CN114672280A - Silicone adhesive, silicone film, and backlight unit - Google Patents
Silicone adhesive, silicone film, and backlight unit Download PDFInfo
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- CN114672280A CN114672280A CN202011549855.1A CN202011549855A CN114672280A CN 114672280 A CN114672280 A CN 114672280A CN 202011549855 A CN202011549855 A CN 202011549855A CN 114672280 A CN114672280 A CN 114672280A
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- silicone
- silicone adhesive
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- 239000013464 silicone adhesive Substances 0.000 title claims abstract description 79
- 229920006268 silicone film Polymers 0.000 title claims abstract description 51
- 239000010410 layer Substances 0.000 claims description 53
- 239000000126 substance Substances 0.000 claims description 41
- 125000003700 epoxy group Chemical group 0.000 claims description 26
- -1 vinylmethyl Chemical group 0.000 claims description 21
- 239000002952 polymeric resin Substances 0.000 claims description 17
- 229920003002 synthetic resin Polymers 0.000 claims description 17
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 claims description 16
- 229910052736 halogen Inorganic materials 0.000 claims description 16
- 239000002131 composite material Substances 0.000 claims description 15
- 150000002367 halogens Chemical class 0.000 claims description 15
- 125000003545 alkoxy group Chemical group 0.000 claims description 14
- 239000002904 solvent Substances 0.000 claims description 14
- YZCKVEUIGOORGS-OUBTZVSYSA-N Deuterium Chemical compound [2H] YZCKVEUIGOORGS-OUBTZVSYSA-N 0.000 claims description 13
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 13
- 125000003342 alkenyl group Chemical group 0.000 claims description 13
- 125000000217 alkyl group Chemical group 0.000 claims description 13
- 125000003277 amino group Chemical group 0.000 claims description 13
- 125000003118 aryl group Chemical group 0.000 claims description 13
- 125000000753 cycloalkyl group Chemical group 0.000 claims description 13
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 claims description 13
- 229910052805 deuterium Inorganic materials 0.000 claims description 13
- 125000001072 heteroaryl group Chemical group 0.000 claims description 13
- 125000000592 heterocycloalkyl group Chemical group 0.000 claims description 13
- 229910052739 hydrogen Inorganic materials 0.000 claims description 13
- 239000001257 hydrogen Substances 0.000 claims description 13
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 13
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 claims description 13
- 125000002560 nitrile group Chemical group 0.000 claims description 13
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 claims description 13
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 13
- 125000003396 thiol group Chemical group [H]S* 0.000 claims description 13
- 229910044991 metal oxide Inorganic materials 0.000 claims description 12
- 150000004706 metal oxides Chemical class 0.000 claims description 12
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 6
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 4
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 claims description 4
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 4
- 239000011787 zinc oxide Substances 0.000 claims description 4
- 229910001928 zirconium oxide Inorganic materials 0.000 claims description 4
- 229910000449 hafnium oxide Inorganic materials 0.000 claims description 3
- WIHZLLGSGQNAGK-UHFFFAOYSA-N hafnium(4+);oxygen(2-) Chemical compound [O-2].[O-2].[Hf+4] WIHZLLGSGQNAGK-UHFFFAOYSA-N 0.000 claims description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 3
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 claims description 3
- 230000035699 permeability Effects 0.000 claims description 3
- 125000005843 halogen group Chemical group 0.000 claims 1
- 239000000853 adhesive Substances 0.000 abstract description 33
- 230000001070 adhesive effect Effects 0.000 abstract description 33
- 238000003475 lamination Methods 0.000 abstract description 11
- 238000004383 yellowing Methods 0.000 abstract description 11
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 abstract description 8
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 abstract description 8
- 230000015572 biosynthetic process Effects 0.000 abstract description 4
- 239000010408 film Substances 0.000 description 54
- 229910000077 silane Inorganic materials 0.000 description 11
- 230000000052 comparative effect Effects 0.000 description 9
- 238000001723 curing Methods 0.000 description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 8
- 239000003054 catalyst Substances 0.000 description 8
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 8
- 229910052710 silicon Inorganic materials 0.000 description 8
- 239000010703 silicon Substances 0.000 description 8
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 239000012790 adhesive layer Substances 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 5
- 239000003431 cross linking reagent Substances 0.000 description 5
- 238000002834 transmittance Methods 0.000 description 5
- 229920002799 BoPET Polymers 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000012788 optical film Substances 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 229910052697 platinum Inorganic materials 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000002346 layers by function Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000010948 rhodium Substances 0.000 description 2
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- SXPLZNMUBFBFIA-UHFFFAOYSA-N butyl(trimethoxy)silane Chemical compound CCCC[Si](OC)(OC)OC SXPLZNMUBFBFIA-UHFFFAOYSA-N 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- SCPWMSBAGXEGPW-UHFFFAOYSA-N dodecyl(trimethoxy)silane Chemical compound CCCCCCCCCCCC[Si](OC)(OC)OC SCPWMSBAGXEGPW-UHFFFAOYSA-N 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- SBRXLTRZCJVAPH-UHFFFAOYSA-N ethyl(trimethoxy)silane Chemical compound CC[Si](OC)(OC)OC SBRXLTRZCJVAPH-UHFFFAOYSA-N 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- VRINOTYEGADLMW-UHFFFAOYSA-N heptyl(trimethoxy)silane Chemical compound CCCCCCC[Si](OC)(OC)OC VRINOTYEGADLMW-UHFFFAOYSA-N 0.000 description 1
