also comprises following structure.That is, the second internal electrode group D is arranged on the inside of lamination sintered body 33 with the close first electrode group C.
The second internal electrode group D comprises following structure.The 3rd internal electrode 37a and the 4th internal electrode 37b are included in the inside of lamination sintered body 33, in lamination sintered body 33 lamination and integrally sintering a plurality of thermal resistor layer 32.The end of the end of the 3rd internal electrode 37a and the 4th internal electrode 37b and has gap 38 at grade toward each other between them in lamination sintered body 33.The other end of the 3rd internal electrode 37a and outer electrode 39 are electrically connected, and the other end of the 4th internal electrode 37b and outer electrode 40 are electrically connected.
Arrange on the identical position of the stack direction of lamination sintered body 33 interior a plurality of thermal resistor layer 32 in the gap 38 of the second internal electrode group D.Gap 38 shown in Figure 2 is arranged in from the distance at lamination sintered body 33 two ends basic identical, that is, and and in the middle of being located substantially on.In addition, gap 38 preferred arrangement are when position identical with the gap 35 of the first internal electrode group C when the direction of thermal resistor layer 32 is seen, more particularly, be arranged in the same position of closure at the two ends of lamination sintered body 33, but gap 38 also can be arranged in diverse location.In addition, in the second internal electrode group D shown in Figure 2, although the 3rd internal electrode 37a and the 4th internal electrode 37b are provided with three layers, can come the quantity of design level according to the quantity of target resistance values.In addition, in Fig. 2, although preferably the thickness of the NTC thermal resistor layer 32a that exists between the first internal electrode group C and the second internal electrode group D is greater than the thickness of NTC thermal resistor layer 32, their thickness also can be identical.
In lamination-type resistance element, determine resistance value in the following manner according to second preferred embodiment.Promptly, in the first internal electrode group C, resistance value is by the size in the gap 35 between the first internal electrode 34a and the second internal electrode 34b, the first internal electrode 34a and the not overlapping region of connecting-type internal electrode 36 and the interval of the two and the second internal electrode 34b and the overlapping region of connecting-type internal electrode 36 and the interval of the two are not determined.In addition, in the second internal electrode group D, resistance value is determined by the size in the gap 38 between the 3rd internal electrode 37a and the 4th internal electrode 37b.Therefore, the resistance value of lamination-type resistance element becomes the combined resistance value of the resistance value of the first internal electrode group C and the second internal electrode group D.In the second internal electrode group D, although determine resistance value by the size in gap 38, a plurality of gaps 38 are in along the adjacent position of the stack direction of thermal resistor layer and are arranged in identical position, and less by the definite resistance value of the size in gap 38.Therefore, utilize the second internal electrode group D might finely tune the resistance value of whole lamination-type resistance element.
Fig. 3 is the profile of the 3rd preferred embodiment of lamination-type resistance element.
In lamination-type resistance element shown in Figure 3 41, first internal electrode 44 and second internal electrode 45 are arranged on lamination sintered body 43 inside, and in lamination sintered body 45, a plurality of NTC thermal resistor layer 12 are by lamination and integral sintered.Outer electrode 49 and 50 is arranged on outer surface, more particularly, is arranged on the two end portions of lamination sintered body 43.
The end that first internal electrode 44 and second internal electrode 45 are arranged to each electrode may extend into an end of lamination sintered body 43.The other end of first internal electrode 44 and outer electrode 49 are electrically connected, and the other end of second internal electrode 44 and outer electrode 50 are electrically connected.First internal electrode 44 and 45 structure are corresponding to the first internal electrode group E of this preferred embodiment.
In this preferred embodiment, in the first internal electrode group E, a plurality of internal electrodes 44 and 45 are arranged to be positioned at each other top via the thermal resistor layer as the ceramic electrical resistance layer.Can produce the resistance unit with a plurality of internal electrodes 44 and 45, an end of resistance unit is connected to outer electrode 49 and the other end is connected to outer electrode 50.
In addition, determine above resistance unit, utilize thermal resistor layer between them to be arranged in the lamination quantity of the internal electrode on top each other to be not limited to four layers of Fig. 4.That is, the upper end of at least two internal electrodes being arranged to be positioned at each other via the thermal resistor layer between them is enough.That is, for obtaining resistance value, the quantity that is clipped in the ceramic electrical resistance layer between the internal electrode can be one or more.
