CN113878919B - Mould pressing forming device for nanometer heat insulation material - Google Patents
Mould pressing forming device for nanometer heat insulation material Download PDFInfo
- Publication number
- CN113878919B CN113878919B CN202110978720.5A CN202110978720A CN113878919B CN 113878919 B CN113878919 B CN 113878919B CN 202110978720 A CN202110978720 A CN 202110978720A CN 113878919 B CN113878919 B CN 113878919B
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- China
- Prior art keywords
- layer
- frame
- rigid layer
- rigid
- buffer layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000012774 insulation material Substances 0.000 title abstract description 18
- 238000003825 pressing Methods 0.000 title abstract description 11
- 230000002093 peripheral effect Effects 0.000 claims abstract description 7
- 239000004744 fabric Substances 0.000 claims description 12
- 239000011810 insulating material Substances 0.000 claims description 8
- 239000000835 fiber Substances 0.000 claims description 6
- 238000000748 compression moulding Methods 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 claims description 3
- 229910010293 ceramic material Inorganic materials 0.000 claims description 3
- 239000011121 hardwood Substances 0.000 claims description 3
- 239000007769 metal material Substances 0.000 claims description 3
- 229920005594 polymer fiber Polymers 0.000 claims description 3
- 229920002379 silicone rubber Polymers 0.000 claims description 3
- 239000004945 silicone rubber Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 2
- 238000012797 qualification Methods 0.000 abstract description 4
- 238000005336 cracking Methods 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 238000004080 punching Methods 0.000 abstract 7
- 238000000034 method Methods 0.000 abstract 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 238000000465 moulding Methods 0.000 description 5
- 238000002360 preparation method Methods 0.000 description 3
- 210000000078 claw Anatomy 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000005543 nano-size silicon particle Substances 0.000 description 2
- 239000002861 polymer material Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B30—PRESSES
- B30B—PRESSES IN GENERAL
- B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
- B30B15/02—Dies; Inserts therefor; Mounting thereof; Moulds
- B30B15/022—Moulds for compacting material in powder, granular of pasta form
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Abstract
The invention discloses a mould pressing forming device of a nanometer heat insulation material, which relates to the technical field of equipment manufacturing and comprises an upper mould punching structure, a lower mould punching structure and a mould frame, wherein the upper mould punching structure and the lower mould punching structure are combined mould punching and are formed by connecting a preset layer and a mould punching part, the preset layer comprises a buffer layer and a rigid layer, and the rigid layer is connected with the mould punching part; the mold frame is of a closed frame structure, and the peripheral outline of the rigid layer is consistent with and adjacent to the outline of the inner frame of the mold frame; the buffer layer is arranged on the inner side surface of the rigid layer, and the buffer layer and the mold frame jointly enclose a mold cavity. The device can solve the problems of easy bulge, easy layering and easy cracking in the process of preparing the nano heat insulation material, can be rapidly and perfectly formed, and improves the efficiency and the product qualification rate of the die forming of the nano heat insulation material.
Description
Technical Field
The invention relates to the technical field of equipment manufacturing, in particular to a mould pressing forming device of a nanometer heat insulation material.
Background
The nanometer heat insulating material is prepared with gas phase nanometer silica, inorganic fiber and functional assistant as main material and through mixing and molding. Because the gas phase nano silicon dioxide has extremely small particle size and extremely low apparent density, the bonding strength between powder bodies is low during mould pressing, and when the gas phase nano silicon dioxide is prepared by adopting a traditional mould pressing forming device, the pressure is maintained for a long time, and the defects of bulging, layering, cracking and the like of products are extremely easy to occur, so that the qualification rate and the preparation efficiency of the products are greatly reduced. In order to solve the problems faced by the traditional molding device for preparing the nano heat-insulating material, the invention provides a molding device for the nano heat-insulating material, which is needed to improve the molding efficiency and the product qualification rate of the nano heat-insulating material.
Disclosure of Invention
In order to solve the problems that a product prepared by a traditional mould pressing device is easy to bulge, laminate and crack, the invention provides a mould pressing device for the nano heat insulation material, so that the nano heat insulation material is rapidly and perfectly formed, and the mould pressing efficiency and the product qualification rate of the nano heat insulation material are improved.
