CN112130385B - Ultra-narrow frame display panel and manufacturing method thereof - Google Patents

Ultra-narrow frame display panel and manufacturing method thereof Download PDF

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Publication number
CN112130385B
CN112130385B CN202011100110.7A CN202011100110A CN112130385B CN 112130385 B CN112130385 B CN 112130385B CN 202011100110 A CN202011100110 A CN 202011100110A CN 112130385 B CN112130385 B CN 112130385B
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substrate
display panel
ultra
array substrate
etching
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CN112130385A (en
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马荣
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Wuhan China Star Optoelectronics Technology Co Ltd
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Wuhan China Star Optoelectronics Technology Co Ltd
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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13458—Terminal pads
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

The application discloses a display panel with an ultra-narrow frame, which comprises a CF substrate and an array substrate which are oppositely arranged at intervals, wherein the CF substrate and the array substrate are sealed in the frame; the IC binding area comprises at least one bonding pad which is a metal layer. The application also provides a manufacturing method of the ultra-narrow frame display panel. A super narrow frame display panel in this application through carrying out the chamfer to CF base plate side, can greatly reduce lower frame size, reduces the non-display area, improves the panel utilization ratio, increases the screen and accounts for the ratio, promotes the competitiveness of product.

Description

Ultra-narrow frame display panel and manufacturing method thereof
Technical Field
The application relates to the technical field of display, in particular to an ultra-narrow frame display panel and a manufacturing method thereof.
Background
In recent years, LTPS (Low Temperature Poly-Silicon) display panels have been increasingly applied to medium-high end small-size products, and have the advantages of high resolution, high aperture ratio, high reaction speed, Low power consumption, and the like. These known techniques all have their own limitations: narrow borders-the borders on the left and right are compressed mainly by Cut on seal; COF-IC is integrated on the FPC and called COF, COF bonding is carried out on TFT glass through ACF, although the IC bonding area is saved, a space needs to be reserved for attaching the ACF; and thirdly, special-shaped display, namely, only avoiding the camera and other areas to increase the display area mainly through the special shape of the upper edge.
The invention provides a display panel with an ultra-narrow frame structure, which can effectively reduce the size of a lower frame, improve the utilization rate of the panel and increase the screen occupation ratio.
Disclosure of Invention
The super narrow frame display panel that this application embodiment provided can greatly reduce lower frame size, reduces non-display area, improves the panel utilization ratio, increases the screen and accounts for the ratio, promotes the competitiveness of product.
The embodiment of the application provides a display panel with an ultra-narrow frame, which comprises a CF substrate and an array substrate which are oppositely arranged at intervals, wherein the CF substrate and the array substrate are sealed in the frame; the IC binding area comprises at least one bonding pad which is a metal layer.
In some embodiments, the surface of the IC bonding area further comprises a Chip On Film (COF) or Chip On Glass (COG).
In some embodiments, the CF substrate is 0.15cm high.
In some embodiments, the height of the array substrate attached to the IC bonding region is 0.15 cm.
The embodiment of the application further provides a manufacturing method of the display panel with the ultra-narrow frame, which comprises the following steps:
providing a display panel oppositely provided with a CF substrate and an array substrate, wherein the side surfaces of the CF substrate and the array substrate are IC binding areas, and chamfering R angles on the side surfaces of the CF substrate to form an R angle area;
sputtering a metal film layer on the IC binding area, wherein the metal film layer extends to the front surface of the CF substrate;
marking and etching the metal film layer to obtain a bonding pad;
and after the etching is finished, COF pasting or COG is carried out on the IC binding area.
In some embodiments, the step of etching comprises: and preliminarily etching the marked metal film layer to an R-angle area, further etching the section of the metal coating layer by taking the edge of the bonding pad obtained by preliminary etching as a reference, and finishing the etching of the metal film layer to obtain the bonding pad.
In some embodiments, the indicia are specifically: and marking (mark) on the metal film layer on the front surface of the CF substrate.
In some embodiments, before chamfering the side of the CF substrate with an R-chamfer, the method further comprises: and grinding the side surfaces of the CF substrate and the array substrate.
In some embodiments, prior to performing the grinding process, the method further comprises: and carrying out flush side cutting on the side surfaces of the CF substrate and the array substrate.
In some embodiments, the height of the CF substrate to which the IC bonding regions are attached is 0.15 cm; the height of the array substrate attached to the IC binding region is 0.15 cm.
The etching method in the invention adopts laser etching.
The beneficial effect of this application lies in:
the application provides a super narrow frame display panel can greatly reduce the lower frame size, reduces the non-display area in binding the district, improves the panel utilization ratio, increases the screen and accounts for the ratio, promotes the competitiveness of product. The Bonding Pad is manufactured on the side face of the display panel in a laser etching mode, and is connected with the Bonding Pad pattern on the glass substrate, so that the area of a non-display area is compressed, and the screen occupation ratio is improved.
According to the manufacturing method of the ultra-narrow frame display panel, the plurality of bonding pads are manufactured on the side face of the display panel, the side face of the CF substrate end of the panel is ground and chamfered, the metal layer is sputtered on the side face and the chamfered area, the bonding pads are formed on the side face in a laser etching mode, laser etching is continued by taking the edges of the formed bonding pads as the reference so as to be connected and conducted with the bonding pads in the plane, and COF bonding is performed on an OLB (on line bonding) section, so that the non-display area on the bonding side is effectively reduced. This application is in laser etching, has provided the realization method of counterpoint benchmark when side etching metal, through the panel chamfer, the mode of front coating dummy metal level converts positive mark into side counterpoint benchmark, has improved the accuracy of side processing technology.
