CN113543483A - Solder resist hole plugging method for printed circuit board - Google Patents
Solder resist hole plugging method for printed circuit board Download PDFInfo
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- CN113543483A CN113543483A CN202110692565.0A CN202110692565A CN113543483A CN 113543483 A CN113543483 A CN 113543483A CN 202110692565 A CN202110692565 A CN 202110692565A CN 113543483 A CN113543483 A CN 113543483A
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- hole
- plugged
- printed circuit
- plugging
- circuit board
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
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- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The invention is suitable for the technical field of printed circuit boards, and provides a solder mask hole plugging method of a printed circuit board, which is used for plugging solder mask ink into a hole to be plugged on the printed circuit board, wherein the printed circuit board comprises a first board surface and a second board surface which are oppositely arranged, and the solder mask hole plugging method of the printed circuit board comprises the following steps: plugging solder resist ink into holes to be plugged of the printed circuit board for the first time, wherein the oil filling depth is 50-70% of the depth of the holes to be plugged; pre-curing and exposing the solder resist ink in the hole to be plugged for the first time, so that the solder resist ink positioned in the middle of the hole to be plugged along the depth direction of the hole to be plugged is photo-cured; filling the hole to be plugged with solder resist ink again; and (4) performing pre-curing and secondary exposure on the solder resist ink plugged into the hole to be plugged. The solder mask plug hole method of the printed circuit board solves the defect of oil bleeding of the solder mask plug hole and improves the product quality.
Description
Technical Field
The invention relates to the technical field of printed circuit boards, in particular to a solder mask hole plugging method of a printed circuit board.
Background
In the manufacturing process of the printed circuit board, a layer of photosensitive ink is generally required to be uniformly printed on the board surface to protect the circuit on the board surface from being corroded by the external environment, so as to achieve the purposes of solder mask and insulation, and the photosensitive ink is generally green, blue, white, red, yellow and black, wherein the most common photosensitive ink is green. Except for the plate surface ink, the holes are required to be plugged in the current manufacturing process of the printed circuit board, namely, the solder resist ink is used for filling the through holes in the plate.
Along with the continuous updating and upgrading of electronic products, the integration level of a printed circuit board is higher, the circuits in the board are fine and dense, the distance between a hole and a bonding pad is small, and the thickness-diameter ratio of the product is large, so that the difficulty of solder resist plug holes is increased, the defect of oil bleeding of the solder resist plug holes often occurs, and the product quality is influenced.
Disclosure of Invention
In view of this, the invention provides a solder mask hole plugging method for a printed circuit board to solve the oil bleeding defect and improve the product quality.
The embodiment of the invention provides a solder mask hole plugging method of a printed circuit board, which is used for plugging solder mask ink into holes to be plugged on the printed circuit board, wherein the printed circuit board comprises a first board surface and a second board surface which are oppositely arranged, and the solder mask hole plugging method of the printed circuit board is characterized by comprising the following steps of:
plugging solder resist ink into holes to be plugged of the printed circuit board for the first time, wherein the oil filling depth is 50-70% of the depth of the holes to be plugged;
pre-curing and exposing the solder resist ink in the hole to be plugged for the first time, so that the solder resist ink positioned in the middle of the hole to be plugged along the depth direction of the hole to be plugged is photo-cured;
plugging the hole to be plugged with solder resist ink again;
and performing pre-curing and secondary exposure on the solder resist ink plugged into the hole to be plugged.
In one embodiment, the first plugging of solder mask ink into the holes to be plugged of the printed circuit board comprises: using a first plugging hole plate, and plugging solder resist ink into the hole to be plugged from the first plate surface for the first time; the first hole plugging plate is provided with a first lower oil hole, the first lower oil hole corresponds to the hole to be plugged, and the aperture of the first lower oil hole is smaller than that of the corresponding hole to be plugged.
In one embodiment, when the aperture of the hole to be plugged is less than or equal to 0.35mm, the aperture of the first lower oil hole is 1-2 mil smaller than the aperture of the corresponding hole to be plugged;
when the aperture of the hole to be plugged is larger than 0.35mm, the aperture of the first lower oil hole is 2-4 mil smaller than the aperture of the corresponding hole to be plugged.
