CN113564654A - Needle tube and method for producing needle tube - Google Patents
Needle tube and method for producing needle tube Download PDFInfo
- Publication number
- CN113564654A CN113564654A CN202110803763.XA CN202110803763A CN113564654A CN 113564654 A CN113564654 A CN 113564654A CN 202110803763 A CN202110803763 A CN 202110803763A CN 113564654 A CN113564654 A CN 113564654A
- Authority
- CN
- China
- Prior art keywords
- needle tube
- layer
- conductive layer
- sealing plug
- base material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 239000000463 material Substances 0.000 claims abstract description 63
- 238000002360 preparation method Methods 0.000 claims abstract description 15
- 238000007789 sealing Methods 0.000 claims description 48
- 239000000758 substrate Substances 0.000 claims description 43
- 238000007747 plating Methods 0.000 claims description 36
- 238000010438 heat treatment Methods 0.000 claims description 11
- 229920001296 polysiloxane Polymers 0.000 claims description 2
- 238000005260 corrosion Methods 0.000 abstract description 34
- 230000007797 corrosion Effects 0.000 abstract description 34
- 238000009713 electroplating Methods 0.000 abstract description 5
- 239000010410 layer Substances 0.000 description 95
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 17
- 238000000034 method Methods 0.000 description 16
- 239000000243 solution Substances 0.000 description 14
- 230000002829 reductive effect Effects 0.000 description 10
- 150000003839 salts Chemical class 0.000 description 10
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 9
- 229910052759 nickel Inorganic materials 0.000 description 9
- 238000012360 testing method Methods 0.000 description 9
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 8
- 239000010931 gold Substances 0.000 description 8
- 229910052737 gold Inorganic materials 0.000 description 7
- 229910000856 hastalloy Inorganic materials 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 210000004243 sweat Anatomy 0.000 description 6
- 238000007772 electroless plating Methods 0.000 description 5
- 230000001590 oxidative effect Effects 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 229910052763 palladium Inorganic materials 0.000 description 4
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 239000003112 inhibitor Substances 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 238000002161 passivation Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- 239000003929 acidic solution Substances 0.000 description 2
- 239000012670 alkaline solution Substances 0.000 description 2
- -1 alkalis Chemical class 0.000 description 2
- UORVGPXVDQYIDP-UHFFFAOYSA-N borane Chemical compound B UORVGPXVDQYIDP-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000008139 complexing agent Substances 0.000 description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 2
- NWFNSTOSIVLCJA-UHFFFAOYSA-L copper;diacetate;hydrate Chemical compound O.[Cu+2].CC([O-])=O.CC([O-])=O NWFNSTOSIVLCJA-UHFFFAOYSA-L 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000007935 neutral effect Effects 0.000 description 2
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 2
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- 229910052703 rhodium Inorganic materials 0.000 description 2
- 239000010948 rhodium Substances 0.000 description 2
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 2
- 238000004062 sedimentation Methods 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- VWDWKYIASSYTQR-UHFFFAOYSA-N sodium nitrate Chemical compound [Na+].[O-][N+]([O-])=O VWDWKYIASSYTQR-UHFFFAOYSA-N 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- PAWQVTBBRAZDMG-UHFFFAOYSA-N 2-(3-bromo-2-fluorophenyl)acetic acid Chemical compound OC(=O)CC1=CC=CC(Br)=C1F PAWQVTBBRAZDMG-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- 229910001020 Au alloy Inorganic materials 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910000570 Cupronickel Inorganic materials 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- CLBRCZAHAHECKY-UHFFFAOYSA-N [Co].[Pt] Chemical compound [Co].[Pt] CLBRCZAHAHECKY-UHFFFAOYSA-N 0.000 description 1
- YPPQDPIIWDQYRY-UHFFFAOYSA-N [Ru].[Rh] Chemical compound [Ru].[Rh] YPPQDPIIWDQYRY-UHFFFAOYSA-N 0.000 description 1
