CN115951769B - Heat abstractor for computer CPU - Google Patents
Heat abstractor for computer CPU Download PDFInfo
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- CN115951769B CN115951769B CN202310225030.1A CN202310225030A CN115951769B CN 115951769 B CN115951769 B CN 115951769B CN 202310225030 A CN202310225030 A CN 202310225030A CN 115951769 B CN115951769 B CN 115951769B
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- 239000004065 semiconductor Substances 0.000 claims abstract description 42
- 238000012546 transfer Methods 0.000 claims abstract description 37
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 32
- 229910052802 copper Inorganic materials 0.000 claims abstract description 32
- 239000010949 copper Substances 0.000 claims abstract description 32
- 230000017525 heat dissipation Effects 0.000 claims abstract description 29
- 238000002791 soaking Methods 0.000 claims abstract description 14
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 8
- 239000000110 cooling liquid Substances 0.000 claims description 6
- 238000005057 refrigeration Methods 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims description 3
- 238000005245 sintering Methods 0.000 claims description 3
- 238000013461 design Methods 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 23
- 238000001816 cooling Methods 0.000 description 22
- 239000000463 material Substances 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000001174 ascending effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005536 corrosion prevention Methods 0.000 description 1
- 238000012938 design process Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000035777 life prolongation Effects 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000000191 radiation effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a heat abstractor for a computer CPU, which relates to the field of computer heat dissipation and comprises a base, wherein a soaking plate is embedded at the bottom of the base, a plurality of heat transfer copper pipes penetrate through the soaking plate, a plurality of layers of heat radiating fins are sleeved on the plurality of heat transfer copper pipes, and a semiconductor refrigerating fin is arranged at the top of the base. According to the invention, the semiconductor refrigerating sheet is arranged on the top of the base, the second fan is arranged on the top of the semiconductor refrigerating sheet, the cold surface of the semiconductor refrigerating sheet is the base and the soaking plate is superposed with the refrigerating effect, so that the radiating effect of the CPU chip can be further improved, heat generated by the hot surface of the semiconductor refrigerating sheet is sucked out through the second fan and then is discharged upwards through a channel formed by superposing the radiating fins, air flow generated by the second fan cannot collide with air flow generated by the side fans of the radiating fins due to shielding of the convex edge, and the holes are streamline, so that the air flow generated by the side fans smoothly passes through gaps among the radiating fins, and the normal radiating of the radiating fins is ensured.
Description
Technical Field
The invention relates to the field of computer heat dissipation, in particular to a heat dissipation device for a computer CPU.
Background
The CPU is used as the core of an electronic computer, and comprises operation and control, the integration level is higher and higher, all operations in the computer are responsible for reading instructions, decoding the instructions and executing the instructions by the CPU, the core component has grown into a core area with high heat content Wen Gaodu along with the progress of technological development, and a great part of DIY players or friends loving hardware like overclocking, but the better the overclocking effect is, the higher the temperature heat of the CPU is, so the heat dissipation of the CPU is the necessary hardware for normally using the computer and carrying out overclocking, and the heat dissipation of the CPU is also a great requirement as the integration level of the CPU is dense and improved, and the heat dissipation of the CPU is a necessary thing.
The CPU radiator is divided into an air-cooled radiator, a heat pipe radiator, a water-cooled radiator and other products, the internationally most mainstream CPU radiator is the air-cooled radiator and the heat pipe radiator, and the radiator can generate different heat dissipation effects due to different design processes, different manufacturing processes and different packages, and can definitely bring better experience if the heat dissipation effect can be further improved on the basis of the existing CPU radiator.
Disclosure of Invention
Accordingly, an object of the present invention is to provide a heat dissipating device for a CPU of a computer, so as to solve the above-mentioned problems in the related art.