In one embodiment, the step of inserting solder resist ink into the hole to be plugged comprises the following steps:
plugging solder resist ink into the hole to be plugged from the first plate surface by using a second plugging plate; the second stopper hole plate comprises a second lower oil hole, and the diameter of the second lower oil hole is equal to that of the corresponding hole to be plugged.
In one embodiment, after the second exposure, the method for solder mask via hole of printed circuit board further comprises:
printing solder resist ink on the surface of the printed circuit board, and performing pre-curing, exposure and development to manufacture a solder resist layer;
and curing the solder resist ink in the hole to be plugged and the solder resist layer.
In one embodiment, in the step of curing the solder resist ink and the solder resist layer in the hole to be plugged, the curing is performed for 60 to 90 minutes at a temperature of 50 to 75 ℃, then the curing is performed for 30 to 60 minutes at a temperature of 90 to 110 ℃, and then the curing is performed for 50 to 80 minutes at a temperature of 125 to 150 ℃.
In one embodiment, when solder resist ink is plugged into the hole to be plugged for the first time or again, a hole plugging base plate is arranged on one side of the second board surface of the printed circuit board, an air guide hole is arranged on one side, facing the printed circuit board, of the hole plugging base plate, and the air guide hole is a blind hole and is communicated with the corresponding hole to be plugged;
the hole diameter of the air guide blind hole is 1-2 mil larger than the corresponding hole diameter single side of the hole to be plugged, and the depth of the air guide blind hole is 1/2-2/3 of the thickness of the plug hole cushion plate.
In one embodiment, the step of inserting solder resist ink into the hole to be plugged comprises the following steps:
and printing solder resist ink on the surface of the printed circuit board, so that part of the solder resist ink is plugged into the hole to be plugged.
In one embodiment, during the first exposure, a first exposure film is used to perform exposure from the first plate surface, the first exposure film is provided with a first exposure point, the first exposure point corresponds to the hole to be plugged, and the aperture of the first exposure point is smaller than that of the corresponding hole to be plugged by 1-2 mil.
In an embodiment, during the second exposure, a second exposure film and a third exposure film are respectively used for exposing two sides of the printed circuit board, and second exposure points corresponding to the holes to be plugged are respectively arranged on the second exposure film and the third exposure film;
if the hole to be plugged is an oil covering hole, the second exposure points on the second exposure film and the third exposure film are both 2-4 mil larger than the aperture of the hole to be plugged;
if the hole to be plugged is a single-sided fenestration, the second exposure point corresponding to the fenestration surface of the hole to be plugged is 1-2 mil smaller than the aperture of the hole to be plugged, and the second exposure point corresponding to the other surface of the hole to be plugged is 2-4 mil larger than the aperture of the hole to be plugged;
and if the holes to be plugged are double-sided window openings, the second exposure points on the second exposure film and the third exposure film are both 1-2 mil smaller than the aperture of the holes to be plugged.
The solder resist plug hole manufacturing method of the printed circuit board comprises two plug holes and two exposure processes, wherein the oil filling depth of the first plug hole is 50% -70% of the depth of the plug hole to be plugged, and then the solder resist ink of the first plug hole is pre-cured and exposed, so that the solder resist ink in the middle of the plug hole to be plugged can be fully photocured; then, secondary hole plugging and secondary exposure are carried out, so that the solder resist ink can be filled to a preset depth and can be fully photocured, therefore, the solder resist ink in the hole to be plugged is not easy to overflow at a high temperature, the defect of oil bleeding of the solder resist hole is overcome, and the product quality is improved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.
FIG. 1 is a flow chart of a solder mask via hole method for a printed circuit board according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a partial structure of a printed circuit board in a solder mask via hole plugging process according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of a partial structure of a printed circuit board after first solder mask via hole plugging according to an embodiment of the present invention;
fig. 4 is a schematic view of a partial structure of a printed wiring board provided with an embodiment of the present invention after a solder resist layer is formed.
The designations in the figures mean:
100. a printed wiring board; 101. a first board surface; 102. a second board surface; 10. plugging holes to be plugged; 11. a ring of holes; 20. a solder resist layer; 200. a first stopper hole plate; 210. a first lower oil hole; 300. plugging a hole base plate; 310. and air vents.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail below with reference to the accompanying drawings, which are examples. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly or indirectly secured to the other element. When an element is referred to as being "connected to" another element, it can be directly or indirectly connected to the other element. The terms "first", "second" and "first" are used merely for descriptive purposes and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features. The meaning of "plurality" is two or more unless specifically limited otherwise.
