CN115308569A - Touch control chip electrical property testing device and testing method - Google Patents
Touch control chip electrical property testing device and testing method Download PDFInfo
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- CN115308569A CN115308569A CN202210812989.0A CN202210812989A CN115308569A CN 115308569 A CN115308569 A CN 115308569A CN 202210812989 A CN202210812989 A CN 202210812989A CN 115308569 A CN115308569 A CN 115308569A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2889—Interfaces, e.g. between probe and tester
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0416—Connectors, terminals
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0441—Details
- G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention discloses a touch chip electrical property testing device and a testing method in the technical field of chip testing, and the touch chip electrical property testing device comprises a conveying mechanism, a chip, two separated jigs and a fixing mechanism; the conveying mechanism is connected with the fixing mechanism, the two separated jigs are respectively arranged on the front side and the rear side of the conveying mechanism, the chip is placed on the conveying mechanism, the conveying mechanism is provided with a clamping mechanism, the lower end face of the chip is provided with a clamping groove corresponding to the clamping mechanism, and the separated jigs can be assembled and molded in the process of moving along with the conveying mechanism and clamp pins of the chip; the lower end face of the chip is positioned relatively, the lower end face of the chip is not easy to damage, so that the operation difficulty of the positioning process is reduced, the phenomenon that the working efficiency of workers is reduced due to fear of damaging the chip is avoided, and the damage rate of the chip in the testing process is reduced.
Description
Technical Field
The invention relates to the technical field of chip testing, in particular to a device and a method for testing electrical property of a touch chip.
Background
Touch refers herein specifically to single-point or multi-point touch technologies; the chip is an IC, refers to a metal sheet or a nonmetal sheet with an end face capable of being integrated with a friction lining and a friction material layer, generally refers to all electronic components, and is a circuit module which integrates various electronic components on a silicon plate to realize a certain specific function; it is the most important part in electronic equipment, and bears the functions of operation and storage; the application range of the integrated circuit covers almost all electronic equipment for military industry and civil use; the silicon chip containing the integrated circuit is small in size and is often part of a computer or other device.
The existing touch control chip electrical property test methods mainly comprise two types, one type is to directly test pins of the chip through manual work, and the other type is to insert the touch control chip into a pin interface of a test fixture through manual work and carry out automatic test through the fixture; the former inefficiency, the latter is at the in-process with touch-control chip insert test fixture's pin interface, and the existence leads to the chip pin to receive the strong extrusion by artifical maloperation, leads to the risk that the pin buckles for detection efficiency descends, especially to the chip of part pin easy rupture, still can make the direct fracture of chip pin, and the direct condemned condition of chip produces, makes the defective rate of whole production flow increase.
Based on this, the invention designs a device and a method for testing the electrical property of a touch chip to solve the above problems.
Disclosure of Invention
The invention aims to provide a device and a method for testing the electrical property of a touch chip, which aim to solve the problems that the prior art provides two main electrical property testing modes of the touch chip, wherein one mode is to directly test pins of the chip through manual work, and the other mode is to insert the touch chip into a pin interface of a testing jig through manual work and carry out automatic testing through the jig; the former inefficiency, the latter is at the in-process with touch-control chip insert test fixture's pin interface, exists and leads to the chip pin to receive the strong extrusion by artifical maloperation, leads to the risk that the pin is buckled for detection efficiency descends, especially to the chip of part pin easy rupture, still can make the direct fracture of chip pin, the direct condemned condition of chip produces, makes the problem of the defective rate increase of whole production flow.
In order to achieve the purpose, the invention provides the following technical scheme: a touch control chip electrical property testing device comprises a conveying mechanism, a chip, two separated jigs and a fixing mechanism; the chip clamping device comprises a conveying mechanism, a fixing mechanism, two separated jigs, a chip, a clamping mechanism and a clamping groove, wherein the conveying mechanism is connected with the fixing mechanism, the two separated jigs are respectively arranged on the front side and the rear side of the conveying mechanism, the chip is placed on the conveying mechanism, the conveying mechanism is provided with the clamping mechanism, the lower end face of the chip is provided with the clamping groove corresponding to the clamping mechanism, and the separated jigs can be assembled and molded in the process of moving along with the conveying mechanism and clamp pins of the chip.