- CZWLNMOIEMTDJY-UHFFFAOYSA-N hexyl(trimethoxy)silane Chemical compound CCCCCC[Si](OC)(OC)OC CZWLNMOIEMTDJY-UHFFFAOYSA-N 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- 239000005453 ketone based solvent Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
- 229910052762 osmium Inorganic materials 0.000 description 1
- SYQBFIAQOQZEGI-UHFFFAOYSA-N osmium atom Chemical compound [Os] SYQBFIAQOQZEGI-UHFFFAOYSA-N 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000001029 thermal curing Methods 0.000 description 1
- XYJRNCYWTVGEEG-UHFFFAOYSA-N trimethoxy(2-methylpropyl)silane Chemical compound CO[Si](OC)(OC)CC(C)C XYJRNCYWTVGEEG-UHFFFAOYSA-N 0.000 description 1
- NMEPHPOFYLLFTK-UHFFFAOYSA-N trimethoxy(octyl)silane Chemical compound CCCCCCCC[Si](OC)(OC)OC NMEPHPOFYLLFTK-UHFFFAOYSA-N 0.000 description 1
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 description 1
- LFRDHGNFBLIJIY-UHFFFAOYSA-N trimethoxy(prop-2-enyl)silane Chemical compound CO[Si](OC)(OC)CC=C LFRDHGNFBLIJIY-UHFFFAOYSA-N 0.000 description 1
- LGROXJWYRXANBB-UHFFFAOYSA-N trimethoxy(propan-2-yl)silane Chemical compound CO[Si](OC)(OC)C(C)C LGROXJWYRXANBB-UHFFFAOYSA-N 0.000 description 1
- HQYALQRYBUJWDH-UHFFFAOYSA-N trimethoxy(propyl)silane Chemical compound CCC[Si](OC)(OC)OC HQYALQRYBUJWDH-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/255—Polyesters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/40—Adhesives in the form of films or foils characterised by release liners
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/318—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of liquid crystal displays
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2467/00—Presence of polyester
- C09J2467/006—Presence of polyester in the substrate
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Laminated Bodies (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The present invention provides a high-functional silicone adhesive, a silicone film and a backlight unit, and more particularly, to the following functional silicone adhesive: the adhesive has high transparency, high heat resistance, low reflectance, vibration resistance, no yellowing, impact resistance and high adhesion of 3,000 gf/inch or more, can be used in a solvent-free manner, exhibits uniform and excellent adhesion even if the thickness is 500um or more, is advantageous for double-sided adhesion, has a high refractive index of 1.5 or more, is advantageous for lamination with functionality and high adhesion equal to or more than that of acrylic or urethane in film formation, and has high visibility characteristics.
Description
Technical Field
The present invention relates to a silicone adhesive, a silicone film, and a backlight unit, and more particularly, to the following functional silicone adhesive and a functional silicone film having multiple functions using the same: the silicone OCA film has high transparency, high heat resistance, low reflectance, vibration resistance, no yellowing, impact resistance and high adhesion force of at least 3,000 gf/inch, is suitable for a silicone OCA film with a thickness of 500-3,000 um, can be used in a solvent-free manner, exhibits uniform and excellent adhesion even if the thickness is more than 500um, is favorable for double-sided adhesion, has a high refractive index of 1.5 or more, is favorable for lamination with functionality and high adhesion force and high visibility characteristics equal to or more than those of acrylic and urethane in film formation.
Background
The following description is merely provided for background information related to the present invention and does not constitute prior art.
In recent years, the demand for touch panels has increased in the field of FRONT (FRONT) displays such as smart phones, tablet computers, new-generation TVs, vehicles, airplanes, and ship navigation. In connection with this, the demand for an Optically Clear Adhesive (OCA) for bonding with the touch panel optical member is also increasing at the same time. In a display device constituting a touch panel, a liquid crystal display device, a transparent member including a transparent electrode and the like, and an optical member including an outer cover panel and the like are formed in a laminated structure, and various OCA films for bonding these optical members are used. In addition, the highly transparent film is also used in a front display, a sunroof (Roof), a headlamp, and the like of a vehicle that require high heat resistance and cold resistance, and no yellowing.
Acrylic and urethane polymers have been mainly used as polymers conventionally used for transparent adhesives. In particular, acrylic and urethane are used in large quantities because they have excellent transparency, are easy to design, and are inexpensive, but they have problems of low heat resistance, low weather resistance, and discoloration due to yellowing, and therefore, thick film type for application to many parts and improvement in the fields of semiconductors, displays, and automobiles requiring high heat work such as high heat resistance and adhesion stability are required in the future.
In response to such a demand, transparent adhesives and adhesives using silicone resins have been developed, and silicone films using the adhesives and adhesives have been developed, but there are limitations in satisfying high transparency, low reflectance, and high visibility at the same time.
Documents of the prior art
Patent document
Korean patent publication No. 10-2016-0085768(2016.07.08.)
Korean patent laid-open No. 10-2020-0075278(2020.06.26.)
Disclosure of Invention
Problems to be solved
In order to solve the above problems, the present invention provides a functional silicone adhesive which has high transparency, high heat resistance, low reflectance, vibration resistance, no yellowing, impact resistance, and high adhesion of 3,000 gf/inch or more, can be used without a solvent, exhibits uniform and excellent adhesion even if the thickness is 500um or more, is advantageous for both-side adhesion, has a high refractive index of 1.5 or more, is advantageous for lamination of functional layers with high adhesion equal to or more than acrylic or urethane in film formation, and has high visibility characteristics.
