CN113406140A - Method and device for testing thermal resistance of power semiconductor element radiator - Google Patents
Method and device for testing thermal resistance of power semiconductor element radiator Download PDFInfo
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- CN113406140A CN113406140A CN202110665887.6A CN202110665887A CN113406140A CN 113406140 A CN113406140 A CN 113406140A CN 202110665887 A CN202110665887 A CN 202110665887A CN 113406140 A CN113406140 A CN 113406140A
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- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N25/00—Investigating or analyzing materials by the use of thermal means
- G01N25/20—Investigating or analyzing materials by the use of thermal means by investigating the development of heat, i.e. calorimetry, e.g. by measuring specific heat, by measuring thermal conductivity
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- G—PHYSICS
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- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
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Abstract
The invention discloses a method and a device for testing the thermal resistance of a power semiconductor element radiator, wherein the method comprises the following steps: step 1: corresponding grooves are formed in the table surface of the radiator and the bottom end of the heating device; step 2: embedding the thermosensitive element in the groove formed in the step 1 to obtain the embedding depth of the thermosensitive element; and step 3: fixedly mounting a heating device on the table-board of the radiator to obtain a contact area; and 4, step 4: starting the heating device to obtain the power of the heating device, measuring the highest temperature of the table board of the radiator through the thermosensitive element, and then calculating the thermal resistance of the radiator. The highest temperature of the radiator table top is measured through the thermistor embedded in the groove on the radiator table top, and the situation that the highest point of the radiator table top temperature cannot be measured due to the fact that the highest point of the radiator table top temperature migrates to a contact area of the heating device and the radiator from 2mm of the periphery is avoided, and therefore inaccuracy of a test result and error judgment on heat dissipation resistance of the radiator are caused.
Description
Technical Field
The invention relates to the technical field of heat radiator thermal resistance testing, in particular to a method and a device for testing the thermal resistance of a power semiconductor element heat radiator.
Background
The power semiconductor element has high dissipation power and large heat flux density and heat productivity during working, so that the heat productivity and temperature are increased rapidly, the quality and reliability of a product are seriously affected, and the power semiconductor element can meet the reliability requirement of normal working only by adopting a proper cooling mode for heat dissipation. The cooling of the power semiconductor element is generally performed by liquid cooling, air cooling, heat pipe, natural cooling radiator, wherein the liquid cooling includes water cooling and oil cooling. In practical engineering applications, the thermal resistance of the heat sink used for cooling the power semiconductor element is measured by tests. The position of the highest temperature on the radiator is measured, a small hole is arranged on the table surface of the radiator at the position 2mm outside the diameter of the table surface of the tube shell of the heating element or the maximum diameter of the bolt-type tube shell, the hole diameter is 0.8mm, and the hole depth is 1 mm'. However, with the increase of power loss and heat flux density of the power semiconductor element, the highest temperature of the table top of the heat sink is not 2mm around the table top, but the highest point of the table top of the heat sink cannot be measured in the contact area between the bottom of the heating element and the heat sink, which leads to inaccuracy of test results and misjudgment of heat dissipation resistance of the heat sink. Therefore, it is necessary to provide a method and an apparatus for testing thermal resistance of a heat sink of a power semiconductor device to at least partially solve the problems in the prior art.
Disclosure of Invention
In this summary, concepts in a simplified form are introduced that are further described in the detailed description. This summary of the invention is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used as an aid in determining the scope of the claimed subject matter.
In order to at least partially solve the above problems, the present invention provides a method and an apparatus for testing thermal resistance of a power semiconductor device heat sink, comprising:
step 1: corresponding grooves are formed in the table surface of the radiator and the bottom end of the heating device;
step 2: embedding the thermosensitive element in the groove formed in the step 1 to obtain the embedding depth of the thermosensitive element;
and step 3: fixedly mounting a heating device on the table-board of the radiator to obtain a contact area;
and 4, step 4: starting the heating device to obtain the power of the heating device, measuring the highest temperature of the table board of the radiator through the thermosensitive element, and then calculating the thermal resistance of the radiator.
Preferably, the calculating step of step 4 is as follows:
a1: calculating the resistance value of the thermal resistance measured by the surface of the embedded heat radiator of the thermosensitive element, wherein the calculation formula is as follows:
Ri＝δ/Sβ
wherein R isiIs a first thermal resistance value, delta is the embedding depth of the thermosensitive element, S is the contact area of the heating device and the table board of the radiator, and beta is the thermal resistance of the radiator;
a2: calculating a second thermal resistance R according to the highest temperature measured by the thermosensitive elementtThe calculation formula is as follows:
wherein, T1For the temperature value, T, measured by the thermistor2The initial temperature of the table-board of the radiator, and P is the heating power of the heating device;
a3: calculating the thermal resistance value of the radiator according to the following calculation formula:
R＝Ri+Rt
wherein, R is the thermal resistance value of the radiator.