In order to achieve the above purpose, the present invention provides the following technical solutions: the heat dissipation device for the CPU of the computer comprises a base, wherein a soaking plate is embedded in the bottom of the base, a plurality of heat transfer copper pipes penetrate through the soaking plate, a plurality of layers of heat dissipation fins are sleeved on the plurality of heat transfer copper pipes, a first fan is installed on one side of each heat dissipation fin, an opening is formed in each heat dissipation fin, the top edge of each opening is provided with a convex edge, when the heat dissipation fins are overlapped together, the convex edges of the bottom layer heat dissipation fins can be abutted against the heat dissipation fins of the upper layer, so that a channel with the upper opening and the lower opening being peripherally closed is formed in the middle of the overlapped heat dissipation fin group, a semiconductor refrigerating fin is installed at the top of the base, the cold face of the semiconductor refrigerating fin is downward and is contacted with the base, the hot face of the semiconductor refrigerating fin is upward, a second fan is installed above the semiconductor refrigerating fin through a supporting plate, and air flow generated by the second fan can be discharged through the channel, and the bottom of the second fan is also provided with fins which are contacted with the semiconductor refrigerating fin.
By adopting the technical scheme, the cold face of the semiconductor refrigerating sheet is the base and the soaking plate has the superimposed refrigerating effect, the radiating effect of the CPU chip can be further improved, and the heat generated by the hot face of the semiconductor refrigerating sheet is scattered on the radiating fin and sucked out through the second fan and discharged through the channel generated by the radiating fin, and the air flow generated by the second fan can not collide with the air flow generated by the fan at the side face of the radiating fin due to the shielding of the convex edge.
The invention is further arranged that the bottom of the bottommost piece of the radiating fin is provided with an upward concave at the position of the opening.
Through adopting above-mentioned technical scheme, the sunken position can play the wind effect that gathers, and the air current accessible sunken guide that the second fan produced is in the passageway, guarantees the smoothness and smoothness of air current.
The invention is further arranged such that the openings are of streamlined configuration.
Through adopting above-mentioned technical scheme, the air current that first fan produced can utilize streamlined guide to walk around the shielding that the chimb formed in trompil position, can guarantee the circulation of air between the fin clearance.
The invention is further arranged that the two sides of the base are connected with mounting plates.
Through adopting above-mentioned technical scheme, install heat abstractor to the fixed knot of computer motherboard through the mounting panel on.
The invention is further characterized in that the base is also provided with a plurality of through grooves which penetrate through the base.
By adopting the technical scheme, the cold air generated by the semiconductor refrigerating sheet can permeate through the through groove to act on the vapor chamber, and the heat dissipation effect is better.
The invention further provides that the heat transfer copper pipe is of a hollow design, cooling liquid is filled in the heat transfer copper pipe, the internal pressure is pumped into negative pressure in the manufacturing process, and the two ends of the heat transfer copper pipe are sealed by using a sintering process.
By adopting the technical scheme, in use, the heat transfer copper pipe absorbs heat at the part contacting the heat source, so that the internal cooling liquid is evaporated into gas, the heat released from the condensing end from the gas to the top is changed into liquid, and the heat transfer copper pipe is internally and repeatedly evaporated and condensed in a circulating way, so that the effect of heat transfer is achieved.
The invention further provides that the contact part between the radiating fin and the heat transfer copper pipe is welded by solder paste.
By adopting the technical scheme, the solder paste is a heat conducting material, and the heat conducting effect is better.
The semiconductor refrigerating sheet is further arranged in such a way that the top of the supporting plate and the first fan are of an integrated structure, the bottom of the supporting plate is connected with the base through screws, and the semiconductor refrigerating sheet is also arranged on the base through screws.
Through adopting above-mentioned technical scheme, first fan, semiconductor refrigeration piece all can dismantle with the base and be connected, the later maintenance of being convenient for.
The invention further provides that the surface of the heat transfer copper pipe is subjected to nickel plating treatment.
By adopting the technical scheme, the nickel plating can realize the effects of preventing corrosion of the heat transfer copper pipe and prolonging the service life of the heat transfer copper pipe.
