CN115190695A - Glass substrate double-side conduction microcircuit processing method - Google Patents

Glass substrate double-side conduction microcircuit processing method Download PDF

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Publication number
CN115190695A
CN115190695A CN202210548723.XA CN202210548723A CN115190695A CN 115190695 A CN115190695 A CN 115190695A CN 202210548723 A CN202210548723 A CN 202210548723A CN 115190695 A CN115190695 A CN 115190695A
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glass substrate
microcircuit
carrier plate
metal
substrate surface
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Inventor
刘智新
潘丹
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Changsha Huiyiyuan Technology Co ltd
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Changsha Huiyiyuan Technology Co ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Surface Treatment Of Glass (AREA)

Abstract

A glass substrate double-sided conduction microcircuit processing method comprises the following steps; firstly, attaching a glass substrate surface I to a carrier plate I through an adhesive composition; secondly, manufacturing micropores penetrating through the glass substrate by adopting a laser drilling and chemical etching mode, and filling the micropores with metal and/or conductive slurry; depositing a metal/alloy film layer on the surface of the glass substrate surface II, and performing a photoetching process on the glass substrate surface II to form a microcircuit; fourthly, attaching the glass substrate surface II to the carrier plate II through the bonding composition, and separating the carrier plate I from the glass substrate surface I through ultraviolet irradiation and/or heating treatment; depositing a metal/alloy film layer on the surface of the glass substrate surface I, and performing a photoetching process on the glass substrate surface I to form a microcircuit; sixthly, ultraviolet irradiation and/or heating treatment are carried out, so that the glass substrate surface II is separated from the carrier plate II, and a glass substrate is obtained; therefore, the product is not easy to break in the production and processing process; thereby improving the production efficiency and reducing the cost.

Description

Glass substrate double-side conduction microcircuit processing method
Technical Field
The invention relates to the technical field of glass substrate processing, in particular to a glass substrate double-sided conduction microcircuit processing method.
Background
Typical products of the existing electronic components, such as mini-led products, micro-led products, chip package substrates, etc., tend to be miniaturized, light and thin, and have increasingly powerful functions. This requires that the circuits of the electronic components be finer and finer, and that the substrates carrying the circuit structures be thinner and lighter. Generally, a substrate for mounting a circuit can be classified into an organic (resin) type and an inorganic (ceramic, glass) type.
The inorganic glass substrate has small thermal expansion coefficient and good dimensional stability, is easy to manufacture circuits with thinner line width and smaller holes, and has good development prospect.
Use glass as the electronic components of base plate, because the fragility of glass material selects for use the glass that thickness is more than 500um as the base plate that bears microcircuit usually, nevertheless can not satisfy the development demand that electronic components are frivolous.
The method for processing the double-sided conduction microcircuit by adopting the glass substrate with the thickness of 10-500 um at the present stage mainly comprises the following steps:
1. the glass substrate is cut into small sizes for processing, and the method has low processing efficiency and high cost;
2. the procedures of punching, filling holes and the like are firstly completed on the glass substrate, then the glass substrate is loaded in the auxiliary jig to deposit the metal/alloy film layer, and then the glass substrate is adhered on the carrier plate by using the adhesive tape to carry out the microcircuit manufacturing process.
Disclosure of Invention
The invention aims to solve the technical problem of providing a method for processing a glass substrate double-sided conduction microcircuit.
The technical scheme adopted by the invention to solve the technical problem is as follows:
a glass substrate double-sided conduction microcircuit processing method comprises the following steps;
attaching a glass substrate surface I to a carrier plate I through an adhesive composition, so that the glass substrate surface I is fixedly connected with the carrier plate I;
secondly, manufacturing micropores penetrating through the glass substrate by adopting a laser drilling and chemical etching mode, and filling the micropores with metal and/or conductive slurry;
depositing a metal/alloy film layer on the surface of the glass substrate surface II, and then performing a photoetching process on the metal/alloy film layer on the glass substrate surface II to form a microcircuit;
attaching the glass substrate surface II to the carrier plate II through the bonding composition, so that the glass substrate surface II is fixedly connected with the carrier plate II, and separating the carrier plate I from the glass substrate surface I through ultraviolet irradiation and/or heating treatment;
depositing a metal/alloy film layer on the surface of the glass substrate surface I, and then performing a photoetching process on the metal/alloy film layer on the glass substrate surface I to form a microcircuit;
cutting the glass substrate with the carrier plate II according to the unit size of the component, and separating the glass substrate surface II from the carrier plate II through ultraviolet irradiation and/or heating treatment; obtaining a glass substrate containing a double-sided conduction microcircuit;
or the glass substrate with the carrier plate II is separated from the carrier plate II through ultraviolet irradiation and/or heating treatment, and the glass substrate is cut according to the size of the component unit; and obtaining the glass substrate containing the double-sided conduction microcircuit.