Drawings
The technical solution and other advantages of the present application will become apparent from the detailed description of the embodiments of the present application with reference to the accompanying drawings.
Fig. 1 is a schematic cross-sectional view of a CF substrate and an array substrate disposed opposite to each other in an embodiment of the invention;
FIG. 2 is a schematic cross-sectional view of an oppositely disposed array substrate and a CF substrate and a side R-angle thereof according to an embodiment of the invention;
FIG. 3 is a schematic cross-sectional view of a metal layer of an IC bonding area in a display panel according to an embodiment of the invention;
FIG. 4 is a schematic diagram illustrating a structure of a metal film layer of a display panel after preliminary etching according to an embodiment of the invention;
FIG. 5 is an enlarged view of area A of FIG. 4;
FIG. 6 is a schematic diagram of a pad structure of a display panel according to an embodiment of the invention;
fig. 7 is an enlarged view of the region B in fig. 6.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The terms "first," "second," "third," and the like in the description and in the claims, as well as in the drawings, if any, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the objects so described are interchangeable under appropriate circumstances. Furthermore, the terms "comprising" and "having," as well as any variations thereof, are intended to cover non-exclusive inclusions.
In this patent document, the drawings discussed below and the embodiments used to describe the principles of the present disclosure are by way of illustration only and should not be construed in any way to limit the scope of the present disclosure. Those skilled in the art will understand that the principles of the present invention may be implemented in any suitably arranged system. Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. Further, a terminal according to an exemplary embodiment will be described in detail with reference to the accompanying drawings. Like reference symbols in the various drawings indicate like elements.
The terms used in the description of the present invention are only used to describe specific embodiments, and are not intended to show the concept of the present invention. Unless the context clearly dictates otherwise, expressions used in the singular number encompass expressions in the plural number. In the present specification, it is to be understood that terms such as "comprising," "having," and "containing" are intended to specify the presence of stated features, integers, steps, acts, or combinations thereof, as taught in the present specification, and are not intended to preclude the presence or addition of one or more other features, integers, steps, acts, or combinations thereof. Like reference symbols in the various drawings indicate like elements.
The embodiment of the present application provides a display panel with an ultra-narrow bezel, and specifically, please refer to fig. 2 or fig. 3, where the display panel with an ultra-narrow bezel includes a CF substrate 1 and an array substrate 2 that are disposed at an interval, the CF substrate 1 and the array substrate 2 are sealed by a bezel, the display panel includes an IC bonding area 3, the IC bonding area 3 is tightly attached to the side surfaces of the CF substrate 1 and the array substrate 2, and the side surface of the CF substrate 1 is an R-corner area 11; referring to fig. 7, the IC bonding area 3 includes at least one bonding pad 5, and the bonding pad 5 is a metal layer.
In some embodiments, the Array substrate 2 is, for example, but not limited to, an Array substrate.
In some embodiments, the CF substrate 1 and the array substrate 2 are sealed by a sealant (seal) (not shown). Referring to fig. 1 to 3, the left side of the dotted line (AA) is a display area, and the right side of the dotted line is a non-display area.
In some embodiments, the surface of the IC bonding area 3 further includes COF (chip on film) or COG (chip on glass).
In some embodiments, the CF substrate 1 is 0.15cm high.
In some embodiments, the height of the array substrate to which the IC bonding region 3 is attached is 0.15 cm.
The embodiment of the application further provides a manufacturing method of the display panel with the ultra-narrow frame, which comprises the following steps:
specifically, referring to fig. 1, a display panel having a CF substrate 1 and an array substrate 1 disposed opposite to each other is provided, and the side surfaces of the CF substrate 1 and the array substrate 2 are IC bonding areas 3'; referring to fig. 2, a side surface of the CF substrate 1 is chamfered to form an R-corner region 11;
referring to fig. 3, after chamfering the R angle, a metal film 4 is sputtered on the IC bonding region 3, and the metal film 4 extends to the front surface of the CF substrate 1;
marking and etching the metal film layer to obtain a bonding pad 5;
after the etching is completed, COF or COG attachment is performed in the IC bonding area 3.
In some embodiments, the step of etching comprises: the marked metal film layer 1 is primarily etched to an R-corner region 11 (see fig. 4 and 5), and the cross section of the metal plating layer is further etched based on the edge of the pad 4' obtained by the primary etching, so as to complete the etching of the metal film layer 4, and obtain a pad 5 (see fig. 6 and 7).
In some embodiments, the indicia are specifically: and mark is arranged on the metal film layer on the front surface of the CF substrate 1.
In some embodiments, before chamfering the side of the CF substrate 1 with an R-chamfer, the method further comprises: and grinding the side surfaces of the CF substrate 1 and the array substrate 2.
In some embodiments, prior to performing the grinding process, the method further comprises: referring to fig. 1, the side surfaces of the CF substrate and the array substrate are cut flush and laterally.
In some embodiments, the height of the CF substrate to which the IC bonding regions are attached is 0.15 cm; the height of the array substrate attached to the IC binding region is 0.15 cm.
The ultra-narrow bezel display panel and the manufacturing method thereof provided by the embodiments of the present application are described in detail above, and the principle and the implementation manner of the present application are explained in this document by applying specific examples, and the description of the above embodiments is only used to help understanding the technical scheme and the core idea of the present application; those of ordinary skill in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications or substitutions do not depart from the spirit and scope of the present disclosure as defined by the appended claims.

