CN112284310B - Nondestructive testing method for thickness of adhesive film of honeycomb sandwich structure - Google Patents
Nondestructive testing method for thickness of adhesive film of honeycomb sandwich structure Download PDFInfo
- Publication number
- CN112284310B CN112284310B CN202011114517.5A CN202011114517A CN112284310B CN 112284310 B CN112284310 B CN 112284310B CN 202011114517 A CN202011114517 A CN 202011114517A CN 112284310 B CN112284310 B CN 112284310B
- Authority
- CN
- China
- Prior art keywords
- adhesive film
- thickness
- honeycomb
- sandwich structure
- honeycomb sandwich
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B17/00—Measuring arrangements characterised by the use of infrasonic, sonic or ultrasonic vibrations
- G01B17/02—Measuring arrangements characterised by the use of infrasonic, sonic or ultrasonic vibrations for measuring thickness
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
Abstract
The invention discloses a nondestructive testing method for the thickness of a honeycomb sandwich structure adhesive film, and belongs to the field of nondestructive testing. The invention adopts an ultrasonic longitudinal wave direct incidence pulse reflection method for detection, firstly, two honeycomb sandwich structure reference blocks with different adhesive film thicknesses are adopted to calibrate equipment, reflection echoes of the positions of the adhesive films of the test blocks with different adhesive film thicknesses are respectively recorded, then, the detected honeycomb sandwich structural member is detected, and the thickness of the detected adhesive film is judged according to the position characteristics of the adhesive film reflection signals of the detected honeycomb sandwich structural member. The invention adopts a nondestructive detection method to realize the measurement of the thickness of the glue film in the workpiece, the workpiece does not need to be damaged, the detection method is simple and convenient, the operation is easy, and the accuracy of the detection result can meet the requirements of material manufacturers.
Description
Technical Field
The invention discloses a nondestructive testing method for the thickness of a honeycomb sandwich structure adhesive film, and belongs to the technical field of nondestructive testing.
Background
Honeycomb sandwich structure composite materials are one of the common composite material part structure forms in military aircraft. The structure is formed by bonding an upper skin, a lower skin and a honeycomb through adhesive films. In some cases, the thickness of the adhesive film between the skin and the honeycomb needs to be measured, and because the adhesive film is contained between the skin and the honeycomb after the honeycomb sandwich structure is cured and formed, the size of the adhesive film cannot be directly measured by adopting a conventional physical method, and the metallographic measurement by adopting an anatomical method damages a workpiece, the invention tries to measure the thickness of the adhesive film inside by adopting a nondestructive testing method.
In the honeycomb sandwich structure, if the adhesive film is very thin, the sound wave reflection signal between the skin and the adhesive film is superposed with the interface reflection signal between the adhesive film and the honeycomb, and only one interface reflection signal can be seen, and when the adhesive film has a certain thickness (generally more than 0.5mm), the sound wave reflection signal between the skin and the adhesive film and the interface reflection signal between the adhesive film and the honeycomb can be respectively and independently reacted, so that the thickness of the adhesive film can be measured through the distance between two interface waves.
Disclosure of Invention
The purpose of the invention is as follows: the invention provides a nondestructive testing method for measuring the thickness of an adhesive film between a skin and a honeycomb in a honeycomb sandwich structure composite material part, aiming at the problem that the thickness of the adhesive film can not be directly measured by a physical method and a dissecting metallographic method. The method aims to realize the preliminary estimation of the thickness of the glue film between the skin and the honeycomb on the premise of not damaging a workpiece and provide workpiece structure dimension data for a material manufacturer.