A thermal resistance testing device for a power semiconductor element radiator comprises:
a semiconductor heat sink;
the top end of the semiconductor radiator is provided with a plurality of slots;
the heating device is arranged at the top end of the semiconductor radiator;
the groove is arranged at the top end of the semiconductor radiator;
the thermosensitive element is arranged in the groove;
and the inserted column penetrates through the heating device and is connected with the slot in a sliding manner.
Preferably, the heat generating device includes:
the heating block is arranged at the top end of the semiconductor radiator;
the heating tube is internally provided with a plurality of heating tubes;
and the heat resistance sheet is arranged at the top end of the heating block.
Preferably, the groove of the groove has one of a straight line shape and a circular arc shape.
Preferably, the heat resistant sheet is made of a urethane material.
Preferably, the heating device is further provided with the auxiliary testing device, and the auxiliary testing device includes:
the heating device comprises a shell, a heating device and a control device, wherein the shell is arranged on the heating device, a pull rope cavity is arranged in the shell, a pressing groove is arranged below the pull rope cavity, and the heating device is connected in the pressing groove in a sliding manner;
one end of the first rotating rod is connected with the handle, the other end of the first rotating rod penetrates through the shell and extends into the pressing groove to be connected with the pressing plate in a rotating mode, and the pressing plate is connected into the pressing groove in a sliding mode;
the spline wheel is sleeved on the first rotating rod, the spline sleeve is connected with the first rotating rod through a spline, and two ends of the spline sleeve are rotationally connected with the inner wall of the pull rope cavity;
the spline wheel is sleeved on the spline sleeve;
the threaded part is arranged on the first rotating rod, and the first rotating rod is in threaded connection with the shell through the threaded part;
slider, slider locates in the casing, the bilateral symmetry who presses the groove is equipped with slider, slider includes:
the sliding groove is arranged in the shell and is positioned on one side of the pressing groove;
the two ends of the limiting rod are connected with the inner wall of the sliding groove;
the moving block is connected to the inner wall of the sliding groove in a sliding mode, the limiting rod penetrates through the moving block, and the limiting rod is connected with the moving block in a sliding mode;
the return spring is arranged between the moving block and the inner wall of the sliding groove;
one end of the connecting rope is connected with the moving block, and the other end of the connecting rope extends into the pull rope cavity to be connected with the spline wheel;
the pulley groove is arranged in the moving block;
the inner wall of the pulley groove is symmetrically provided with two rotating block grooves;
the rotating blocks are connected in the rotating block grooves in a sliding mode, and a second rotating rod is rotatably arranged between every two adjacent rotating blocks;
the spring is arranged between the rotating block and the rotating block groove;
the pulley is sleeved on the second rotating rod and positioned in the pulley groove, and the pulley is in contact connection with the side wall of the semiconductor radiator;
the brake groove is arranged in the pulley groove and is arc-shaped;
a brake pad disposed within the brake groove.
Preferably, the indication device is further disposed in the housing, and the indication device includes:
the display cavity is arranged in the shell and is positioned on one side of the pull rope cavity;
the torsion cavity is arranged in the shell and is positioned below the display cavity;
the brake cavity is arranged in the shell and is positioned on one side of the pull rope cavity, which is far away from the display cavity;
the first gear is sleeved on the spline sleeve and is positioned above the spline wheel;
the second gear is rotatably arranged on the inner wall of the brake cavity through a rotating shaft and is meshed with the first gear, and a plurality of clamping holes are uniformly formed in the second gear;
the clamping block groove is formed in the inner wall of the brake cavity, and an electromagnet is arranged in the clamping block groove;
one end of the magnet rod is connected in the clamping block groove in a sliding mode, a clamping spring is arranged between the magnet rod and the electromagnet, and the other end of the magnet rod is matched with the clamping hole;
one end of the third rotating rod is rotatably connected with the inner wall of the torsion cavity, and the other end of the third rotating rod extends into the display cavity to be connected with an indicator needle;
the rotating wheel is sleeved on the third rotating rod and located in the torsion cavity, a torsion spring is arranged between the torsion cavity and the inner wall of the torsion cavity, and the torsion spring is sleeved on the third rotating rod;
one end of the pull rope is connected with the spline wheel, and the other end of the pull rope extends into the torsion cavity to be connected with the rotating wheel;
the dial is arranged on the inner wall of the display cavity, and the indicating needle is in contact connection with the dial;
the glass plate is arranged on the inner wall of the display cavity.
Compared with the prior art, the invention at least comprises the following beneficial effects:
the method and the device for testing the thermal resistance of the power semiconductor element radiator measure the highest temperature of the radiator table top through the thermistor embedded in the groove on the radiator table top, and avoid the condition that the highest point of the temperature of the radiator table top cannot be measured due to the fact that the highest point of the temperature of the radiator table top is moved to a contact area between the heating device and the radiator from 2mm of the periphery, so that the inaccuracy of a test result and the error of judgment on the thermal resistance of the radiator are caused.
