CN116525488B - Straight write charging device for wafer channel - Google Patents
Straight write charging device for wafer channel Download PDFInfo
- Publication number
- CN116525488B CN116525488B CN202310468642.3A CN202310468642A CN116525488B CN 116525488 B CN116525488 B CN 116525488B CN 202310468642 A CN202310468642 A CN 202310468642A CN 116525488 B CN116525488 B CN 116525488B
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- feeding
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- control rod
- assembly
- frame body
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- 239000000463 material Substances 0.000 claims abstract description 20
- 230000000149 penetrating effect Effects 0.000 claims abstract description 4
- 238000007789 sealing Methods 0.000 claims description 28
- 239000004809 Teflon Substances 0.000 claims description 4
- 229920006362 Teflon® Polymers 0.000 claims description 4
- 238000007599 discharging Methods 0.000 claims description 3
- 238000001125 extrusion Methods 0.000 claims description 3
- 230000003746 surface roughness Effects 0.000 claims description 3
- 238000003754 machining Methods 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 238000007517 polishing process Methods 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 3
- 229910052814 silicon oxide Inorganic materials 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005429 filling process Methods 0.000 description 1
- 229920002457 flexible plastic Polymers 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Coating Apparatus (AREA)
Abstract
The invention discloses a straight write filling device for a wafer channel, which belongs to the technical field of wafer channel filling and comprises a frame body, wherein an eccentric rotating assembly is vertically arranged on the side wall of the frame body, an elastic flow passage control rod is vertically arranged at the lower end of the frame body in a penetrating manner, the elastic flow passage control rod is vertical to the axis of the eccentric rotating assembly, a feeding assembly is arranged below the frame body, a feeding flow passage is arranged in the feeding assembly, a feeding assembly communicated with the inside of the feeding flow passage is arranged on the side wall of the feeding assembly, the lower end of the elastic flow passage control rod is positioned in the feeding flow passage, and the upper end of the elastic flow passage control rod is in contact with the output end of the eccentric rotating assembly; when the eccentric rotating assembly works, the elastic flow passage control rod is pressed to control the opening and closing of the feeding flow passage to feed materials. The straight write filling device for the wafer channel reduces the usage amount of filling materials, reduces the area required to be polished, reduces the processing difficulty, improves the production efficiency and saves the production cost.
Description
Technical Field
The invention belongs to the technical field of wafer channel filling, and particularly relates to a straight write filling device for a wafer channel.
Background
In the semiconductor industry, it is often necessary to fill the wafer trench, and a common fill material is silicon oxide to form a trench isolation structure, a pre-metal dielectric layer, or an inter-metal dielectric layer. The channel filling is carried out by PECVD plasma enhanced chemical vapor deposition technology commonly adopted in the industry at present, and the mode is that the whole surface is filled indiscriminately, so that a layer of silicon oxide film is formed on the whole surface of the wafer, then the subsequent polishing is carried out, and the layer of film above the channel is removed, so that a silicon oxide isolation structure in the channel is left.
However, the PECVD method has low utilization rate of filling materials, wastes materials, is time-consuming in the subsequent polishing process, has high polishing precision requirement, and increases the processing difficulty.
Disclosure of Invention
Aiming at the defects of the prior art, the invention aims to provide a straight write filling device for a wafer channel, which aims to solve the problems of waste of filling materials, time consumption of a subsequent polishing process and high processing difficulty in the prior art when the wafer channel is filled.
In order to achieve the above purpose, the invention provides a straight write filling device for a wafer channel, which comprises a frame body, wherein an eccentric rotating assembly is vertically arranged on the side wall of the frame body, an elastic flow passage control rod is vertically arranged at the lower end of the frame body in a penetrating manner, the elastic flow passage control rod is vertical to the axis of the eccentric rotating assembly, a feeding assembly is arranged below the frame body, a feeding flow passage is arranged in the feeding assembly, a feeding assembly communicated with the inside of the feeding flow passage is arranged on the side wall of the feeding assembly, the lower end of the elastic flow passage control rod is positioned in the feeding flow passage, and the upper end of the elastic flow passage control rod is in contact with the output end of the eccentric rotating assembly; when the eccentric rotating assembly works, the elastic flow passage control rod is pressed to control the opening and closing of the feeding flow passage to feed materials.