It should be noted that, in the embodiments of the present invention, the same reference numerals are used to denote the same components or parts, and for the same components or parts in the embodiments of the present invention, only one of the components or parts may be labeled with the reference numeral, and it should be understood that the reference numerals are also applicable to other similar components or parts.
To illustrate the technical solution of the present invention, the following description is made with reference to the specific drawings and examples.
The embodiment of the invention provides a solder mask hole plugging method of a printed circuit board, which is used for plugging solder mask ink into holes to be plugged on the printed circuit board.
Referring to fig. 1 and 2, the printed circuit board 100 includes a first board 101 and a second board 102 disposed opposite to each other. In this embodiment, the hole to be plugged 10 is a through hole penetrating through the first board surface 101 and the second board surface 102, the hole to be plugged 10 is a metalized hole, and two sides of the hole to be plugged 10 are provided with a hole ring 11 or a pad, but the hole to be plugged 10 is not limited thereto, and the hole to be plugged 10 may also be other holes requiring filling with solder resist ink. It is understood that the number of holes 10 to be plugged may be one or more.
In one embodiment, the solder resist via method of the printed wiring board 100 includes the following steps.
Step S10: the solder resist ink is plugged into the hole to be plugged 10 of the printed circuit board 100 for the first time, and the oil filling depth is 50% -70% of the depth of the hole to be plugged 10.
The step is a first hole plugging process, and as shown in fig. 3, the oil penetration depth of the solder resist ink is 50% -70% of the depth of the hole to be plugged 10. By controlling the oil penetration depth, the solder resist ink in the middle of the hole 10 to be plugged can be fully cured by light during subsequent exposure. If the oil depth is less than 50% or more than 70% of the depth of the hole 10 to be plugged, the problem that the solder resist ink in the middle of the hole 10 to be plugged cannot be completely photo-cured after the whole hole 10 to be plugged is subsequently plugged may still exist.
When plugging holes, the quantity of plugging ink can be adjusted by adjusting parameters such as the number of plugging blades, the feed speed, the pressure of a scraper and the like, so that the oil inlet depth reaches the preset depth; it can be understood that the smaller the number of the hole plugging knives, the smaller the hole plugging amount; the faster the feed speed, the less the amount of ink in the hole; the smaller the scraper pressure is, the less ink is in the hole; the specific operating parameters can be selected according to actual conditions.
Optionally, step S10 includes: plugging solder resist ink into the hole to be plugged 10 from the first plate surface 101 for the first time by using the first plugging plate 200; the first hole plugging plate 200 is provided with a first lower oil hole 210, the first lower oil hole 210 corresponds to the hole to be plugged 10, and the aperture of the first lower oil hole 210 is smaller than that of the corresponding hole to be plugged 10.
By adopting the technical scheme, the oil feeding amount of the solder resist ink during the first hole plugging is favorably controlled, and excessive solder resist ink plugging in the holes is avoided; meanwhile, exposure can be carried out after the first hole plugging, and because the aperture of the first lower oil hole is smaller than that of the hole to be plugged 10, exposure and solidification caused by solder resist ink being stained on the bonding pad due to alignment deviation can be avoided. The first plugging hole plate 200 may be an aluminum sheet drilled with the first lower oil hole 210, and when the first lower oil hole 210 is drilled, expansion and contraction adjustment should be performed according to the printed circuit board 100 to ensure that the position of the first lower oil hole 210 completely corresponds to the hole to be plugged 10, thereby preventing plugging deviation or plugging leakage.
Optionally, when the aperture of the hole to be plugged 10 is less than or equal to 0.35mm, the aperture of the first lower oil hole 210 is 1-2 mil smaller than the aperture of the hole to be plugged 10; when the aperture of the hole to be plugged 10 is larger than 0.35mm, the aperture of the first lower oil hole 210 is 2-4 mil smaller than the aperture of the hole to be plugged 10. Thus, the first lower oil hole 210 is designed according to the diameter of the hole 10 to be plugged, so that the oil feeding amount and the oil feeding depth can be conveniently controlled.
Step S20: the solder resist ink inserted into the hole 10 to be plugged is pre-cured and first exposed.
The solder resist ink located in the center of the hole to be plugged 10 in the depth direction of the hole to be plugged 10 may be photo-cured by step S20.