In order to solve the above problems, the present invention provides a silicone film having high transparency, high heat resistance, low reflectance, vibration resistance, no yellowing, impact resistance, and high adhesion of 3,000 gf/inch or more, capable of being used in a solvent-free type for vehicle display applications, exhibiting uniform and excellent adhesion even at a thickness of 500um or more, facilitating both-side adhesion, facilitating functional lamination, and having high visibility characteristics at the same time due to lamination of a low refractive index layer and a high refractive index layer.
Further, the present invention provides a surface-emitting backlight unit for a new-generation display using the above functional silicone film.
However, the problems to be solved by the present invention are not limited to the above-mentioned matters, and other problems not mentioned can be clearly understood by those skilled in the art from the following descriptions.
Means for solving the problems
In order to solve such technical problems, the present invention provides a silicone adhesive comprising a composite polymer resin represented by the following chemical formula 1:
[ chemical formula 1]
In the chemical formula 1 as described above,
MO is a metal oxide, A is the following chemical formula 2, B is the following chemical formula 3, C is the following chemical formula 4,
[ chemical formula 2]
[ chemical formula 3]
[ chemical formula 4]
In the above-mentioned chemical formulas 2 to 4,
R1each independently hydrogen having a valence of 1; deuterium; halogen; an amine group; an epoxy group; a cyclohexyl epoxy group; a (meth) acryloyl group; a hydroxyl group; a thiol group; an isocyanate group; a nitrile group; a nitro group; a phenyl group; C1-C40 alkyl; alkenyl of C2-C40; alkoxy of C1-C40; cycloalkyl of C3-C40; C3-C40 heterocycloalkyl; aryl of C6-C40; or a heteroaryl group of C3 to C40,
R2each independently hydrogen having a valence of 1; deuterium; a halogen; an amine group; an epoxy group; a cyclohexyl epoxy group; a (meth) acryloyl group; a hydroxyl group; a thiol group; an isocyanate group; a nitrile group; a nitro group; a phenyl group; C1-C40 alkyl; alkenyl of C2-C40 substituted or unsubstituted by halogen; alkoxy of C1-C40; cycloalkyl of C3-C40; C3-C40 heterocycloalkyl; aryl of C6-C40; or a heteroaryl group of C3 to C40, at least one of which is methyl, vinylmethyl, phenylvinylmethyl or fluorovinylmethyl,
R3each independently hydrogen having a valence of 1; deuterium; halogen; an amine group; an epoxy group; a cyclohexyl epoxy group; a (meth) acryloyl group; a hydroxyl group; a thiol group; an isocyanate group; a nitrile group; a nitro group; a phenyl group; C1-C40 alkyl; alkenyl of C2-C40; alkoxy of C1-C40; cycloalkyl of C3-C40; C3-C40 heterocycloalkyl; aryl of C6-C40; or a heteroaryl group of C3 to C40, at least one of which is acryloyl or methacryloyl,
x, y and z are each independently an integer of 1 to 100,
q is an integer of 1 to 200,
a may be bonded to B or C, and the terminal B or C is hydrogen having a valence of 1; deuterium; halogen; an amine group; an epoxy group; a cyclohexyl epoxy group; a (meth) acryloyl group; a hydroxyl group; a thiol group; an isocyanate group; a nitrile group; a nitro group; a phenyl group; C1-C40 alkyl; alkenyl of C2-C40; alkoxy of C1-C40; cycloalkyl of C3-C40; C3-C40 heterocycloalkyl; aryl of C6-C40; or a heteroaryl group of C3 to C40.
The silicone adhesive may further comprise a catalyst.
The silicone adhesive may further comprise a solvent.
Specifically, the metal oxide is at least one selected from the group consisting of zirconium oxide, titanium oxide, zinc oxide, hafnium oxide, and yttrium oxide.
The present invention also provides an organic silicon film comprising a high refractive organic silicon adhesive layer obtained by coating the organic silicon adhesive on a substrate and then curing the same.
Specifically, the silicone film further includes a low-refractive silicone adhesive layer adjacent to the upper surface or the lower surface of the high-refractive silicone adhesive layer.
Specifically, the refractive index of the high-refractive silicone adhesive layer is 1.50 to 1.90, and the refractive index of the low-refractive silicone adhesive layer is 1.30 to 1.49.
Preferably, the permeability of the silicone film is 95% or more.
In addition, the present invention provides a backlight unit comprising the above silicone film.
Effects of the invention
According to the present invention, the following functional silicone adhesive can be provided: the adhesive has high transparency, high heat resistance, low reflectance, vibration resistance, no yellowing, impact resistance and high adhesion of 3,000 gf/inch or more, can be used in a solvent-free manner, exhibits uniform and excellent adhesion even if the thickness is 500um or more, is advantageous for double-sided adhesion, has a high refractive index of 1.5 or more, is advantageous for lamination with functionality and high adhesion equal to or more than that of acrylic or urethane in film formation, and has high visibility characteristics.
Further, the present invention can provide the following silicone film: the adhesive has high transparency, high heat resistance, low reflectance, vibration resistance, no yellowing, impact resistance and high adhesion of 3,000 gf/inch or more, can be used in a solvent-free manner, exhibits uniform and excellent adhesion even if the thickness is 500um or more, is advantageous for both-side adhesion and functional lamination, and has high visibility characteristics at the same time by laminating a low refractive index layer and a high refractive index layer.
Further, the present invention can provide a backlight unit using the above functional silicone film.
Drawings
Fig. 1 to 5 are views each showing a silicone film using a functional silicone adhesive according to an embodiment of the present invention.
Fig. 6 is a diagram illustrating a backlight unit using micro LED local dimming according to an embodiment of the present invention.