The technical scheme of the invention is as follows:
a nondestructive testing method for the thickness of a honeycomb sandwich structure adhesive film adopts the following steps to carry out detection and evaluation:
the detection system comprises an ultrasonic flaw detector, a contact type ultrasonic probe, a first comparison test block and a second comparison test block;
step two, preparing a first reference block and a second reference block, wherein the thickness of a glue film between a skin of the first reference block and the honeycomb is h1, the thickness of the glue film between the skin of the second reference block and the honeycomb is h2, and h2 is more than h 1;
step three, detecting a first comparison test block and a second comparison test block by using a contact type ultrasonic probe, moving the contact type ultrasonic probe to a good part of the first comparison test block, recording a first horizontal position of a reflected wave of an interface between a skin and an adhesive film of the good part of the first comparison test block on a display screen of the ultrasonic flaw detector, which is marked as d1, moving the contact type ultrasonic probe to a good part of the second comparison test block, recording a second horizontal position of the reflected wave of the interface between the skin and the adhesive film of the good part of the second comparison test block on the display screen of the ultrasonic flaw detector, which is marked as d2, and recording a third horizontal position of the reflected wave of the interface between the adhesive film and a honeycomb on the display screen of the ultrasonic flaw detector, which is marked as d 3;
detecting the detected honeycomb sandwich structure, and observing the number and the positions of reflected waves of the interface between the skin and the glue film of the detected honeycomb sandwich structure and between the glue film and the honeycomb; if only one reflected wave of the skin-adhesive film interface appears, the adhesive film thickness of the detected honeycomb sandwich structure is smaller than h 1; if two skin-film interface reflection waves occur, recording the horizontal position four d4 of the first interface reflection wave on the ultrasonic flaw detector display screen, and recording the horizontal position five d5 of the second interface reflection wave on the ultrasonic flaw detector display screen, wherein the thickness h of the detected honeycomb sandwich structure adhesive film is h2(d5-d4)/(d3-d 2);
and the scanning range of the ultrasonic flaw detector in the third step is the same as that of the ultrasonic flaw detector in the fourth step.
And in the second step, the materials and the thicknesses of skins and honeycombs of the first reference block and the second reference block are the same as those of the composite material part with the honeycomb sandwich structure to be detected.
And in the second step, the thickness h1 of the glue film between the first skin of the test block and the honeycomb is less than 0.5 mm.
And in the second step, the glue film thickness h2 between the second skin of the test block and the honeycomb is more than 1 mm.
And in the third step and the fourth step, the detection frequency of the contact type ultrasonic probe is 5 MHz.
And detecting the diameter of the wafer to be 6mm by the contact type ultrasonic probe in the third step and the fourth step.
And the detection sensitivity of the third step and the fourth step is that the height of the debonding defect reflection signal wave between the skin and the adhesive film in the first reference block is adjusted to 80% of the full scale of the ultrasonic flaw detector.
And the detection sensitivity of the ultrasonic flaw detector in the third step is the same as that of the ultrasonic flaw detector in the fourth step.
And the scanning range of the ultrasonic flaw detector in the third step is the same as that of the ultrasonic flaw detector in the fourth step.
The invention has the beneficial effects that:
1. the thickness measurement of the glue film inside the workpiece is realized by adopting a nondestructive testing method, and the workpiece is not required to be damaged;
2. the detection method is simple and convenient and easy to operate;
3. the accuracy of the detection result can meet the requirements of material manufacturers.
Detailed Description
A nondestructive testing method for the thickness of a honeycomb sandwich structure adhesive film adopts the following steps to carry out detection and evaluation:
the detection system comprises an ultrasonic flaw detector, a contact type ultrasonic probe, a first comparison test block and a second comparison test block;
step two, preparing a first reference block and a second reference block, wherein the thickness of a glue film between a skin of the first reference block and the honeycomb is h1, the thickness of the glue film between the skin of the second reference block and the honeycomb is h2, and h2 is more than h 1;
step three, detecting a first comparison test block and a second comparison test block by using a contact type ultrasonic probe, moving the contact type ultrasonic probe to a good part of the first comparison test block, recording a first horizontal position of a reflected wave of an interface between a skin and an adhesive film of the good part of the first comparison test block on a display screen of the ultrasonic flaw detector, which is marked as d1, moving the contact type ultrasonic probe to a good part of the second comparison test block, recording a second horizontal position of the reflected wave of the interface between the skin and the adhesive film of the good part of the second comparison test block on the display screen of the ultrasonic flaw detector, which is marked as d2, and recording a third horizontal position of the reflected wave of the interface between the adhesive film and a honeycomb on the display screen of the ultrasonic flaw detector, which is marked as d 3;
detecting the detected honeycomb sandwich structure, and observing the number and the positions of reflected waves of the interface between the skin and the glue film of the detected honeycomb sandwich structure and between the glue film and the honeycomb; if only one reflected wave of the skin-adhesive film interface appears, the adhesive film thickness of the detected honeycomb sandwich structure is smaller than h 1; if two skin-film interface reflection waves occur, recording the horizontal position four d4 of the first interface reflection wave on the ultrasonic flaw detector display screen, and recording the horizontal position five d5 of the second interface reflection wave on the ultrasonic flaw detector display screen, wherein the thickness h of the detected honeycomb sandwich structure adhesive film is h2(d5-d4)/(d3-d 2);
and the scanning range of the ultrasonic flaw detector in the third step is the same as that of the ultrasonic flaw detector in the fourth step.