Still further, the elastic flow passage control rod comprises a control rod capable of axially moving, a spring is sleeved on the control rod, a limit nut is propped against the upper end of the spring, and the lower end of the spring is propped against the feeding assembly.
Still further, the feed subassembly is including being used for with the flange that the support body is fixed, flange below is equipped with the feed body in proper order, sealing block and can dismantle the syringe needle fixer, the feed body the sealing block can dismantle between the syringe needle fixer the inner wall with the control lever outer wall cooperate and form the feed runner, the feed body is external still to be equipped with the locking ring, the locking ring be used for with sealing block can dismantle syringe needle fixer extrusion is fixed, can dismantle syringe needle fixer below and be equipped with the miniature syringe needle that is used for the ejection of compact.
Still further, be equipped with on the flange and be used for the oilless bush of control lever axial displacement direction, the flange with extrude between the feed body be equipped with be used for with the sealing washer of control lever outer wall seal, the sealing piece lower extreme is equipped with first conical surface, it is equipped with the second conical surface to dismantle syringe needle fixer upper end, the control lever lower extreme is equipped with the diamond-shaped end, the diamond-shaped end is located between first inclined plane and the second conical surface.
Still further, the eccentric rotating assembly comprises a motor, an eccentric shaft is sleeved at the output end of the motor, an annular groove is formed in the eccentric shaft, a rotary switch is arranged in the annular groove, and the outer wall of the rotary switch is contacted with the upper end of the elastic flow passage control rod.
Still further, the eccentric shaft tip still is equipped with the signal disc, still be equipped with the inductor on the support body lateral wall, the inductor with the signal disc cooperation detects rotary switch rotation position.
Furthermore, the rotary switch is a bearing, the bearing is limited by adopting an elastic retainer ring, and the outer wall of the bearing is contacted with the upper end of the elastic flow passage control rod.
Still further, offer on the feed body with the feed inlet of feed runner intercommunication, the charging assembly is including the filling tube, the filling tube front end cover be equipped with the feed connector that the feed inlet corresponds, still overlap on the feed connector be equipped with be used for with the teflon gasket of feed inlet installation location.
Furthermore, the machining precision error of the control rod is smaller than 1um, the surface roughness is smaller than 0.8, and the feeding flow channel is a micron flow channel.
Further, the aperture of the micro needle is 1um-10um.
In general, the above technical solutions conceived by the present invention have the following beneficial effects compared with the prior art:
(1) According to the straight write filling device for the wafer channel, provided by the invention, the elastic flow channel control rod is pressed by the eccentric rotating component to feed the opening and closing of the control feeding flow channel, the whole surface of the wafer is not required to be filled indiscriminately, the filling material is directly filled into the wafer channel, the using amount of the filling material is greatly reduced, meanwhile, the channel is only filled, the area required to be polished is also greatly reduced in the subsequent polishing process, the processing difficulty is reduced, the production efficiency is improved, and the production cost is saved.
(2) In addition, the sealing block and the detachable needle head fixer are fixed by adopting the extrusion of the locking ring, so that the sealing block has a good sealing effect on the feeding flow channel and prevents leakage of materials; the rotary switch can finish high-speed rotation under the drive of the motor through the eccentric shaft, and can drive the control rod to realize high-frequency opening and closing of the feeding flow channel, so that the requirement of high-frequency dotting in the wafer channel filling process is met.
Drawings
FIG. 1 is a schematic diagram of a wafer trench alignment write charging apparatus according to the present invention;
FIG. 2 is a side view of a wafer trench straight write charging apparatus provided in the present invention;
FIG. 3 is an exploded view of a wafer trench straight write charging apparatus provided in the present invention;
FIG. 4 is a cross-sectional view of a wafer trench straight write charging apparatus provided in the present invention;
Fig. 5 is a cross-sectional view of another view of a wafer trench straight write charging apparatus provided by the present invention.
The corresponding structure of each numerical mark in the attached drawings is as follows: 1-frame body, 11-inductor, 12-connecting piece, 2-eccentric rotating component, 21-motor, 22-eccentric shaft, 23-rotary switch, 24-signal panel, 25-circlip, 3-elastic flow channel control rod, 31-control rod, 311-diamond end, 32-spring, 33-limit nut, 4-feeding component, 4 a-feeding flow channel, 41-connecting flange, 411-oilless bushing, 412-sealing ring, 42-feeding body, 421-feeding hole, 43-sealing block, 431-first conical surface, 44-detachable needle fixer, 441-second conical surface, 45-locking ring, 46-miniature needle, 5-feeding component, 51-feeding pipe, 52-feeding connector and 53-Teflon gasket.