As a further scheme of the invention, the conveying mechanism comprises two synchronizing wheels, the two synchronizing wheels are rotationally connected with the fixing mechanism, the synchronizing wheels are externally connected with a driving mechanism, the front side and the rear side of each synchronizing wheel are jointly in transmission connection with a synchronous belt, the two separate jigs are respectively arranged on one sides of the two synchronous belts far away from the median plane of the synchronizing wheels, and the clamping mechanism is arranged between the two synchronous belts.
As a further scheme of the invention, the clamping mechanism comprises a rotating shaft, the rotating shaft is fixedly arranged between the two synchronous belts, the rotating shaft is elastically and rotatably connected with a clamping plate through a torsion spring, the initial position of the clamping plate can be coplanar with the belt surfaces of the synchronous belts, and a first trigger mechanism is arranged on the inner sides of the synchronous belts; first trigger mechanism can make the block board pop out the hold-in range area after the block board removes hold-in range upper end, the hold-in range top is external to have the clamp plate, the clamp plate is used for spacing chip upward movement.
As a further aspect of the present invention, the first triggering mechanism includes a first boss, the first boss is disposed at a position between two timing belts inside the timing belts, a first connecting rod is fixedly connected to a sidewall of the first boss, and the first connecting rod is fixedly connected to the fixing mechanism.
As a further scheme of the invention, the split jig comprises two second connecting rods, the two second connecting rods are respectively and fixedly connected with the side walls of the two synchronous belts, the second connecting rods are both fixedly connected with a first mounting plate, the side walls are fixedly connected with a second mounting plate, the upper end of the second mounting plate is fixedly connected with a lower die with the same amount as the number of pins on one side of the chip, the upper surface profile of the lower die is completely attached to the lower surface profile of the pins of the chip, the side walls of the second mounting plate are fixedly connected with a first connecting plate, the first connecting plate is vertically and elastically connected with a sliding rod, the upper end of the sliding rod is fixedly connected with a first mounting rod, the first mounting rod is fixedly connected with an upper die with the same amount as the number of pins on one side of the chip, the lower surface profile of the upper die is completely attached to the upper surface profile of the pins of the chip, and the first mounting rod and the first connecting plate are both provided with a second trigger mechanism for controlling the split jig to be folded.
As a further scheme of the present invention, the second trigger mechanism includes a first trigger rod, the first trigger rod is fixedly connected to a side wall of the first installation rod, the side wall of the first connection plate is fixedly connected to a second trigger rod, a second boss is disposed above the synchronous belt, a third boss is disposed inside the synchronous belt, both the second boss and the third boss are fixedly connected to the fixing mechanism, the second boss can extrude the first trigger rod downward, and the third boss can extrude the first installation rod upward.
As a further scheme of the invention, a second connecting rod is fixedly connected between the first connecting rod and each upper die, the lower end of each second connecting rod is fixedly connected with a trigger block, two calibration plates are arranged at the upper end of the second mounting plate and below the trigger block, the two calibration plates are symmetrically arranged relative to the median plane of the trigger block, the upper ends of the calibration plates are fixedly connected with inserting plates, the side walls of the calibration plates are fixedly connected with wedge blocks, and the calibration plates are elastically connected with the upper ends of the second mounting plate in a transverse sliding manner.
As a further aspect of the present invention, the calibration plate side wall is made of a hard elastic material.
As a further scheme of the invention, binding surfaces of the lower die, the upper die and the pins are made of hard elastic materials.
