CN114539776B - 介电弹性体金属化材料及制备方法 - Google Patents
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Abstract
介电弹性体金属化材料及制备方法,该方法包括如下步骤:在无机非金属颗粒外包覆多巴胺活性层;配置形成介电弹性体薄膜的介电弹性体材料溶液,将包覆有所述多巴胺活性层的无机非金属颗粒分散于所述介电弹性体材料溶液内,并对所述介电弹性体材料溶液进行固化,形成介电弹性体薄膜;对所述介电弹性体薄膜的表面进行亲水化处理;采用磁控溅射的方式,在经过亲水化处理的所述介电弹性体薄膜的表面形成第一金属层;采用电镀工艺在所述第一金属层的表面形成第二金属层。由该该介电弹性体金属化材料的制备方法制作而成的介电弹性体金属化材料,其介电常数较高,介电损耗较小,金属层与介电弹性材料之间的结合力较大。
Description
技术领域
本发明涉及介电材料技术领域,尤其是一种介电弹性体金属化材料及制备方法。
背景技术
介电弹性体材料具有优异的弯曲和拉伸特性可广泛应用于柔性电子领域,但作为通讯介质基板,现有的介电弹性体材料的介电常数较低(约为2.7),不利于器件的小型化。这会增加器件体积,影响器件使用,产生较大的介质损耗(约为0.02),增加器件损耗,不利于器件性能的提高。制备高介电常数和低介电损耗的介电弹性体材料是解决这一问题的重要途径。
另外作为通讯器件的介质材料,介电弹性体材料表面必须进行金属化,需要金属层材料具有一定的厚度以完成导热和信号传输,还需要金属层被做成响应的金属图案以实现响应的功能。由于线图图案向精细和高密度方向发展,需要金属层与介质基板具有较高的结合力以提高器件的可靠性和加工性。因此提高金属层与介电弹性体材料的结合力,是提高器件可靠性和性能稳定的重要途径。
发明内容
有鉴于此,本发明提供了一种介电弹性体金属化材料及该介电弹性体金属化材料的制备方法,由该该介电弹性体金属化材料的制备方法制作而成的介电弹性体金属化材料,其介电常数较高,介电损耗较小,金属层与介电弹性材料之间的结合力较大。
本发明提供了一种介电弹性体金属化材料的制备方法,包括如下步骤:
S1:在无机非金属颗粒外包覆多巴胺活性层;
S2:配置形成介电弹性体薄膜的介电弹性体材料溶液,将包覆有所述多巴胺活性层的无机非金属颗粒分散于所述介电弹性体材料溶液内,并对所述介电弹性体材料溶液进行固化,形成介电弹性体薄膜;
S3:对所述介电弹性体薄膜的表面进行亲水化处理;
S4:采用磁控溅射的方式,在经过亲水化处理的所述介电弹性体薄膜的表面形成第一金属层;
S5:采用电镀工艺在所述第一金属层的表面形成第二金属层。
进一步地,在所述无机非金属颗粒外包覆多巴胺活性层时,该方法还包括如下步骤:
配置多巴胺溶液;
将所述无机非金属颗粒分散于所述多巴胺溶液内;
将混合有所述无机非金属颗粒的多巴胺溶液经过过滤、烘干、水洗、再烘干后,以在所述无机非金属颗粒外包覆所述多巴胺活性层。
进一步地,所述多巴胺溶液的浓度为0.1-0.5g/mL。
进一步地,所述无机非金属颗粒包括钛酸锶、二氧化钛和钛酸钙等中的一种或多种。
进一步地,所述无机非金属颗粒的尺寸为0.1-1μm,所述多巴胺活性层的厚度为2-20nm。
进一步地,所述介电弹性体材料溶液为PDMS溶液或TPU溶液。
进一步地,在S2步骤中,对所述介电弹性体材料溶液进行加热固化,固化温度为60-120℃。