Lamination-type thermistor 41 also comprises following structure.That is, in lamination sintered body 43, be provided with the second internal electrode group F near the first internal electrode group E.
The second internal electrode group F has following structure.The 3rd internal electrode 47a and the 4th internal electrode 47b are arranged on lamination sintered body 43 inside, and in lamination sintered body 43, a plurality of thermal resistor layer 42 are by lamination and integral sintered.The 3rd internal electrode 47a and the 4th internal electrode 47b are arranged in such a way, and promptly the end of the end of the 3rd internal electrode 47a and the 4th internal electrode 47b is faced on the same plane of lamination sintered body 43 mutually, and has gap 48 between them.The other end of the 3rd internal electrode 47a and outer electrode 49 are electrically connected, and the other end of the 4th internal electrode 47b and outer electrode 50 are electrically connected.
A plurality of gaps 48 of the second internal electrode group F are arranged in such a way in lamination sintered body 43, and promptly gap 48 is close to each other along the stack direction of a plurality of thermal resistor layer 42, and when when stack direction is seen, being in identical position.Gap 48 shown in Figure 3 is positioned adjacent to outer electrode 50.In addition, in the second internal electrode group F shown in Fig. 3, although the 3rd internal electrode 47a and the 4th internal electrode 47b are arranged to three layers, they are set to two-layer at least is enough.
In the lamination-type resistance element according to the 3rd preferred embodiment, resistance value is determined in the following manner.That is, in the first internal electrode group E, resistance value is determined by the overlapping region of first internal electrode 44 and second internal electrode 45 and the interval between first internal electrode 44 and 45.In addition, in the second internal electrode group F, resistance value is determined by the gap between the 3rd internal electrode 47a and the 4th internal electrode 47b 48.Therefore, the resistance value of lamination-type resistance element becomes the combined resistance value of the first electrode group E and the second internal electrode group F.In the second internal electrode group F, resistance value is determined by the size in gap 48.Gap 48 is placed with at the stack direction of thermal resistor layer 42 close to each other, and when when stack direction is seen, being in identical position.Less by the resistance value that the size in a plurality of gaps 48 provides.Therefore, the whole resistance value of utilizing the second internal electrode group F to finely tune lamination-type resistance element becomes possibility.
Next, more specifically describe, when using the lamination-type resistance element of this preferred embodiment, might the semifixed resistor value by the lamination quantity that increases or reduce the second internal electrode group.
Fig. 4 is the front sectional elevation according to the lamination-type resistance 51 of the modification example of the thermistor 31 of preferred embodiment shown in Figure 2.Lamination-type resistance 51 is identical with lamination-type resistance 31, except the first internal electrode 34a and the second internal electrode 34b that the superiors shown in Figure 2 are not set.Therefore, components identical is provided identical label, it is described in this omission.
For example, supposition now is in the design of Fig. 4, and the lamination-type thermistor 51 with resistance value of 47,000 Ω utilizes and uses the test of specific thermistor material to make.Yet especially when the resistance change of the thermistor material that will use, the resistance value of the lamination-type thermistor 51 that is obtained can change.For example, when the resistivity of thermistor material was higher, resistance value became than 47,000 Ω height.For example, when resistance value is approximately 47,734 Ω, consider that the second internal electrode group is enough with the logarithm increase by 1 of internal electrode, as shown in Figure 5.In this way, the electrode logarithm of third and fourth internal electrode by will being arranged at the first internal electrode group increases by 1, and resistance value can reduce about 4.0%.
In addition, become hour the lamination-type thermistor 51 that can obtain to have the resistance value lower in the resistivity of the thermistor material that will use than target resistance values.Promptly, when utilizing test to make lamination-type thermistor 51 shown in Figure 4 and resistance value becomes about 45, during 825 Ω, with the electrode logarithm that is arranged at the third and fourth internal electrode 37a of the first internal electrode group and 37b reduce 1 with form as shown in Figure 62 be enough.In this case, might increase by about 2.5% resistance value, the result might realize the target resistance values of 47,000 Ω.
As mentioned above, in the lamination-type resistance element of this preferred embodiment, it being understood that and to carry out the fine setting of resistance value by the electrode logarithm that increases or reduce third and fourth internal electrode that is arranged at the first internal electrode group.For example, when the quantity of electrode pair increases, can carry out very trickle adjusting, change about 0.5% such as resistance value to resistance value.Therefore, it being understood that, can carry out very trickle adjusting to resistance value in the scope of broad by changing the lamination quantity of electrode.
