CN1231971C - 表面安装型片式半导体器件和制造方法 - Google Patents
表面安装型片式半导体器件和制造方法 Download PDFInfo
- Publication number
- CN1231971C CN1231971C CNB021051917A CN02105191A CN1231971C CN 1231971 C CN1231971 C CN 1231971C CN B021051917 A CNB021051917 A CN B021051917A CN 02105191 A CN02105191 A CN 02105191A CN 1231971 C CN1231971 C CN 1231971C
- Authority
- CN
- China
- Prior art keywords
- conductive
- welding disk
- semiconductor device
- chip
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/564—Details not otherwise provided for, e.g. protection against moisture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3157—Partial encapsulation or coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
Claims (21)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001051403A JP2002252318A (ja) | 2001-02-27 | 2001-02-27 | チップ型半導体装置 |
JP51403/2001 | 2001-02-27 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1372320A CN1372320A (zh) | 2002-10-02 |
CN1231971C true CN1231971C (zh) | 2005-12-14 |
Family
ID=18912191
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB021051917A Expired - Fee Related CN1231971C (zh) | 2001-02-27 | 2002-02-26 | 表面安装型片式半导体器件和制造方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US6608372B2 (zh) |
JP (1) | JP2002252318A (zh) |
KR (1) | KR20020070107A (zh) |
CN (1) | CN1231971C (zh) |
TW (1) | TW523892B (zh) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6885108B2 (en) * | 2003-03-18 | 2005-04-26 | Micron Technology, Inc. | Protective layers formed on semiconductor device components so as to reduce or eliminate the occurrence of delamination thereof and cracking therein |
US7294533B2 (en) * | 2003-06-30 | 2007-11-13 | Intel Corporation | Mold compound cap in a flip chip multi-matrix array package and process of making same |
JP2005347356A (ja) * | 2004-05-31 | 2005-12-15 | Sanyo Electric Co Ltd | 回路装置の製造方法 |
DE102005053842B4 (de) * | 2005-11-09 | 2008-02-07 | Infineon Technologies Ag | Halbleiterbauelement mit Verbindungselementen und Verfahren zur Herstellung desselben |
JP2008235837A (ja) * | 2007-03-23 | 2008-10-02 | Matsushita Electric Ind Co Ltd | 半導体装置及びその製造方法 |
CN102460694A (zh) * | 2009-06-19 | 2012-05-16 | 株式会社安川电机 | 电力变换装置 |
US9324677B2 (en) | 2011-04-04 | 2016-04-26 | Rohm Co., Ltd. | Semiconductor device and method for manufacturing semiconductor device |
US8790850B2 (en) * | 2012-03-01 | 2014-07-29 | Institute Of Nuclear Energy Research | Current collection apparatus and method of processing for a solid oxide fuel cell thereof |
US11189537B2 (en) * | 2012-03-21 | 2021-11-30 | Infineon Technologies Ag | Circuit package, an electronic circuit package, and methods for encapsulating an electronic circuit |
US9627338B2 (en) * | 2013-03-06 | 2017-04-18 | STATS ChipPAC Pte. Ltd. | Semiconductor device and method of forming ultra high density embedded semiconductor die package |
KR102207273B1 (ko) * | 2014-01-29 | 2021-01-25 | 삼성전기주식회사 | 패키지 기판 |
CN108934132B (zh) * | 2017-05-25 | 2021-08-06 | 法雷奥汽车内部控制(深圳)有限公司 | 印刷电路板组件及其封装方法和机动车辆 |
US10796976B2 (en) * | 2018-10-31 | 2020-10-06 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor device and method of forming the same |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2747634B2 (ja) | 1992-10-09 | 1998-05-06 | ローム株式会社 | 面実装型ダイオード |
JPH07169766A (ja) | 1993-12-15 | 1995-07-04 | Mitsubishi Electric Corp | 半導体装置およびその製造方法 |
JP3877401B2 (ja) | 1997-03-10 | 2007-02-07 | 三洋電機株式会社 | 半導体装置の製造方法 |
JP2915888B1 (ja) * | 1998-01-28 | 1999-07-05 | 日本特殊陶業株式会社 | 配線基板及びその製造方法 |
US6140155A (en) * | 1998-12-24 | 2000-10-31 | Casio Computer Co., Ltd. | Method of manufacturing semiconductor device using dry photoresist film |
JP3895884B2 (ja) | 1999-03-25 | 2007-03-22 | 三洋電機株式会社 | 半導体装置 |
JP3772066B2 (ja) * | 2000-03-09 | 2006-05-10 | 沖電気工業株式会社 | 半導体装置 |
JP3745213B2 (ja) * | 2000-09-27 | 2006-02-15 | 株式会社東芝 | 半導体装置及びその製造方法 |
-
2001
- 2001-02-27 JP JP2001051403A patent/JP2002252318A/ja active Pending
-
2002
- 2002-02-25 TW TW091103373A patent/TW523892B/zh not_active IP Right Cessation
- 2002-02-25 KR KR1020020009831A patent/KR20020070107A/ko not_active Application Discontinuation
- 2002-02-25 US US10/083,998 patent/US6608372B2/en not_active Expired - Fee Related
- 2002-02-26 CN CNB021051917A patent/CN1231971C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US20020117762A1 (en) | 2002-08-29 |
US6608372B2 (en) | 2003-08-19 |
JP2002252318A (ja) | 2002-09-06 |
CN1372320A (zh) | 2002-10-02 |
KR20020070107A (ko) | 2002-09-05 |
TW523892B (en) | 2003-03-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: NEC ELECTRONICS TAIWAN LTD. Free format text: FORMER OWNER: NIPPON ELECTRIC CO., LTD. Effective date: 20030410 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20030410 Address after: Kanagawa, Japan Applicant after: NEC Corp. Address before: Tokyo, Japan Applicant before: NEC Corp. |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20051214 Termination date: 20100226 |