进一步地,所述第一金属层的厚度为50-100nm,所述第二金属层的厚度为9-18μm。
进一步地,所述第一金属层及第二金属层的材料为Cu、Ni、Cr、Au、Ag、Al、Ti及Pt中的一种或多种。
本发明还提供了一种介电弹性体金属化材料,所述介电弹性体金属化材料由上述的介电弹性体金属化材料的制备方法制作而成。
综上所述,在本发明中,通过在介电弹性体薄膜内添加无机非金属颗粒,能够提高介电弹性体薄膜的介电常数,降低介电损耗;通过在无机非金属颗粒外包覆多巴胺活性层,多巴胺活性层上的羟基等活性基团一方面能够较好地吸附于无机非金属颗粒的表面上,另一方面还可以与介电弹性体薄膜具有较好的相容性,降低异质材料之间的差异,弱化界面效应,进一步地降低介电弹性层的介电损耗,提高微波介电性能。
进一步地,通过在介电弹性体薄膜上先利用磁控溅射的方法,形成一层较薄的第一金属层,然后利用电镀工艺形成较厚的第二金属层,这一方面能够使金属层的厚度达到需要,另一方面还能够保证金属层与介电弹性体薄膜之间结合的紧密。
上述说明仅是本发明技术方案的概述,为了能够更清楚了解本发明的技术手段,而可依照说明书的内容予以实施,并且为了让本发明的上述和其他目的、特征和优点能够更明显易懂,以下特举较佳实施例,并配合附图,详细说明如下。
附图说明
图1所示为本发明实施例提供的介电弹性体金属化材料的制备方法各步骤的流程示意图。
图2所示为本发明实施例提供的介电弹性体金属化材料的结构示意图。
具体实施方式
为更进一步阐述本发明为达成预定发明目的所采取的技术手段及功效,以下结合附图及较佳实施例,详细说明如下。
本发明提供了一种介电弹性体金属化材料及该介电弹性体金属化材料的制备方法,由该该介电弹性体金属化材料的制备方法制作而成的介电弹性体金属化材料,其介电常数较高,介电损耗较小,金属层与介电弹性材料之间的结合力较大。
图1所示为本发明实施例提供的介电弹性体金属化材料的制备方法各步骤的流程示意图。如图1所示,本发明实施例提供的介电弹性体金属化材料包括如下步骤:
S1:在无机非金属颗粒10外包覆多巴胺活性层20;
在本实施例中,无机非金属颗粒10可以为钛酸锶、二氧化钛和钛酸钙等中的一种或多种。该无机非金属颗粒10的尺寸为0.1-1μm。包覆层的厚度为2-20nm。
在将多巴胺活性层20包覆于无机非金属颗粒10外时,该方法包括如下步骤:
配置多巴胺溶液,优选地,该多巴胺溶液的浓度为0.1-0.5g/mL;
将无机非金属颗粒10分散于多巴胺溶液内;
将混合有无机非金属颗粒10的多巴胺溶液经过过滤、烘干、水洗、再次烘干后,形成多巴胺活性层20包覆的无机非金属颗粒10。
S2:配置形成介电弹性体薄膜30的介电弹性体材料溶液,将包覆有多巴胺活性层20的无机非金属颗粒10分散于该介电弹性体材料溶液内,并对该溶液进行固化,以形成介电弹性体薄膜30,此时,包覆有多巴胺活性层20的无机非金属颗粒10分散于介电弹性体薄膜30内;
在本实施例中,介电弹性体材料溶液可以为PDMS(聚二甲基硅氧烷;Polydimethylsiloxane)溶液,或TPU(热塑性聚氨酯弹性体;Thermoplasticpolyurethanes)溶液。
在配置PDMS溶液时,可以将PDMS预聚体及固化剂按照质量比10:1-20:1的比例均匀混合,以形成PDMS溶液。
在配置TPU溶液时,可以将1KPa-1MPa模量的TPU颗粒用DMF(N,N-二甲基甲酰胺;N,N-Dimethylformamide)溶液熔融,以形成TPU溶液。