- NZYYYKTZOWEGLS-UHFFFAOYSA-N [Sn].[Ce] Chemical compound [Sn].[Ce] NZYYYKTZOWEGLS-UHFFFAOYSA-N 0.000 description 1
- MQRWBMAEBQOWAF-UHFFFAOYSA-N acetic acid;nickel Chemical compound [Ni].CC(O)=O.CC(O)=O MQRWBMAEBQOWAF-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 150000003863 ammonium salts Chemical class 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 229910000963 austenitic stainless steel Inorganic materials 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 229910000085 borane Inorganic materials 0.000 description 1
- 239000006172 buffering agent Substances 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000006555 catalytic reaction Methods 0.000 description 1
- SKEYZPJKRDZMJG-UHFFFAOYSA-N cerium copper Chemical compound [Cu].[Ce] SKEYZPJKRDZMJG-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 150000001805 chlorine compounds Chemical class 0.000 description 1
- 150000001845 chromium compounds Chemical class 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- TVZPLCNGKSPOJA-UHFFFAOYSA-N copper zinc Chemical compound [Cu].[Zn] TVZPLCNGKSPOJA-UHFFFAOYSA-N 0.000 description 1
- DOBRDRYODQBAMW-UHFFFAOYSA-N copper(i) cyanide Chemical compound [Cu+].N#[C-] DOBRDRYODQBAMW-UHFFFAOYSA-N 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- LNOPIUAQISRISI-UHFFFAOYSA-N n'-hydroxy-2-propan-2-ylsulfonylethanimidamide Chemical compound CC(C)S(=O)(=O)CC(N)=NO LNOPIUAQISRISI-UHFFFAOYSA-N 0.000 description 1
- 229940078494 nickel acetate Drugs 0.000 description 1
- QELJHCBNGDEXLD-UHFFFAOYSA-N nickel zinc Chemical compound [Ni].[Zn] QELJHCBNGDEXLD-UHFFFAOYSA-N 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- ACVYVLVWPXVTIT-UHFFFAOYSA-M phosphinate Chemical compound [O-][PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-M 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 230000001376 precipitating effect Effects 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000012279 sodium borohydride Substances 0.000 description 1
- 229910000033 sodium borohydride Inorganic materials 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 239000004317 sodium nitrate Substances 0.000 description 1
- 235000010344 sodium nitrate Nutrition 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/04—Tubes; Rings; Hollow bodies
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1689—After-treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/54—Contact plating, i.e. electroless electrochemical plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/02—Local etching
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/48—Electroplating: Baths therefor from solutions of gold
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/50—Electroplating: Baths therefor from solutions of platinum group metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F3/00—Electrolytic etching or polishing
- C25F3/02—Etching
- C25F3/14—Etching locally
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses a needle tube and a preparation method of the needle tube, wherein the needle tube comprises a base material and a first conducting layer, the base material is cylindrical and is provided with an inner surface and an outer surface which are opposite, and the first conducting layer is arranged on the inner surface of the base material. The needle tube has the advantages of strong corrosion resistance, small contact resistance and low electroplating cost.
Description
Technical Field
The invention relates to the technical field of metal surface coatings, in particular to a needle tube and a preparation method of the needle tube.
Background
As the demands on the corrosion resistance of the Pogo Pin connector in consumer electronics for salt fog and sweat are higher and higher, some corrosion-resistant materials with high salt fog and sweat, such as SUS316, C904, 904L, C276 hastelloy, C22 hastelloy and the like, are applied. However, these materials mainly contain iron species, have high electrical resistance and poor electrical conductivity, and affect the charging efficiency of the device in actual use. The prior art uses less resistive metals (e.g., nickel, gold) to plate the entire part to improve the conductivity of the needle of the Pogo Pin connector, but the plating has lower corrosion resistance than the base material and the plating costs are high.