Specifically, the pre-curing is performed after the first hole plugging, so that the solvent in the solder resist ink can be volatilized, and the fluidity of the solder resist ink can be reduced. Optionally, the pre-curing temperature is 70-80 ℃, and the baking time is 60-90 minutes. After precuring, performing first exposure on the solder resist ink plugged into the hole 10 to be plugged, so that the solder resist ink positioned at the center of the hole 10 to be plugged is fully photocured.
In one embodiment, the first exposure film is used to expose the first plate surface 101, so that the solder resist ink located in the middle of the hole 10 to be plugged in the depth direction of the hole 10 to be plugged is photo-cured. The first exposure film is provided with a first exposure point, the first exposure point corresponds to the hole to be plugged 10, and the aperture of the first exposure point is smaller than that of the hole to be plugged 10 by 1-2 mil. The first exposure point is a light transmission point, and because the first exposure point is smaller than the hole to be plugged 10, the problem that the solder resist ink adhered outside the hole opening is exposed and cured due to deviation or other operation factors during the hole plugging operation, and the subsequent development cannot be removed to influence the hole ring 11 or the bonding pad of the hole opening can be avoided.
Step S30: and inserting the solder resist ink into the hole 10 to be plugged again.
The step is a second hole plugging process, which can enable the solder resist ink to reach a preset depth in the hole to be plugged 10, and optionally, the solder resist ink can be fully plugged into the hole to be plugged 10.
Optionally, step S30 includes: plugging solder resist ink into the hole to be plugged 10 from the first plate surface 101 again by using a second plugging plate; the second stopper plate includes a second lower oil hole having an aperture equal to that of the corresponding hole to be plugged 10.
Because the second lower oil hole is equal to the corresponding hole to be plugged 10 in diameter, the plugging efficiency can be improved, and the solder resist ink is prevented from flowing to the outside of the hole to be plugged 10. It is understood that the second lower oil hole may also be smaller than the bore diameter of the hole 10 to be plugged.
Step S40: the solder resist ink inserted into the hole 10 to be plugged is pre-cured and exposed for a second time.
Specifically, the solder resist ink is pre-cured, so that the solvent in the solder resist ink can be volatilized, and the fluidity of the solder resist ink is reduced. Optionally, the pre-curing temperature is 70-80 ℃, and the baking time is 60-90 minutes. Next, the printed wiring board 100 is exposed for the second time to photocure the solder resist ink in the holes 10 to be plugged. Alternatively, the exposure is performed from both sides of the printed wiring board 100, respectively.
The solder resist plug hole manufacturing method of the printed circuit board 100 comprises two plug holes and two exposure processes, wherein the oil filling depth of the first plug hole is 50% -70% of the depth of the hole to be plugged 10, and then the solder resist ink of the first plug hole is pre-cured and exposed, so that the solder resist ink in the middle of the hole to be plugged 10 can be fully photo-cured; then, secondary hole plugging and secondary exposure are carried out, so that the solder resist ink can be filled to a preset depth and can be fully photocured, therefore, the solder resist ink in the hole to be plugged 10 is not easy to overflow at a high temperature, the defect of oil leakage of the solder resist hole is overcome, and the product quality is improved.
The solder resist via hole plugging method of the printed wiring board 100 described above is applicable to various inks such as green ink and black ink, wherein the black ink has poor light transmittance, and the problem of incomplete photocuring is more likely to occur in the via hole plugging process of the prior art, and particularly, the ink in the middle position of the via hole is not easily photocured, so that oil bleeding is more likely to occur. This application can hinder the sufficient photocuring of printing ink with downthehole hindering, can effectively improve the problem that black printing ink bled oil.
In addition, the solder resist via hole method of the printed circuit board 100 is applicable to various types of printed circuit boards, and is also applicable to a printed circuit board 100 with a relatively large thickness-diameter ratio, for example, a printed circuit board 100 with a thickness-diameter ratio larger than 8: 1. The "thickness-to-diameter ratio" is the ratio of the thickness of the printed wiring board 100 to the diameter of the hole 10 to be plugged. For the printed circuit board 100 with high thickness-diameter ratio, the solder resist hole plugging method of the printed circuit board 100 reduces the difficulty of hole plugging and solves the defect of oil bleeding.