A touch control chip electrical property test method comprises the following steps:
s1, manually placing a chip on a conveying mechanism during working;
s2, clamping the chip with a clamping mechanism on the conveying mechanism through a clamping groove to enable the chip to be fixed on the conveying mechanism;
and S3, the chip which is positioned moves along with the conveying mechanism, and in the moving process, the separated jig clamps the pins so as to complete the subsequent electrical test work.
Compared with the prior art, the invention has the beneficial effects that:
1. according to the invention, the chip indirectly completes the positioning work of the relatively-separated jig by matching the clamping mechanism with the clamping groove arranged on the lower end surface of the chip, and the pin of the chip is not required to participate in the whole positioning process, so that the condition that the pin is damaged due to inaccurate positioning of the relatively-fragile pin is avoided in the positioning process, and meanwhile, the lower end surface of the chip is positioned relatively, so that the operation difficulty in the positioning process is reduced, the phenomenon that the working efficiency is reduced due to fear of damaging the chip by workers is avoided, and the damage rate of the chip in the testing process is reduced.
2. According to the pin clamping device, the pins are clamped through the upper die and the lower die, and in the clamping process, the stress on the pins is mainly expressed in a distributed stress distribution mode, so that compared with the traditional mode that the pins are inserted into the jacks, the pin damage caused by the stress concentration of the pins is avoided, and the pins are protected to the greatest extent; according to the invention, the pin is prevented from being concentrated in stress by actively clamping the pin, and meanwhile, in the process of clamping the pin by the upper die and the lower die, the upper die and the lower die are respectively attached to the upper end surface and the lower end surface of the pin, so that the pin can be supported by the upper die and the lower die in the clamping process, the pin is prevented from being excessively bent, the integrity of the pin is further protected, and the chip damage rate in a testing link is reduced.
3. The calibration plate moves to a position between adjacent pins along with the upward movement of the lower die, then the trigger block moves downward to extrude the wedge block along with the downward movement of the upper die, so that the wedge block moves transversely, the calibration plate moves towards the adjacent pin side walls to extrude the pin side walls, the pins are corrected, the subsequent detection inaccuracy caused by the pins deflection is avoided, and meanwhile, the subsequent manual pin trimming work is avoided.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the present invention;
FIG. 2 is a schematic view of the fixing mechanism with one side removed according to the present invention;
FIG. 3 is an enlarged view of the structure at A in FIG. 2;
FIG. 4 is a schematic front sectional view of the overall structure of the present invention;
FIG. 5 is a side cross-sectional view of the structure of FIG. 2;
FIG. 6 is an enlarged view of the structure at B in FIG. 5;
FIG. 7 is a schematic structural view of a separable jig and a pin;
FIG. 8 is a process flow diagram of the present invention.
In the drawings, the components represented by the respective reference numerals are listed below:
the device comprises a chip 1, a clamping groove 11, a synchronous wheel 21, a synchronous belt 22, a rotating shaft 31, a clamping plate 32, a first boss 41, a first connecting rod 42, a second connecting rod 51, a first mounting plate 52, a second mounting plate 53, a lower die 54, a first connecting plate 55, a sliding rod 56, a first mounting rod 57, an upper die 58, a first trigger rod 61, a second trigger rod 62, a second boss 63, a third boss 64, a second connecting rod 71, a trigger block 72, a calibration plate 73, an inserting plate 74, a wedge block 75 and a fixing mechanism 8.
Detailed Description
Referring to fig. 1-8, the present invention provides a technical solution: a touch control chip electrical property testing device comprises a conveying mechanism, a chip 1, two separated jigs and a fixing mechanism 8; the conveying mechanism is connected with the fixing mechanism 8, the two separated jigs are respectively arranged on the front side and the rear side of the conveying mechanism, the chip 1 is placed on the conveying mechanism, the conveying mechanism is provided with a clamping mechanism, a clamping groove 11 corresponding to the clamping mechanism is formed in the lower end face of the chip 1, and the separated jigs can be assembled and molded in the process of moving along with the conveying mechanism and clamp pins of the chip 1.