In summary, the invention has the following advantages:
according to the invention, the semiconductor refrigerating sheet is arranged on the top of the base, the bottom surface of the semiconductor refrigerating sheet is a cold surface and is in contact with the base, the top of the semiconductor refrigerating sheet is provided with the second fan, the bottom of the fan is provided with the radiating fin and is in contact with the hot surface of the semiconductor refrigerating sheet, the cold surface of the semiconductor refrigerating sheet is the base and the soaking plate, the refrigerating effect is further improved, the heat radiation effect of the CPU chip can be further improved, the heat generated by the hot surface of the semiconductor refrigerating sheet is scattered on the radiating fin and is sucked out through the second fan, then each layer of radiating sheet which is overlapped is provided with an opening, the edge of each opening is provided with a convex edge, after the radiating sheets are overlapped, the opening in the middle is overlapped to form a channel, the heat discharged by the second fan is discharged upwards through the channel, the air flow generated by the second fan cannot collide with the air flow generated by the side fans of the radiating sheets due to the shielding of the convex edge, and the opening is streamline, and the air flow generated by the side fans is ensured to smoothly pass through gaps among the radiating sheets.
Drawings
FIG. 1 is a schematic view of a first view structure according to the present invention;
FIG. 2 is a schematic view of a second view angle structure according to the present invention;
FIG. 3 is a schematic view of a portion of the structure of the present invention;
FIG. 4 is a schematic view of a monolithic heat sink according to the present invention;
FIG. 5 is a schematic diagram of a stacked heat sink according to the present invention;
FIG. 6 is a schematic view of the internal structure of the heat transfer copper tube of the present invention;
fig. 7 is a schematic structural view of the base of the present invention.
In the figure: 1. a base; 2. a soaking plate; 3. a heat transfer copper tube; 4. a heat sink; 5. a first fan; 6. opening holes; 7. a convex edge; 8. a channel; 9. a semiconductor refrigeration sheet; 10. a support plate; 11. a second fan; 12. a heat dissipating fin; 13. a through groove; 14. a cooling liquid; 15. a recess; 16. and (3) mounting a plate.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the invention.
Hereinafter, an embodiment of the present invention will be described in accordance with its entire structure.
The heat dissipating double-fuselage for CPU of the computer, as shown in figure 1-7, including the base 1, the bottom of the base 1 is imbedded with the soaking plate 2, pass several pieces of heat transfer copper pipe 3 in the soaking plate 2, cover several layers of cooling fins 4 on several pieces of heat transfer copper pipe 3, the cooling fin 4 increases the density through the multilayer stack, and then increase the interface with air, in order to raise radiating efficiency, the heat transfer copper pipe 3 contacts soaking plate 2 and cooling fin 4 at the same time to conduct heat, install the first fan 5 on one side of these cooling fins 4, blow through the first fan 5, make the air current pass the interval between the cooling fins 4, thus take away the heat on the cooling fin 4.
In order to further increase the heat dissipation efficiency, in this embodiment, the semiconductor cooling fin 9 is mounted on the top of the base 1, (when an N-type semiconductor material and a P-type semiconductor material are connected to form a couple, after a direct current is connected in this circuit, energy transfer can be generated, the current absorbs heat from the joint of the N-type element to the P-type element to become a cold end, the heat is released from the joint of the P-type element to the N-type element to become a hot end, the heat absorption and release sizes are determined by the magnitude of the current and the logarithm of the semiconductor material N, P), the cold surface of the semiconductor cooling fin 9 is downward in contact with the base 1, the cooling effect is superimposed for the base 1 and the soaking plate 2, the heat dissipation effect of the CPU chip can be further improved, when the cold and hot ends of the semiconductor cooling fin 9 reach a certain temperature difference, when the two heat transfer amounts are equal, a balance point can be reached, forward and reverse heat transfer counteracts each other, the temperature at this moment can not be changed continuously, the temperature can be reduced in a mode of reducing the temperature in order to become a hot end, the heat is realized, the heat absorption and the heat release is realized by adopting a mode, the heat absorption and the heat release effect is reduced, and the heat dissipation effect is realized by arranging a fan on the second side of the semiconductor cooling fin 4 on the base 1, and the semiconductor cooling fin 4, and the semiconductor cooling fin is provided with a second side 4, and the cooling fin is provided with a cooling fin, and the second side 4 is provided with a cooling fin, and the cooling effect is arranged on the cooling fin, and the cooling fin is further, and the cooling fin is placed on the side, and the cooling fin.