The technical scheme adopted by the invention is as follows:
the nanometer heat insulating material compression molding device comprises an upper die stamping structure, a lower die stamping structure and a die frame, wherein the upper die stamping structure and the lower die stamping structure are combined die stamping and are formed by connecting a preset layer and a die stamping, the preset layer comprises a buffer layer and a rigid layer, and the rigid layer is connected with the die stamping; the mold frame is of a closed frame structure, and the peripheral outline of the rigid layer is consistent with and adjacent to the outline of the inner frame of the mold frame; the buffer layer is arranged on the inner side surface of the rigid layer, and the buffer layer and the mold frame jointly enclose a mold cavity.
Preferably, the mold frame is integral or spliced.
Preferably, the buffer layer is a fabric layer, and the thickness of the fabric layer is not less than 1mm; the density of the warp and the weft of the fabric is not more than 50 pieces/cm; the fabric fiber selected for the buffer layer is ceramic fiber or polymer fiber.
Preferably, a gap of 0.5-1mm is reserved between the buffer layer and the die frame for air leakage and die clamping placement.
Preferably, there is a gap of not less than 1.5mm between the peripheral outline of the rigid layer and the inner frame outline of the mold frame.
Preferably, the rigid layer is made of one of metal material, polymer material, ceramic material and hard wood.
Preferably, the closest distance of the punch to the die frame is not less than 10mm.
Preferably, the buffer layer and the rigid layer are bonded by silicone rubber.
Preferably, the rigid layer and the punch are connected in a controlled mode or in a contact-only and non-connected mode, wherein the controlled mode comprises a magnetic mode and a mechanical claw mode, so that further automatic design is facilitated.
Preferably, the outer surface of the punch is provided with a connecting hole for mechanical connection with the press.
Preferably, the two surfaces of the rigid layer and the punch, which are close to each other, are respectively and uniformly provided with grooves, the directions of the grooves on the two surfaces are not in mirror symmetry, the width and the depth of the grooves are not less than 2mm, and the density of the grooves is 10-200m/m 2 。
The beneficial effects obtained by the invention are as follows:
1) The device can be used for the density range of 0.2-1.0g/cm 3 The forming of the nano heat insulation material, the buffer layer has compressibility, and the buffer layer is in soft contact with the nano heat insulation material, so that the slow unloading of stress during demolding can be realized, and the swelling phenomenon of the surface of the nano heat insulation material after demolding is avoided;
2) The die punch of the device is connected with the preset layer in a controllable mode, the die punch moves away during demolding, the preset layer is removed after pressure is unloaded, and the phenomenon that layering and cracking of products are caused due to negative pressure on the surface of the products formed by the fact that the die punch is removed during demolding is avoided.
3) The device has simple structure and convenient preparation, and can realize high-quality and rapid preparation of the nanometer heat insulation material, and the product percent of pass can reach more than 95 percent; after the stamping is connected with an automatic press, automatic production can be realized.
Drawings
FIG. 1 is a schematic diagram of a molding apparatus for nano heat insulating material according to the present invention.
Detailed Description
In order to make the above features and advantages of the present invention more comprehensible, embodiments accompanied with figures are described in detail below.
The embodiment discloses a nano heat-insulating material compression molding device, as shown in figure 1, comprising an upper die stamping structure, a lower die stamping structure and a die frame, wherein the upper die stamping structure and the lower die stamping structure are combined die stamping, and are respectively provided with a preset layer and a dieThe punch is formed by connecting two parts, wherein the preset layer comprises a buffer layer and a rigid layer, and the rigid layer is connected with the punch. The mold frame is a closed frame structure and can be in any shape, such as square (or called a shape of a circle), round (or called a circular ring), and the like, and is integral or spliced. The peripheral outline of the rigid layer is consistent with the outline of the inner frame of the mold frame in shape, and the peripheral outline of the rigid layer and the outline of the inner frame of the mold frame are close to each other, so that a gap of not less than 1.5mm is reserved. The buffer layer is positioned on the inner side surface of the rigid layer and forms a die cavity together with the die frame. The buffer layer is a fabric layer, and the thickness of the fabric layer is not less than 1mm; the density of the warp and the weft of the fabric is not more than 50 pieces/cm; the fabric fiber selected for the buffer layer is ceramic fiber or polymer fiber. A gap of 0.5-1mm is reserved between the buffer layer and the die frame, so that air leakage is facilitated, and die clamping is prevented. The rigid layer is made of one of metal material, polymer material, ceramic material and hard wood. The minimum distance between the die and the die frame is not less than 10mm. One side of the buffer layer is contacted with the nano heat insulation material powder. The buffer layer and the rigid layer are bonded through silicone rubber. The rigid layer and the stamping adopt a controlled connection mode or a contact-only non-connection mode, wherein the controlled connection mode comprises a magnetic connection mode and a mechanical claw connection mode, so that further automatic design is facilitated. The outer surface of the die punch is provided with a connecting hole which is mechanically connected with the press. Grooves are respectively and uniformly distributed on two surfaces of the rigid layer and the stamping, which are close to each other, the directions of the grooves on the two surfaces are not in mirror symmetry, the width and depth of the grooves are not less than 2mm, and the density of the grooves is 10-200m/m 2 。
The embodiment uses the device to carry out compression molding on the nanometer heat insulation material, and the operation steps are as follows:
step one: adding a nano heat insulation material to be pressed into a mold cavity surrounded by a mold frame and a mold structure which is not removed by removing one of the upper mold punch structure and the lower mold punch structure;
step two: resetting the removed stamping structure, and pressing the stamping according to the set pressure. And after the pressure maintaining is finished according to the set time, one or all of the upper and lower stamping structures are removed, and the formed nano heat insulation material block is taken out to obtain the nano heat insulation material pressing component.