Furthermore, the upper surface of the glass substrate is a glass substrate surface I, and the lower surface of the glass substrate is a glass substrate surface II.
Furthermore, the glass substrate comprises a glass raw material, the glass raw material is prepared by a chemical etching and thinning and/or physical grinding and polishing mode, the glass raw material is fixed with the carrier plate I and is prepared by a chemical etching and thinning and/or physical grinding and polishing mode, and the thickness of the glass substrate is 10-500 um.
Further, the carrier plate comprises a glass, ceramic, quartz, PP, PE, PVC, PVDF and PMMA material carrier plate; and the attaching mode comprises scraper blade coating, roller rolling and pressing plate pressing and attaching.
Further, the adhesive composition includes a pressure-sensitive adhesive, a thermosetting adhesive, a UV-curable adhesive, a two-liquid mixing curing adhesive, a composition mainly composed of a photo-shrinkable/expandable resin or a thermo-shrinkable/expandable resin, and a substrate of PE, PO, PU, PI, or PET having a surface to which the pressure-sensitive adhesive, the thermosetting adhesive, the UV-curable adhesive, or the two-liquid mixing curing adhesive is adhered.
Further, the chemical etching includes a soaking type, a spraying type and a horizontal rinsing type, wherein the etching solution includes an acidic etching solution and/or an alkaline etching solution, the acidic etching solution includes one or more of hydrofluoric acid, fluosilicic acid, ammonium fluoride, ammonium bifluoride, hydrochloric acid, sulfuric acid, nitric acid, phosphoric acid, oxalic acid, citric acid, tartaric acid and sulfamic acid, and the alkaline etching solution includes one or more of ammonium hydroxide, lithium hydroxide, sodium hydroxide, potassium hydroxide, calcium hydroxide, barium hydroxide, lithium carbonate, sodium carbonate and potassium carbonate.
Further, the micropore filling mode comprises the steps of filling micropores with metal and/or conductive slurry, and then physically grinding and polishing the surface of the glass substrate, wherein the grinding and polishing powder comprises one or more of carborundum, quartz sand, silicon carbide, aluminum oxide, cerium oxide and iron oxide;
furthermore, the micropore filling mode comprises the step of depositing a metal/alloy film layer on the surface of the glass substrate while filling micropores with metal.
Furthermore, the mode of depositing the metal/alloy film layer comprises one or more of vacuum evaporation, magnetron sputtering, electrolytic plating and chemical plating, and the material of the deposited film layer comprises one or more of gold, silver, copper, aluminum, nickel, palladium, molybdenum, zinc, chromium, indium and tin.
Further, the photoetching process comprises the steps of coating photosensitive photoresist on a glass substrate or attaching a photosensitive dry film, and then forming a microcircuit of the metal/alloy film layer through the processes of exposure, development, etching, stripping and cleaning; the method also comprises the steps of coating a photosensitive resin layer on the surface of the microcircuit containing the metal/alloy film layer of the glass substrate, and then forming a surface insulation protective layer through exposure, development, solid baking and cleaning processes.
Compared with the prior art, the invention has the following beneficial effects:
according to the processing method of the glass substrate double-side conduction microcircuit, the carrier plate is used as a support, so that the glass substrate with a thinner thickness can be selected, and the requirements of electronic components on lightness and thinness are met. During the production and processing processes, the product is not easy to crack; and can carry out large-size processing, improve production efficiency and reduce cost.
Detailed Description
The following examples further illustrate the invention.