The invention is directed to a method and apparatus for testing thermal resistance of a power semiconductor component heat sink, and other advantages, objects, and features of the invention will be set forth in part in the description which follows and in part will become apparent to those having ordinary skill in the art upon examination of the following or may be learned from practice of the invention.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:
FIG. 1 is a schematic structural diagram of a thermal resistance testing apparatus for a power semiconductor device heat sink according to the present invention;
FIG. 2 is a schematic top view of a semiconductor heat sink of the thermal resistance testing apparatus for a power semiconductor device according to the present invention;
FIG. 3 is a schematic structural diagram of a heat block of a thermal resistance testing apparatus for a power semiconductor device heat sink according to the present invention;
FIG. 4 is a schematic structural diagram of an auxiliary testing device for a thermal resistance testing device of a power semiconductor device heat sink according to the present invention;
FIG. 5 is an enlarged schematic view of the thermal resistance testing apparatus for a power semiconductor device heat sink shown in FIG. 4A according to the present invention;
FIG. 6 is a schematic structural diagram of an indicating apparatus of a thermal resistance testing apparatus for a power semiconductor device according to the present invention;
FIG. 7 is a schematic structural diagram of a second gear of the thermal resistance testing apparatus for a heat sink of an electrical semiconductor device according to the present invention.
Description of reference numerals: 1. a semiconductor heat sink; 2. a heat generating device; 3. a heat resistant sheet; 4. inserting a column; 5. a slot; 6. a heat generating tube; 7. a groove; 8. a heat block; 9. a thermosensitive element; 10. an auxiliary test device; 11. a housing; 12. a rope pulling cavity; 13. pressing the groove; 14. a sliding groove; 15. a pulley groove; 16. a handle; 17. a first rotating lever; 18. a threaded portion; 19. a spline wheel; 20. connecting ropes; 21. a moving block; 22. a limiting rod; 23. a pressing plate; 24. a brake groove; 25. a brake pad; 26. a rotating block groove; 27. a spring; 28. rotating the block; 29. a second rotating lever; 30. a pulley; 31. a spline housing; 32. a display cavity; 33. a torsion chamber; 34. a brake chamber; 35. a glass plate; 36. a third rotating rod; 38. pulling a rope; 39. a torsion spring; 40. a dial scale; 41. an indicator needle; 42. a second gear; 43. a block slot; 44. a magnet rod; 45. an electromagnet; 46. a chucking spring; 47. a first gear; 48. a clamping hole; 49. and a return spring.
Detailed Description
The present invention is further described in detail below with reference to the drawings and examples so that those skilled in the art can practice the invention with reference to the description.
It will be understood that terms such as "having," "including," and "comprising," as used herein, do not preclude the presence or addition of one or more other elements or groups thereof.
As shown in fig. 1-7, the present invention provides a method and a device for testing thermal resistance of a power semiconductor device heat sink, comprising:
step 1: corresponding grooves are formed in the table surface of the radiator and the bottom end of the heating device;
step 2: embedding the thermosensitive element in the groove formed in the step 1 to obtain the embedding depth of the thermosensitive element;
and step 3: fixedly mounting a heating device on the table-board of the radiator to obtain a contact area;
and 4, step 4: starting the heating device to obtain the power of the heating device, measuring the highest temperature of the table board of the radiator through the thermosensitive element, and then calculating the thermal resistance of the radiator.
The working principle of the technical scheme is as follows: in the actual use process, a groove is formed in the table top of the radiator, then the thermosensitive element is embedded in the groove, the highest temperature of the table top of the radiator is measured through the thermosensitive element when the heating device is started, and then the thermal resistance of the radiator is calculated through the measured temperature.
The beneficial effects of the above technical scheme are that: through the design of the structure, the highest temperature of the table top of the radiator is measured through the thermistor embedded in the groove on the table top of the radiator, and the situation that the highest point of the temperature of the table top of the radiator cannot be measured due to the fact that the highest point of the temperature of the table top of the radiator is moved to a contact area of the heating device and the radiator from 2mm of the periphery of the highest point of the table top of the radiator is avoided, so that the test result is inaccurate, and the judgment of the heat dissipation resistance of the radiator is wrong.
In one embodiment, the calculation step of step 4 is as follows:
a1: calculating the resistance value of the thermal resistance measured by the surface of the embedded heat radiator of the thermosensitive element, wherein the calculation formula is as follows:
Ri＝δ/Sβ
wherein R isiIs a first thermal resistance value, delta is the embedding depth of the thermosensitive element, S is the contact area of the heating device and the table board of the radiator, and beta is the thermal resistance of the radiator;
a2: calculating a second thermal resistance R according to the highest temperature measured by the thermosensitive elementtThe calculation formula is as follows:
wherein, T1For the temperature value, T, measured by the thermistor2The initial temperature of the table-board of the radiator, and P is the heating power of the heating device;
a3: calculating the thermal resistance value of the radiator according to the following calculation formula:
R＝Ri+Ry
wherein, R is the thermal resistance value of the radiator.