During operation, a chip 1 is manually placed on a conveying mechanism (refer to fig. 1, the conveying mechanism in the invention is a conveyor belt type transmission part), the chip 1 is clamped with a clamping mechanism on the conveying mechanism through a clamping groove 11, so that the chip 1 can be fixed on the conveying mechanism, and further the positioning of the chip 1 relative to the conveying mechanism is completed, meanwhile, as the separated jig is arranged on the conveying mechanism, the separated jig can have the property of being positioned relative to the conveying mechanism, and further the clamping groove 11 arranged on the lower end face of the chip 1 is matched with the clamping mechanism, the chip 1 indirectly completes the positioning work of the relative separated jig, and the whole positioning process does not need the pins of the chip 1, so that the situation that the pins are damaged due to inaccurate positioning of the relatively fragile pins is avoided in the positioning process, meanwhile, the positioning is performed through the lower end face of the chip 1, the operation difficulty of the positioning process is reduced, the phenomenon that the work efficiency is reduced due to fear of damaging the chip 1 is avoided, and then the chip 1 which completes the positioning moves along with the conveying mechanism, and all mechanisms of the separated jig are mutually folded to clamp and perform the subsequent electrical property testing work.
According to the invention, the clamping groove 11 arranged on the lower end surface of the chip 1 is matched with the clamping mechanism, the chip 1 indirectly finishes the positioning work of the relatively-separated jig, and the pins of the chip 1 are not needed in the whole positioning process, so that the damage of the pins caused by the inaccurate positioning of the relatively-fragile pins in the positioning process is avoided, meanwhile, the positioning is carried out by the lower end surface of the chip 1, the lower end surface of the chip 1 is not easy to damage, the operation difficulty in the positioning process is reduced, the phenomenon that the working efficiency is reduced due to the fear of damaging the chip 1 by workers is avoided, and the damage rate of the chip 1 in the testing process is reduced.
As a further scheme of the invention, the conveying mechanism comprises two synchronizing wheels 21, the two synchronizing wheels 21 are rotationally connected with the fixing mechanism 8, the synchronizing wheels 21 are externally connected with a driving mechanism, the front side and the rear side of each synchronizing wheel 21 are jointly in transmission connection with a synchronizing belt 22, the two separate jigs are respectively arranged on one side of each synchronizing belt 22, which is far away from the median plane of the synchronizing wheels 21, and the clamping mechanism is arranged between the two synchronizing belts 22.
During operation, actuating mechanism passes through synchronizing wheel 21 and drives hold-in range 22 and rotate, chip 1 is fixed on hold-in range 22 through block mechanism, rotate the in-process at hold-in range 22, the setting is static relative chip 1 at the disconnect-type tool of hold-in range 22 side (the rest here indicates that disconnect-type tool overall position is unchangeable relative chip 1, do not represent hold-in range 22 and rotate the in-process, part in the disconnect-type tool is static relative chip 1), and then guaranteed follow-up disconnect-type tool and folded the in-process, the position accuracy between disconnect-type tool and chip 1.
As a further scheme of the present invention, the engaging mechanism includes a rotating shaft 31, the rotating shaft 31 is fixedly disposed between two synchronous belts 22, the rotating shaft 31 is elastically and rotatably connected with an engaging plate 32 through a torsion spring, an initial position of the engaging plate 32 can be coplanar with a belt surface of the synchronous belt 22, and a first triggering mechanism is disposed inside the synchronous belt 22; the first trigger mechanism can make the clamping plate 32 pop out the belt surface of the synchronous belt 22 after the clamping plate 32 moves to the upper end of the synchronous belt 22, a pressing plate is externally connected to the upper side of the synchronous belt 22, and the pressing plate is used for limiting the upward movement of the chip 1.