For this reason, in this embodiment, the convex edge 7 is disposed at the top edge of the opening 6, when the fins 4 are stacked together, the openings 6 are also stacked together, the convex edge 7 of the bottom fin 4 will abut against the fins 4 of the upper layer, the stacked layers of openings 6 cooperate with the convex edge 7 to form a channel 8 with a closed periphery with upper and lower openings in the middle of the stacked fin group, as shown in fig. 5, the air flow generated by the second fan 11 flows upward through the channel 8, and due to the closed structure formed by the convex edge 7, the air flow generated by the second fan 11 can only flow upward and does not spread between the fin groups from the side, so that the air flow generated by the first fan 5 does not collide with the bottom of the second fan 11, the heat generated by the semiconductor cooling fin 9 is spread onto the heat radiating fin 12, and then the heat is sucked away by the second fan 11 and discharged upward through the channel 8.
Further, the trompil 6 is streamline structure to the chimb 7 of formation also is streamline structure, and chimb 7 can be walked around in the air current that first fan 5 produced through streamline structure's guide, and chimb 7 can not form obvious shielding to the air current, guarantees that the air current between the fin 4 clearance circulates smoothly, thereby guarantees the radiating efficiency of fin 4, is located a slice of bottom fin 4's bottom forms ascending sunken 15 in trompil 6 position department, and sunken 15 can play the wind effect that gathers, and the air current that second fan 11 produced can pass through sunken 15 and guide to in the passageway 8.
The base 1 is also provided with a plurality of through grooves 13, the through grooves 13 penetrate through the base 1, and cold air generated by the semiconductor refrigerating sheet 9 can act on the vapor chamber 2 through the through grooves 13, so that the heat dissipation effect is better.
The heat transfer copper pipe 3 is hollow, the inside is filled with cooling liquid 14, the internal pressure is pumped to negative pressure in the manufacturing process, the two ends of the heat transfer copper pipe 3 are sealed by using a sintering process, in use, the heat transfer copper pipe 3 absorbs heat at the part contacted with a heat source, so that the internal cooling liquid 14 is evaporated into gas, the heat released by the condensation end at the top of the gas is changed into liquid again, the heat is circularly evaporated and condensed in the heat transfer copper pipe 3, the effect of heat transfer is further achieved, the contact part between the radiating fin 4 and the heat transfer copper pipe 3 is welded by using a heat conducting material such as solder paste, the heat conducting effect is better, the surface of the heat transfer copper pipe 3 is plated with nickel, and the effects of corrosion prevention and service life prolongation of the heat transfer copper pipe 3 can be achieved.
The top and the first fan 5 of backup pad 10 are integrated into one piece structure, and the bottom of backup pad 10 is connected with base 1 through the screw, semiconductor refrigeration piece 9 also passes through the screw to be installed on base 1, and first fan 5, semiconductor refrigeration piece 9 all can dismantle with base 1 and be connected, the later maintenance of being convenient for.
Although embodiments of the invention have been shown and described, the detailed description is to be construed as exemplary only and is not limiting of the invention as the particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples, and modifications, substitutions, variations, etc. may be made in the embodiments as desired by those skilled in the art without departing from the principles and spirit of the invention, provided that such modifications are within the scope of the appended claims.
Claims (9)
1. The utility model provides a heat abstractor for computer CPU, includes base (1), soaking plate (2) are embedded to the bottom of base (1), pass a plurality of heat transfer copper pipe (3) in soaking plate (2), the cover has a plurality of layers fin (4) on a plurality of heat transfer copper pipe (3), installs first fan (5) in one side of these fin (4), its characterized in that: the heat dissipation device comprises heat dissipation fins (4), wherein each layer of heat dissipation fins (4) is provided with an opening (6), the top edge of each opening (6) is provided with a convex edge (7), when the heat dissipation fins (4) are stacked together, the convex edges (7) of the heat dissipation fins (4) at the bottom layer can be propped against the heat dissipation fins (4) at the upper layer, so that a channel (8) with a closed upper opening periphery and a closed lower opening periphery is formed in the middle of the stacked heat dissipation fin group, a semiconductor refrigerating fin (9) is arranged at the top of each base (1), the cold face of each semiconductor refrigerating fin (9) is downward contacted with the base (1), the hot face of each semiconductor refrigerating fin is upward, a second fan (11) is arranged above the semiconductor refrigerating fin (9) at the top of each base (1), air flow generated by the second fan (11) can be discharged through the channel (8), and heat dissipation fins (12) which are contacted with the semiconductor refrigerating fin (9) are further arranged at the bottom of the second fan (11).