The working principle of the technical scheme is as follows: before starting the heating device, the initial temperature T of the table-board of the radiator is measured2Measuring the area S of the contact area of the table top of the radiator and the heating device and the embedding depth delta of the thermal sensitive element, and then calculating the first thermal resistance R of the measured thermal resistance influenced by the embedding of the thermal sensitive element in the table top of the radiator according to the area S, the depth delta and the thermal resistivity beta of the table top of the radiatoriWhen the heating device is started, the heating power P of the heating device is determined, and the highest temperature T of the table top of the radiator is measured through the thermosensitive element1Then passes the maximum temperature T1Heat generation power P and initial temperature T2Calculating a second thermal resistance RtAnd finally calculating the thermal resistance R of the radiator.
The beneficial effects of the above technical scheme are that: through the design of the structure, the thermal resistance value of the radiator is obtained through the calculation steps, and the obtained thermal resistance value is more accurate than that obtained by the previous method.
A thermal resistance testing device for a power semiconductor element radiator comprises:
a semiconductor heat sink 1;
the slots 5 are formed in the top end of the semiconductor radiator 1;
the heating device 2 is arranged at the top end of the semiconductor radiator 1;
the groove 7 is formed in the top end of the semiconductor radiator 1;
the thermosensitive element 9, the said thermosensitive element 9 locates in said recess 7;
the inserting column 4 penetrates through the heat generating device 2 and is connected with the slot 5 in a sliding mode.
The working principle of the technical scheme is as follows: in the actual use process, after the thermosensitive element 9 is embedded into the groove 7, the heating device 2 is installed on the semiconductor heat sink 1, then the heating device 2 is fixed on the semiconductor heat sink 1 through the inserting columns 4, and simultaneously the distance of each inserting column 4 inserted into the slot 5 is consistent, so that the pressure of the heating device 2 on each position of the semiconductor heat sink 1 is kept consistent, thereby ensuring the contact thermal resistance in the contact area to be consistent, avoiding the heating device 2 from heating the semiconductor heat sink 1 unevenly, then the heating device 2 is started, the highest temperature of the semiconductor heat sink 1 is measured through the thermosensitive element 9, and then the thermal resistance of the semiconductor heat sink 1 is calculated.
The beneficial effects of the above technical scheme are that: through the design of the structure, the highest temperature after the highest temperature point position of the radiator is moved can be measured through the thermal resistance testing device, then the thermal resistance of the radiator is calculated through the measured temperature, and the situation that the highest point of the temperature of the radiator table top cannot be measured due to the fact that the highest temperature point of the radiator table top is moved to the contact area of the heating device and the radiator is avoided, so that inaccuracy of a test result and judgment errors of the thermal dissipation resistance of the radiator are caused.
In one embodiment, the heat generating device 2 includes:
the heating block 8, the said heating block 8 locates the top of the said semiconductor heat sink 1;
the heating block 8 is internally provided with a plurality of heating tubes 6;
and the heat resistance sheet 3 is arranged at the top end of the heating block 8.
The working principle of the technical scheme is as follows: in the actual use process, when the heating device is started, the heating tube 6 is electrified to generate heat, the heat generated by the heating tube acts on the semiconductor radiator 1 through the heating block, and then the highest temperature of the semiconductor radiator 1 is tested, so that the thermal resistance of the semiconductor radiator 1 is measured.
The beneficial effects of the above technical scheme are that: through the design of the structure, the heating device 2 replaces a semiconductor to generate heat, so that the thermal resistance of the semiconductor radiator 1 is measured, and the manufacturing cost of the thermal resistance measuring device is reduced.
In one embodiment, the groove 7 has a shape of one of a straight line and a circular arc.
The working principle of the technical scheme is as follows: in practical use, the shape of the groove in which the thermosensitive element 9 is embedded may be straight or circular arc, so that when the groove 7 is provided, different shapes of the groove can be selectively provided according to different semiconductor heat sinks 1.
The beneficial effects of the above technical scheme are that: through the design of the structure, the grooves 7 with different shapes are arranged, so that the detected highest temperature of the table top of the radiator can be more accurate.
In one embodiment, the heat resistant sheet 3 is made of a urethane material.
The working principle of the technical scheme is as follows: in the practical use process, the polyurethane material has low price and good heat insulation performance.
The beneficial effects of the above technical scheme are that: through the design of the structure, the heat resistance sheet made of the polyurethane material reduces the cost of the heat resistance testing device.