During operation, the chip 1 is placed at the upper end of the synchronous belt 22, the upper end of the chip 1 is lightly pressed manually to keep the chip 1 still, then the clamping plate 32 moves to the lower end of the chip 1 along with the walking belt 22, at the moment, under the action of the first trigger mechanism, the clamping plate 32 pops out of the belt surface of the synchronous belt 22 and enters the clamping groove 11 in the process of moving along with the walking belt 22 to be clamped with the chip 1, and then the synchronous belt 22 drives the chip 1 to move through the clamping plate 32 and enter the space between the synchronous belt 22 and the pressing plate, so that the chip 1 and the synchronous belt 22 are kept relatively still.
As a further aspect of the present invention, the first triggering mechanism includes a first boss 41, the first boss 41 is disposed at a position between two timing belts 22 inside the timing belts 22, a first connecting rod 42 is fixedly connected to a side wall of the first boss 41, and the first connecting rod 42 is fixedly connected to the fixing mechanism 8.
In operation, as the engaging plate 32 moves above the first boss 41, the lower end of the engaging plate 32 is pressed against the first boss 41, and the first boss 41 presses the engaging plate 32 upward to push the engaging plate 32 out of the timing belt 22 and engage with the engaging groove 11.
According to the invention, the lifting of the clamping plate 32 is controlled through the boss structure, so that the lifting of the clamping plate 32 can be completely matched with the requirement of equipment, the accumulation of motion errors is avoided, and the equipment can run more stably.
As a further scheme of the present invention, the separated jig includes two second connecting rods 51, the two second connecting rods 51 are respectively and fixedly connected to side walls of the two synchronous belts 22, the second connecting rods 51 are both fixedly connected to a first mounting plate 52, the side walls are fixedly connected to a second mounting plate 53, a lower die 54 having an equal number of pins on one side of the chip 1 is fixedly connected to an upper end of the second mounting plate 53, an upper surface profile of the lower die 54 completely conforms to a lower surface profile of the pins on one side of the chip 1, a first connecting plate 55 is fixedly connected to a side wall of the second mounting plate 53, the first connecting plate 55 is vertically and elastically connected to a sliding rod 56, a first mounting rod 57 is fixedly connected to an upper end of the sliding rod 56, the first mounting rod 57 is fixedly connected to an upper die 58 having an equal number of pins on one side of the chip 1, a lower surface profile of the upper die 58 completely conforms to an upper surface profile of the pins on one side of the chip 1, and second triggering mechanisms are respectively disposed at the first mounting rod 57 and the first connecting plate 55, and are used for controlling the separated jig.
The during operation, after chip 1 and hold-in range 22 are fixed, hold-in range 22 area chip 1 continues to move, and at this moment in-process, the first installation pole 57 of second trigger mechanism control moves down, controls first connecting plate 55 rebound, and then drives lower mould 54 rebound laminating pin lower surface, drives mould 58 rebound laminating pin upper surface to this centre gripping to the pin is accomplished, makes chip 1 can carry out subsequent electrical test link then.
According to the invention, the pins are clamped through the upper die 58 and the lower die 54, and in the clamping process, the stress on the pins is mainly expressed in a distributed stress distribution mode, so that compared with the traditional mode of inserting the pins into the jacks, the pin damage caused by the stress concentration of the pins is avoided, and the pins are protected to the greatest extent.
According to the invention, the phenomenon of concentrated stress on the pins is avoided by actively clamping the pins, and meanwhile, in the process of clamping the pins by the upper die 58 and the lower die 54, because the upper die 58 and the lower die 54 are respectively attached to the upper end surface and the lower end surface of the pins, the pins can be supported by the upper die 58 and the lower die 54 in the clamping process, so that the pins are prevented from being bent too much, the integrity of the pins is further protected, and the damage rate of the chip 1 in the testing link is reduced.
As a further aspect of the present invention, the second trigger mechanism includes a first trigger rod 61, the first trigger rod 61 is fixedly connected to a side wall of the first installation rod 57, a second trigger rod 62 is fixedly connected to a side wall of the first connection plate 55, a second boss 63 is disposed above the synchronous belt 22, a third boss 64 is disposed inside the synchronous belt 22, both the second boss 63 and the third boss 64 are fixedly connected to the fixing mechanism 8, the second boss 63 can press the first trigger rod 61 downward, and the third boss 64 can press the first installation rod 57 upward.