Detailed Description
Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In describing the present invention, a detailed description thereof will be omitted in a case where it is considered that a detailed description of related well-known functions or configurations may unnecessarily obscure the gist of the present invention. In addition, the terms used in the present specification are terms used to properly express preferred embodiments of the present invention, and may be changed according to the intention of a user, an operator, a convention in the art to which the present invention pertains, and the like. Therefore, the definitions of the above terms should be defined based on the entire contents of the present specification. Like reference symbols in the various drawings indicate like elements.
Throughout the specification, when it is stated that a certain member is "on" another member, it includes not only a case where the certain member is in contact with the other member but also a case where the other member exists between the two members.
When a part is referred to as "including" a certain component throughout the specification, it means that other components may be further included, but other components are not excluded.
The silicone adhesive of the present invention comprises a composite polymer resin represented by the following chemical formula 1:
[ chemical formula 1]
In the chemical formula 1 described above,
MO is a metal oxide, A is the following chemical formula 2, B is the following chemical formula 3, C is the following chemical formula 4,
[ chemical formula 2]
[ chemical formula 3]
[ chemical formula 4]
In the chemical formulas 2 to 4, the metal oxide,
R1each independently hydrogen having a valence of 1; deuterium; halogen; an amine group; an epoxy group; a cyclohexyl epoxy group; a (meth) acryloyl group; a hydroxyl group; a thiol group; an isocyanate group; a nitrile group; a nitro group; a phenyl group; C1-C40 alkyl; alkenyl of C2-C40; alkoxy of C1-C40; cycloalkyl of C3-C40; C3-C40 heterocycloalkyl; aryl of C6-C40; or a heteroaryl group of C3 to C40,
R2each independently hydrogen having a valence of 1; deuterium; halogen; an amine group; an epoxy group; a cyclohexyl epoxy group; a (meth) acryloyl group; a hydroxyl group; a thiol group; an isocyanate group; a nitrile group; a nitro group; a phenyl group; C1-C40 alkyl; substituted or unsubstituted alkenyl of C2 to C40 (which may be substituted by halogen); alkoxy of C1-C40(ii) a Cycloalkyl of C3-C40; C3-C40 heterocycloalkyl; aryl of C6-C40; or a heteroaryl group of C3 to C40, at least one of which is methyl, vinylmethyl, phenylvinylmethyl or fluorovinylmethyl,
R3each independently hydrogen having a valence of 1; deuterium; halogen; an amine group; an epoxy group; a cyclohexyl epoxy group; a (meth) acryloyl group; a hydroxyl group; a thiol group; an isocyanate group; a nitrile group; a nitro group; a phenyl group; C1-C40 alkyl; alkenyl of C2-C40; alkoxy of C1-C40; cycloalkyl of C3-C40; C3-C40 heterocycloalkyl; aryl of C6-C40; or a C3-C40 heteroaryl group, at least one of which is acryloyl or methacryloyl,
x, y and z are each independently an integer of 1 to 100,
q is an integer of 1 to 200,
a may be bonded to B or C, and the terminal B or C is hydrogen having a valence of 1; deuterium; halogen; an amine group; an epoxy group; a cyclohexyl epoxy group; a (meth) acryloyl group; a hydroxyl group; a thiol group; an isocyanate group; a nitrile group; a nitro group; a phenyl group; C1-C40 alkyl; alkenyl of C2-C40; alkoxy of C1-C40; cycloalkyl of C3-C40; C3-C40 heterocycloalkyl; aryl of C6-C40; or a heteroaryl group of C3 to C40.
Specifically, the metal oxide is at least one selected from the group consisting of zirconium oxide, titanium oxide, zinc oxide, hafnium oxide, and yttrium oxide.
The composite polymer resin represented by the above chemical formula 1 may be bonded to [ B ] or [ C ] adjacent to [ A ] as in the case of [ A ] to [ B ] or [ C ] respectively.
The composite polymer resin represented by the above chemical formula 1 can be produced as follows: the silane compound constituting [ A ] is polymerized to produce [ A ], the silane compound constituting [ B ] is polymerized with the silane compound constituting [ A ] to produce [ A ] - [ B ], the silane compound constituting [ C ] is polymerized with the silane compound constituting [ A ] - [ B ] to produce [ A ] - [ B ] - [ C ], and MO is linked to [ A ] of [ A ] - [ B ] - [ C ] by a crosslinking agent.
The composite polymer resin represented by chemical formula 1 may be produced as follows: the silane compound constituting [ A ] is polymerized to produce [ A ], the silane compound constituting [ C ] is polymerized with the silane compound constituting [ A ] to produce [ A ] to [ C ], the silane compound constituting [ B ] is polymerized with the silane compound constituting [ A ] to [ C ] to produce [ A ] to [ C ] to [ B ], and MO is linked to the silane compound constituting [ A ] to [ C ] to [ A ] of [ B ] by means of a crosslinking agent. As a specific example, the reaction of linking MO in the MO nanosol with [ A ] of [ A ] - [ C ] - [ B ] using a crosslinking agent can be carried out at a reaction temperature of 60 to 150 ℃ for 30 to 120 minutes.
Specifically, as the crosslinking agent, one or more alkoxy compounds selected from the group consisting of vinyltrimethoxysilane, allyltrimethoxysilane, ethyltrimethoxysilane, propyltrimethoxysilane, butyltrimethoxysilane, isopropyltrimethoxysilane, hexyltrimethoxysilane, heptyltrimethoxysilane, n-octyltrimethoxysilane, dodecyltrimethoxysilane, phenyltrimethoxysilane and isobutyltrimethoxysilane can be used.
Preferably, the metal oxide and the alkoxide compound are contained in the composite polymer resin in amounts of 1 to 50 wt% and 0.001 to 20 wt%, respectively. In this case, the following functional silicone adhesive can be produced: the adhesive has high transparency, high heat resistance, low reflectance, vibration resistance, no yellowing, impact resistance and high adhesion of 3,000 gf/inch or more, can be used in a solvent-free manner, exhibits uniform and excellent adhesion even if the thickness is 500um or more, is advantageous for double-sided adhesion, has a high refractive index of 1.5 or more, is advantageous for lamination with functionality and high adhesion equal to or more than those of acrylic or urethane in the production of a film, and has high visibility characteristics.
The functional silicone adhesive of the present invention may further comprise a catalyst. In the present invention, the catalyst may use one or more selected from the group consisting of platinum (Pt), palladium (Pd), iridium (Ir), rhodium (Rh), osmium (Os), and ruthenium (Ru) as a central metal, and preferably contains platinum (Pt). Specifically, the content of the catalyst may be 0.01 to 1 part by weight with respect to 100 parts by weight of the composite polymer resin represented by chemical formula 1.
In addition, the present invention may further comprise a solvent. The solvent is not particularly limited, and specifically, one or a mixture of two or more of aromatic hydrocarbon solvents, aliphatic hydrocarbon solvents, and ketone solvents may be used. More specifically, the solvent may include one or more of xylene, methyl ethyl ketone, ethyl acetate, toluene, butyl cellosolve, and isopropyl alcohol, but is not limited thereto.
The amount of the solvent may be arbitrarily adjusted, and specifically, may be 50 to 500 parts by weight with respect to 100 parts by weight of the composite polymer resin represented by chemical formula 1.
The functional silicone adhesive of the present invention can have a viscosity of 100 to 100,000cps by sufficient stirring.
The silicone adhesive of the present invention has high transparency, high heat resistance, low reflectance, vibration resistance, no yellowing, impact resistance, and high adhesion of 3,000 gf/inch or more, can be used in a solvent-free manner, exhibits uniform and excellent adhesion even if the thickness is 500um or more, is advantageous for both-side adhesion, has a high refractive index of 1.5 or more, is advantageous for lamination with functionality and high adhesion equal to or more than that of acrylic or urethane in the production of a film, and has high visibility characteristics.
In particular, the silicone adhesive of the present invention has an adhesive force of 3000 to 6000 gf/inch, preferably 4000 gf/inch or more, thereby having a characteristic of remarkably improving the adhesive force (2000 gf/inch or less) of the conventional fragile silicone adhesive, and can fundamentally solve the problems of difficult processing, difficult adjustment of refractive index, thermal instability, and non-uniformity of physical properties of the nano-sized metal powder when the metal powder is mixed in the conventional low refractive index silicone adhesive.
The present invention also provides an organic silicon film comprising a high refractive organic silicon adhesive layer obtained by coating the organic silicon adhesive on a substrate and then curing the same. If necessary, a release film may be further included on the high refractive silicone adhesive layer. The substrate may be a release film, an optical film or a hard coat layer, and the release film, the optical film or the hard coat layer may be coated with a primer if necessary.
As the release film, the optical film, or the hard coat layer, a known film may be used, and as a specific example, the release film may be a release film coated with fluorine, the optical film may be a film in which high refraction and low refraction are alternately coated on a PET base film, and each layer may further include one or more functional layers.
The thickness of the high-refractive and low-refractive silicone adhesive layer and the substrate in the silicone film of the invention can be arbitrarily adjusted, and as a specific example, the ratio of the thickness of the high-refractive and low-refractive silicone adhesive layer to the thickness of the substrate can be set to 1-10: 10-1. For example, the thickness of the high-refractive and low-refractive silicone adhesive layer may be 20 to 3000 um.
In the present invention, the coating method is not particularly limited, and the thickness can be adjusted by a comma blade or a slit coating head.
Further, the above curing may be applied by heat curing and light curing, or may be applied simultaneously. In the case of thermal curing, the curing may be carried out at a temperature at which the solvent can be volatilized, and the curing may be carried out in 1 to 8 steps as necessary. The curing temperature may vary depending on the solvent used, and may be, for example, 50 to 300 ℃. In addition, in the case of photocuring, the curing time can be 500 to 4000mj/cm2Is cured.
Preferably, the silicone film of the present invention further comprises a low refractive silicone adhesive layer adjacent to the upper surface or the lower surface of the above-described high refractive silicone adhesive layer. In this case, the film has high transparency, high heat resistance, low reflectance, vibration resistance, no yellowing, impact resistance and high adhesion, is advantageous for functional lamination, and has high visibility.
The low refractive silicone adhesive layer may be a polymer resin represented by [ A ] - [ B- [ C ] or [ A ] - [ C ] - [ B ] of the above chemical formula 1 without MO in the above silicone adhesive, and if necessary, a crosslinking agent may be incorporated in the above [ A ] - [ B- [ C ] or [ A ] - [ C ] and [ B ]. In this case, [ A ] has a terminal 1-valent hydrogen; deuterium; halogen; an amine group; an epoxy group; a cyclohexyl epoxy group; a (meth) acryloyl group; a hydroxyl group; a thiol group; an isocyanate group; a nitrile group; a nitro group; a phenyl group; C1-C40 alkyl; alkenyl of C2-C40; alkoxy of C1-C40; cycloalkyl of C3-C40; C3-C40 heterocycloalkyl; aryl of C6-C40; or a heteroaryl group of C3 to C40.