Example one
The present embodiment includes the following steps;
attaching a glass substrate surface I to a carrier plate I through an adhesive composition, so that the glass substrate surface I is fixedly connected with the carrier plate I;
secondly, manufacturing micropores penetrating through the glass substrate by adopting a laser drilling and chemical etching mode, and filling the micropores with metal slurry;
depositing a metal film layer on the surface of the glass substrate surface II, and then performing a photoetching process on the metal film layer on the glass substrate surface II to form a microcircuit;
attaching the glass substrate surface II to a carrier plate II through the adhesive composition, so that the glass substrate surface II is fixedly connected with the carrier plate II, and separating the carrier plate I from the glass substrate surface I through ultraviolet irradiation;
depositing a metal film layer on the surface of the glass substrate surface I, and then performing a photoetching process on the metal film layer on the glass substrate surface I to form a microcircuit;
cutting the glass substrate with the carrier plate II according to the unit size of the component, and separating the glass substrate surface II from the carrier plate II through ultraviolet irradiation and/or heating treatment; obtaining a glass substrate containing a double-sided conduction microcircuit;
the upper surface of the glass substrate is a glass substrate surface I, the lower surface of the glass substrate is a glass substrate surface II, the glass substrate comprises a glass raw material, the glass raw material is prepared by a chemical etching and thinning and/or physical grinding and polishing mode, the glass raw material and the carrier plate I are fixed and then prepared by a chemical etching and thinning and/or physical grinding and polishing mode, and the thickness of the glass substrate is 10-500 micrometers.
The carrier plate comprises a glass, ceramic, quartz, PP, PE, PVC, PVDF and PMMA material carrier plate; and the attaching mode comprises scraper blade coating, roller rolling and pressing plate pressing and attaching.
The adhesive composition includes pressure-sensitive adhesive, thermosetting adhesive, UV-curable adhesive, two-liquid mixed curable adhesive, composition mainly composed of photo-shrinkable/expandable resin or thermo-shrinkable/expandable resin, and base material of PE, PO, PU, PI, or PET having pressure-sensitive adhesive, thermosetting adhesive, UV-curable adhesive, or two-liquid mixed curable adhesive adhered to the surface thereof.
The chemical etching comprises a soaking type, a spraying type and a horizontal spraying type, wherein the etching solution comprises an acidic etching solution and/or an alkaline etching solution, the acidic etching solution comprises one or more of hydrofluoric acid, fluosilicic acid, ammonium fluoride, ammonium bifluoride, hydrochloric acid, sulfuric acid, nitric acid, phosphoric acid, oxalic acid, citric acid, tartaric acid and sulfamic acid, and the alkaline etching solution comprises one or more of ammonium hydroxide, lithium hydroxide, sodium hydroxide, potassium hydroxide, calcium hydroxide, barium hydroxide, lithium carbonate, sodium carbonate and potassium carbonate.
The micropore filling mode comprises the following steps of filling micropores with metal and/or conductive slurry, and then physically grinding and polishing the surface of the glass substrate, wherein grinding and polishing material powder comprises one or more of carborundum, quartz sand, silicon carbide, aluminum oxide, cerium oxide and ferric oxide;
the method for depositing the metal/alloy film layer comprises one or more of vacuum evaporation, magnetron sputtering, electrolytic plating and chemical plating, and the deposited film layer material comprises one or more of gold, silver, copper, aluminum, nickel, palladium, molybdenum, zinc, chromium, indium and tin.
The photoetching process comprises coating photosensitive photoresist or attaching photosensitive dry film resist on a glass substrate, and then forming a microcircuit of a metal/alloy film layer through exposure, development, etching, stripping and cleaning processes; the method also comprises the steps of coating a photosensitive resin layer on the surface of the microcircuit containing the metal/alloy film layer of the glass substrate, and then forming a surface insulation protective layer through exposure, development, solid baking and cleaning processes.
Example two
The present embodiment includes the following steps;
attaching a glass substrate surface I to a carrier plate I through an adhesive composition, so that the glass substrate surface I is fixedly connected with the carrier plate I;
secondly, manufacturing micropores penetrating through the glass substrate by adopting a laser drilling and chemical etching mode, and filling the micropores with conductive slurry; depositing an alloy film layer on the surface of the glass substrate surface II, and then performing a photoetching process on the alloy film layer on the glass substrate surface II to form a microcircuit;
attaching the glass substrate surface II to the carrier plate II through the bonding composition, so that the glass substrate surface II is fixedly connected with the carrier plate II, and separating the carrier plate I from the glass substrate surface I through heating treatment;
depositing a metal/alloy film layer on the surface of the glass substrate surface I, and then performing a photoetching process on the alloy film layer on the glass substrate surface I to form a microcircuit;
step six, separating the glass substrate with the carrier plate II from the carrier plate II through ultraviolet irradiation and/or heating treatment, and cutting the glass substrate according to the size of the component unit; and obtaining the glass substrate containing the double-sided conduction microcircuit.