The above is only for the purpose of assisting understanding of the technical solutions of the present invention, and does not represent an admission that the above is the prior art.
Disclosure of Invention
The invention mainly aims to provide a needle tube, aiming at reducing the contact resistance value of the existing needle tube and improving the corrosion resistance of the needle tube.
To achieve the above object, the present invention provides a needle tube comprising:
the base material is cylindrical and provided with an inner surface and an outer surface which are opposite; and
the first conducting layer is arranged on the inner surface of the substrate.
In one embodiment, the needle cannula further comprises:
the second conducting layer is arranged on the outer surface of the base material, and the thickness of the second conducting layer is smaller than that of the first conducting layer.
In one embodiment, the needle cannula further comprises:
the third conducting layer comprises a first sub-layer arranged on the outer side of the first conducting layer and a second sub-layer arranged on the outer surface of the base material, and the thickness of the first sub-layer is equal to that of the second sub-layer.
In one embodiment, the contact resistance value of the needle tube is greater than or equal to 1 milliohm and less than or equal to 30 milliohm.
The invention also provides a preparation method of the needle tube, which comprises the following steps:
plating a first conductive layer on the inner surface and the outer surface of the substrate;
placing a sealing plug into the substrate to deplate the part of the first conductive layer on the outer surface of the substrate;
and taking out the sealing plug.
In one embodiment, before the step of removing the sealing plug, the method further comprises:
and plating a second conductive layer on the outer surface of the substrate.
In one embodiment, after the step of removing the sealing plug, the method further comprises:
plating a third conductive layer on the inner surface and the outer surface of the substrate.
In one embodiment, the step of removing the sealing plug comprises:
and (3) placing the needle tube with the sealing plug into a heating device, heating to 150-260 ℃, and taking out the sealing plug.
In one embodiment, the sealing plug comprises a plug cap and a plugging part which are connected with each other, and the plugging part is used for plugging into the base material of the needle tube.
In one embodiment, the sealing plug is made of a silicone material or a rubber material.
The needle tube comprises a base material and a first conducting layer; the substrate is cylindrical and provided with an inner surface and an outer surface which are opposite to each other, and the first conducting layer is arranged on the inner surface of the substrate; therefore, the inner surface of the needle tube is plated with the first conductive layer, and the contact resistance value inside the base material is reduced; the outer surface of the needle tube is not provided with a conductive layer, so that the high corrosion resistance of the base material is kept on one hand; on the other hand, the conductivity of the base material is lower than that of the first conductive layer, electrons are not easy to transmit to the base material and the outer surface of the base material, so that the current has low and stable contact impedance in the base material, the conduction is stable, and the current-carrying capacity of the connector and the equipment charging efficiency are improved; on the other hand, the use of plating materials is reduced, and the electroplating cost is reduced; therefore, the needle tube has strong corrosion resistance, small contact resistance and low electroplating cost.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a perspective view of the needle cannula of the present invention prior to assembly with a sealing plug;
FIG. 2 is a cross-sectional view of the syringe and sealing plug of the present invention assembled;
FIG. 3 is a partial cross-sectional view of one embodiment of a needle cannula of the present invention;
FIG. 4 is a partial cross-sectional view of another embodiment of a needle cannula of the present invention;
FIG. 5 is a partial cross-sectional view of a needle cannula according to yet another embodiment of the invention.
The reference numbers illustrate:
| reference numerals | Name (R) | Reference numerals | Name (R) | Reference numerals | Name (R) |
| 1 | |
11 | |
12 | First |
| 13 | Second |
14 | Third |
141 | |
| 142 | |
2 | |
21 | |
| 22 | Inserting |
221 | The |
222 | The second sub-part |
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
It should be noted that if the description of "first", "second", etc. is provided in the embodiment of the present invention, the description of "first", "second", etc. is only for descriptive purposes and is not to be construed as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the meaning of "and/or" appearing throughout is to include three juxtapositions, exemplified by "A and/or B" including either scheme A, or scheme B, or a scheme in which both A and B are satisfied.