Further, it may be a silicone adhesive having a low refractive index as disclosed in the prior application korean patent laid-open publication No. 10-2020-0075278 of the present inventor.
Specifically, the refractive index of the high-refractive silicone adhesive layer is 1.50 to 1.90, and the refractive index of the low-refractive silicone adhesive layer is 1.30 to 1.49. Preferably, the difference between the refractive index of the high refractive silicone adhesive layer and the refractive index of the low refractive silicone adhesive layer may be 0.2 to 0.3. In this case, the transparency, low reflectance, and visibility can be further improved.
Further, the permeability of the silicone film is preferably 95% or more.
FIGS. 1 to 5 respectively show the silicone films according to the embodiments of the present invention.
Fig. 1 is a film of a high refractive silicone adhesive layer having a release film on both sides and cured with a silicone adhesive of the present invention interposed between the release films, fig. 2 is a film having a release film on a surface and a high refractive silicone adhesive layer and a low refractive silicone adhesive layer interposed adjacent to each other, fig. 3 and 4 are films in which a high refractive silicone adhesive layer and a low refractive silicone adhesive layer are disposed adjacent to both sides of a PET film and a release film is bonded thereto, and fig. 5 is a film in which a high refractive silicone adhesive layer and a low refractive silicone adhesive layer are disposed adjacent to both sides of a PET film and a release film is bonded to one side and a hard coat layer is bonded to the other side.
The silicone film of the present invention is not limited to the above-described structure, and various changes can be made.
In addition, in the case where the silicone film of the present invention includes two or more adhesive layers, the adhesive force of the adhesive layers may be different from each other. The films having different upper and lower adhesive forces may be films obtained by coating silicone adhesives having different adhesive forces on the two films, respectively, and curing the films, and then laminating portions of the silicone adhesives on each other, or functional silicone films having different adhesive forces on both sides may be produced by coating the silicone adhesives having different adhesive forces on both sides. This case can be effectively applied to adhesive layers requiring different adhesive forces from top to bottom.
In addition, the present invention provides a backlight unit comprising the above silicone film. Specifically, the backlight unit may be a surface-emitting backlight unit.
Fig. 6 is a diagram illustrating a separated and combined state of a backlight unit using micro LED local dimming according to an embodiment of the present invention.
Referring to fig. 6, the backlight unit using micro LEDs for local dimming according to an embodiment of the present invention includes: a plate 300 in which micro LEDs 310 capable of emitting light upward are arranged in a plane at predetermined intervals; a first silicone film 210 which is located on the upper surface of the plate 300 in a film form and functions as an adhesive sheet; a reflective sheet 100 on the upper surface of the first silicone film 210, wherein a hole 110 is punched in a section corresponding to the micro LED310 to transmit a light source, and the remaining portion except the section corresponding to the micro LED310 is formed to shield the light source; and a second silicone film 220 which is located on the upper surface of the reflective sheet 100 in a film form and diffuses the light source output from the reflective sheet 100.
The hole 110 is characterized in that the first and second silicone films 210 and 220 are closely adhered to the reflective sheet 100 so as to form a vacuum.
The board 300 is characterized in that the micro LEDs 310 are formed at intervals of 2mm in the lateral and longitudinal directions.
The thickness of the second silicone film 220 can be thicker than the thickness of the first silicone film 210.
In the present invention, the size and the interval of the micro LEDs 310 as the light source, which can uniformly radiate the light source in the plane section of the light guide plate, can be arbitrarily adjusted, and particularly in the case of the present invention, the size of the micro LEDs is preferably 0.1mm or less, and the micro LED interval may be arranged in a range of 1 to 4mm as a specific example.
In order to prevent loss of light reflected in the same manner as the section of the micro LED310, only the direct section of the reflection sheet 100 in contact with the light source is left for shielding.
The reflecting sheet 100 is punched with holes 110 at intervals of the micro LEDs 310 to guide the light in the direction of the screen.
The first organic silicon film 210 and the second organic silicon film 220 are characterized in that the reflective sheet 100 is closely adhered by vacuum lamination.
The micro LED310 may be a rectangular solid having one side of 0.1 mm.
The hole 110 is characterized by being formed in a cylindrical or rectangular parallelepiped shape.
The thickness of the first silicone film 210 may be 0.025 mm.
The thickness of the reflective sheet 100 may be 0.075 mm.
The thickness of the second silicone film 210 may be 0.4 mm.
As shown in fig. 6, the first silicone film 210, the reflective sheet 100, and the second silicone film 220 may be closely adhered to each other and attached, and the composition of the first silicone film or the second silicone film 220 may fill the gap between the hole 110 of the reflective sheet 100 and the LED310 of the board 300 in a vacuum state.
For this purpose, the first silicone film 210, the reflective sheet 100, and the second silicone film 220 may be adhered to each other by vacuum pressure bonding, and then the plates may be adhered to each other again.
Here, the light guide plate may be composed of the first silicone film 210, the reflective sheet 100, and the second silicone film 220, and the upper surface of the second silicone film 220 may further include a protective film or a light diffusion film. As a specific example of the protective film, a PET film can be used. The adhesion of the second silicone film 220 can be adjusted according to the presence or absence of the protective film or the light diffusion film.
The first silicone film 210 may be a high refractive silicone adhesive layer using the high refractive silicone adhesive of the present invention, or may be a film in which a high refractive silicone adhesive layer and a low refractive silicone adhesive layer are bonded. The first silicone film 210 may have a light transmittance (measured by UV-VIS Melten (Minolta) CM-5) of 94% or more, and may have an adhesive force of 3000 to 6000 gf/inch.