In one embodiment, a via-plugging pad is disposed on one side of the second board surface 102 of the printed circuit board 100 when the solder resist ink is plugged into the via-to-be-plugged 10 for the first time or again. Referring to fig. 2, when the first plugging is performed by using the first plugging plate 200 in step S10, the first plugging plate 200 is disposed on one side of the first board surface 101 of the printed circuit board 100, a plugging pad 300 is disposed on one side of the second board surface 102 of the printed circuit board 100, an air vent 310 is disposed on one side of the plugging pad 300 facing the printed circuit board 100, and the air vent 310 is a blind hole and is communicated with the corresponding to-be-plugged hole 10. It can be understood that when the hole diameters of the holes to be plugged 10 are not equal, the air guide hole 310, the first lower oil hole 210 and the second lower oil hole are all adjusted corresponding to the size of the corresponding holes to be plugged 10.
The hole plugging base plate 300 is used for a solder mask hole plugging process of the printed circuit board 100 to prevent solder mask ink from contaminating the table top of the screen printer, and meanwhile, the air guide holes 310 of the hole plugging base plate 300 play a role in air guide and enable the ink in the holes to be plugged 10 to be full. Because the air guide hole 310 is a blind hole, the air guide performance of the plug hole base plate 300 can be properly weakened, the oil inlet depth of the first plug hole can be better controlled, and oil accumulation at the hole opening can be prevented.
It is understood that the tap hole plate 300 may be reused when the tap hole is performed again in step S30, and may be replaced with another tap hole plate 300 having an air guide through hole.
In one embodiment, the air guide blind hole can be drilled on the plug hole backing plate 300 by a depth control drill, the aperture of the air guide blind hole is 1-2 mil larger than the aperture of the corresponding plug hole 10 to be plugged, and the depth of the air guide blind hole is 1/2-2/3 of the thickness of the plug hole backing plate 300. By adopting the technical scheme, the air guide blind hole prevents solder resist ink from polluting the table top of the screen printing machine, and the air guide blind hole meeting the depth dimension can play a good role in air guide and support.
In one embodiment, the second exposure process in step S40 includes: and in the second exposure, exposing two sides of the printed circuit board 100 by using a second exposure film and a third exposure film respectively, wherein the second exposure film and the third exposure film are respectively provided with second exposure points corresponding to the holes to be plugged 10. By adopting the above technical scheme, the solder resist ink at both ends of the hole to be plugged 10 can be fully photocured by exposing both sides of the printed circuit board 100, and oil bleeding is prevented.
It is understood that, if both ends of the holes to be plugged 10 are identical in structure, the second exposure film and the third exposure film may be identical exposure films.
It is understood that the first board 101 of the printed circuit board 100 may be exposed first, and then the second board 102 may be exposed; or exposing the second board surface 102 of the printed circuit board 100 first, and then exposing the first board surface 101; alternatively, the first plate surface 101 and the second plate surface 102 are exposed at the same time, and the order of exposure is not limited in the present application.
Wherein, the second exposure points on the second exposure film and the third exposure film are set according to the type of the holes 10 to be plugged.
Specifically, referring to fig. 4, if the hole to be plugged 10 is an oil covering hole, the second exposure points on the second exposure film and the third exposure film are both 2-4 mil larger than the aperture of the hole to be plugged 10. The hole 10 to be plugged on the right side in fig. 4 is an oil covering hole, i.e. the hole 10 to be plugged is covered by a solder resist layer later.
If the hole to be plugged 10 is a single-sided opening, the second exposure point corresponding to the opening surface of the hole to be plugged 10 is 1-2 mil smaller than the aperture of the hole to be plugged 10, and the second exposure point corresponding to the other surface of the hole to be plugged 10 is 2-4 mil larger than the aperture of the hole to be plugged 10. The hole to be plugged 10 in the middle of fig. 4 is a single-sided opening, and the term "opening" means that the solder resist layer is provided with an opening above the hole to be plugged 10, so that the grommet 11 or the pad of the hole to be plugged 10 can be exposed.
If the hole to be plugged 10 is a double-sided fenestration, the second exposure points on the second exposure film and the third exposure film are both 1-2 mil smaller than the aperture of the hole to be plugged 10. The hole 10 to be plugged on the leftmost side of fig. 4 is a double-sided fenestration.