In one embodiment, the auxiliary testing device 10 is further disposed on the heat generating device 2, and the auxiliary testing device 10 includes:
the heating device comprises a shell 11, wherein the shell 11 is arranged on the heating device 2, a pull rope cavity 12 is arranged in the shell 11, a pressing groove 13 is arranged below the pull rope cavity 12, and the heating device 2 is connected in the pressing groove 13 in a sliding manner;
one end of the first rotating rod 17 is connected with the handle 16, the other end of the first rotating rod 17 penetrates through the shell 11 and extends into the pressing groove 13 to be connected with the pressing plate 23 in a rotating mode, and the pressing plate 23 is connected into the pressing groove 13 in a sliding mode;
the spline sleeve 31 is sleeved on the first rotating rod 17, the spline sleeve 31 is connected with the first rotating rod 17 through a spline, and two ends of the spline sleeve 31 are rotationally connected with the inner wall of the pull rope cavity 12;
the spline wheel 19 is sleeved on the spline sleeve 31;
a threaded portion 18, wherein the threaded portion 18 is arranged on the first rotating rod 17, and the first rotating rod 17 is in threaded connection with the shell 11 through the threaded portion 18;
slide device, slide device locates in the casing 11, the bilateral symmetry that presses groove 13 is equipped with slide device, slide device includes:
the sliding groove 14 is arranged in the shell 11, and the sliding groove 14 is positioned on one side of the pressing groove 13;
the two ends of the limiting rod 22 are connected with the inner wall of the sliding groove 14;
the moving block 21 is connected to the inner wall of the sliding groove 14 in a sliding manner, the limiting rod 14 penetrates through the moving block 21, and the limiting rod 22 is connected with the moving block 21 in a sliding manner;
the return spring 49 is arranged between the moving block 21 and the inner wall of the sliding groove 14;
one end of the connecting rope 20 is connected with the moving block 21, and the other end of the connecting rope 20 extends into the rope cavity 12 and is connected with the spline wheel 19;
the pulley groove 15 is arranged in the moving block 21, and the pulley groove 15 is arranged in the moving block 21;
the inner wall of the pulley groove 15 is symmetrically provided with two rotating block grooves 26;
the rotating blocks 28 are connected in the rotating block grooves 26 in a sliding mode, and a second rotating rod 29 is rotatably arranged between every two adjacent rotating blocks 28;
a spring 27, wherein the spring 27 is arranged between the rotating block 28 and the rotating block groove 26;
the pulley 30 is sleeved on the second rotating rod 29, the pulley 30 is located in the pulley groove 15, and the pulley 30 is in contact connection with the side wall of the semiconductor radiator 1;
the brake groove 24 is arranged in the pulley groove 15, and the brake groove 24 is arc-shaped;
and a brake plate 25, wherein the brake plate 25 is arranged in the brake groove 24.
The working principle of the technical scheme is as follows: in the actual use process, when the semiconductor radiator 1 which cannot be provided with the slot 5 is subjected to a thermal resistance test, the semiconductor radiator 1 is clamped between two sliding devices, namely the semiconductor radiator 1 is positioned between two pulleys 30, so that the auxiliary measuring device 10 can slide on the semiconductor radiator 1; when measurement needs to be started, the handle 16 is rotated, the handle 16 drives the first rotating rod 17 to rotate, the spline sleeve 31 is driven to rotate through the spline when the first rotating rod 17 rotates, the spline sleeve 31 drives the spline wheel 19 to rotate, the spline wheel 19 drives the moving block 21 to move towards the extending direction of the return spring 49 through the connecting rope 20 when the spline wheel 19 rotates, so that the two moving blocks 21 move oppositely, the pulley 30 moves towards the contracting direction of the spring 27 under the action of the semiconductor radiator 1 and the moving block 21 in the opposite movement process, half of the pulley 30 enters the arc-shaped braking groove 24 in the pulley movement process, then the pulley 30 cannot rotate under the action of the braking sheet 25, and the auxiliary measuring device 10 is clamped on the semiconductor radiator 1; meanwhile, when the first rotating rod 17 rotates, the first rotating rod 17 moves downwards under the action of the threaded portion 18, the first rotating rod 17 drives the pressing plate 23 to move downwards, when the pressing plate 23 moves downwards, the heating device 2 is pushed out of the pressing groove 13, the heating device 2 is fixed on the semiconductor heat sink 1, and then the heating device 2 is started to measure; when one measurement is completed, the handle 16 is rotated in the reverse direction, so that the auxiliary measuring device 10 slides on the semiconductor heat sink 1, and a second measurement is performed quickly.