And in the second step, the materials and the thicknesses of skins and honeycombs of the first reference block and the second reference block are the same as those of the composite material part with the honeycomb sandwich structure to be detected.
And in the second step, the thickness h1 of the glue film between the first skin of the test block and the honeycomb is less than 0.5 mm.
And in the second step, the glue film thickness h2 between the second skin of the test block and the honeycomb is more than 1 mm.
And in the third step and the fourth step, the detection frequency of the contact type ultrasonic probe is 5 MHz.
And detecting the diameter of the wafer to be 6mm by the contact type ultrasonic probe in the third step and the fourth step.
And the detection sensitivity of the third step and the fourth step is to adjust the height of the debonding defect reflection signal wave between the skin and the glue film in the first reference block to 80% of the full scale of the ultrasonic flaw detector.
And the detection sensitivity of the ultrasonic flaw detector in the third step is the same as that of the ultrasonic flaw detector in the fourth step.
And the scanning range of the ultrasonic flaw detector in the third step is the same as that of the ultrasonic flaw detector in the fourth step.
The method comprises the following specific steps:
step one, preparing a first reference block and a second reference block, wherein the thickness of an adhesive film between a skin of the first reference block and a honeycomb is h1, the thickness of the adhesive film between the skin of the second reference block and the honeycomb is h2, and h2 is more than h 1;
step two, a contact ultrasonic probe is adopted to detect a first contrast test block and a second contrast test block, the contact ultrasonic probe is connected with an ultrasonic flaw detector, the contact ultrasonic probe moves to the surface of a good part of the first contrast test block, the probe is placed perpendicular to the surface of the first contrast test block, a detection waveform in the ultrasonic flaw detector is observed, the thickness of a rubber film between a skin and a honeycomb is small, two interfaces between the skin and the rubber film and between the rubber film and the honeycomb cannot be obviously distinguished, a pulse reflection wave is shown on a display of the ultrasonic flaw detector, the horizontal position of the reflection wave of the interface between the skin and the rubber film of the good part of the first contrast test block on a display screen of the ultrasonic flaw detector is recorded as d1, the contact ultrasonic probe moves to the good part of the second contrast test block, the probe is placed perpendicular to the surface of the contrast test block, the detection waveform in the ultrasonic flaw detector is observed, at the moment, the thickness of the rubber film between the skin and the honeycomb is large, two interface reflection waves respectively appear between the skin and the adhesive film and between the adhesive film and the honeycomb, the horizontal position II of the interface reflection wave between the skin and the adhesive film at the good part of the reference block II on the display screen of the ultrasonic flaw detector is recorded as d2, and the horizontal position III of the interface reflection wave between the adhesive film and the honeycomb on the display screen of the ultrasonic flaw detector is recorded as d 3;
step three, detecting the detected honeycomb sandwich structure, and observing the number and the positions of interface reflection waves between the skin of the detected honeycomb sandwich structure and the honeycomb; if only one skin-glue film interface reflection wave appears, the glue film thickness of the detected honeycomb sandwich structure is less than or equal to h 1; if two skin-film interface reflection waves occur, recording the horizontal position four d4 of the first interface reflection wave on the ultrasonic flaw detector display screen, and recording the horizontal position five d5 of the second interface reflection wave on the ultrasonic flaw detector display screen, wherein the thickness h of the detected honeycomb sandwich structure adhesive film is h2(d5-d4)/(d3-d 2);
in the step one, the materials and the thicknesses of skins and honeycombs of the first reference block and the second reference block are the same as those of the detected honeycomb sandwich structure composite material part.
In the first step, the thickness h1 of the glue film between the first skin of the test block and the honeycomb is less than 0.5 mm.
In the step one, the glue film thickness h2 between the second skin of the test block and the honeycomb is larger than 1 mm.
And the detection frequency of the contact type ultrasonic probe in the second step and the third step is 5 MHz.
And the diameter of the wafer detected by the contact ultrasonic probe in the second step and the third step is 6 mm.