Detailed Description
The present invention will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present invention more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
Referring to fig. 1 to 5, the present invention provides a straight write filling device for a wafer trench, which is used for directly filling the wafer trench, so as to save filling materials, reduce the time of subsequent polishing processes, improve the production efficiency, and reduce the production cost.
Specifically, referring to fig. 1, the straight write filling device of the wafer channel of the invention comprises a frame body 1, wherein the side wall of the frame body 1 is vertically provided with an eccentric rotating assembly 2, the lower end of the frame body 1 is vertically provided with an elastic flow passage control rod 3 in a penetrating way, the elastic flow passage control rod 3 is vertical to the axis of the eccentric rotating assembly 2, a feeding assembly 4 is arranged below the frame body 1, a feeding flow passage 4a is arranged in the feeding assembly 4, the side wall of the feeding assembly 4 is provided with a feeding assembly 5 communicated with the inside of the feeding flow passage 4a, the lower end of the elastic flow passage control rod 3 is positioned in the feeding flow passage 4a, and the upper end of the elastic flow passage control rod is contacted with the output end of the eccentric rotating assembly 2; wherein, charging assembly 5 is used for connecting the outside charging container that provides filling material, and charging container is impressed filling material into charging assembly 5 through the mode of control atmospheric pressure, because charging assembly 5 and feed runner 4a intercommunication, during the eccentric rotary assembly 2 during operation, presses elasticity runner control lever 3, controls the switching of feed runner 4a and supplies.
Further, referring to fig. 3 to 5, the eccentric rotary assembly 2 includes a motor 21, an output end of the motor 21 is sleeved with an eccentric shaft 22, as shown in fig. 3, the eccentric shaft 22 is provided with a clamping part for being fixedly mounted with a motor shaft, and when the clamping part is locked, an axis of the eccentric shaft 22 is not coaxial with an axis of the output end of the motor, namely, is eccentric; the eccentric shaft 22 is provided with an annular groove, a rotary switch 23 is arranged in the annular groove, the outer wall of the rotary switch 23 is contacted with the upper end of the elastic flow passage control rod 3, in order to conveniently control the rotation angle of the eccentric shaft 21, the end part of the eccentric shaft 21 is also provided with a signal panel 24, the side wall of the frame body 1 is also provided with an inductor 11, the inductor 11 is arranged on the frame body 1 through a connecting plate 12, and the inductor 11 and the signal panel 24 are matched to detect the rotation position of the rotary switch 23; in some embodiments, in order to simplify the processing of the rotary switch 23, a standard component is directly selected, the rotary switch 23 is a bearing, the bearing is limited by adopting a circlip 25 for installation, and the outer wall of the bearing is contacted with the upper end of the elastic flow passage control rod 3.
In some embodiments, the elastic flow channel control rod 3 comprises a control rod 31 capable of moving axially, a spring 32 is sleeved on the control rod 31, as shown in fig. 3, preferably, in the embodiment, the spring 32 is a rectangular spring, a limit nut 33 is abutted against the upper end of the spring 32, and the lower end of the spring 33 is abutted against the feeding assembly 4.
In some embodiments, the feeding component 4 includes a connection flange 41 for fixing with the frame 1, a feeding body 42, a sealing block 43 and a detachable needle holder 44 are sequentially disposed below the connection flange 41, wherein the sealing block 43 is made of a flexible plastic with low hardness, a feeding flow channel 4a is formed by matching between the inner wall of the feeding body 42, the sealing block 43 and the detachable needle holder 44 and the outer wall of the control rod 31, the feeding flow channel 4a is a micro flow channel, in order to reduce the flow resistance of the filling material in the feeding flow channel 4a, reduce the accumulation caused by the wall hanging phenomenon of the filling material, and the processing precision error of the control rod 31 is less than 1um, and the surface roughness is less than 0.8.
For convenient locking and fixing the sealing block 43 and the detachable needle head fixer 44, the tightness of the feeding flow channel 4a is ensured, a locking ring 45 is further arranged outside the feeding body 42, the feeding lifter 42 and the locking ring 45 are in threaded connection, the locking ring 45 is used for extruding and fixing the sealing block 43 and the detachable needle head fixer 44, and for convenient discharging, a miniature needle head 46 for discharging is arranged below the detachable needle head fixer 44.
Further, in order to facilitate guiding the control rod during axial movement, an oilless bushing 411 is provided on the connection flange 41, and further, in order to improve the sealing effect between the feeding assembly 4 and the control rod 31, a sealing ring 412 for sealing with the outer wall of the control rod 31 is extruded between the connection flange 41 and the feeding body 42.
In order to facilitate opening and closing of the feed flow channel 4a, referring to fig. 4 and 5, a first conical surface 431 is provided at the lower end of the sealing block 43, a second conical surface 441 is provided at the upper end of the detachable needle holder 44, a diamond-shaped end 311 is provided at the lower end of the control rod 31, the diamond-shaped end 311 is located between the first conical surface 431 and the second conical surface 441, when the feed flow channel 4a is closed, the upper end surface of the diamond-shaped end 311 is attached to the first conical surface 431 for sealing, when the feed flow channel 4a is opened, the control rod 31 is pressed by the rotary switch 23, the upper end surface of the diamond-shaped end 311 is separated from the first conical surface 431 for contact, the filling material is discharged through the micro needle 46, and the aperture of the micro needle 46 is 1um-10um.
Further, for convenient feeding, a feeding hole 421 communicated with the feeding flow channel 4a is formed in the feeding body 42, the feeding assembly 5 comprises a feeding pipe 51, the feeding pipe 51 is connected with an external feeding container, a feeding connector 52 corresponding to the feeding hole 421 is sleeved at the front end of the feeding pipe 51, and a teflon gasket 53 used for being installed and positioned with the feeding hole 421 is further sleeved on the feeding connector 52.
When the straight write filling device of the wafer channel provided by the invention is used, filling materials are pressed into a micron-sized feeding flow passage through a feeding container in an air pressure mode, after the feeding flow passage is filled with the filling materials, a motor controls a rotary switch to rotate, after a sensor detects that the rotary switch is in a zero position, the motor controls the rotary switch to rotate 180 degrees, so that a control rod is pressed down, a diamond-shaped end at the lower end of the control rod is separated from a part tightly contacted with a sealing block to form a micron-sized flow passage, the filling materials flow to a detachable needle head fixer through the flow passage under the pushing of air pressure and then flow to a micro needle head, the needle head tip is directly written into a micron-sized straight line by matching with a precise air pressure control and the micron-sized needle head, when the feeding flow passage needs to be stopped, the motor controls the rotary cam switch to rotate 180 degrees, and the control rod is lifted under the action of a spring, so that the diamond-shaped end at the lower end of the control rod is tightly contacted with the sealing block to close the feeding flow passage, and the direct writing process is stopped rapidly.
The rotary switch can rotate at high speed under the drive of the motor through the eccentric shaft, and can drive the control rod to realize high-frequency opening and closing of the feeding flow channel, so that the requirement of high-frequency dotting in the process of filling the wafer channel is met.
It will be readily appreciated by those skilled in the art that the foregoing description is merely a preferred embodiment of the invention and is not intended to limit the invention, but any modifications, equivalents, improvements or alternatives falling within the spirit and principles of the invention are intended to be included within the scope of the invention.
Claims (5)
1. The utility model provides a straight write of wafer channel fills device which characterized in that: the automatic feeding device comprises a frame body (1), wherein an eccentric rotating assembly (2) is vertically arranged on the side wall of the frame body (1), an elastic flow passage control rod (3) is vertically arranged at the lower end of the frame body (1) in a penetrating mode, the elastic flow passage control rod (3) is perpendicular to the axis of the eccentric rotating assembly (2), a feeding assembly (4) is arranged below the frame body (1), a feeding flow passage (4 a) is arranged in the feeding assembly (4), a feeding assembly (5) communicated with the inside of the feeding flow passage (4 a) is arranged on the side wall of the feeding assembly (4), the lower end of the elastic flow passage control rod (3) is located in the feeding flow passage (4 a), and the upper end of the elastic flow passage control rod is in contact with the output end of the eccentric rotating assembly (2); when the eccentric rotating assembly (2) works, the elastic flow passage control rod (3) is pressed to control the opening and closing of the feeding flow passage (4 a) to feed materials;
The elastic flow passage control rod (3) comprises a control rod (31) capable of axially moving, a spring (32) is sleeved on the control rod (31), a limit nut (33) is propped against the upper end of the spring (32), and the lower end of the spring (33) is propped against the feeding component (4);
The feeding assembly (4) comprises a connecting flange (41) used for being fixed with the frame body (1), a feeding body (42), a sealing block (43) and a detachable needle head fixer (44) are sequentially arranged below the connecting flange (41), the feeding body (42), the sealing block (43), the inner wall of the detachable needle head fixer (44) and the outer wall of the control rod (31) are matched to form a feeding flow passage (4 a), a locking ring (45) is further arranged outside the feeding body (42), the locking ring (45) is used for fixing the sealing block (43) and the detachable needle head fixer (44) in an extrusion mode, and a miniature needle head (46) used for discharging is arranged below the detachable needle head fixer (44);
The oil-free bushing (411) for guiding the axial movement of the control rod (31) is arranged on the connecting flange (41), a sealing ring (412) for sealing the outer wall of the control rod (31) is arranged between the connecting flange (41) and the feeding body (42) in an extruding mode, a first conical surface (431) is arranged at the lower end of the sealing block (43), a second conical surface (441) is arranged at the upper end of the detachable needle head fixer (44), a diamond-shaped end (311) is arranged at the lower end of the control rod (31), and the diamond-shaped end (311) is located between the first inclined surface (431) and the second conical surface (441);
The eccentric rotating assembly (2) comprises a motor (21), an eccentric shaft (22) is sleeved at the output end of the motor (21), an annular groove is formed in the eccentric shaft (22), a rotary switch (23) is arranged in the annular groove, and the outer wall of the rotary switch (23) is in contact with the upper end of the elastic flow passage control rod (3);
The machining precision error of the control rod (31) is smaller than 1um, the surface roughness is smaller than 0.8, and the feeding flow channel is a micron flow channel.
2. The wafer trench direct write charging apparatus as defined in claim 1, wherein: the end part of the eccentric shaft (21) is also provided with a signal panel (24), the side wall of the frame body (1) is also provided with an inductor (11), and the inductor (11) and the signal panel (24) are matched to detect the rotating position of the rotary switch (23).
3. The wafer trench direct write charging apparatus as defined in claim 1, wherein: the rotary switch (23) is a bearing, the bearing is limited by adopting an elastic retainer ring (25), and the outer wall of the bearing is contacted with the upper end of the elastic flow passage control rod (3).
4. The wafer trench direct write charging apparatus as defined in claim 1, wherein: the feeding device is characterized in that a feeding hole (421) communicated with the feeding flow channel (4 a) is formed in the feeding body (42), the feeding assembly (5) comprises a feeding pipe (51), a feeding connector (52) corresponding to the feeding hole (421) is sleeved at the front end of the feeding pipe (51), and a Teflon gasket (53) used for being installed and positioned with the feeding hole (421) is further sleeved on the feeding connector (52).
5. The wafer trench direct write charging apparatus as defined in claim 1, wherein: the aperture of the micro needle (46) is 1um-10um.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310468642.3A CN116525488B (en) | 2023-04-26 | 2023-04-26 | Straight write charging device for wafer channel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310468642.3A CN116525488B (en) | 2023-04-26 | 2023-04-26 | Straight write charging device for wafer channel |
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| Publication Number | Publication Date |
|---|---|
| CN116525488A CN116525488A (en) | 2023-08-01 |
| CN116525488B true CN116525488B (en) | 2024-05-14 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202310468642.3A Active CN116525488B (en) | 2023-04-26 | 2023-04-26 | Straight write charging device for wafer channel |
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| Study on bubble defects in roll-to-roll UV imprinting process for micropyramid arrays II: Numerical study;Peng, Linfa Wu, Hao Yi, Peiyun Lai, Xinmin;JOURNAL OF VACCUM SCIENCE & TECHNOLOGY B;20160930;第051203卷;全文 * |
| 光生物芯片的激光微加工;孔延梅;;光机电信息;20100225(02);15-23 * |
| 纳米集成电路制造中的CMP;王海明;;电子工业专用设备;20180420(02);5-9, 61 * |
| 超薄芯片真空拾取与贴装工艺机理研究;徐洲龙;华中科技大学;20170716(第08期);全文 * |
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