2. The heat dissipating device for a CPU of a computer according to claim 1, wherein: the bottom of the fin (4) at the bottommost part is provided with an upward concave (15) at the position of the opening (6).
3. The heat dissipating device for a CPU of a computer according to claim 1, wherein: the opening (6) is in a streamline structure.
4. The heat dissipating device for a CPU of a computer according to claim 1, wherein: the two sides of the base (1) are connected with mounting plates (16).
5. The heat dissipating device for a CPU of a computer according to claim 1, wherein: the base (1) is also provided with a plurality of through grooves (13), and the through grooves (13) penetrate through the base (1).
6. The heat dissipating device for a CPU of a computer according to claim 1, wherein: the heat transfer copper pipe (3) is of a hollow design, cooling liquid (14) is filled in the heat transfer copper pipe, the internal pressure is pumped into negative pressure in the manufacturing process, and the two ends of the heat transfer copper pipe (3) are sealed by using a sintering process.
7. The heat dissipating device for a CPU of a computer according to claim 1, wherein: and the contact part between the radiating fin (4) and the heat transfer copper pipe (3) is welded by using solder paste.
8. The heat dissipating device for a CPU of a computer according to claim 1, wherein: the top of backup pad (10) and first fan (5) are integrated into one piece structure, and the bottom of backup pad (10) is connected with base (1) through the screw, semiconductor refrigeration piece (9) are also installed on base (1) through the screw.
9. The heat dissipating device for a CPU of a computer according to claim 1, wherein: and nickel plating treatment is carried out on the surface of the heat transfer copper pipe (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310225030.1A CN115951769B (en) | 2023-03-10 | 2023-03-10 | Heat abstractor for computer CPU |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310225030.1A CN115951769B (en) | 2023-03-10 | 2023-03-10 | Heat abstractor for computer CPU |
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| Publication Number | Publication Date |
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| CN115951769A CN115951769A (en) | 2023-04-11 |
| CN115951769B true CN115951769B (en) | 2023-05-09 |
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| CN202310225030.1A Active CN115951769B (en) | 2023-03-10 | 2023-03-10 | Heat abstractor for computer CPU |
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| CN218450979U (en) * | 2022-05-09 | 2023-02-03 | 东莞市拓鑫界热传科技有限公司 | Semiconductor refrigerating sheet type heat radiator |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11638366B2 (en) * | 2021-09-23 | 2023-04-25 | Dongguan Bingdian Intelligent Science & Technology Co, Ltd. | Water-cooled radiator internally provided with semiconductor refrigeration system and fan |
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2023
- 2023-03-10 CN CN202310225030.1A patent/CN115951769B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004071636A (en) * | 2002-08-01 | 2004-03-04 | Fujikura Ltd | Heat sink with fan |
| CN107219906A (en) * | 2017-06-08 | 2017-09-29 | 刘兴丹 | A kind of semiconductor cold-storing type heat sink arrangement, method |
| CN109668346A (en) * | 2017-12-28 | 2019-04-23 | 杭州大和热磁电子有限公司 | A kind of novel semi-conductor refrigeration radiating module |
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| CN115951769A (en) | 2023-04-11 |
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Denomination of invention: A heat dissipation device for computer CPU Granted publication date: 20230509 Pledgee: Laishang Bank Co.,Ltd. Beiyuan sub branch Pledgor: Shandong Hezhong Zhiyuan Information Technology Co.,Ltd. Registration number: Y2024980014940 |
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