在将包覆有多巴胺活性层20的无机非金属颗粒10分散于介电弹性体材料溶液内时,可以通过真空搅拌、超声搅拌等方式以增加均匀性。
在进行固化时,其固化温度可以为60-120℃。
在该步骤的处理后,介电弹性体薄膜30的介电常数为10-30,介电损耗≤0.02。
S3:对S2步骤中的介电弹性体薄膜30的表面进行亲水化处理;
在本实施例中,在进行亲水化处理时,可以将该介电弹性体薄膜30置于真空腔室进行等离子体处理,处理的气体为Ar、O2、N2和/或它们的混合气体。处理电压为1000~2000V,电流为0.1~1A,处理时间为30s~1min,使得薄膜表面具有一定的亲水性。在进行亲水化处理后,介电弹性体薄膜30的表面的表面张力≥60达因。
S4:采用磁控溅射方式,在亲水化处理后的介电弹性体薄膜30表面形成第一金属层40;
在本实施例中,第一金属层40的厚度可以为50-100nm。第一金属层40的材料可以为Cu、Ni、Cr、Au、Ag、Al、Ti及Pt中的一种或多种。
S5:采用电镀工艺在第一金属层40表面形成第二金属层50。
在本实施例中,第二金属层50的厚度为9-18μm。第二金属层50的材料可以为Cu、Ni、Cr、Au、Ag、Al、Ti及Pt中的一种或多种。在第二金属层50成型后,第二金属层50与介电弹性体薄膜30之间的结合力为5B(采用百格法测试)。
在本实施例中,通过在介电弹性体薄膜30内添加无机非金属颗粒10,能够提高介电弹性体薄膜30的介电常数,降低介电损耗;通过在无机非金属颗粒10外包覆多巴胺活性层20,多巴胺活性层20上的羟基等活性基团一方面能够较好地吸附于无机非金属颗粒10的表面上,另一方面还可以与介电弹性体薄膜30具有较好的相容性,降低异质材料之间的差异,弱化界面效应,进一步地降低介电弹性层的介电损耗,提高微波介电性能。
进一步地,通过在介电弹性体薄膜30上先利用磁控溅射的方法,形成一层较薄的第一金属层40,然后利用电镀工艺形成较厚的第二金属层50,这一方面能够使金属层的厚度达到需要,另一方面还能够保证金属层与介电弹性体薄膜30之间结合的紧密。
以下以具体的实施例来对上述方法进行说明:
实施例1
将20g PDMS预聚体与固化剂分别按照10:1混合,形成PDMS溶液。将2g粒径为0.1μm的二氧化钛颗粒在0.1g/mL的多巴胺溶液中分散均匀,烘干后形成多巴胺包覆的二氧化钛颗粒。将该颗粒加入PDMS溶液充分搅拌均匀,并将该混合溶液置于模具内成型,在60℃烘箱内保温4小时固化成型。将成型后的介电弹性体薄膜30置于真空腔室,采用等离子体清洗,使得薄膜表面的表面张力为60达因,等离子体清洗的工艺参数为:Ar气,1000V电压,0.1A电流,处理时间为30秒。再采用磁控溅射在薄膜表面沉积一定厚度的Cu薄膜,以形成第一金属层40,其厚度为50nm,再采用电镀工艺,电镀铜金属厚度为9微米,形成第二金属层50。经过介电性能测试,该薄膜的微波介电常数为10,介电损耗为0.02,第一金属层40与第二金属层50形成的整体金属层与聚合物薄膜的结合力为5B。
实施例2