The upper surface of the glass substrate is a glass substrate surface I, the lower surface of the glass substrate is a glass substrate surface II, the glass substrate comprises a glass raw material, the glass raw material is prepared by a chemical etching and thinning and/or physical grinding and polishing mode, the glass raw material and the carrier plate I are fixed and then prepared by a chemical etching and thinning and/or physical grinding and polishing mode, and the thickness of the glass substrate is 10-500 micrometers.
The carrier plate comprises a glass, ceramic, quartz, PP, PE, PVC, PVDF and PMMA material carrier plate; and the attaching mode comprises scraper blade coating, roller rolling and pressing plate pressing and attaching.
The adhesive composition includes pressure-sensitive adhesive, thermosetting adhesive, UV-curable adhesive, two-liquid mixed curable adhesive, composition mainly composed of photo-shrinkable/expandable resin or thermo-shrinkable/expandable resin, and base material of PE, PO, PU, PI, or PET having pressure-sensitive adhesive, thermosetting adhesive, UV-curable adhesive, or two-liquid mixed curable adhesive adhered to the surface thereof.
The chemical etching comprises a soaking type, a spraying type and a horizontal spraying type, wherein the etching solution comprises an acidic etching solution and/or an alkaline etching solution, the acidic etching solution comprises one or more of hydrofluoric acid, fluosilicic acid, ammonium fluoride, ammonium bifluoride, hydrochloric acid, sulfuric acid, nitric acid, phosphoric acid, oxalic acid, citric acid, tartaric acid and sulfamic acid, and the alkaline etching solution comprises one or more of ammonium hydroxide, lithium hydroxide, sodium hydroxide, potassium hydroxide, calcium hydroxide, barium hydroxide, lithium carbonate, sodium carbonate and potassium carbonate.
The micropore filling mode comprises the following steps of filling micropores with metal and/or conductive slurry, and then physically grinding and polishing the surface of the glass substrate, wherein grinding and polishing material powder comprises one or more of carborundum, quartz sand, silicon carbide, aluminum oxide, cerium oxide and ferric oxide;
the mode of depositing the metal/alloy film layer comprises one or more of vacuum evaporation, magnetron sputtering, electrolytic plating and chemical plating, and the material of the deposited film layer comprises one or more of gold, silver, copper, aluminum, nickel, palladium, molybdenum, zinc, chromium, indium and tin.
The photoetching process comprises coating photosensitive photoresist or attaching photosensitive dry film resist on a glass substrate, and then forming a microcircuit of a metal/alloy film layer through exposure, development, etching, stripping and cleaning processes; the method also comprises the steps of coating a photosensitive resin layer on the surface of the microcircuit containing the metal/alloy film layer of the glass substrate, and then forming a surface insulation protective layer through exposure, development, solid baking and cleaning processes.
EXAMPLE III
The present embodiment includes the following steps;
attaching a glass substrate surface I to a carrier plate I through an adhesive composition, so that the glass substrate surface I is fixedly connected with the carrier plate I;
secondly, manufacturing micropores penetrating through the glass substrate by adopting a laser drilling and chemical etching mode, and filling the micropores with metal and conductive slurry; depositing a metal/alloy film layer on the surface of the glass substrate surface II, and then performing a photoetching process on the metal/alloy film layer on the glass substrate surface II to form a microcircuit;
attaching the glass substrate surface II to the carrier plate II through the bonding composition, so that the glass substrate surface II is fixedly connected with the carrier plate II, and separating the carrier plate I from the glass substrate surface I through ultraviolet irradiation and heating treatment;
depositing a metal/alloy film layer on the surface of the glass substrate surface I, and then performing a photoetching process on the metal/alloy film layer on the glass substrate surface I to form a microcircuit;
cutting the glass substrate with the carrier plate II according to the unit size of the component, and separating the glass substrate surface II from the carrier plate II through ultraviolet irradiation and/or heating treatment; obtaining a glass substrate containing a double-sided conduction microcircuit;
or the glass substrate with the carrier plate II is separated from the carrier plate II through ultraviolet irradiation and/or heating treatment, and the glass substrate is cut according to the size of the component unit; and obtaining the glass substrate containing the double-sided conduction microcircuit.