The beneficial effects of the above technical scheme are that: through the design of the structure, the auxiliary measuring device 10 can measure when the slot 5 is not formed on the semiconductor radiator 1, so that the influence of the formation of the slot 5 on the thermal resistance of the semiconductor radiator 1 is avoided; meanwhile, the heating device 2 is fixed through the pressing plate 23, so that the step that the pressure of the heating device 2 on each position of the semiconductor radiator 1 is the same by adjusting the distance of the plurality of inserting columns 4 inserted into the inserting slots 5 is avoided; meanwhile, the auxiliary measuring device 10 can quickly perform multiple thermal resistance measurements on the semiconductor radiator 1 to obtain an average value so as to reduce the error of the measured thermal resistance; when no measurement is performed, the heat generating device 2 can completely enter the pressing groove 13, and damage to the heat generating device 2 is avoided.
In one embodiment, the indication device is further disposed in the housing 1, and the indication device includes:
a display cavity 32, wherein the display cavity 32 is arranged in the shell 11, and the display cavity 32 is positioned at one side of the pull rope cavity 12;
a torsion cavity 33, wherein the torsion cavity 33 is arranged in the housing 11, and the torsion cavity 33 is positioned below the display cavity 32;
the brake cavity 34 is arranged in the shell 11, and the brake cavity 34 is positioned on one side of the pull rope cavity 12 far away from the display cavity 32;
the first gear 47 is sleeved on the spline housing 31, and the first gear 47 is positioned above the spline wheel 19;
the second gear 42 is rotatably arranged on the inner wall of the brake cavity 34 through a rotating shaft, the second gear 42 is meshed with the first gear 47, and a plurality of clamping holes 48 are uniformly formed in the second gear 42;
the clamping block groove 43 is formed in the inner wall of the brake cavity 34, and an electromagnet 45 is arranged in the clamping block groove 43;
one end of the magnet rod 44 is slidably connected into the block slot 43, a clamping spring 46 is arranged between the magnet rod 44 and the electromagnet 45, and the other end of the magnet rod 44 is matched with the clamping hole 48;
one end of the third rotating rod 36 is rotatably connected with the inner wall of the torsion cavity 33, and the other end of the third rotating rod 36 extends into the display cavity 32 and is connected with the pointer 41;
the rotating wheel 34 is sleeved on the third rotating rod 36, the rotating wheel 34 is located in the torsion cavity 33, a torsion spring 39 is arranged between the torsion cavity 33 and the inner wall of the torsion cavity 33, and the torsion spring 39 is sleeved on the third rotating rod 36;
a pull rope 38, one end of the pull rope 38 is connected with the spline wheel 19, and the other end of the pull rope 38 extends into the torsion cavity 33 to be connected with the rotating wheel 34;
the dial 40 is arranged on the inner wall of the display cavity 32, and the indicating needle 41 is in contact connection with the dial 40;
and the glass plate 35, wherein the glass plate 35 is arranged on the inner wall of the display cavity 32.
The working principle of the technical scheme is as follows: in actual use, during the process of rotating the handle 16, the handle 16 drives the spline housing 31 to rotate through the first rotating rod 17, the spline housing 31 drives the spline wheel 19 to rotate, the spline wheel 19 drives the rotating wheel 34 to rotate through the pull rope 38, and the rotating wheel 34 drives the indicating needle 41 to rotate through the third rotating rod 36, so that the indicating needle 41 indicates the scale on the dial 40, and the downward moving distance of the first rotating rod 17 is displayed; after the first rotating rod 17 finishes moving downwards, the electromagnet 45 is started, the electromagnet 45 generates magnetic force to move the magnet rod 44 towards the extension direction of the clamping spring 46, so that the magnet rod 44 enters the clamping hole 48, the second gear 42 cannot rotate continuously, the second gear 42 cannot rotate the spline sleeve 31 through the first gear 47, the spline sleeve 31 cannot rotate the first rotating rod 17 continuously, and the first rotating rod 17 finishes fixing after moving downwards; when the test is completed, the electromagnet 45 is turned off, the magnet rod 44 moves in the direction of contracting the chucking spring 46, and the magnet rod 44 exits the second gear 42, so that the first rotating lever 17 can be rotated.
The beneficial effects of the above technical scheme are that: through the design of the structure, when the auxiliary measuring device 10 is used for continuous measurement, the descending distance of the first rotating rod 17 indicated by the indicating needle 41 in the first measurement can be remembered, so that when a plurality of subsequent measurements are carried out, the same descending distance of the first rotating rod 17 is taken, the pressure applied to the heating device 2 by the first rotating rod 17 through the pressing plate 23 every time is consistent, and the conditions of each measurement are kept consistent; meanwhile, after the movement distance of the first rotating rod 17 is adjusted, the first rotating rod 17 can be fixed through the indicating device, and the pressure change of the pressing plate 23 on the heating device 2 caused by the rotation of the first rotating rod 17 in the testing process is avoided.
In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the invention.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; may be mechanically coupled, may be electrically coupled or may be in communication with each other; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
While embodiments of the invention have been disclosed above, it is not limited to the applications set forth in the description and the embodiments, which are fully applicable in various fields of endeavor to which the invention pertains, and further modifications may readily be made by those skilled in the art, it being understood that the invention is not limited to the details shown and described herein without departing from the general concept defined by the appended claims and their equivalents.