In each lamination-type resistance element of above preferred embodiment, show the example of NTC thermistor, but also lamination-type resistance element can be applied to the PTC thermistor.
Though above describing a plurality of preferred embodiment of the present invention, it being understood that under the situation that does not deviate from scope and spirit of the present invention variations and modifications are tangible to those skilled in the art.Therefore, the scope of this aspect is only determined by following claim.
Claims (9)
1. lamination-type resistance element comprises:
Have a plurality of ceramic electrical resistance layers and a plurality of internal electrode and be stacked in wherein lamination sintered body; And
Be arranged on first outer electrode and second outer electrode on the described lamination sintered body outer surface; Wherein
A plurality of described internal electrodes comprise a plurality of internal electrodes of first group and a plurality of internal electrodes of second group;
In described first group a plurality of internal electrodes each comprises resistance unit, at least two internal electrodes are configured to face one another via one in the described ceramic electrical resistance layer in described resistance unit, first end of described resistance unit and described first outer electrode are electrically connected, and second end and described second outer electrode are electrically connected; And
Each of described second group a plurality of internal electrodes comprises many to internal electrode, relative on first end of one of them electrode and the same plane of first end of another electrode in described lamination sintered body, and between two ends, has the gap, each an internal electrode and described first outer electrode to described electrode are electrically connected, and another internal electrode and described second outer electrode are electrically connected.
2. lamination-type resistance element as claimed in claim 1 is characterized in that, described second group a plurality of described gap is arranged in the described lamination sintered body along stack direction and is positioned at each other top.
3. lamination-type resistance element as claimed in claim 1, it is characterized in that, each described first group internal electrode comprise with described first outer electrode be electrically connected first separate internal electrode be electrically connected with described second outer electrode second separate internal electrode, and described first first end that separates internal electrode faces one another at grade with described second first end that separates internal electrode, and between them, have the gap, and
Every pair of internal electrode about the described second internal electrode group, when the internal electrode that is electrically connected with described first outer electrode constituted the 3rd internal electrode and constitutes the 4th internal electrode with another internal electrode that described second outer electrode is electrically connected, the most close described first group gap was arranged to be positioned at each other top along stack direction in a plurality of gaps in described first group a plurality of gaps between the most close described second group gap and described second group described third and fourth internal electrode.
4. lamination-type resistance element as claimed in claim 3 is characterized in that, manyly separates internal electrodes by lamination to described first and second, and when when a side of stack direction is seen, is arranged on different positions along the gap of the adjacent pairs of electrodes of stack direction.
5. lamination-type resistance element as claimed in claim 3 is characterized in that, described first group comprises that being arranged on described first and second via described ceramic electrical resistance layer separates the not connecting-type internal electrode on internal electrode top.
6. lamination-type resistance element as claimed in claim 1, it is characterized in that, each of described first group internal electrode comprises first internal electrode that is electrically connected with described first outer electrode and second internal electrode that is electrically connected with described second outer electrode, and first and second internal electrodes are arranged to be positioned at each other top via being arranged at ceramic layer between them.
7. cascade type resistive element comprises:
Have a plurality of ceramic electrical resistance layers and a plurality of internal electrode and be stacked in wherein lamination sintered body; And
Be arranged on first outer electrode and second outer electrode on the described lamination sintered body outer surface; Wherein
Described internal electrode comprises a plurality of internal electrodes of first group and a plurality of internal electrodes of second group;
Each of described first group a plurality of internal electrodes comprises first internal electrode and second internal electrode, first end of one of them electrode is aligned on the same plane of first end in described lamination sintered body with another electrode relative, between them, has the gap, and second end is connected with described second outer electrode with described first outer electrode respectively, and the adjacent segment between described first and second internal electrodes is arranged in diverse location when the stack direction of described lamination sintered body is seen along the stack direction of described lamination sintered body; And
Each of described second group a plurality of internal electrodes comprises the 3rd internal electrode and the 4th internal electrode, relative on first end of wherein said the 3rd internal electrode and the same plane of first end of described the 4th internal electrode in described lamination sintered body, between them, has the gap, and second end is connected with described second outer electrode with described first outer electrode respectively, and the gap between described the 3rd internal electrode and described the 4th internal electrode is in identical position along the stack direction of described lamination sintered body.