Claims (9)

1. A manufacturing method of an ultra-narrow frame display panel is characterized by comprising the following steps:
providing a display panel oppositely provided with a CF substrate and an array substrate, wherein the side surfaces of the CF substrate and the array substrate are IC binding regions, and chamfering an R angle on the side surface of the CF substrate to form an R angle region;
sputtering a metal film layer on the IC binding region, wherein the metal film layer extends to the front surface of the CF substrate, and the front surface is the surface of the CF substrate far away from the array substrate;
marking and etching the metal film layer to obtain a bonding pad;
after the etching is finished, COF or COG pasting is carried out on the IC binding area;
the step of etching includes: and preliminarily etching the marked metal film layer to an R-angle area, further etching the section of the metal film layer by taking the edge of the bonding pad obtained by preliminary etching as a reference, and finishing the etching of the metal film layer to obtain the bonding pad.
2. The method for manufacturing the ultra-narrow bezel display panel according to claim 1, wherein the mark is specifically: and marking on the metal film layer on the front surface of the CF substrate.
3. The method of manufacturing an ultra-narrow bezel display panel as claimed in claim 1, wherein before chamfering the side face of the CF substrate, the method further comprises: and grinding the side surfaces of the CF substrate and the array substrate.
4. The method of manufacturing an ultra-narrow bezel display panel as claimed in claim 3, wherein before the grinding process, the method further comprises: and carrying out flush side cutting on the side surfaces of the CF substrate and the array substrate.
5. The method of claim 1, wherein the height of the CF substrate attached to the IC bonding area is 0.15 cm; the height of the array substrate attached to the IC binding region is 0.15 cm.
6. The utility model provides a super narrow frame display panel which characterized in that: the display panel comprises a CF substrate and an array substrate which are oppositely arranged at intervals, wherein the CF substrate and the array substrate are sealed in a frame mode, the display panel comprises an IC binding area, the IC binding area is tightly attached to the side faces of the CF substrate and the array substrate, and the side face of the CF substrate is an R-angle area; the IC binding area comprises at least one bonding pad which is a metal layer;
the ultra-narrow bezel display panel is manufactured by the method according to any one of claims 1 to 5.
7. The ultra-narrow bezel display panel of claim 6, wherein the surface of the IC bonding area further comprises a COF or COG.
8. The ultra-narrow bezel display panel of claim 6, wherein the CF substrate is 0.15cm high.
9. The ultra-narrow bezel display panel as claimed in claim 6 or 8, wherein the height of the array substrate to which the IC bonding region is attached is 0.15 cm.
CN202011100110.7A 2020-10-15 2020-10-15 Ultra-narrow frame display panel and manufacturing method thereof Active CN112130385B (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004207644A (en) * 2002-12-26 2004-07-22 Toto Ltd Electrostatic chuck and apparatus for manufacturing bonded substrate using it
CN106647070A (en) * 2017-01-03 2017-05-10 京东方科技集团股份有限公司 Display panel and display device
CN110579916A (en) * 2019-08-22 2019-12-17 武汉华星光电技术有限公司 display panel, preparation method thereof and display device
CN111007685A (en) * 2019-11-29 2020-04-14 武汉华星光电技术有限公司 Liquid crystal display panel and side bonding method thereof
CN111638607A (en) * 2020-06-11 2020-09-08 武汉华星光电技术有限公司 Narrow-frame display panel and preparation method thereof

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108231852B (en) * 2018-01-03 2020-08-21 京东方科技集团股份有限公司 Preparation method of display panel

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004207644A (en) * 2002-12-26 2004-07-22 Toto Ltd Electrostatic chuck and apparatus for manufacturing bonded substrate using it
CN106647070A (en) * 2017-01-03 2017-05-10 京东方科技集团股份有限公司 Display panel and display device
CN110579916A (en) * 2019-08-22 2019-12-17 武汉华星光电技术有限公司 display panel, preparation method thereof and display device
CN111007685A (en) * 2019-11-29 2020-04-14 武汉华星光电技术有限公司 Liquid crystal display panel and side bonding method thereof
CN111638607A (en) * 2020-06-11 2020-09-08 武汉华星光电技术有限公司 Narrow-frame display panel and preparation method thereof

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