And the detection sensitivity of the second step and the third step is that the height of the debonding defect reflection signal wave between the skin and the adhesive film in the first comparison test block is adjusted to 80% of the full scale of the ultrasonic flaw detector.
And the detection sensitivity of the ultrasonic flaw detector in the second step is the same as that of the ultrasonic flaw detector in the third step.
And the scanning range of the ultrasonic flaw detector in the third step is the same as that of the ultrasonic flaw detector in the fourth step.
The technical solution of the present invention will be described in detail below with reference to specific examples, but the present invention is not limited thereto.
Example 1
Detect the glued membrane thickness between a carbon fiber honeycomb sandwich structure finished piece covering and honeycomb, the covering is T700 carbon fiber material, thickness 2mm, and the honeycomb is the NOMEX honeycomb, and thickness 25mm prepares two and is detected the same contrast test block of honeycomb sandwich structure, material, and glued membrane thickness is 0.3mm between a contrast test block covering and the honeycomb, and glued membrane thickness is 1.5mm between two covers of contrast test block and the honeycomb. The method comprises the steps of adopting a 5MHz contact type ultrasonic probe, adjusting the height of a debonding defect reflection signal wave between a skin and an adhesive film in a first comparison test block to 80% of the full scale of an ultrasonic flaw detector, keeping the detection sensitivity unchanged, moving the probe to a good part of the first comparison test block, recording the position of a skin-adhesive film interface reflection wave on a display screen of the ultrasonic flaw detector to be 2 grids, moving the probe to a good part of a second comparison test block, recording the position of the skin-adhesive film interface reflection wave to be 2 grids, and recording the position of the adhesive film-adhesive honeycomb interface reflection wave to be 3 grids. Keeping the detection sensitivity unchanged, detecting the detected honeycomb sandwich structure, and observing the number and the positions of reflected waves of the interface between the skin and the glue film of the detected honeycomb sandwich structure and between the glue film and the honeycomb. At the moment, only one reflected signal appears at the position of 2 grids of the display screen, and the thickness of the glue film of the detected honeycomb sandwich structure composite material product is less than 0.3 mm.
Example 2
Detect the glued membrane thickness between a carbon fiber honeycomb sandwich structure finished piece covering and honeycomb, the covering is T300 carbon fiber material, thickness 3mm, and the honeycomb is the NOMEX honeycomb, and thickness 40mm prepares two and is detected the same contrast test block of honeycomb sandwich structure, material, and glued membrane thickness is 0.4mm between a contrast test block covering and the honeycomb, and glued membrane thickness is 2mm between two covers of contrast test block and the honeycomb. The method comprises the steps of adopting a 5MHz contact type ultrasonic probe, adjusting the height of a debonding defect reflection signal wave between a skin and a glue film in a first comparison test block to 80% of the full scale of an ultrasonic flaw detector, keeping the detection sensitivity unchanged, moving the probe to a good part of the first comparison test block, recording the position of a skin-glue film interface reflection wave on a display screen of the ultrasonic flaw detector to be 3 grids, moving the probe to a good part of a second comparison test block, recording the position of the skin-glue film interface reflection wave to be 3 grids, and recording the position of the glue film-honeycomb interface reflection wave to be 5 grids. Keeping the detection sensitivity unchanged, detecting the detected honeycomb sandwich structure, and observing the number and the positions of reflected waves of the interface between the skin and the glue film of the detected honeycomb sandwich structure and between the glue film and the honeycomb. At this time, a reflection signal appears at each of the 3 and 4.5 cells of the display screen, and the glue film thickness of the detected honeycomb sandwich structure composite material product is h2(d5-d4)/(d3-d2) 2 (4.5-3)/(5-3) 1.5 mm.
