CN113829223A - 一种半导体生产用的基板加工装置 - Google Patents
一种半导体生产用的基板加工装置 Download PDFInfo
- Publication number
- CN113829223A CN113829223A CN202111436061.9A CN202111436061A CN113829223A CN 113829223 A CN113829223 A CN 113829223A CN 202111436061 A CN202111436061 A CN 202111436061A CN 113829223 A CN113829223 A CN 113829223A
- Authority
- CN
- China
- Prior art keywords
- polishing
- silicon wafer
- transmission
- semiconductor production
- substrate processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
- B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/02—Frames; Beds; Carriages
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/04—Headstocks; Working-spindles; Features relating thereto
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/10—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces
- B24B47/12—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces by mechanical gearing or electric power
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/06—Dust extraction equipment on grinding or polishing machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/12—Devices for exhausting mist of oil or coolant; Devices for collecting or recovering materials resulting from grinding or polishing, e.g. of precious metals, precious stones, diamonds or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202111436061.9A CN113829223B (zh) | 2021-11-30 | 2021-11-30 | 一种半导体生产用的基板加工装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202111436061.9A CN113829223B (zh) | 2021-11-30 | 2021-11-30 | 一种半导体生产用的基板加工装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN113829223A true CN113829223A (zh) | 2021-12-24 |
CN113829223B CN113829223B (zh) | 2022-03-01 |
Family
ID=78971920
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202111436061.9A Active CN113829223B (zh) | 2021-11-30 | 2021-11-30 | 一种半导体生产用的基板加工装置 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN113829223B (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114734319A (zh) * | 2022-03-20 | 2022-07-12 | 林小花 | 一种半导体材料处理***及方法 |
CN116922243A (zh) * | 2023-09-19 | 2023-10-24 | 苏州中砥半导体材料有限公司 | 一种基于磷化铟单晶的制备***及制备方法 |
Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000005990A (ja) * | 1998-06-26 | 2000-01-11 | Nippei Toyama Corp | 研削盤 |
JP2000296463A (ja) * | 1999-04-13 | 2000-10-24 | Fujikoshi Mach Corp | 両面研磨装置システム |
JP2009095923A (ja) * | 2007-10-16 | 2009-05-07 | Sd Future Technology Co Ltd | 研磨装置 |
CN103182675A (zh) * | 2013-03-28 | 2013-07-03 | 铜陵迈维电子科技有限公司 | 一种二氧化硅晶片研磨机 |
JP2016007671A (ja) * | 2014-06-24 | 2016-01-18 | 株式会社タカトリ | ワークの両面研削装置及び両面研削方法 |
KR101900795B1 (ko) * | 2017-04-18 | 2018-09-20 | 한국생산기술연구원 | 중심정렬 및 진동방지 구조를 가진 양면가공장치 |
CN108907936A (zh) * | 2018-09-04 | 2018-11-30 | 黄海璇 | 一种家具制造用木材双面打磨机 |
CN112123171A (zh) * | 2020-09-24 | 2020-12-25 | 广州集佳科技有限公司 | 一种半导体制备用抛光装置 |
CN112264908A (zh) * | 2020-10-27 | 2021-01-26 | 龙南新涛亚克力科技有限公司 | 一种亚克力板表面抛光装置 |
CN112518520A (zh) * | 2020-12-02 | 2021-03-19 | 安徽万幡慧巨信息科技发展有限公司 | 一种新能源汽车的刹车片加工用辅助装置 |
CN112536706A (zh) * | 2020-12-21 | 2021-03-23 | 山东舒尔家具有限公司 | 一种实木板抛光机 |
CN213646937U (zh) * | 2020-10-30 | 2021-07-09 | 上高华源玻璃科技有限公司 | 一种玻璃加工用表面抛光设备 |
CN113561023A (zh) * | 2021-06-30 | 2021-10-29 | 安徽中兴流体装备有限责任公司 | 一种法兰整平机 |
-
2021
- 2021-11-30 CN CN202111436061.9A patent/CN113829223B/zh active Active