8. cascade type resistive element comprises:
Have a plurality of ceramic electrical resistance layers and a plurality of internal electrode and be stacked in wherein lamination sintered body; And
Be arranged on first outer electrode and second outer electrode on the described lamination sintered body outer surface; Wherein
Described internal electrode comprises a plurality of internal electrodes of first group and a plurality of internal electrodes of second group;
Each of described first group a plurality of internal electrodes comprises first internal electrode and second internal electrode, first end of wherein said first internal electrode is aligned on the same plane of first end in described lamination sintered body with described second internal electrode relative, between them, has the gap, and second end is connected with described second outer electrode with described first outer electrode respectively, the connecting-type internal electrode is not arranged in the top that is positioned at described first internal electrode and described second internal electrode along the stack direction of described lamination sintered body via the ceramic electrical resistance layer, and is not connected with described first and second outer electrodes; And
Each of described second group a plurality of internal electrodes comprises the 3rd internal electrode and the 4th internal electrode, wherein relative on the same plane of first end in described lamination sintered body of first end of the 3rd internal electrode and described the 4th internal electrode, between them, has the gap, and second end is connected with described second outer electrode with described first outer electrode respectively, and the gap between described the 3rd internal electrode and described the 4th internal electrode is in identical position along the stack direction of described lamination sintered body.
9. cascade type resistive element comprises:
Have a plurality of ceramic electrical resistance layers and a plurality of internal electrode and be stacked in wherein lamination sintered body; And
Be arranged on first outer electrode and second outer electrode on the described lamination sintered body outer surface; Wherein
Described internal electrode comprises a plurality of internal electrodes of first group and a plurality of internal electrodes of second group;
Each of described first group a plurality of internal electrodes comprises first internal electrode that is connected with described first outer electrode and second internal electrode that is connected with described second outer electrode, and they via described ceramic electrical resistance layer toward each other; And
Each of described second group a plurality of internal electrodes comprises the 3rd internal electrode and the 4th internal electrode, wherein relative on the same plane of first end in described lamination sintered body of first end of the 3rd internal electrode and the 4th internal electrode, between them, has the gap, and second end is connected with described second outer electrode with described first outer electrode respectively, and the gap between described the 3rd internal electrode and described the 4th internal electrode is in identical position along the stack direction of described lamination sintered body.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410349883.7A CN104091663B (en) | 2003-10-31 | 2004-10-28 | Lamination-type resistance element |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003372846 | 2003-10-31 | ||
JP372846/2003 | 2003-10-31 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410349883.7A Division CN104091663B (en) | 2003-10-31 | 2004-10-28 | Lamination-type resistance element |
Publications (1)
Publication Number | Publication Date |
---|---|
CN1875438A true CN1875438A (en) | 2006-12-06 |
Family
ID=34544055
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNA2004800320644A Pending CN1875438A (en) | 2003-10-31 | 2004-10-28 | Lamination-type resistance element |
CN201410349883.7A Active CN104091663B (en) | 2003-10-31 | 2004-10-28 | Lamination-type resistance element |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410349883.7A Active CN104091663B (en) | 2003-10-31 | 2004-10-28 | Lamination-type resistance element |