Claims (8)
1. A method for testing thermal resistance of a power semiconductor element radiator is characterized by comprising the following steps:
step 1: corresponding grooves are formed in the table surface of the radiator and the bottom end of the heating device;
step 2: embedding the thermosensitive element in the groove formed in the step 1 to obtain the embedding depth of the thermosensitive element;
and step 3: fixedly mounting a heating device on the table-board of the radiator to obtain a contact area;
and 4, step 4: starting the heating device to obtain the power of the heating device, measuring the highest temperature of the table board of the radiator through the thermosensitive element, and then calculating the thermal resistance of the radiator.
2. The method for testing the thermal resistance of the heat sink of the power semiconductor component as claimed in claim 1,
the calculation steps of the step 4 are as follows:
a1: calculating the resistance value of the thermal resistance measured by the surface of the embedded heat radiator of the thermosensitive element, wherein the calculation formula is as follows:
Ri＝δ/Sβ
wherein R isiIs a first thermal resistance value, delta is the embedding depth of the thermosensitive element, S is the contact area of the heating device and the table board of the radiator, and beta is the thermal resistance of the radiator;
a2: calculating a second thermal resistance R according to the highest temperature measured by the thermosensitive elementtThe calculation formula is as follows:
wherein, T1For the temperature value, T, measured by the thermistor2The initial temperature of the table-board of the radiator, and P is the heating power of the heating device;
a3: calculating the thermal resistance value of the radiator according to the following calculation formula:
R＝Ri+Rt
wherein, R is the thermal resistance value of the radiator.
3. A thermal resistance testing device for a power semiconductor element radiator, which is used for the thermal resistance testing method for the power semiconductor element radiator according to any one of claims 1 to 2, and is characterized by comprising the following steps:
a semiconductor heat sink (1);
the top end of the semiconductor radiator (1) is provided with a plurality of slots (5);
the heating device (2), the heating device (2) is arranged at the top end of the semiconductor radiator (1);
the groove (7), the groove (7) is arranged at the top end of the semiconductor radiator (1);
the thermosensitive element (9), the thermosensitive element (9) is arranged in the groove (7);
insert post (4), what insert post (4) pass generate heat device (2) with slot (5) sliding connection.
4. A power semiconductor component heat sink thermal resistance test device according to claim 3, wherein the heat generating device (2) comprises:
the heating block (8), the heating block (8) is arranged at the top end of the semiconductor radiator (1);
the heating block (8) is internally provided with a plurality of heating tubes (6);
the heat resistance sheet (3) is arranged at the top end of the heating block (8).
5. The thermal resistance testing device for the power semiconductor element radiator according to claim 3, wherein the groove shape of the groove (7) is one of a straight line shape and a circular arc shape.
6. The thermal resistance testing device of the power semiconductor element radiator according to claim 4, characterized in that the thermal resistance sheet (3) is made of polyurethane material.
7. A thermal resistance testing device for a power semiconductor element radiator according to claim 3, wherein an auxiliary testing device (10) is further provided on the heat generating device (2), and the auxiliary testing device (10) comprises:
the heating device comprises a shell (11), wherein the shell (11) is arranged on the heating device (2), a pull rope cavity (12) is arranged in the shell (11), a pressing groove (13) is arranged below the pull rope cavity (12), and the heating device (2) is connected in the pressing groove (13) in a sliding manner;
one end of the first rotating rod (17) is connected with the handle (16), the other end of the first rotating rod (17) penetrates through the shell (11) and extends into the pressing groove (13) to be connected with the pressing plate (23) in a rotating mode, and the pressing plate (23) is connected into the pressing groove (13) in a sliding mode;
the spline sleeve (31) is sleeved on the first rotating rod (17), the spline sleeve (31) is connected with the first rotating rod (17) through a spline, and two ends of the spline sleeve (31) are rotationally connected with the inner wall of the pull rope cavity (12);
the spline wheel (19) is sleeved on the spline sleeve (31);
the threaded part (18) is arranged on the first rotating rod (17), and the first rotating rod (17) is in threaded connection with the shell (11) through the threaded part (18);
the slider, slider locates in casing (11), the bilateral symmetry that presses down groove (13) is equipped with slider, slider includes:
the sliding groove (14) is formed in the shell (11), and the sliding groove (14) is located on one side of the pressing groove (13);
the two ends of the limiting rod (22) are connected with the inner wall of the sliding groove (14);
the moving block (21) is connected to the inner wall of the sliding groove (14) in a sliding mode, the limiting rod (14) penetrates through the moving block (21), and the limiting rod (22) is connected with the moving block (21) in a sliding mode;
the return spring (49) is arranged between the moving block (21) and the inner wall of the sliding groove (14);
one end of the connecting rope (20) is connected with the moving block (21), and the other end of the connecting rope (20) extends into the rope pulling cavity (12) and is connected with the spline wheel (19);
the pulley groove (15), the said pulley groove (15) locates in the said movable block (21);
the inner wall of the pulley groove (15) is symmetrically provided with two rotating block grooves (26);
the rotating blocks (28) are connected in the rotating block groove (26) in a sliding mode, and a second rotating rod (29) is rotatably arranged between every two adjacent rotating blocks (28);
a spring (27), wherein the spring (27) is arranged between the rotating block (28) and the rotating block groove (26);
the pulley (30) is sleeved on the second rotating rod (29), the pulley (30) is located in the pulley groove (15), and the pulley (30) is in contact connection with the side wall of the semiconductor radiator (1);
the brake groove (24) is formed in the pulley groove (15), and the brake groove (24) is arc-shaped;
a brake pad (25), wherein the brake pad (25) is arranged in the brake groove (24).