Although the present invention has been described with reference to the above embodiments, it should be understood that the invention is not limited thereto, and that modifications and equivalents may be made thereto by those skilled in the art, which modifications and equivalents are intended to be included within the scope of the present invention as defined by the appended claims.
Claims (9)
1. The nanometer heat insulating material compression molding device is characterized by comprising an upper die stamping structure, a lower die stamping structure and a die frame, wherein the upper die stamping structure and the lower die stamping structure are combined die stamping and are formed by connecting a preset layer and a die stamping, the preset layer comprises a buffer layer and a rigid layer, and the rigid layer is connected with the die stamping; the mold frame is of a closed frame structure, and the peripheral outline of the rigid layer is consistent with and adjacent to the outline of the inner frame of the mold frame; the buffer layer is positioned on the inner side surface of the rigid layer, and the buffer layer and the mold frame jointly enclose a mold cavity; the buffer layer is a fabric layer, and the thickness of the fabric layer is not less than 1mm; the density of the warp and the weft of the fabric is not more than 50 pieces/cm; the fabric fiber selected for the buffer layer is ceramic fiber or polymer fiber.
2. The apparatus of claim 1, wherein the mold frame is monolithic or spliced.
3. The apparatus of claim 1, wherein the rigid layer is connected to the plunger by a controlled connection, including a magnetic connection or a mechanical jaw connection, or by a contact-only disconnection.
4. The device of claim 1, wherein the rigid layer is selected from the group consisting of a metallic material, a polymeric material, a ceramic material, and a hard wood.
5. The apparatus of claim 1, wherein a gap of not less than 1.5mm exists between the peripheral outline of the rigid layer and the inner frame outline of the mold frame, and a gap of 0.5-1mm exists between the cushioning layer and the mold frame.
6. The device of claim 1, wherein the cushioning layer and the rigid layer are bonded by silicone rubber.
7. The apparatus of claim 1, wherein the closest distance of the punch from the die frame is no less than 10mm.
8. The apparatus of claim 1, wherein the outer surface of the punch is provided with attachment holes for mechanical attachment to the press.