In operation, when the first trigger rod 61 and the second trigger rod 62 pass through the second boss 63 and the third boss 64, the upper mold 58 is driven to move downwards and the lower mold 54 is driven to move upwards by extrusion.
As a further scheme of the present invention, second connecting rods 71 are fixedly connected between the first connecting rods 42 and the upper dies 58, the lower ends of the second connecting rods 71 are fixedly connected with trigger blocks 72, two calibration plates 73 are arranged at the upper ends of the second mounting plates 53 and below the trigger blocks 72, the two calibration plates 73 are symmetrically arranged relative to the middle plane of the trigger blocks 72, the upper ends of the calibration plates 73 are fixedly connected with inserting plates 74, the side walls of the calibration plates 73 are fixedly connected with wedge blocks 75, and the calibration plates 73 are transversely and elastically slidably connected with the upper ends of the second mounting plates 53.
During operation, along with lower mould 54 shifts up, calibration plate 73 moves to between the adjacent pin, and then along with last mould 58 shifts down, trigger block 72 shifts down and extrudes wedge 75, makes wedge 75 lateral shifting, and then makes calibration plate 73 move to adjacent pin lateral wall, extrudes the pin lateral wall to reach the action of rectifying the pin, avoid the crooked follow-up detection that leads to of pin inaccurate, avoided the work of follow-up manual work repairment pin simultaneously.
As a further aspect of the present invention, the side wall of the calibration plate 73 is made of a hard elastic material.
As a further aspect of the present invention, the bonding surfaces of the lower mold 54 and the upper mold 58 and the leads are made of hard elastic materials.
A method for testing electrical property of a touch chip comprises the following steps:
s1, manually placing a chip 1 on a conveying mechanism during work;
s2, the chip 1 is clamped with a clamping mechanism on the conveying mechanism through the clamping groove 11, so that the chip 1 can be fixed on the conveying mechanism;
and S3, the positioned chip 1 moves along with the conveying mechanism, and in the moving process, the separated jig clamps the pins so as to complete the subsequent electrical test work.
Claims (10)
1. A touch control chip electrical property testing device which characterized in that: comprises a conveying mechanism, a chip (1), two separated jigs and a fixing mechanism (8); the chip clamping device is characterized in that the conveying mechanism is connected with the fixing mechanism (8), the two separated jigs are respectively arranged on the front side and the rear side of the conveying mechanism, the chip (1) is placed on the conveying mechanism, the conveying mechanism is provided with the clamping mechanism, a clamping groove (11) corresponding to the clamping mechanism is formed in the lower end face of the chip (1), and the separated jigs can be assembled and molded in the process of moving along with the conveying mechanism and clamp pins of the chip (1).
2. The electrical testing device of claim 1, wherein: transport mechanism includes two synchronizing wheel (21), two synchronizing wheel (21) rotate with fixed establishment (8) and are connected, synchronizing wheel (21) are external to have actuating mechanism, two the equal common transmission in both sides is connected with hold-in range (22) around synchronizing wheel (21), two disconnect-type tool sets up respectively and keeps away from synchronizing wheel (21) meso position face one side in two hold-in range (22), block mechanism sets up between two hold-in range (22).
3. The electrical testing device of claim 2, wherein: the clamping mechanism comprises a rotating shaft (31), the rotating shaft (31) is fixedly arranged between the two synchronous belts (22), the rotating shaft (31) is elastically and rotatably connected with a clamping plate (32) through a torsion spring, the initial position of the clamping plate (32) can be coplanar with the belt surfaces of the synchronous belts (22), and a first trigger mechanism is arranged on the inner sides of the synchronous belts (22); the first trigger mechanism can make the clamping plate (32) pop out the belt surface of the synchronous belt (22) after the clamping plate (32) moves to the upper end of the synchronous belt (22), a pressing plate is externally connected to the upper side of the synchronous belt (22), and the pressing plate is used for limiting the upward movement of the chip (1).