Patent Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000005990A (ja) * | 1998-06-26 | 2000-01-11 | Nippei Toyama Corp | 研削盤 |
JP2000296463A (ja) * | 1999-04-13 | 2000-10-24 | Fujikoshi Mach Corp | 両面研磨装置システム |
JP2009095923A (ja) * | 2007-10-16 | 2009-05-07 | Sd Future Technology Co Ltd | 研磨装置 |
CN103182675A (zh) * | 2013-03-28 | 2013-07-03 | 铜陵迈维电子科技有限公司 | 一种二氧化硅晶片研磨机 |
JP2016007671A (ja) * | 2014-06-24 | 2016-01-18 | 株式会社タカトリ | ワークの両面研削装置及び両面研削方法 |
KR101900795B1 (ko) * | 2017-04-18 | 2018-09-20 | 한국생산기술연구원 | 중심정렬 및 진동방지 구조를 가진 양면가공장치 |
CN108907936A (zh) * | 2018-09-04 | 2018-11-30 | 黄海璇 | 一种家具制造用木材双面打磨机 |
CN112123171A (zh) * | 2020-09-24 | 2020-12-25 | 广州集佳科技有限公司 | 一种半导体制备用抛光装置 |
CN112264908A (zh) * | 2020-10-27 | 2021-01-26 | 龙南新涛亚克力科技有限公司 | 一种亚克力板表面抛光装置 |
CN213646937U (zh) * | 2020-10-30 | 2021-07-09 | 上高华源玻璃科技有限公司 | 一种玻璃加工用表面抛光设备 |
CN112518520A (zh) * | 2020-12-02 | 2021-03-19 | 安徽万幡慧巨信息科技发展有限公司 | 一种新能源汽车的刹车片加工用辅助装置 |
CN112536706A (zh) * | 2020-12-21 | 2021-03-23 | 山东舒尔家具有限公司 | 一种实木板抛光机 |
CN113561023A (zh) * | 2021-06-30 | 2021-10-29 | 安徽中兴流体装备有限责任公司 | 一种法兰整平机 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114734319A (zh) * | 2022-03-20 | 2022-07-12 | 林小花 | 一种半导体材料处理***及方法 |
CN114734319B (zh) * | 2022-03-20 | 2023-08-22 | 深圳市陆和神州科技有限公司 | 一种半导体材料处理***及方法 |
CN116922243A (zh) * | 2023-09-19 | 2023-10-24 | 苏州中砥半导体材料有限公司 | 一种基于磷化铟单晶的制备***及制备方法 |
CN116922243B (zh) * | 2023-09-19 | 2023-11-28 | 苏州中砥半导体材料有限公司 | 一种基于磷化铟单晶的制备***及制备方法 |
Also Published As
Publication number | Publication date |
---|---|
CN113829223B (zh) | 2022-03-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN113829223B (zh) | 一种半导体生产用的基板加工装置 | |
US7029380B2 (en) | Double-side polishing method and apparatus | |
CN107322452B (zh) | 智能多工段曲面抛光机 | |
WO2021065102A1 (ja) | 研削装置及び研削ヘッド | |
CN210550339U (zh) | 一种新型研磨抛光设备 | |
CN114346794A (zh) | 打磨装置及打磨机器人 | |
TW201922413A (zh) | 基板處理裝置及基板處理方法 | |
CN210024913U (zh) | 一种扫光机的复合转动上磨盘结构 | |
US8137162B2 (en) | Semiconductor wafer polishing machine | |
CN115091285A (zh) | 一种多方向钢衬板打磨装置 | |
CN211332724U (zh) | 一种化学机械抛光装置 | |
CN114131445A (zh) | 一种用于硅片的研磨清洗装置 | |
US6506099B1 (en) | Driving a carrier head in a wafer polishing system | |
JP6941008B2 (ja) | 基板を研磨する方法および装置 | |
JP3651820B2 (ja) | ワークの両面研磨処理方法および装置 | |
CN214203713U (zh) | 一种电池片表层处理装置 | |
JP2827769B2 (ja) | ウエーハ面取部研磨装置 | |
CN113523933B (zh) | 一种晶圆打磨、抛光处理一体装置 | |
JP2000077379A (ja) | ブラシ洗浄装置 | |
CN208162111U (zh) | 一种玻璃传送用过渡台 | |
CN220672529U (zh) | 晶圆清洗装置及晶圆减薄设备 | |
CN221390398U (zh) | 一种双平台轮换式打磨平台 | |
CN218613241U (zh) | 一种圆晶处理装置 | |
CN218556488U (zh) | 一种碳化硅晶圆研磨抛光设备 | |
CN221135467U (zh) | 一种化学机械抛光*** |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20220622 Address after: No. 6-1, tanma Road, Tancheng County, Linyi City, Shandong Province, 276100 Patentee after: Tancheng Chengtou Pharmaceutical Co.,Ltd. Address before: No. 178, machenbu village, Lizhuang Town, Tancheng County, Linyi City, Shandong Province, 276100 Patentee before: Linyi Anxin Electric Co.,Ltd. |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A substrate processing device for semiconductor production Effective date of registration: 20221116 Granted publication date: 20220301 Pledgee: Linshang Bank Co.,Ltd. Tancheng sub branch Pledgor: Tancheng Chengtou Pharmaceutical Co.,Ltd. Registration number: Y2022980022039 |