将20g模量为1KPa的TPU颗粒用DMF溶液充分溶解,形成TPU溶液。将6g粒径为1μm的钛酸锶颗粒在0.5g/mL的多巴胺溶液中分散均匀,烘干后形成多巴胺包覆的钛酸锶颗粒。将该颗粒加入TPU溶液充分搅拌均匀,并将该混合溶液置于模具内成型,在100℃烘箱内保温3小时固化成型。将成型后的介电弹性体薄膜30置于真空腔室,采用等离子体清洗,使得薄膜表面的表面张力为80达因,等离子体清洗的工艺参数为:O2气,2000V电压,1A电流,处理时间为1min秒。再采用磁控溅射在薄膜表面沉积一定厚度的Ag薄膜,以形成第一金属层40,其厚度为100nm,再采用电镀工艺,电镀铜金属厚度为18微米,形成第二金属层50。经过介电性能测试,该薄膜的微波介电常数为30,介电损耗为0.015,第一金属层40与第二金属层50形成的整体金属层与聚合物薄膜的结合力为5B。
本发明还提供了一种介电弹性体金属化材料,该介电弹性体金属化材料由上述的介电弹性体金属化材料的制备方法制作而成,关于该介电弹性体金属化材料的其它技术特征,请参见现有技术,在此不再赘述。
以上所述,仅是本发明的较佳实施例而已,并非对本发明作任何形式上的限制,虽然本发明已以较佳实施例揭露如上,然而并非用以限定本发明,任何熟悉本专业的技术人员,在不脱离本发明技术方案范围内,当可利用上述揭示的技术内容作出些许更动或修饰为等同变化的等效实施例,但凡是未脱离本发明技术方案内容,依据本发明的技术实质对以上实施例所作的任何简单修改、等同变化与修饰,均仍属于本发明技术方案的范围内。
Claims (8)
1.一种介电弹性体金属化材料的制备方法,其特征在于:包括如下步骤:
S1:在无机非金属颗粒外包覆多巴胺活性层,所述无机非金属颗粒包括钛酸锶、二氧化钛和钛酸钙中的一种或多种;
S2:配置形成介电弹性体薄膜的介电弹性体材料溶液,将包覆有所述多巴胺活性层的无机非金属颗粒分散于所述介电弹性体材料溶液内,并对所述介电弹性体材料溶液进行固化,形成介电弹性体薄膜;
S3:对所述介电弹性体薄膜的表面进行亲水化处理;
S4:采用磁控溅射的方式,在经过亲水化处理的所述介电弹性体薄膜的表面形成第一金属层;
S5:采用电镀工艺在所述第一金属层的表面形成第二金属层,所述第一金属层的厚度为50-100nm,所述第二金属层的厚度为9-18μm。
2.根据权利要求1所述的介电弹性体金属化材料的制备方法,其特征在于:在所述无机非金属颗粒外包覆多巴胺活性层时,该方法还包括如下步骤:
配置多巴胺溶液;
将所述无机非金属颗粒分散于所述多巴胺溶液内;
将混合有所述无机非金属颗粒的多巴胺溶液经过过滤、烘干、水洗、再烘干后,以在所述无机非金属颗粒外包覆所述多巴胺活性层。
3.根据权利要求2所述的介电弹性体金属化材料的制备方法,其特征在于:所述多巴胺溶液的浓度为0.1-0.5g/mL。
4.根据权利要求1所述的介电弹性体金属化材料的制备方法,其特征在于:所述无机非金属颗粒的尺寸为0.1-1μm,所述多巴胺活性层的厚度为2-20nm。
5.根据权利要求1所述的介电弹性体金属化材料的制备方法,其特征在于:所述介电弹性体材料溶液为PDMS溶液或TPU溶液。
6.根据权利要求1所述的介电弹性体金属化材料的制备方法,其特征在于:在S2步骤中,对所述介电弹性体材料溶液进行加热固化,固化温度为60-120℃。
7.根据权利要求1所述的介电弹性体金属化材料的制备方法,其特征在于:所述第一金属层及第二金属层的材料为Cu、Ni、Cr、Au、Ag、Al、Ti及Pt中的一种或多种。
8.一种介电弹性体金属化材料,其特征在于:所述介电弹性体金属化材料由权利要求1至权利要求7中任意一项所述的介电弹性体金属化材料的制备方法制作而成。
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