By adopting the technical scheme, the second exposure point corresponding to the windowing part is smaller than the aperture of the hole to be plugged 10, so that the problem that ink adhered to the outside of the hole opening is exposed and cured due to deviation or other operation factors during plugging operation and cannot be removed during subsequent development to affect the hole opening bonding pad/hole ring 11 can be avoided.
Referring to fig. 1 to 4, in an embodiment, in step S30, the solder resist ink is plugged into the hole to be plugged 10 again by using a second plugging plate, and after performing the second exposure in step S40, the method for plugging the solder resist hole in the printed circuit board 100 further includes the following steps: printing solder resist ink on the surface of the printed wiring board 100 and performing precuring, exposure and development to produce a solder resist layer 20; the solder resist ink in the holes to be plugged 10 and the solder resist layer 20 are cured.
After the exposure is carried out in the step S40, the final curing of the solder resist ink in the hole is not required, the solder resist process is switched to the solder resist process for the board surface ink printing, and after the pre-curing, the exposure and the development, the final curing operation is carried out together with the solder resist ink on the board surface, so that the production time can be saved.
In one embodiment, the solder resist ink is cured in a segmented curing manner. Optionally, in the step of curing the solder resist ink and the solder resist layer 20 in the hole to be plugged 10, the curing is performed for 60 to 90 minutes at a temperature of 50 to 75 ℃, then the curing is performed for 30 to 60 minutes at a temperature of 90 to 110 ℃, and then the curing is performed for 50 to 80 minutes at a temperature of 125 to 150 ℃.
In another embodiment, step S30 includes: solder resist ink is printed on the surface of the printed wiring board 100 so that a part of the solder resist ink is inserted into the hole 10 to be plugged. Therefore, the solder mask procedure can be directly transferred after the step S20, the holes are synchronously plugged when the solder mask ink is printed on the surface of the board, the position of the printing screen corresponding to the hole to be plugged 10 is not provided with a blocking point, and the hole to be plugged 10 can be filled with the solder mask ink to meet the requirement of the preset hole plugging depth. Accordingly, in step S40, the solder resist ink in the hole to be plugged 10 and the solder resist ink on the board surface are exposed simultaneously, and the design of the hole to be plugged exposure film is added to the board surface exposure film, it can be understood that the film pattern at the hole to be plugged may be set according to the structure of the hole to be plugged, for example, refer to the design of the second exposure film and the third exposure film.
By adopting the technical scheme, the operation time of the second solder mask plug hole can be saved, and the efficiency is improved; this embodiment is suitable for a printed wiring board 100 having a small thickness to diameter ratio, for example, a printed wiring board 100 having a thickness to diameter ratio of less than 8:1 and using a non-black solder resist ink.
The solder resist via hole method of the printed wiring board 100 will be described below with specific examples.
In this embodiment, the printed wiring board 100 is a printed wiring board 100 having a thickness to diameter ratio of more than 8: 1. The solder resist via hole method of the printed wiring board 100 includes the following steps.
Step 1, engineering data design: designing and producing the makeup size, graphic data and other tool data, such as exposure film, drilling belt, routing belt, etc.
Step 2, cutting: according to the size requirement of production makeup, the copper-clad plate is cut into a working plate with a specified size.
Step 3, inner layer graph manufacturing: according to the engineering data, making inner layer circuit pattern and plate edge target pattern, including film sticking (dry film or wet film), exposure, development and etching.
Step 4, AOI detection: the quality of the work plate was checked using AOI (automated optical inspection machine).
Step 5, pressing: according to the design of the stacked structure, a multilayer printed wiring board 100 is formed by press-fitting in a high-temperature and high-pressure environment. The embodiment is a 10-layer board, which may be formed by laminating 4 double-sided core boards, copper foils, and prepregs, or by laminating 5 double-sided core boards and prepregs, and is not particularly limited.
Step 6, drilling: and drilling metallized holes and/or non-metallized holes on the surface of the printed circuit board 100, wherein the holes to be plugged 10 into which solder resist ink is to be plugged are included.
Step 7, copper deposition and plate electric: and depositing and electroplating a copper layer with a specified thickness in the holes and on the plate surface.
Step 8, manufacturing an outer layer circuit: and manufacturing an outer layer circuit pattern according to engineering data, wherein the outer layer circuit pattern comprises film pasting, exposure, development, pattern electroplating, tin plating, etching and the like.
And 9, resistance welding.