Claims (9)
1. A nondestructive testing method for the thickness of a honeycomb sandwich structure adhesive film is characterized by comprising the following steps: the following steps are adopted for detection and evaluation:
the detection system comprises an ultrasonic flaw detector, a contact type ultrasonic probe, a first comparison test block and a second comparison test block;
step two, preparing a first reference block and a second reference block, wherein the thickness of a glue film between a skin of the first reference block and the honeycomb is h1, the thickness of the glue film between the skin of the second reference block and the honeycomb is h2, and h2 is more than h 1;
step three, detecting a first comparison test block and a second comparison test block by using a contact type ultrasonic probe, moving the contact type ultrasonic probe to a good part of the first comparison test block, recording a first horizontal position of a reflected wave of an interface between a skin and an adhesive film of the good part of the first comparison test block on a display screen of the ultrasonic flaw detector, which is marked as d1, moving the contact type ultrasonic probe to a good part of the second comparison test block, recording a second horizontal position of the reflected wave of the interface between the skin and the adhesive film of the good part of the second comparison test block on the display screen of the ultrasonic flaw detector, which is marked as d2, and recording a third horizontal position of the reflected wave of the interface between the adhesive film and a honeycomb on the display screen of the ultrasonic flaw detector, which is marked as d 3;
detecting the detected honeycomb sandwich structure, and observing the number and the positions of reflected waves of the interface between the skin and the glue film of the detected honeycomb sandwich structure and between the glue film and the honeycomb; if only one reflected wave of the skin-adhesive film interface appears, the adhesive film thickness of the detected honeycomb sandwich structure is smaller than h 1; and if one skin-to-film interface reflection wave and one film-to-honeycomb interface reflection wave occur, recording the horizontal position of the first interface reflection wave on the ultrasonic flaw detector display screen by four d4, and recording the horizontal position of the second interface reflection wave on the ultrasonic flaw detector display screen by five d5, wherein the thickness h of the detected honeycomb sandwich structure film is h2(d5-d4)/(d3-d 2).
2. The nondestructive testing method for the thickness of the adhesive film of the honeycomb sandwich structure, according to claim 1, characterized in that in the second step, the materials and the thicknesses of the skins and the honeycombs of the first reference block and the second reference block are the same as those of the composite material product of the honeycomb sandwich structure to be tested.
3. The nondestructive testing method for the thickness of the adhesive film of the honeycomb sandwich structure in claim 1, wherein in the second step, the thickness h1 between the skin of the reference block I and the honeycomb is less than 0.5 mm.
4. The nondestructive testing method for the thickness of the adhesive film of the honeycomb sandwich structure is characterized in that in the second step, the thickness h2 of the adhesive film between the second skin of the test block and the honeycomb is more than 1 mm.
5. The method for nondestructive testing of the thickness of the adhesive film of the honeycomb sandwich structure is characterized in that the contact type ultrasonic probe in the third step and the fourth step is used for testing the frequency of 5 MHz.
6. The method for nondestructive testing of the thickness of the adhesive film of the honeycomb sandwich structure is characterized in that the diameter of the wafer detected by the contact type ultrasonic probe in the third step and the fourth step is 6 mm.
7. The nondestructive testing method for the thickness of the adhesive film of the honeycomb sandwich structure according to any one of claims 1 to 3, wherein the detection sensitivity in the third step and the fourth step is to adjust the height of the debonding defect reflection signal wave between the skin and the adhesive film in the first test block to 80% of the full scale of the ultrasonic flaw detector.
8. The method for nondestructive testing of the thickness of the adhesive film of the honeycomb sandwich structure according to any one of claims 1 to 3, wherein the detection sensitivity of the ultrasonic flaw detector in the third step is the same as that in the fourth step.
9. The method for nondestructive testing of the thickness of the adhesive film of the honeycomb sandwich structure according to any one of claims 1 to 3, wherein the scanning range of the ultrasonic flaw detector in the third step is the same as that in the fourth step.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011114517.5A CN112284310B (en) | 2020-10-16 | 2020-10-16 | Nondestructive testing method for thickness of adhesive film of honeycomb sandwich structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011114517.5A CN112284310B (en) | 2020-10-16 | 2020-10-16 | Nondestructive testing method for thickness of adhesive film of honeycomb sandwich structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112284310A CN112284310A (en) | 2021-01-29 |