8. The device for testing the thermal resistance of the heat sink of the power semiconductor component as claimed in claim 7, comprising:
still be equipped with in casing (1) indicating device, indicating device includes:
a display cavity (32), wherein the display cavity (32) is arranged in the shell (11), and the display cavity (32) is positioned at one side of the pull rope cavity (12);
a torsion cavity (33), wherein the torsion cavity (33) is arranged in the shell (11), and the torsion cavity (33) is positioned below the display cavity (32);
the brake cavity (34), the brake cavity (34) is arranged in the shell (11), and the brake cavity (34) is positioned on one side of the pull rope cavity (12) far away from the display cavity (32);
the first gear (47), the said first gear (47) is fitted over the said spline housing (31), the said first gear (47) locates above the said spline wheel (19);
the second gear (42) is rotatably arranged on the inner wall of the brake cavity (34) through a rotating shaft, the second gear (42) is meshed with the first gear (47), and a plurality of clamping holes (48) are uniformly formed in the second gear (42);
the clamping block groove (43) is formed in the inner wall of the brake cavity (34), and an electromagnet (45) is arranged in the clamping block groove (43);
one end of the magnet rod (44) is connected in the clamping block groove (43) in a sliding mode, a clamping spring (46) is arranged between the magnet rod (44) and the electromagnet (45), and the other end of the magnet rod (44) is matched with the clamping hole (48);
one end of the third rotating rod (36) is rotatably connected with the inner wall of the torsion cavity (33), and the other end of the third rotating rod (36) extends into the display cavity (32) and is connected with an indicator needle (41);
the rotating wheel (34) is sleeved on the third rotating rod (36), the rotating wheel (34) is located in the torsion cavity (33), a torsion spring (39) is arranged between the torsion cavity (33) and the inner wall of the torsion cavity (33), and the torsion spring (39) is sleeved on the third rotating rod (36);
the pull rope (38), one end of the pull rope (38) is connected with the spline wheel (19), and the other end of the pull rope (38) extends into the torsion cavity (33) to be connected with the rotating wheel (34);
the dial (40), the dial (40) is arranged on the inner wall of the display cavity (32), and the indicating needle (41) is in contact connection with the dial (40);
the glass plate (35), the glass plate (35) is located on the display chamber (32) inner wall.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110665887.6A CN113406140A (en) | 2021-06-16 | 2021-06-16 | Method and device for testing thermal resistance of power semiconductor element radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110665887.6A CN113406140A (en) | 2021-06-16 | 2021-06-16 | Method and device for testing thermal resistance of power semiconductor element radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113406140A true CN113406140A (en) | 2021-09-17 |
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ID=77684347
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110665887.6A Withdrawn CN113406140A (en) | 2021-06-16 | 2021-06-16 | Method and device for testing thermal resistance of power semiconductor element radiator |
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| Country | Link |
|---|---|
| CN (1) | CN113406140A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115165428A (en) * | 2022-09-06 | 2022-10-11 | 山东中茂散热器有限公司 | Radiator testing device |
| CN117434111A (en) * | 2023-12-19 | 2024-01-23 | 北京蓝威技术有限公司 | Thermal resistance testing method for fin radiator under natural convection |
-
2021
- 2021-06-16 CN CN202110665887.6A patent/CN113406140A/en not_active Withdrawn
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115165428A (en) * | 2022-09-06 | 2022-10-11 | 山东中茂散热器有限公司 | Radiator testing device |
| CN115165428B (en) * | 2022-09-06 | 2022-11-29 | 山东中茂散热器有限公司 | Radiator testing device |
| CN117434111A (en) * | 2023-12-19 | 2024-01-23 | 北京蓝威技术有限公司 | Thermal resistance testing method for fin radiator under natural convection |
| CN117434111B (en) * | 2023-12-19 | 2024-03-15 | 北京蓝威技术有限公司 | Thermal resistance testing method for fin radiator under natural convection |
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Application publication date: 20210917 |