The upper surface of the glass substrate is a glass substrate surface I, the lower surface of the glass substrate is a glass substrate surface II, the glass substrate comprises a glass raw material, the glass raw material is prepared by a chemical etching and thinning and/or physical grinding and polishing mode, the glass raw material and the carrier plate I are fixed and then prepared by a chemical etching and thinning and/or physical grinding and polishing mode, and the thickness of the glass substrate is 10-500 micrometers.
The carrier plate comprises a glass, ceramic, quartz, PP, PE, PVC, PVDF and PMMA material carrier plate; and the attaching mode comprises scraper blade coating, roller rolling and pressing plate pressing and attaching.
The adhesive composition includes pressure-sensitive adhesive, thermosetting adhesive, UV-curable adhesive, two-liquid mixed curable adhesive, composition mainly composed of photo-shrinkable/expandable resin or thermo-shrinkable/expandable resin, and base material of PE, PO, PU, PI, or PET having pressure-sensitive adhesive, thermosetting adhesive, UV-curable adhesive, or two-liquid mixed curable adhesive adhered to the surface thereof.
The chemical etching comprises a soaking type, a spraying type and a horizontal spraying type, wherein the etching solution comprises an acidic etching solution and/or an alkaline etching solution, the acidic etching solution comprises one or more of hydrofluoric acid, fluosilicic acid, ammonium fluoride, ammonium bifluoride, hydrochloric acid, sulfuric acid, nitric acid, phosphoric acid, oxalic acid, citric acid, tartaric acid and sulfamic acid, and the alkaline etching solution comprises one or more of ammonium hydroxide, lithium hydroxide, sodium hydroxide, potassium hydroxide, calcium hydroxide, barium hydroxide, lithium carbonate, sodium carbonate and potassium carbonate.
The micropore filling mode comprises the following steps of filling micropores with metal and/or conductive slurry, and then physically grinding and polishing the surface of the glass substrate, wherein grinding and polishing material powder comprises one or more of carborundum, quartz sand, silicon carbide, aluminum oxide, cerium oxide and ferric oxide; the micropore filling mode comprises the step of depositing a metal/alloy film layer on the surface of the glass substrate while filling micropores with metal.
The mode of depositing the metal/alloy film layer comprises one or more of vacuum evaporation, magnetron sputtering, electrolytic plating and chemical plating, and the material of the deposited film layer comprises one or more of gold, silver, copper, aluminum, nickel, palladium, molybdenum, zinc, chromium, indium and tin.
The photoetching process comprises coating photosensitive photoresist or attaching photosensitive dry film resist on a glass substrate, and then forming a microcircuit of a metal/alloy film layer through exposure, development, etching, stripping and cleaning processes; the method also comprises the steps of coating a photosensitive resin layer on the surface of the microcircuit containing the metal/alloy film layer of the glass substrate, and then forming a surface insulation protective layer through exposure, development, solid baking and cleaning processes.
The following table shows the bonding conditions and the separation conditions of the glass substrate of the present invention at different thicknesses
Figure BDA0003653510550000061
Figure BDA0003653510550000071
Figure BDA0003653510550000081
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the technical solutions of the present invention have been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that the technical solutions described in the foregoing embodiments can be modified or some technical features can be replaced equally; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims (10)

1. A glass substrate double-side conduction microcircuit processing method is characterized in that: comprises the following steps;
attaching a glass substrate surface I to a carrier plate I through an adhesive composition, so that the glass substrate surface I is fixedly connected with the carrier plate I;
secondly, manufacturing micropores penetrating through the glass substrate by adopting a laser drilling and chemical etching mode, and filling the micropores with metal and/or conductive slurry;
depositing a metal/alloy film layer on the surface of the glass substrate surface II, and then performing a photoetching process on the metal/alloy film layer on the glass substrate surface II to form a microcircuit;
attaching the glass substrate surface II to the carrier plate II through the bonding composition, so that the glass substrate surface II is fixedly connected with the carrier plate II, and separating the carrier plate I from the glass substrate surface I through ultraviolet irradiation and/or heating treatment;
depositing a metal/alloy film layer on the surface of the glass substrate surface I, and then performing a photoetching process on the metal/alloy film layer on the glass substrate surface I to form a microcircuit;
cutting the glass substrate with the carrier plate II according to the unit size of the component, and separating the glass substrate surface II from the carrier plate II through ultraviolet irradiation and/or heating treatment; obtaining a glass substrate containing a double-sided conduction microcircuit;
or the glass substrate with the carrier plate II is separated from the carrier plate II through ultraviolet irradiation and/or heating treatment, and the glass substrate is cut according to the size of the component unit; and obtaining the glass substrate containing the double-sided conduction microcircuit.