Country Status (6)
Country | Link |
---|---|
US (1) | US7696677B2 (en) |
EP (1) | EP1679723B1 (en) |
JP (1) | JP4419960B2 (en) |
KR (1) | KR100803916B1 (en) |
CN (2) | CN1875438A (en) |
WO (1) | WO2005043556A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8134447B2 (en) | 2007-09-28 | 2012-03-13 | Epcos Ag | Electrical multilayer component and method for producing an electrical multilayer component |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201029285A (en) * | 2009-01-16 | 2010-08-01 | Inpaq Technology Co Ltd | Over-current protection device and manufacturing method thereof |
DE102009010212B4 (en) * | 2009-02-23 | 2017-12-07 | Epcos Ag | Electrical multilayer component |
DE102009025716A1 (en) * | 2009-06-20 | 2010-12-30 | Forschungszentrum Jülich GmbH | Measuring instrument, electrical resistance elements and measuring system for measuring time-varying magnetic fields or field gradients |
DE102010044856A1 (en) * | 2010-09-09 | 2012-03-15 | Epcos Ag | Resistor component and method for producing a resistance component |
DE102011014965B4 (en) * | 2011-03-24 | 2014-11-13 | Epcos Ag | Electrical multilayer component |
KR101288151B1 (en) * | 2011-11-25 | 2013-07-19 | 삼성전기주식회사 | Multi-Layered Ceramic Electronic Component and Manufacturing Method of the Same |
DE102014107450A1 (en) * | 2014-05-27 | 2015-12-03 | Epcos Ag | Electronic component |
WO2016072154A1 (en) * | 2014-11-07 | 2016-05-12 | 株式会社村田製作所 | Thermistor element |
DE102015116278A1 (en) * | 2015-09-25 | 2017-03-30 | Epcos Ag | Overvoltage protection device and method for producing an overvoltage protection device |
EP3824482A4 (en) * | 2018-07-18 | 2022-06-01 | Hubbell Incorporated | Voltage-dependent resistor device for protecting a plurality of conductors against a power surge |
WO2020244972A1 (en) * | 2019-06-03 | 2020-12-10 | Tdk Electronics Ag | Component and use of a component |
JP2021057556A (en) * | 2019-10-02 | 2021-04-08 | Tdk株式会社 | NTC thermistor element |
CN112951533B (en) * | 2019-12-10 | 2022-08-23 | 广州创天电子科技有限公司 | Preparation method of high-voltage piezoresistor and high-voltage piezoresistor |
JP7322793B2 (en) * | 2020-04-16 | 2023-08-08 | Tdk株式会社 | Chip varistor manufacturing method and chip varistor |
Family Cites Families (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6466903A (en) * | 1987-09-07 | 1989-03-13 | Murata Manufacturing Co | Semiconductor ceramic having positive resistance temperature characteristic |
DE3930000A1 (en) * | 1988-09-08 | 1990-03-15 | Murata Manufacturing Co | VARISTOR IN LAYER DESIGN |
JPH02260605A (en) | 1989-03-31 | 1990-10-23 | Murata Mfg Co Ltd | Lamination type varistor |
JP2888020B2 (en) | 1992-02-27 | 1999-05-10 | 株式会社村田製作所 | Negative multilayer thermistor |
JPH0634201A (en) | 1992-07-17 | 1994-02-08 | Matsushita Electric Ind Co Ltd | Generating apparatus of warm air |
JP3393524B2 (en) * | 1997-03-04 | 2003-04-07 | 株式会社村田製作所 | NTC thermistor element |
JPH10270207A (en) * | 1997-03-27 | 1998-10-09 | Matsushita Electric Ind Co Ltd | Multiple laminated thermistor |
JPH11111554A (en) | 1997-09-30 | 1999-04-23 | Murata Mfg Co Ltd | Laminated ceramic electrical parts and its trimming method |
JPH11191506A (en) * | 1997-12-25 | 1999-07-13 | Murata Mfg Co Ltd | Laminated varistor |
TW412755B (en) * | 1998-02-10 | 2000-11-21 | Murata Manufacturing Co | Resistor elements and methods of producing same |
US6236302B1 (en) * | 1998-03-05 | 2001-05-22 | Bourns, Inc. | Multilayer conductive polymer device and method of manufacturing same |
US6242997B1 (en) * | 1998-03-05 | 2001-06-05 | Bourns, Inc. | Conductive polymer device and method of manufacturing same |
JP2000188205A (en) * | 1998-10-16 | 2000-07-04 | Matsushita Electric Ind Co Ltd | Chip-type ptc thermistor |
JP2000124008A (en) | 1998-10-21 | 2000-04-28 | Tdk Corp | Composite chip thermistor electronic component and its manufacture |
TW432731B (en) * | 1998-12-01 | 2001-05-01 | Murata Manufacturing Co | Multilayer piezoelectric part |
JP3440883B2 (en) * | 1999-06-10 | 2003-08-25 | 株式会社村田製作所 | Chip type negative characteristic thermistor |
JP2001035707A (en) | 1999-07-26 | 2001-02-09 | Tdk Corp | Laminated chip varistor |