9. The device as claimed in claim 1, wherein the two surfaces of the rigid layer and the stamp which are adjacent to each other are each provided with uniformly distributed grooves, the grooves of the two surfaces are not provided with mirror symmetry, the width and depth of the grooves are not less than 2mm, and the density of the grooves is 10-200m/m 2 。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110978720.5A CN113878919B (en) | 2021-08-25 | 2021-08-25 | Mould pressing forming device for nanometer heat insulation material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110978720.5A CN113878919B (en) | 2021-08-25 | 2021-08-25 | Mould pressing forming device for nanometer heat insulation material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113878919A CN113878919A (en) | 2022-01-04 |
| CN113878919B true CN113878919B (en) | 2023-11-21 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110978720.5A Active CN113878919B (en) | 2021-08-25 | 2021-08-25 | Mould pressing forming device for nanometer heat insulation material |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113878919B (en) |
Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200505607A (en) * | 2003-08-15 | 2005-02-16 | Kinesis Industry Co Ltd | Method for forming a bicycle metal working component and device for same |
| CN2933844Y (en) * | 2006-07-20 | 2007-08-15 | 重庆长安汽车股份有限公司 | Stamping die for thin type material processing |
| JP2009000741A (en) * | 2007-05-23 | 2009-01-08 | Mitsuboshi Belting Ltd | Cushion material for hot pressing |
| CN101722608A (en) * | 2007-04-09 | 2010-06-09 | 杭州兴源过滤科技股份有限公司 | Die-pressing membrane filter plate and molding method thereof |
| CN101758638A (en) * | 2008-12-24 | 2010-06-30 | 台湾铭板股份有限公司 | Hot-pressing light guide plate device |
| CN201841589U (en) * | 2010-10-19 | 2011-05-25 | 广西晶联光电材料有限责任公司 | Anti-adhering plane ceramic target forming die |
| TW201224039A (en) * | 2010-12-09 | 2012-06-16 | Tech Advance Ind Co Ltd | Cushion material for hot-press and its application |
| CN102814853A (en) * | 2012-08-03 | 2012-12-12 | 燕山大学 | Die-bonding resistant method for processing expansive perlite plates |
| CN109129809A (en) * | 2018-07-24 | 2019-01-04 | 陈敏芬 | Improved thermosetting property molding production technology and its mould structure |
| CN110560684A (en) * | 2019-09-29 | 2019-12-13 | 合肥波林新材料股份有限公司 | pressing die and preparation method of powder material |
| CN110899693A (en) * | 2019-12-09 | 2020-03-24 | 株洲钻石切削刀具股份有限公司 | Forming method and forming device for powder metallurgy part |
| CN210908102U (en) * | 2019-09-29 | 2020-07-03 | 合肥波林新材料股份有限公司 | Pressing die for powder material |
| CN211000694U (en) * | 2019-07-16 | 2020-07-14 | 李英 | Compression molding equipment for wooden furniture |
| CN211591453U (en) * | 2019-12-31 | 2020-09-29 | 云浮市盛云岗石有限公司 | Pressure plate for artificial granite vacuum pressing forming device |
-
2021
- 2021-08-25 CN CN202110978720.5A patent/CN113878919B/en active Active
Patent Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200505607A (en) * | 2003-08-15 | 2005-02-16 | Kinesis Industry Co Ltd | Method for forming a bicycle metal working component and device for same |
| CN2933844Y (en) * | 2006-07-20 | 2007-08-15 | 重庆长安汽车股份有限公司 | Stamping die for thin type material processing |
| CN101722608A (en) * | 2007-04-09 | 2010-06-09 | 杭州兴源过滤科技股份有限公司 | Die-pressing membrane filter plate and molding method thereof |
| JP2009000741A (en) * | 2007-05-23 | 2009-01-08 | Mitsuboshi Belting Ltd | Cushion material for hot pressing |
| CN101758638A (en) * | 2008-12-24 | 2010-06-30 | 台湾铭板股份有限公司 | Hot-pressing light guide plate device |
| CN201841589U (en) * | 2010-10-19 | 2011-05-25 | 广西晶联光电材料有限责任公司 | Anti-adhering plane ceramic target forming die |
| TW201224039A (en) * | 2010-12-09 | 2012-06-16 | Tech Advance Ind Co Ltd | Cushion material for hot-press and its application |
| CN102814853A (en) * | 2012-08-03 | 2012-12-12 | 燕山大学 | Die-bonding resistant method for processing expansive perlite plates |
| CN109129809A (en) * | 2018-07-24 | 2019-01-04 | 陈敏芬 | Improved thermosetting property molding production technology and its mould structure |
| CN211000694U (en) * | 2019-07-16 | 2020-07-14 | 李英 | Compression molding equipment for wooden furniture |
| CN110560684A (en) * | 2019-09-29 | 2019-12-13 | 合肥波林新材料股份有限公司 | pressing die and preparation method of powder material |
| CN210908102U (en) * | 2019-09-29 | 2020-07-03 | 合肥波林新材料股份有限公司 | Pressing die for powder material |
| CN110899693A (en) * | 2019-12-09 | 2020-03-24 | 株洲钻石切削刀具股份有限公司 | Forming method and forming device for powder metallurgy part |
| CN211591453U (en) * | 2019-12-31 | 2020-09-29 | 云浮市盛云岗石有限公司 | Pressure plate for artificial granite vacuum pressing forming device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN113878919A (en) | 2022-01-04 |
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