The second silicone film 220 may be a high refractive silicone adhesive layer using the high refractive silicone adhesive of the present invention, or may be a film in which a high refractive silicone adhesive layer and a low refractive silicone adhesive layer are bonded. The second silicone film 220 can be made of a material having a light transmittance (measured by UV-VIS Meinenda CM-5) of 94% or more, and the adhesion can be arbitrarily adjusted, for example, a film having 3000 to 6000 gf/inch.
The light guide plate and the backlight unit of the present invention generate heat as the brightness of the light source is increased, and by reversely using the heat, the size of the light source can be reduced, the area of the light source can be minimized, and the loss of brightness can be minimized while the area of the light source is reduced by using the side light source as the whole light source of the bottom plate.
In addition, the light guide plate of the present invention can maximize the effect of the light source by disposing the silicone films on both sides of the reflective sheet to form diffusion when receiving the LED light source and to form diffusion again when passing through the reflective film.
In addition, the brightness of the LED light source is adjusted by using the dimming method for adjusting the brightness of the light source, so that the shadow difference of the brightness of the picture is expanded to a local area, and the visible effect of the external environment, namely the sunlight state, can be improved.
Hereinafter, the present invention will be described in detail with reference to examples. However, the embodiments of the present invention may be modified into various other forms, and the scope of the present invention should not be construed as being limited to the embodiments described in detail below. The embodiments of the present invention are provided to more fully explain the present invention to those skilled in the art.
Examples 1 to 4 and comparative example 1
The components described in table 1 below were uniformly mixed to produce a silicone adhesive. Examples 1 to 4 used the composite polymer resin represented by chemical formula 1, and in particular, example 1 used a composite polymer resin to which zirconium oxide was bonded as a metal oxide, example 2 used a composite polymer resin to which titanium oxide was bonded, example 3 used a composite polymer resin to which zinc oxide was bonded, a platinum-based catalyst was used as a catalyst, and toluene was used as a solvent. Example 4 was the same as example 1 except that the contents of the catalyst and the solvent were different. As comparative example 1, a silsesquioxane resin of the following chemical formula 5 was used instead of the composite polymer resin represented by chemical formula 1 to manufacture an adhesive. In addition, as reference example 1, an adhesive was produced in the same content except that the polymer resin not containing the metal oxide in example 1 was used in order to produce a low refractive silicone adhesive. The unit of content is part by weight.
[ Table 1]
| Distinguishing | Composite polymer resin | Catalyst and process for preparing same | Solvent(s) |
| Example 1 | 100 | 0.2 | 200 |
| Example 2 | 100 | 0.2 | 200 |
| Example 3 | 100 | 0.2 | 200 |
| Example 4 | 100 | 0.3 | 220 |
| Comparative example 1 | 100 | 0.2 | 200 |
| Reference example 1 | 100 | 0.2 | 200 |
[ chemical formula 5]
In the chemical formula 5, m is an integer of 1 to 100.
Experiment 1
The silicone adhesive of examples 1 to 4 and comparative example 1 was applied on a 100um thick PET film and dried at 150 ℃ for 1 minute to form a silicone adhesive layer.
A fluorine-based release film was bonded to the upper portion of the silicone adhesive layer, and the resultant was allowed to stand at room temperature for 24 hours. After the above sample was cut at a width of 25mm, the release film was removed. A saponified TAC film fixed to the glass with a double-sided adhesive is bonded to the upper portion of the silicone adhesive layer from which the release film was removed.
The sample (TAC/OCA/PET) prepared as described above was left to stand at normal temperature for 24 hours, and then peeled at 180 ° using autosGRAPH to measure the peeling force, and the results are shown in table 1 below.
In addition, the above-manufactured sample (TAC/OCA/PET) was folded at angles of 0 ° and 180 ° toward the TAC film, and crack (crack) and peel resistance of PET were evaluated up to 20 ten thousand every 1 ten thousand times, and the results are shown in table 2 below.
[ Table 2]
As shown in Table 2, it was confirmed that the silicone adhesives of examples 1 to 4 of the present invention have significantly improved cracking properties and peeling properties, and particularly exhibit an adhesive force of 4000 gf/inch or more and significantly improved adhesive force (2500 gf/inch or less) of conventional silicone adhesives, as compared with comparative example 1.
Experiment 2
Adhesive sheets were produced as examples 5 to 8 using the high refractive silicone adhesive layers using the adhesives of examples 1 to 4 and the low refractive silicone adhesive layer using the adhesive of reference example 1. As comparative example 2, a sheet of reference example 1 was formed in two layers. The adhesive sheets of examples 5 to 8 and comparative example 2 were measured for transmittance and are shown in table 3 below.
[ Table 3]
| Distinguishing | First layer | Second layer | Transmittance (%) |
| Example 5 | Example 1 | Reference example 1 | 99.1 |
| Example 6 | Example 2 | Reference example 1 | 98.5 |
| Example 7 | Example 3 | Reference example 1 | 98.6 |
| Example 8 | Example 4 | Reference example 1 | 98.4 |
| Comparative example 2 | Reference example 1 | Reference example 1 | 93.2 |
As shown in table 3 above, it was confirmed that the adhesive sheets of examples 5 to 8 of the present invention include both the high refractive silicone adhesive layer and the low refractive silicone adhesive layer, and thus have significantly superior transmittance compared to the adhesive sheet of comparative example 2 including only the low refractive silicone adhesive layer, and are suitable for use as an OCA film.