The invention provides a needle tube.
Referring to fig. 1 to 5, a needle tube 1 according to the present invention includes a substrate 11 and a first conductive layer 12; the substrate 11 is cylindrical and has an inner surface and an outer surface opposite to each other, and the first conductive layer 12 is disposed on the inner surface of the substrate 11.
In the needle tube 1 of the present invention, the base material 11 is cylindrical, and one end of the base material 11 is open for the needle and the spring to extend into. The substrate 11 may be made of SUS316, 904L, C276 hastelloy, C22 hastelloy or the like, which have high corrosion resistance against salt mist and sweat. Specifically, the SUS316 has a low carbon content, contains 2% to 3% of molybdenum, has good corrosion resistance to reducing salts, various inorganic acids, organic acids, alkalis, and salts, and has various advantages of high temperature resistance, good appearance gloss, excellent work hardenability, non-magnetic solid solution state, good weldability, and the like. The 904L is high-alloying austenitic stainless steel with low carbon content, is specially designed for environments with harsh corrosion conditions, and has good pitting corrosion resistance and crevice corrosion resistance, high stress corrosion cracking resistance, good intergranular corrosion resistance and good machinability and weldability. The C276 hastelloy belongs to a nickel-molybdenum-chromium-iron-tungsten nickel-based alloy, mainly resists moisture and chlorine, various oxidizing chlorides, chloride solution, sulfuric acid and oxidizing salt, and has good corrosion resistance in low-temperature and medium-temperature hydrochloric acid. The C22 hastelloy has better uniform corrosion resistance and local corrosion resistance in an oxidizing medium than the C276 hastelloy, has better resistance to oxidizing and medium reductive corrosion, and has excellent stress corrosion resistance.
The first conductive layer 12 may comprise gold, nickel, rhodium, palladium, and other precious metals, and the needle cannula 1 made of different materials is suitable for different usage scenarios. In the field of Pogo pins, the needle tube 1 is usually plated by electroless plating, and is prepared by barrel plating of hard gold and copper alloy. The preparation method can be divided into two methods according to whether the preparation material contains nickel or not. The first preparation process is no-nickel releasing process, and includes barrel plating of white copper tin or cuprous cyanide as bottom layer and hard gold, and the layer may be rhodium, ruthenium, rhodium ruthenium, platinum cobalt, palladium, silver, tin cerium, copper zinc, matte tin, zinc nickel, copper cerium, copper tin, indium, platinum, etc. depending on the use and function of the product. The second preparation method is a nickel process, namely, firstly barrel plating sulfamic acid type improved nickel plating or common matte nickel sulfate as a bottom layer, and then barrel plating hard gold.
The needle tube 1 of the present invention comprises a base material 11 and a first conductive layer 12; the substrate 11 is cylindrical and has an inner surface and an outer surface which are opposite to each other, and the first conductive layer 12 is arranged on the inner surface of the substrate 11; thus, the inner surface of the needle tube 1 is plated with the first conductive layer 12, so that the contact resistance value inside the base material 11 is reduced; the outer surface of the needle tube 1 is not provided with a conductive layer, so that the high corrosion resistance of the base material 11 is kept; on the other hand, the conductivity of the base material 11 is lower than that of the first conductive layer 12, electrons are not easy to transmit to the base material 11 and the outer surface of the base material 11, so that the current has low and stable contact resistance in the base material 11, the conduction is stable, and the current carrying capacity of the connector and the device charging efficiency are improved; on the other hand, the use of plating materials is reduced, and the electroplating cost is reduced; thus, the needle tube 1 has high corrosion resistance, low contact resistance and low plating cost.
Referring to fig. 4, in an embodiment, the needle tube 1 further includes a second conductive layer 13, the second conductive layer 13 is disposed on the outer surface of the substrate 11, and the thickness of the second conductive layer 13 is smaller than that of the first conductive layer 12. The second conductive layer 13 is suitable for use in a use situation where the contact resistance value of the outer surface of the substrate 11 needs to be reduced. Since the outer surface of the substrate 11 is more exposed to sweat and salt spray than the inner surface, the thickness of the second conductive layer 13 is less than the thickness of the first conductive layer 12, so that the outer surface of the substrate 11 still has good corrosion resistance.
Referring to fig. 5, in an embodiment, the needle tube 1 further includes a third conductive layer 14, the third conductive layer 14 includes a first sub-layer 141 disposed outside the first conductive layer 12, and a second sub-layer 142 disposed on the outer surface of the substrate 11, and a thickness of the first sub-layer 141 is equal to a thickness of the second sub-layer 142. The third conductive layer 14 is also suitable for use in a situation where it is necessary to reduce the contact resistance of the outer surface of the substrate 11. The thickness of the third conductive layer 14 is less than the thickness of the first conductive layer 12, which also ensures that the outer surface of the substrate 11 still has good corrosion resistance.
The contact resistance value of the needle tube 1 is greater than or equal to 1 milliohm and less than or equal to 30 milliohm. In this embodiment, the outer surface of the needle tube 1 is not provided with a conductive layer, the conductivity of the base material 11 is lower than that of the first conductive layer 12, and electrons are not easily transferred to the base material 11 and the outer surface of the base material 11, so that the current has low and stable contact resistance in the base material 11, the contact resistance of the needle tube 1 can be reduced to 1-30 milliohms, and the current carrying capacity of the connector and the charging efficiency of the device are improved.
Referring to fig. 1 to 5, the present invention further provides a method for manufacturing a needle cannula 1, comprising the following steps: plating a first conductive layer 12 on the inner surface and the outer surface of the substrate 11; placing a sealing plug 2 into the substrate 11 to deplate the portion of the first conductive layer 12 on the outer surface of the substrate 11; the sealing plug 2 is removed.
In the preparation method of the present invention, an electroless plating method may be selected to plate the first conductive layer 12 on the inner surface and the outer surface of the substrate 11. The plating solution for electroless plating is generally prepared by adding various auxiliaries to nickel sulfate, nickel acetate, etc. as main salts, hypophosphite, sodium borohydride, borane, hydrazine, etc. as reducing agents, and then performing operations in an acidic solution at 90 ℃ or a neutral solution or an alkaline solution at near room temperature. The chemical plating layer has no electrolytic process, and the general flow is as follows: cleaning, microetching, presoaking, activating, electroless nickel plating, electroless plating, and the like. The electroless plating layer shows superiority in uniformity, corrosion resistance, hardness, weldability, magnetism and decorativeness.
The sealing plug 2 can be inserted into the substrate 11 by an automated robot. The specific structure of the sealing plug 2 will be described in detail later, and will not be described in detail here.
The first conductive layer 12 is removed from the outer surface of the base material 11 by two methods, one is to immerse the needle tube 1 in a stripping solution and remove the plating layer by chemical dissolution. Specifically, certain base metals are subjected to anodic passivation in an alkaline solution or a solution containing a chromium compound, the passivation condition or corrosion inhibition of the solution is utilized to prevent the metal base from being corroded, or substances such as a corrosion inhibitor and the like are added into an acidic solution, so that only the plating metal is subjected to anodic oxidation and is dissolved. Alternatively, the needle tube 1 is electrolyzed in a stripping solution, and the plating layer is removed electrochemically. The plating metal loses electrons at the anode and enters the solution or deposits at the bottom of the tank under the action of a complexing agent or a precipitating agent or an electric field, and when the plating is dissolved and the metal matrix is exposed, the metal matrix is prevented from being corroded by the passivation condition of the solution or the corrosion inhibitor. The electrolytic stripping solution mainly comprises an oxidant, ammonium salt, organic amine, a corrosion inhibitor of a corresponding matrix, a catalyst (such as divalent sulfide) for improving the stripping rate and the like. At present, the deplating of a copper/nickel/chromium or nickel/iron/chromium plating layer on a steel substrate generally adopts a formula which takes ammonium nitrate or sodium nitrate as main salt, acetate as a buffering agent, citric acid and triethanolamine as complexing agents and has neutral pH.
In the deplating process, the sealing plug 2 seals the inside of the base material 11, so that the deplating solution cannot enter the inside of the base material 11, and only the first conductive layer 12 on the outer surface of the base material 11 is deplated.
The needle tube 1 prepared by the preparation method of the needle tube 1 has the advantages of strong corrosion resistance, small contact resistance and low cost; in addition, the sealing plug 2 adopted in the preparation method of the needle tube 1 can be recycled, and the use is convenient.
In an embodiment, before the step of removing the sealing plug 2, a second conductive layer 13 is plated on the outer surface of the substrate 11. The needle tube 1 prepared by the preparation method is suitable for use scenes which need the outer surface of the base material 11 to have a relatively low contact resistance value. In the present manufacturing method, the thickness of the second conductive layer 13 is smaller than the thickness of the first conductive layer 12.
In one embodiment, after the step of removing the sealing plug 2, plating a third conductive layer 14 on the inner surface and the outer surface of the substrate 11 is further included. The needle cannula 1 prepared in this step is also suitable for use in a usage situation where a relatively low contact resistance value is required for the outer surface of the base material 11. In addition, in the preparation method, the sealing plug 2 and the needle tube 1 are not interfered with each other in electroplating, and the sealing plug 2 can be recycled.
In one embodiment, the step of removing the sealing plug 2 comprises placing the needle tube 1 with the sealing plug 2 into a heating device, and removing the sealing plug 2 when the needle tube is heated to 150-260 ℃. The heating device may be an oven. When the needle tube 1 with the sealing plug 2 is placed in a heating device and heated to be more than or equal to 150 ℃, air between the inner surface of the needle tube 1 and the sealing plug 2 is greatly increased due to the heating pressure, and the sealing plug 2 is pushed to be separated from the base material 11. Considering that the maximum heating temperature of the sealing plug 2 is 260 c or less, it is preferable to set the heating temperature to 150 c to 260 c. Of course, the separation of the sealing plug 2 from the needle cannula 1 can also be done by an automated robot.
Referring to fig. 1 and 2, in an embodiment, the sealing plug 2 includes a plug cap 21 and a plug portion 22 connected to each other, and the plug portion 22 is used to plug into the base material 11 of the needle cannula 1. The diameter of the plug cap 21 may be larger than the diameter of the inside of the base material 11, which facilitates grasping of the plug cap 21 to plug the plug portion 22 into or out of the base material 11. The plugging portion 22 may include a first sub-portion 221 and a second sub-portion 222, the first sub-portion 221 is connected between the plugging cap 21 and the second sub-portion 222 and connects the plugging cap 21 and the second sub-portion 222, and the first sub-portion 221 has a diameter larger than that of the inside of the substrate 11, so that the first sub-portion 221 may seal the inside of the substrate 11. The second sub-portion 222 may have a diameter smaller than the diameter of the inside of the substrate 11, which facilitates the insertion portion 22 to be inserted into the substrate 11. And the diameter of the second sub-portion 222 is smaller than the diameter of the inside of the base material 11, so that after the plugging portion 22 is plugged into the base material 11, a certain gap is formed between the second sub-portion 222 and the inner surface of the base material 11, and air in the gap can push the sealing plug 2 to be pulled out from the base material 11 at 150-260 ℃, so as to separate the sealing plug 2 from the needle tube 1.
The sealing plug 2 is made of a silica gel material or a rubber material. Thus, the sealing plug 2 has elasticity and good sealing effect. Further, the sealing plug 2 can be made of a high-temperature-resistant silica gel material or a rubber material, so that the sealing plug 2 is not deformed when being separated from the needle tube 1 by heating to 150-260 ℃, and the sealing plug 2 can be recycled.
Example 1
Referring to fig. 3, the needle tube 1 includes a base material 11 and a first conductive layer 12, and the first conductive layer 12 is disposed on an inner surface of the base material 11.
The first protective layer is divided into a copper layer, a palladium-P layer and a gold layer. The copper layer is a bottom plating layer, the fit between the substrate 11 and the palladium-P layer can be effectively adjusted, and the thickness is about 1.5-3 microns. Plating a palladium-P layer on the copper layer, wherein the thickness of the palladium-P layer is about 0.08 to 0.14 microns. The palladium has self-catalysis performance, and after the palladium is pre-coated on the chemical copper, the gold is catalytically reduced, and the gold layer is plated. The barrel plating process of the needle tube 1 comprises ultrasonic oil removal, chemical polishing, water washing, sulfuric acid activation, water washing, chemical copper plating (HV160#), pre-palladium core treatment and chemical palladium-P plating; thickness control was performed using XRF: X-RAY spectrometer.
Example 2
The needle tube 1 is prepared by the preparation method of the invention. Referring to fig. 4, the needle tube 1 includes a substrate 11, a first conductive layer 12 and a second conductive layer 13, wherein the thickness of the second conductive layer 13 is smaller than that of the first conductive layer 12. The barrel plating method of the second conductive layer 13 is described with reference to the barrel plating method of the first conductive layer 12 in the first embodiment, and is not described again.
Example 3
The needle tube 1 is prepared by the preparation method of the invention. Referring to fig. 5, the needle tube 1 includes a substrate 11, a first conductive layer 12 and a third conductive layer 14, the third conductive layer 14 includes a first sub-layer 141 disposed outside the first conductive layer 12 and a second sub-layer 142 disposed on an outer surface of the substrate 11, and a thickness of the first sub-layer 141 is equal to a thickness of the second sub-layer 142. The barrel plating method of the third conductive layer 14 refers to the barrel plating method of the first conductive layer 12 in the first embodiment.
Comparative example 1
A needle cannula is purchased on the market.
Comparative example 2
Another syringe is purchased on the market.
First, the needle cannulae of examples 1 to 3 and comparative examples 1 and 2 were subjected to corrosion resistance tests, respectively. Random draw, 20 were tested in parallel for each syringe. The test procedure was as follows:
(1) applying sweat (pH is about 4.6) on the needle tube, charging for 1 hr, and applying sweat once every 10 min;
(2) placing the mixture in a 5% sodium chloride aqueous solution, wherein the pH of the solution is 6.5-7.2, the sedimentation rate of salt spray is 1-3 ml/80cm2.h, the sedimentation amount is 1-2 ml/80cm2.h, and treating the mixture for 3h in an environment with the temperature of 55 ℃ and the RH of 95%;
(3) cleaning with clear water, standing for more than 12 hours, and observing the result.
Table 1 corrosion resistance test results
The test results refer to table 1, and the results in table 1 show that after the treatment, the needle tube 1 of the present invention has no phenomena of coating shedding, discoloration, corrosion and verdigris precipitation, and has excellent corrosion resistance; after the needle tubes on the market are treated, the phenomena of color change, spot rot and verdigris precipitation appear. The above results demonstrate that the needle cannula 1 of the present invention has better corrosion resistance.
Secondly, measuring the contact resistance value of the needle tube by a four-wire measuring method. Testing current: 100mA Max, test voltage: 20mV Max. Random drawing, 10 tests for each syringe, and 3 repeated tests. See table 2 for the average values of the test results.