Firstly, the printed circuit board 100 is subjected to solder resist pretreatment, the surface of the printed circuit board 100 is cleaned, certain roughness is formed on the copper surface in the board, and the bonding force between the solder resist ink and the copper surface is improved.
Next, first plugging is performed using the first plugging plate 200 and the plugging pad 300. The aperture of the first lower oil hole 210 of the first plugging plate 200 is 2mil smaller than the aperture of the hole to be plugged 10, and the depth of the air guide hole 310 of the plugging base plate 300 is 1/2 of the thickness of the plugging base plate 300. From supreme superpose consent backing plate 300, printed circuit board 100, first stopper hole board 200 in proper order down (first stopper hole board 200 is the aluminum sheet and the adhesion is on the half tone), counterpoint fixed back, use the scraper will hinder and weld the printing ink and fill in treating the consent 10 in, the consent degree of depth control is at 50% -70%, accessible adjustment consent sword number, feed (scraper) speed, scraper pressure etc. adjust the consent printing ink volume, make the degree of depth reach preset degree of depth.
And (3) pre-curing after hole plugging, wherein the solvent in the solder resist ink can be volatilized by the pre-curing, the fluidity of the solder resist ink is reduced, the pre-curing can be baked for 60-90 minutes at the temperature of 70-80 ℃, a first exposure film is adopted for carrying out first exposure after the pre-curing, and the first exposure point is 1mil smaller than the whole aperture of the hole to be plugged 10. Wherein, the first exposure only exposes one surface, and the solder mask ink in the hole is exposed from the plug hole surface, so that the solder mask ink positioned at the center of the hole 10 to be plugged is fully photocured.
Then, the second hole plugging plate and the hole plugging base plate 300 are used for plugging holes again, and due to the natural gravity action and the air guide action of the hole plugging base plate 300, after first hole plugging, solder resist ink can be closer to an orifice of a non-hole plugging surface, so that the secondary hole plugging surface and the first hole plugging surface are the same, and the ink is plugged into the holes from the first hole plugging surface until the requirement of preset hole plugging depth is met.
And (3) pre-curing after plugging, wherein the pre-curing can be baked at the temperature of 70-80 ℃ for 60-90 minutes, and then the second exposure film and the third exposure film are used for exposing two surfaces of the printed circuit board 100, so that the printing ink at two ends of the orifice is fully photocured. The ink in the orifice can be fully photo-cured, the residual ink in the orifice is not cured, and the residual ink can be subsequently developed and removed without influencing the subsequent surface treatment of the orifice ring 11.
And (3) after exposure, not performing final curing, transferring to a solder resist process to perform plate surface ink printing, and performing final curing operation after pre-curing, exposure and development, thereby saving the production time. The final curing can be in a segmented curing form, such as three-segment curing, wherein the curing is respectively carried out at 50-75 ℃ for 60-90 minutes, at 90-110 ℃ for 30-60 minutes and at 125-150 ℃ for 50-80 minutes. The segmented curing can fully harden the solder resist ink in the holes and on the board surface. Because the ink in the center of the hole and the ink in the orifice are all photocured, even if a small amount of ink is not completely photocured at the high temperature of final curing, the cured ink can form a barrier and cannot overflow to a bonding pad because of the small amount.
Step 12, routing: the printed wiring board 100 (production board) is milled to a specified size according to the number of impositions for shipment.
And step 13, packaging and delivering.
The solder mask plug hole manufacturing method of the printed circuit board 100 can solve the problem of oil leakage of solder mask ink, and improves the product quality.
The above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not substantially depart from the spirit and scope of the embodiments of the present invention, and are intended to be included within the scope of the present invention.
Claims (10)
1. A solder mask hole plugging method of a printed circuit board is used for plugging solder mask ink into holes to be plugged on the printed circuit board, the printed circuit board comprises a first board surface and a second board surface which are oppositely arranged, and the solder mask hole plugging method of the printed circuit board is characterized by comprising the following steps of:
plugging solder resist ink into holes to be plugged of the printed circuit board for the first time, wherein the oil filling depth is 50-70% of the depth of the holes to be plugged;
pre-curing and exposing the solder resist ink in the hole to be plugged for the first time, so that the solder resist ink positioned in the middle of the hole to be plugged along the depth direction of the hole to be plugged is photo-cured;
plugging the hole to be plugged with solder resist ink again;
and performing pre-curing and secondary exposure on the solder resist ink plugged into the hole to be plugged.