2. The glass substrate double-sided conduction microcircuit processing method according to claim 1, characterized in that: the upper surface of the glass substrate is a glass substrate surface I, and the lower surface of the glass substrate is a glass substrate surface II.
3. The glass substrate double-sided conduction microcircuit processing method according to claim 2, characterized in that: the glass substrate comprises a glass raw material, the glass raw material is prepared in a chemical etching thinning and/or physical grinding and polishing mode, the glass raw material and the carrier plate I are fixed and then prepared in a chemical etching thinning and/or physical grinding and polishing mode, and the thickness of the glass substrate is 10-500 um.
4. The glass substrate double-sided conduction microcircuit processing method according to claim 3, characterized in that: the carrier plate comprises a glass, ceramic, quartz, PP, PE, PVC, PVDF and PMMA material carrier plate; and the attaching mode comprises scraper blade coating, roller rolling and pressing plate pressing and attaching.
5. The glass substrate double-sided conduction microcircuit processing method according to claim 4, characterized in that: the adhesive composition comprises a pressure-sensitive adhesive, a thermosetting adhesive, a UV curing adhesive, a two-liquid mixed curing adhesive, a composition taking a light shrinkage/expansion type resin or a heat shrinkage/expansion type resin as a main body, and a PE, PO, PU, PI and PET substrate with the pressure-sensitive adhesive, the thermosetting adhesive, the UV curing adhesive and the two-liquid mixed curing adhesive adhered on the surface.
6. The glass substrate double-sided conduction microcircuit processing method according to claim 5, characterized in that: the chemical etching comprises a soaking type, a spraying type and a horizontal spraying type, wherein the etching solution comprises an acidic etching solution and/or an alkaline etching solution, the acidic etching solution comprises one or more of hydrofluoric acid, fluosilicic acid, ammonium fluoride, ammonium bifluoride, hydrochloric acid, sulfuric acid, nitric acid, phosphoric acid, oxalic acid, citric acid, tartaric acid and sulfamic acid, and the alkaline etching solution comprises one or more of ammonium hydroxide, lithium hydroxide, sodium hydroxide, potassium hydroxide, calcium hydroxide, barium hydroxide, lithium carbonate, sodium carbonate and potassium carbonate.
7. The glass substrate double-sided conduction microcircuit processing method according to claim 6, wherein: the micropore filling mode comprises the steps of filling micropores with metal and/or conductive slurry, and then physically grinding and polishing the surface of the glass substrate, wherein grinding and polishing material powder comprises one or more of carborundum, quartz sand, silicon carbide, aluminum oxide, cerium oxide and ferric oxide.
8. The glass substrate double-sided conduction microcircuit processing method according to claim 7, characterized in that: the micropore filling mode comprises the step of depositing a metal/alloy film layer on the surface of the glass substrate while filling micropores with metal.
9. The glass substrate double-sided conduction microcircuit processing method according to claim 7 or 8, characterized in that: the mode of depositing the metal/alloy film layer comprises one or more of vacuum evaporation, magnetron sputtering, electrolytic plating and chemical plating, and the material of the deposited film layer comprises one or more of gold, silver, copper, aluminum, nickel, palladium, molybdenum, zinc, chromium, indium and tin.
10. The glass substrate double-sided conduction microcircuit processing method according to claim 7, characterized in that: the photoetching process comprises the steps of coating photosensitive photoresist on a glass substrate or attaching a photosensitive corrosion-resistant dry film, and then forming a microcircuit of a metal/alloy film layer through the processes of exposure, development, etching, stripping and cleaning; the method also comprises the steps of coating a photosensitive resin layer on the surface of the microcircuit containing the metal/alloy film layer of the glass substrate, and then forming a surface insulation protective layer through exposure, development, solid baking and cleaning processes.
CN202210548723.XA 2022-05-20 2022-05-20 Glass substrate double-side conduction microcircuit processing method Pending CN115190695A (en)

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