TABLE 2 contact resistance test results
The results in table 2 show that the contact resistance values of the needle cannula 1 of the invention are all less than 30m Ω, and the contact resistance values of the conventional needle cannula are more than 200m Ω. The contact resistance value of the needle tube 1 is obviously smaller than that of the existing needle tube, and the needle tube 1 has higher current-carrying capacity of a connector and higher equipment charging efficiency.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. A needle cannula, comprising:
the base material is cylindrical and provided with an inner surface and an outer surface which are opposite; and
the first conducting layer is arranged on the inner surface of the substrate.
2. The needle cannula of claim 1, further comprising:
the second conducting layer is arranged on the outer surface of the base material, and the thickness of the second conducting layer is smaller than that of the first conducting layer.
3. The needle cannula of claim 1, further comprising:
the third conducting layer comprises a first sub-layer arranged on the outer side of the first conducting layer and a second sub-layer arranged on the outer surface of the base material, and the thickness of the first sub-layer is equal to that of the second sub-layer.
4. The syringe of claim 1 wherein the contact resistance of the syringe is greater than or equal to 1 milliohm and less than or equal to 30 milliohm.
5. The preparation method of the needle tube is characterized by comprising the following steps:
plating a first conductive layer on the inner surface and the outer surface of the substrate;
placing a sealing plug into the substrate to deplate the part of the first conductive layer on the outer surface of the substrate;
and taking out the sealing plug.
6. The method of manufacturing a needle cannula of claim 5, wherein the step of removing the sealing plug is preceded by the step of:
and plating a second conductive layer on the outer surface of the substrate.
7. The method of manufacturing a needle cannula of claim 5, wherein after the step of removing the sealing plug, further comprising:
plating a third conductive layer on the inner surface and the outer surface of the substrate.
8. A method of making a needle cannula as in claim 5, wherein the step of removing the sealing plug comprises:
and (3) placing the needle tube with the sealing plug into a heating device, heating to 150-260 ℃, and taking out the sealing plug.
9. The method of manufacturing a syringe as claimed in claim 5, wherein said sealing plug comprises a plug cap and a plug-in portion connected to each other, said plug-in portion being adapted to be plugged into a base material of said syringe.
10. A method of manufacturing a needle cannula as claimed in claim 5, characterized in that the sealing plug is made of a silicone material or a rubber material.
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| CN202110803763.XA CN113564654A (en) | 2021-07-15 | 2021-07-15 | Needle tube and method for producing needle tube |
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| CN202110803763.XA CN113564654A (en) | 2021-07-15 | 2021-07-15 | Needle tube and method for producing needle tube |
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| CN112531431A (en) * | 2020-10-31 | 2021-03-19 | 东莞市川富电子有限公司 | Preparation of high-stability low-impedance spring needle electric connector and probe electroplating process |
| CN213690230U (en) * | 2021-01-07 | 2021-07-13 | 东莞市环侨金属制品有限公司 | Electroplating needle tube for clock |
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- 2021-07-15 CN CN202110803763.XA patent/CN113564654A/en active Pending
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103894305A (en) * | 2012-12-28 | 2014-07-02 | 鸿富锦精密工业（深圳）有限公司 | Surface treatment covering method |
| CN110401056A (en) * | 2019-08-07 | 2019-11-01 | 东莞市合航精密科技有限公司 | A kind of corrosion-resistant coating for electronic equipment interfaces |
| CN212517610U (en) * | 2020-04-28 | 2021-02-09 | 深圳市拓普联科技术股份有限公司 | Electrical connector |
| CN112261788A (en) * | 2020-10-22 | 2021-01-22 | 江门崇达电路技术有限公司 | Manufacturing method of thick copper high-density interconnection printed board |
| CN112531431A (en) * | 2020-10-31 | 2021-03-19 | 东莞市川富电子有限公司 | Preparation of high-stability low-impedance spring needle electric connector and probe electroplating process |
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