JP2001118731A (en) * | 1999-10-19 | 2001-04-27 | Murata Mfg Co Ltd | Chip composite electronic component and its manufacturing method |
JP2001237107A (en) * | 2000-02-22 | 2001-08-31 | Koa Corp | Laminated chip thermistor |
KR100361310B1 (en) * | 2000-05-25 | 2002-11-18 | (주) 래트론 | Negative Temperature Coefficient Thermistor Device using Spinel Ferrite |
US6717506B2 (en) | 2000-11-02 | 2004-04-06 | Murata Manufacturing Co., Ltd. | Chip-type resistor element |
JP3829683B2 (en) * | 2000-11-02 | 2006-10-04 | 株式会社村田製作所 | Chip resistor |
JP2002252103A (en) | 2001-02-22 | 2002-09-06 | Murata Mfg Co Ltd | Negative temperature coefficient thermistor device and manufacturing method therefor |
DE10159451A1 (en) * | 2001-12-04 | 2003-06-26 | Epcos Ag | Electrical component with a negative temperature coefficient |
JP4135651B2 (en) * | 2003-03-26 | 2008-08-20 | 株式会社村田製作所 | Multilayer positive temperature coefficient thermistor |
JP4492216B2 (en) * | 2004-05-28 | 2010-06-30 | 株式会社村田製作所 | Multilayer positive temperature coefficient thermistor |
-
2004
- 2004-10-28 JP JP2005515155A patent/JP4419960B2/en active Active
- 2004-10-28 WO PCT/JP2004/016044 patent/WO2005043556A1/en active Application Filing
- 2004-10-28 KR KR20067008237A patent/KR100803916B1/en active IP Right Grant
- 2004-10-28 EP EP04793152.2A patent/EP1679723B1/en active Active
- 2004-10-28 US US10/595,232 patent/US7696677B2/en active Active
- 2004-10-28 CN CNA2004800320644A patent/CN1875438A/en active Pending
- 2004-10-28 CN CN201410349883.7A patent/CN104091663B/en active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8134447B2 (en) | 2007-09-28 | 2012-03-13 | Epcos Ag | Electrical multilayer component and method for producing an electrical multilayer component |
Also Published As
Publication number | Publication date |
---|---|
JPWO2005043556A1 (en) | 2007-11-29 |
CN104091663B (en) | 2019-06-25 |
KR20060069519A (en) | 2006-06-21 |
WO2005043556A1 (en) | 2005-05-12 |
KR100803916B1 (en) | 2008-02-15 |
CN104091663A (en) | 2014-10-08 |
EP1679723B1 (en) | 2017-09-06 |
EP1679723A1 (en) | 2006-07-12 |
US20060279172A1 (en) | 2006-12-14 |
EP1679723A4 (en) | 2009-05-06 |
US7696677B2 (en) | 2010-04-13 |
JP4419960B2 (en) | 2010-02-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN1875438A (en) | Lamination-type resistance element | |
CN1235336C (en) | Multi-layer LC composite element and mfg. method thereof | |
CN101034621A (en) | Multilayer capacitor and mounted structure thereof | |
CN101079347A (en) | Multilayer capacitor | |
CN1909125A (en) | Laminated electronic component | |
JP4299252B2 (en) | Multilayer capacitor | |
JP2006253371A (en) | Multi-terminal multilayer capacitor and its manufacturing method | |
CN101030476A (en) | An electronic component | |
CN1397965A (en) | Ceramic electronic device with multi-terminal and multiple layers | |
CN1612272A (en) | Multilayer capacitor | |
CN1661741A (en) | Multilayer capacitor | |
CN1659719A (en) | Method for the production of a monolithic multilayer actuator, monolithic multilayer actuator made of a piezoceramics or electrostrictive material, and external electrical contact for a monolithic mul | |
CN1841020A (en) | Angular velocity sensor | |
CN1906848A (en) | Package for piezoelectric oscillation element, and piezoelectric oscillator | |
CN1774965A (en) | Module component and method for manufacturing the same | |
CN1805087A (en) | Multilayer capacitor and method of adjusting equivalent series resistance of multilayer capacitor | |
CN1670875A (en) | Multilayer capacitor | |
CN1835136A (en) | Multilayer capacitor | |
CN1905099A (en) | Multilayer capacitor | |
CN103081033A (en) | Resistance component and method for producing a resistance component | |
US20180082793A1 (en) | Electronic Component | |
US11335501B2 (en) | Multilayer ceramic electronic component and method for producing the same | |
US20180226195A1 (en) | Multilayer capacitor, method for manufacturing the same, and electronic device using same | |
CN1815643A (en) | Laminated electronic component | |
CN1661732A (en) | Chip resister and its mfg. method |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C12 | Rejection of a patent application after its publication | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20061206 |