2. The solder mask via hole method of printed circuit board according to claim 1, wherein the first plugging of solder mask ink into the via hole of the printed circuit board comprises: using a first plugging hole plate, and plugging solder resist ink into the hole to be plugged from the first plate surface for the first time; the first hole plugging plate is provided with a first lower oil hole, the first lower oil hole corresponds to the hole to be plugged, and the aperture of the first lower oil hole is smaller than that of the corresponding hole to be plugged.
3. The solder mask plug hole method of the printed circuit board according to claim 2, wherein when the hole diameter of the hole to be plugged is less than or equal to 0.35mm, the hole diameter of the first lower oil hole is 1-2 mil smaller than the corresponding hole diameter of the hole to be plugged;
when the aperture of the hole to be plugged is larger than 0.35mm, the aperture of the first lower oil hole is 2-4 mil smaller than the aperture of the corresponding hole to be plugged.
4. The solder mask via hole method of printed wiring board according to any of claims 1 to 3, wherein the re-plugging of solder mask ink into the hole to be plugged comprises:
plugging solder resist ink into the hole to be plugged from the first plate surface by using a second plugging plate; the second stopper hole plate comprises a second lower oil hole, and the diameter of the second lower oil hole is equal to that of the corresponding hole to be plugged.
5. The printed wiring board solder mask via hole method of claim 4 wherein after the second exposure, the printed wiring board solder mask via hole method further comprises:
printing solder resist ink on the surface of the printed circuit board, and performing pre-curing, exposure and development to manufacture a solder resist layer;
and curing the solder resist ink in the hole to be plugged and the solder resist layer.
6. The method for solder mask via hole of printed circuit board according to claim 5, wherein in the step of curing the solder mask ink and the solder mask layer in the via hole, the solder mask ink and the solder mask layer are cured at 50-75 ℃ for 60-90 minutes, then at 90-110 ℃ for 30-60 minutes, and then at 125-150 ℃ for 50-80 minutes.
7. The solder mask hole plugging method for the printed circuit board according to claim 4, wherein when the solder mask ink is plugged into the hole to be plugged for the first time or again, a hole plugging base plate is arranged on one side of the second board surface of the printed circuit board, and a gas guide hole is arranged on one side of the hole plugging base plate facing the printed circuit board, wherein the gas guide hole is a blind hole and is communicated with the corresponding hole to be plugged;
the hole diameter of the air guide blind hole is 1-2 mil larger than the corresponding hole diameter single side of the hole to be plugged, and the depth of the air guide blind hole is 1/2-2/3 of the thickness of the plug hole cushion plate.
8. The solder mask via hole method of printed wiring board according to any of claims 1 to 3, wherein the re-plugging of solder mask ink into the hole to be plugged comprises:
and printing solder resist ink on the surface of the printed circuit board, so that part of the solder resist ink is plugged into the hole to be plugged.
9. The solder mask plug hole method of the printed circuit board according to claim 1, wherein in the first exposure, a first exposure film is used to expose from the first board surface, the first exposure film is provided with a first exposure point, the first exposure point corresponds to the plug hole to be plugged, and the first exposure point is 1-2 mil smaller than the corresponding aperture of the plug hole to be plugged.
10. The solder mask via hole filling method for the printed circuit board according to claim 1, wherein in the second exposure, a second exposure film and a third exposure film are respectively used for exposing two sides of the printed circuit board, and the second exposure film and the third exposure film are respectively provided with a second exposure point corresponding to the via hole to be filled;
if the hole to be plugged is an oil covering hole, the second exposure points on the second exposure film and the third exposure film are both 2-4 mil larger than the aperture of the hole to be plugged;
if the hole to be plugged is a single-sided fenestration, the second exposure point corresponding to the fenestration surface of the hole to be plugged is 1-2 mil smaller than the aperture of the hole to be plugged, and the second exposure point corresponding to the other surface of the hole to be plugged is 2-4 mil larger than the aperture of the hole to be plugged;
and if the holes to be plugged are double-sided window openings, the second exposure points on the second exposure film and the third exposure film are both 1-2 mil smaller than the aperture of the holes to be plugged.
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| US5761803A (en) * | 1996-06-26 | 1998-06-09 | St. John; Frank | Method of forming plugs in vias of a circuit board by utilizing a porous membrane |
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