4. The electrical testing device of claim 3, wherein: first trigger mechanism includes first boss (41), first boss (41) set up the position between two hold-in range (22) of hold-in range (22) inboard, first boss (41) lateral wall fixedly connected with head rod (42), head rod (42) and fixed establishment (8) fixed connection.
5. The electrical testing device of claim 4, wherein: the disconnect-type tool includes two second connecting rods (51), two second connecting rod (51) respectively with two hold-in range (22) lateral wall fixed connection, the equal first mounting panel of fixedly connected with (52) of second connecting rod (51), lateral wall fixedly connected with second mounting panel (53), second mounting panel (53) upper end fixedly connected with is equivalent to lower mould (54) of chip (1) one side pin number, the lower surface profile of chip (1) pin is laminated completely to lower mould (54) upper surface profile, the first connecting plate of second mounting panel (53) lateral wall fixedly connected with (55), the vertical elastic connection of first connecting plate (55) has slide bar (56), slide bar (56) upper end fixedly connected with first installation pole (57), first installation pole (57) fixedly connected with is equivalent to last mould (58) of chip (1) one side pin number, it laminates the upper surface profile of chip (1) pin completely to go up mould (58) lower surface profile, first installation pole (57) and first connecting plate (55) department all are provided with the second and trigger the mechanism, the second trigger mechanism is used for the separation control tool to fold.
6. The electrical testing device of claim 5, wherein: second trigger mechanism includes first trigger lever (61), first trigger lever (61) and first installation pole (57) lateral wall fixed connection, first connecting plate (55) lateral wall fixedly connected with second trigger lever (62), hold-in range (22) top is provided with second boss (63), hold-in range (22) inboard is provided with third boss (64), second boss (63) and third boss (64) all with fixed establishment (8) fixed connection, second boss (63) can extrude first trigger lever (61) downwards, third boss (64) can upwards extrude first installation pole (57).
7. The device for testing electrical properties of a touch chip as claimed in claim 6, wherein: first connecting rod (42) are located each and go up equal fixedly connected with second connecting rod (71) between mould (58), the equal fixedly connected with of second connecting rod (71) lower extreme triggers piece (72), second mounting panel (53) upper end is located and all is provided with two calibration plate (73) below trigger piece (72), two the meso-position face symmetry that triggers piece (72) relatively in calibration plate (73) sets up, equal fixedly connected with picture peg (74) in calibration plate (73) upper end, the equal fixedly connected with wedge (75) of calibration plate (73) lateral wall, calibration plate (73) and second mounting panel (53) upper end horizontal elastic sliding connection.
8. The electrical testing device of claim 7, wherein: the side wall of the calibration plate (73) is made of hard elastic material.
9. The electrical testing device of claim 7, wherein: the binding surfaces of the lower die (54) and the upper die (58) and the pins are made of hard elastic materials.
10. A touch chip electrical test method is suitable for the touch chip electrical test device of claim 7, and is characterized in that; the method comprises the following steps:
s1, manually placing a chip (1) on a conveying mechanism during working;
s2, the chip (1) is clamped with a clamping mechanism on the conveying mechanism through a clamping groove (11), so that the chip (1) can be fixed on the conveying mechanism;
and S3, the chip (1) which is positioned moves along with the conveying mechanism, and in the moving process, the separated jig clamps the pins so as to complete the subsequent electrical test work.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210812989.0A CN115308569B (en) | 2022-07-11 | 2022-07-11 | Touch chip electrical property testing device and testing method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210812989.0A CN115308569B (en) | 2022-07-11 | 2022-07-11 | Touch chip electrical property testing device and testing method |
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| CN115308569A true CN115308569A (en) | 2022-11-08 |
| CN115308569B CN115308569B (en) | 2023-06-16 |
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| CN115308569B (en) | 2023-06-16 |
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