While the foregoing has been with reference to a limited number of embodiments and drawings, it will be apparent to those skilled in the art that various changes and modifications can be made therein without departing from the scope of the invention as defined in the appended claims. For example, reasonable results can be achieved even if the described techniques are performed in a different order than the described methods, and/or the described components are combined or combined in a different form than the described methods, or replaced or substituted with other components or equivalents. Accordingly, other presentations, other embodiments, and equivalents of the scope of the claims are also within the scope of the claims that follow.
Claims (8)
1. A silicone adhesive comprising a composite polymer resin represented by the following chemical formula 1:
chemical formula 1
In the chemical formula 1, the metal oxide is represented by,
MO is a metal oxide, A is the following chemical formula 2, B is the following chemical formula 3, C is the following chemical formula 4,
chemical formula 2
Chemical formula 3
Chemical formula 4
In the chemical formulas 2-4, the metal oxide,
R1each independently hydrogen having a valence of 1; deuterium; halogen; an amine group; an epoxy group; a cyclohexyl epoxy group; a (meth) acryloyl group; a hydroxyl group; a thiol group; an isocyanate group; a nitrile group; a nitro group; a phenyl group; C1-C40 alkyl; alkenyl of C2-C40; alkoxy of C1-C40; cycloalkyl of C3-C40; C3-C40 heterocycloalkyl; aryl of C6-C40; or a heteroaryl group of C3 to C40,
R2each of which isIndependently hydrogen having a valence of 1; deuterium; halogen; an amine group; an epoxy group; a cyclohexyl epoxy group; a (meth) acryloyl group; a hydroxyl group; a thiol group; an isocyanate group; a nitrile group; a nitro group; a phenyl group; C1-C40 alkyl; alkenyl of C2-C40 substituted or unsubstituted by halogen; alkoxy of C1-C40; cycloalkyl of C3-C40; C3-C40 heterocycloalkyl; aryl of C6-C40; or a heteroaryl group of C3 to C40, at least one of which is methyl, vinylmethyl, phenylvinylmethyl or fluorovinylmethyl,
R3each independently hydrogen having a valence of 1; deuterium; halogen; an amine group; an epoxy group; a cyclohexyl epoxy group; a (meth) acryloyl group; a hydroxyl group; a thiol group; an isocyanate group; a nitrile group; a nitro group; a phenyl group; C1-C40 alkyl; alkenyl of C2-C40; alkoxy of C1-C40; cycloalkyl of C3-C40; C3-C40 heterocycloalkyl; aryl of C6-C40; or a heteroaryl group of C3 to C40, at least one of which is acryloyl or methacryloyl,
x, y and z are each independently an integer of 1 to 100,
q is an integer of 1 to 200,
the A can be connected with B or C, and the terminal B or C is hydrogen with the valence of 1; deuterium; halogen; an amine group; an epoxy group; a cyclohexyl epoxy group; a (meth) acryloyl group; a hydroxyl group; a thiol group; an isocyanate group; a nitrile group; a nitro group; a phenyl group; C1-C40 alkyl; alkenyl of C2-C40; alkoxy of C1-C40; cycloalkyl of C3-C40; C3-C40 heterocycloalkyl; aryl of C6-C40; or a heteroaryl group of C3 to C40.
2. The silicone adhesive according to claim 1, further comprising a solvent.
3. The silicone adhesive according to claim 1, wherein the metal oxide is one or more selected from the group consisting of zirconium oxide, titanium oxide, zinc oxide, hafnium oxide, and yttrium oxide.
4. A silicone film comprising a high refractive silicone adhesive layer obtained by applying the silicone adhesive according to any one of claims 1 to 3 on a substrate and curing the applied silicone adhesive.
5. The silicone film of claim 4, further comprising a low refractive silicone adhesive layer adjacent to an upper surface or a lower surface of the high refractive silicone adhesive layer.
6. The silicone film according to claim 5, wherein the refractive index of the high refractive silicone adhesive layer is 1.50 to 1.90, and the refractive index of the low refractive silicone adhesive layer is 1.30 to 1.49.
7. The silicone film according to claim 5, wherein the permeability of the silicone film is 95% or more.
8. A backlight unit comprising the silicone film according to any one of claims 4 to 7.
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|---|---|---|---|---|
| JP2010150341A (en) * | 2008-12-24 | 2010-07-08 | Nitto Denko Corp | Silicone resin composition |
| JP2011168675A (en) * | 2010-02-17 | 2011-09-01 | Nitto Denko Corp | Adhesive composition and method for producing adhesive |
| CN102702532A (en) * | 2012-05-31 | 2012-10-03 | 中科院广州化学有限公司 | Method for preparing organosilicone hybrid resin and power type encapsulating material for light-emitting diodes (LED) thereof and application |
| US20130154473A1 (en) * | 2010-09-01 | 2013-06-20 | Hitachi, Ltd. | Adhesive sheet, as well as optical member and organic light emission device using the same |
| CN106604968A (en) * | 2014-06-19 | 2017-04-26 | 英克伦股份有限公司 | Transparent siloxane encapsulant and adhesive |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010150341A (en) * | 2008-12-24 | 2010-07-08 | Nitto Denko Corp | Silicone resin composition |
| JP2011168675A (en) * | 2010-02-17 | 2011-09-01 | Nitto Denko Corp | Adhesive composition and method for producing adhesive |
| US20130154473A1 (en) * | 2010-09-01 | 2013-06-20 | Hitachi, Ltd. | Adhesive sheet, as well as optical member and organic light emission device using the same |
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