| CN112284310B true CN112284310B (en) | 2022-05-27 |
Family
ID=74497774
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011114517.5A Active CN112284310B (en) | 2020-10-16 | 2020-10-16 | Nondestructive testing method for thickness of adhesive film of honeycomb sandwich structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112284310B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2076966A (en) * | 1980-05-23 | 1981-12-09 | Japan Steel Works Ltd | Apparatus and method for measuring layer thicknesses of a multilayered metal member |
| JPH07198686A (en) * | 1993-12-28 | 1995-08-01 | Kobe Steel Ltd | Inspection method for honeycomb panel connection state |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62140010A (en) * | 1985-12-16 | 1987-06-23 | Hitachi Constr Mach Co Ltd | Method for measuring thickness of coated film and member to be coated by ultrasonic wave |
| JPH0894344A (en) * | 1994-07-26 | 1996-04-12 | Shinko Kensa Service Kk | Layer thickness measuring instrument utilizing transversal wave of ultrasonic wave |
| JPH11108648A (en) * | 1997-09-30 | 1999-04-23 | Nobuhiko Nishiwaki | Measuring method of thickness and distance by using ultrasonic wave |
| CA2552623A1 (en) * | 2006-07-20 | 2008-01-20 | Ibm Canada Limited - Ibm Canada Limitee | A method for measuring thin layers in solid state devices |
| US8336365B2 (en) * | 2010-03-25 | 2012-12-25 | Olympus Ndt Inc. | Automatic calibration error detection for ultrasonic inspection devices |
| CN103148815B (en) * | 2013-01-30 | 2015-12-23 | 大连理工大学 | Based on the thickness of thin layer supersonic detection method of sound pressure reflection coefficient autocorrelation function |
| CN105973992B (en) * | 2016-06-06 | 2019-01-01 | 平高集团有限公司 | The ultrasonic Wavelet Detection method of epoxy casting insulating part Minute pores defect |
| CN111650217B (en) * | 2020-06-03 | 2023-03-07 | 航天特种材料及工艺技术研究所 | Foam bonding quality detection method for variable-thickness foam sandwich member |
-
2020
- 2020-10-16 CN CN202011114517.5A patent/CN112284310B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2076966A (en) * | 1980-05-23 | 1981-12-09 | Japan Steel Works Ltd | Apparatus and method for measuring layer thicknesses of a multilayered metal member |
| JPH07198686A (en) * | 1993-12-28 | 1995-08-01 | Kobe Steel Ltd | Inspection method for honeycomb panel connection state |
Also Published As
| Publication number | Publication date |
|---|---|
| CN112284310A (en) | 2021-01-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102183582B (en) | Ultrasonic nondestructive testing device and method | |
| EP1952137B1 (en) | System and method for ultrasonically detecting discontinuous fibers in composite laminates | |
| CN110243935A (en) | A kind of GIS epoxy insulation internal flaw ultrasonic detection method and system | |
| CN109298080A (en) | Weld defect based on feature guided wave detects the time-sharing exciting system and method for dedicated array-type sensor | |
| US8522615B1 (en) | Simplified direct-reading porosity measurement apparatus and method | |
| CN102608212B (en) | Method for measuring acoustic impedance and acoustic attenuation of thin layer based on sound pressure reflection coefficient power spectrum | |
| CN108181378B (en) | Ultrasonic defect identification method for detecting laminated structure of mixed-layer composite material | |
| CN109115872B (en) | Ultrasonic detection method for bonding quality | |
| CN106198763A (en) | ultrasonic flaw detector performance testing device | |
| CN110208384A (en) | A kind of workpiece surface is open the measurement method at oblique flaw height and inclination angle | |
| CN111537604B (en) | Automatic detection imaging method for composite material plate based on water film coupling guided wave detection | |
| CN104111286B (en) | A kind of velocity of wave for the detection of supersonic welding point and thickness calibration steps | |
| CN115541709A (en) | Ultrasonic detection method for bonding structure of ceramic matrix composite radome and metal ring | |
| CN112284310B (en) | Nondestructive testing method for thickness of adhesive film of honeycomb sandwich structure | |
| CN103743817B (en) | A kind of low frequency ultrasound transducer array couples detection means | |
| CN109030625B (en) | Device and method for detecting bonding defects of composite material | |
| CN113808092B (en) | Method, system, device and medium for detecting debonding defect of steel pipe concrete interface | |
| CN114113328A (en) | Method for detecting debonding defect of aluminum panel and honeycomb glued joint | |
| JPH02129544A (en) | Ultrasonic flaw detecting device | |
| Bramanti | A nondestructive diagnostic method based on swept-frequency ultrasound transmission-reflection measurements | |
| CN204514866U (en) | A kind of sheet workpiece phased array supersonic guided wave image-forming detecting system | |
| CN111521679A (en) | Flaw detection method for steel structure | |
| CN113405752A (en) | Ultrasonic detection method for interface rigidity based on microwave network analysis | |
| CN205691081U (en) | A kind of waveform calibrator | |
| JPH01158348A (en) | Ultrasonic flaw detection apparatus |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |