CN111739812B - 一种大功率轴向双向二极管的生产工艺 - Google Patents
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Abstract
本发明公开了一种大功率轴向双向二极管的生产工艺,包括以下步骤:铜粒预焊:将方铜粒、铜粒通过焊片焊接制成预焊铜粒;芯片预焊:将铜粒、方形芯片通过焊片焊接制成预焊芯片;下模填装:在下模内先填装下引线,再按正序或反序依次填装方形芯片、预焊芯片、预焊铜粒,并用焊片间隔;上模填装:在上模内填装上引线,所述上引线与所述下模内的方形芯片或预焊铜粒之间间隔有焊片;合模焊接:将上模与下模合模后压紧,送入焊接炉内焊接。本发明通过在传统二极管焊接工艺的基础上、使用现有铜粒双面预焊工艺、芯片双面预焊工艺,按照轴向二极管原件的尺寸做设计调整解决了传统低效率、难操作、难定位、材料短路、本体易错位的情况。
Description
技术领域
本发明涉及半导体器件的制造技术领域,具体涉及一种大功率轴向双向二极管的生产工艺。
背景技术
长期以来,在半导体器件制造领域,人们在结构设计、成本降低、可靠性、提高产品的性价比等方面,作出了不懈的努力。GPP芯片采用电泳玻璃、低损伤的激光切割的方式形成具有高度稳定的玻璃钝化结构,具有电压均一性好,反向漏电流低,可靠性高,抗浪涌能力强的优点。用于高压整流二极管、单相整流桥等整流器件。本专利采用GPP芯片,通过芯片叠焊方法,提高产品性能。为了保护玻璃钝化芯片不受损需要在芯片与芯片之间加入一层与芯片同大的铜粒,且该铜粒两端各需要焊接一个小铜粒,继而保证不被大铜粒及焊锡短路,或在双P面各焊接一个小铜粒(即使用芯片双面预焊技术和铜粒双面预焊技术),当前加工工艺中,需按照所需产品结构,由人工用镊子将各部件依次夹入焊接下模的阶梯状容置槽中,待所有部件摆放完毕后,合焊接模上模,并送入炉内进行焊接。传统的加工工艺过程中各部件的定位不准确,容易导致后续二极管焊接完成后,出现本体错位的情况,严重的会直接导致材料短路。且放置焊片和铜粒操作较为繁琐,效率较低,如果操作不当,将焊片和铜粒放置顺序弄错,需要重新从头开始放置,对于操作者的技术素养要求较高,严重制约了生产效率。
发明内容
为了解决现有技术问题,本发明提供一种大功率轴向双向二极管的生产工艺,通过使用现有铜粒双面预焊工艺、芯片双面预焊工艺按照轴向二极管元件的尺寸做改进设计解决了传统低效率、难操作、难定位、材料短路、本体易错位的情况,将原本复杂的二极管装填步骤分开简单化,且本专利工艺具有可调节性,更好适用于各种材料元件的焊接。
本发明的技术方案:
一种大功率轴向双向二极管的生产工艺,包括以下步骤:
(1)铜粒预焊:将方铜粒、铜粒通过焊片焊接制成预焊铜粒;
(2)芯片预焊:将铜粒、方形芯片通过焊片焊接制成预焊芯片;
(3)下模填装:在下模内先填装下引线,再按正序或反序依次填装方形芯片、预焊芯片、预焊铜粒,并用焊片间隔;
(4)上模填装:在上模内填装上引线,所述上引线与所述下模内的方形芯片或预焊铜粒之间间隔有焊片;
(5)合模焊接:将上模与下模合模后压紧,送入焊接炉内焊接。
进一步地,所述步骤(1)中铜粒预焊为将方铜粒、焊片、铜粒、焊片依次按顺序叠放在铜粒预焊板上,再置入焊接炉中制成预焊铜粒。
进一步地,所述步骤(2)中芯片预焊为将铜粒、焊片、方形芯片依次按顺序叠放在芯片预焊板上,再置入焊接炉中制成I型预焊芯片;或者将铜粒、焊片、方形芯片、焊片、铜粒依次按顺序叠放在芯片预焊板上,再置入焊接炉中制成II型预焊芯片;
进一步地,所述步骤(3)中下模填装为在下模内先填装下引线,再在下引线上依次按顺序叠放焊片、方形芯片、焊片、I型预焊芯片、焊片、I型预焊芯片、预焊铜粒、焊片;或者在下模内先填装下引线,再在下引线上依次按顺序叠放焊片、预焊铜粒、方形芯片、焊片、II型预焊芯片、焊片、方形芯片、焊片。
进一步地,所述步骤(1)为:①将焊片倒入真空吸盘中,摇晃吸盘,使每个焊片能均匀的分布在吸盘的每个坑中,启动真空机抽取空气,再将吸盘倒置,然后倒置的吸盘和铜粒预焊板重合,断开真空机气管,敲击吸盘,焊片自然落在铜粒预焊板上;②重复上面①操作,将装的材料换成铜粒;③重复上面①操作,将装的材料换成焊片;④重复上面①操作,将装的材料换成方铜粒。
进一步地,所述步骤(2)I型预焊芯片的制作步骤包含:a.将铜粒倒入真空吸盘中,摇晃吸盘,使每个焊片能均匀的分布在吸盘的每个坑中,启动真空机抽取空气,再将吸盘倒置,然后倒置的吸盘和芯片预焊板重合,断开真空机气管,敲击吸盘,铜粒自然落在芯片预焊板上;b.重复上面a操作;将装的材料换成焊片;c.重复上面a操作,将装的材料换成芯片;所述步骤(2)II型预焊芯片的制作步骤包含:a.将铜粒倒入真空吸盘中,摇晃吸盘,使每个焊片能均匀的分布在吸盘的每个坑中,启动真空机抽取空气,再将吸盘倒置,然后倒置的吸盘和芯片预焊板重合,断开真空机气管,敲击吸盘,铜粒自然落在芯片预焊板上;b.重复上面a操作,将装的材料换成焊片;c.重复上面a操作,将装的材料换成方形芯片;d.重复上面a操作,将装的材料换成焊片;e.重复上面a操作,将装的材料换成铜粒。
进一步地,所述步骤(3)中使用I型芯片的制作步骤包含A.将焊片倒入吸盘中,摇晃吸盘,使每个焊片能均匀的分布在吸盘的每个坑中,启动真空机抽取空气,再将吸盘倒置,然后倒置的吸盘和装有引线的下模重合,断开真空机气管,敲击吸盘,焊片自然落在模孔内;B.重复上面A操作,将装的材料换成方形芯片;C.重复上面A操作,将装的材料换成焊片;D.重复上面A操作,将装的材料换成预焊芯片;E.重复上面A操作,将装的材料换成焊片;所述步骤(3)中使用II型芯片的制作步骤包含:A.将焊片倒入吸盘中,摇晃吸盘,使每个焊片能均匀的分布在吸盘的每个坑中,启动真空机抽取空气,再将吸盘倒置,然后倒置的吸盘和装有引线的下模重合,断开真空机气管,敲击吸盘,焊片自然落在模孔内;B.重复上面A操作,将装的材料换成预焊铜粒;C.重复上面A操作,将装的材料换成方形芯片;D.重复上面A操作,将装的材料换成焊片;E.重复上面A操作,将装的材料换成II型预焊芯片;F.重复上面A操作,将装的材料换成焊片;G.重复上面A操作,将装的材料换成方形芯片;H.重复上面A操作,将装的材料换成焊片。
进一步地,所述步骤(5)中,将填装完下引线的下模用转换板盖好,再翻转过来,与下模装填好的石墨舟重合。
进一步地,所述真空吸盘、铜粒预焊板、芯片预焊板、下模和上模上设有位置一致的定位孔,所述定位孔内设有定位销。
进一步地,所述下模和上模分别为下石墨舟和上石墨舟。
与现有技术相比,本发明本专利通过使用现有铜粒双面预焊工艺、芯片双面预焊工艺,配合二极管元件尺寸,在满足现有二极管预焊工艺的基础上进行调整设计,使用吸盘、定位销、定位板等辅助工具,快速装填;本产品既能适用于GPP全系列大功率焊接产品使用,又大大节约的工人操作时间和提高了材料品质产出率,简单易操作、提高工作效率和产品品质及提高产品产出率。
本专利通过在传统二极管焊接工艺的基础上、使用现有铜粒双面预焊工艺、芯片双面预焊工艺,按照轴向二极管原件的尺寸做设计调整解决了传统低效率、难操作、难定位、材料短路、本体易错位的情况;通过本发明方法制作的产品具有高效率、高品质、高产出的特点,本体一致,外观良好,电性优良。
附图说明
图1是本发明预焊铜粒流程示意图;
图2是本发明I型预焊芯片流程示意图;
图3是本发明I型预焊芯片的下模填装和合模流程示意图;
图4是本发明预焊铜粒流程和II型预焊芯片流程示意图;
图5是本发明II型预焊芯片的下模填装和合模示意图;
图6是本发明铜粒预焊板结构示意图;
图7是本发明芯片预焊板结构示意图;
图8是本发明下模结构示意图;
图9是本发明真空吸盘结构示意图;
图10是本发明转换板结构示意图。
具体实施方式
下面结合附图对本发明的具体实施方式进行详细说明。
实施例1:
(1)铜粒预焊:将方铜粒、焊片、铜粒、焊片依次按顺序叠放在铜粒预焊板上,再置入焊接炉中制成预焊铜粒。
(2)芯片预焊:将铜粒、焊片、方形芯片依次按顺序叠放在芯片预焊板上,再置入焊接炉中制成I型预焊芯片;或者将铜粒、焊片、方形芯片、焊片、铜粒依次按顺序叠放在芯片预焊板上,再置入焊接炉中制成II型预焊芯片;
(3)下模填装:在下模内先填装下引线,再在下引线上依次按顺序叠放焊片、方形芯片、焊片、I型预焊芯片、焊片、I型预焊芯片、预焊铜粒、焊片;或者在下模内先填装下引线,再在下引线上依次按顺序叠放焊片、预焊铜粒、方形芯片、焊片、II型预焊芯片、焊片、方形芯片、焊片。
(4)上模填装:在上模内填装上引线,所述上引线与所述下模内的方形芯片或预焊铜粒之间间隔有焊片;
(5)合模焊接:将上模与下模合模后压紧,送入焊接炉内焊接。
上述方案的具体实施步骤为:
制作预焊铜粒:①将焊片倒入真空吸盘中,摇晃吸盘,使每个焊片能均匀的分布在吸盘的每个坑中,启动真空机抽取空气,再将吸盘倒置,然后倒置的吸盘和铜粒预焊板重合,断开真空机气管,敲击吸盘,焊片自然落在铜粒预焊板上,其中吸盘与铜粒预焊板对接,需要准确定位,通过设置在吸盘和铜粒预焊板上位置相对应的定位孔和定位销来实现定位;②重复上面①操作,将装的材料换成铜粒;③重复上面①操作,将装的材料换成焊片;④重复上面①操作,将装的材料换成方铜粒;如此备用。
制作预焊芯片:
如图1、2和3所示,制作I型预焊芯片:a.将铜粒倒入真空吸盘中,摇晃吸盘,使每个焊片能均匀的分布在吸盘的每个坑中,启动真空机抽取空气,再将吸盘倒置,然后倒置的吸盘和芯片预焊板重合,断开真空机气管,敲击吸盘,铜粒自然落在芯片预焊板上,其中吸盘与芯片预焊板对接,需要准确定位,通过设置在吸盘和铜粒预焊板上位置相对应的定位孔和定位销来实现定位;b.重复上面a操作;将装的材料换成焊片;c.重复上面a操作,将装的材料换成芯片。
如图4和5所示,制作II型预焊芯片:a.将铜粒倒入真空吸盘中,摇晃吸盘,使每个焊片能均匀的分布在吸盘的每个坑中,启动真空机抽取空气,再将吸盘倒置,然后倒置的吸盘和芯片预焊板重合,断开真空机气管,敲击吸盘,铜粒自然落在芯片预焊板上;b.重复上面a操作,将装的材料换成焊片;c.重复上面a操作,将装的材料换成方形芯片;d.重复上面a操作,将装的材料换成焊片;e.重复上面a操作,将装的材料换成铜粒。
将上述的填装后的铜粒预焊板和芯片预焊板,置入焊接炉中,制作出预焊铜粒和预焊芯片。同时放入,节省时间,提高效率。
下模填装:
如图1、2和3所示,下模内填装I型预焊芯片:A.将焊片倒入吸盘中,摇晃吸盘,使每个焊片能均匀的分布在吸盘的每个坑中,启动真空机抽取空气,再将吸盘倒置,然后倒置的吸盘和装有引线的下模重合,断开真空机气管,敲击吸盘,焊片自然落在模孔内;B.重复上面A操作,将装的材料换成方形芯片;C.重复上面A操作,将装的材料换成焊片;D.重复上面A操作,将装的材料换成预焊芯片;E.重复上面A操作,将装的材料换成焊片;
如图4和5所示,下模内填装II型预焊芯片:A.将焊片倒入吸盘中,摇晃吸盘,使每个焊片能均匀的分布在吸盘的每个坑中,启动真空机抽取空气,再将吸盘倒置,然后倒置的吸盘和装有引线的下模重合,断开真空机气管,敲击吸盘,焊片自然落在模孔内;B.重复上面A操作,将装的材料换成预焊铜粒;C.重复上面A操作,将装的材料换成方形芯片;D.重复上面A操作,将装的材料换成焊片;E.重复上面A操作,将装的材料换成II型预焊芯片;F.重复上面A操作,将装的材料换成焊片;G.重复上面A操作,将装的材料换成方形芯片;H.重复上面A操作,将装的材料换成焊片。
上模填装:在上模内填装上引线,将填装完下引线的下模用转换板6盖好,再翻转过来,与下模装填好的石墨舟重合,所述翻转板呈不规则的Z字形。
现有的用于制作GPP的下模和上模,本发明采用石墨材料制作成石墨舟,其结构为常用结构。
真空吸盘,其尺寸大小与现有的模具相适应,并在其盘面上设计吸孔,吸孔的位置和数量与现有模具相对,吸盘的内腔中空,且与吸孔连通,吸盘一侧设有抽气管与真空机相连通,通过控制真空机,即可实现吸附位于吸孔上的铜粒、焊片等材料。
铜粒预焊板,用石墨材质制作,板面上设有数量、位置与吸盘吸孔一致的孔槽,孔槽的大小、深度、形状与方形铜粒、焊片、铜粒相匹配,用于容纳吸盘上依次下落叠放的焊片,铜粒等材料。
芯片预焊板,用石墨材质制作,板面上设有数量、位置与吸盘吸孔一致的孔槽,孔槽的大小、深度、形状与方形芯片、焊片、铜粒相匹配,用于容纳吸盘上依次下落叠放的焊片,铜粒、方形芯片等材料。
上述模具1、铜粒预焊板2、芯片预焊板3、真空吸盘4上设有位置对应一致的定位孔5,通过向定位孔内***定位销,将吸盘与铜粒预焊板、吸盘与芯片预焊板、吸盘与下模、下模和上模进行定位,保证材料稳定掉落到准确位置,确保产品质量和一致性。
以上显示和描述了本发明的基本原理、主要特征和本发明的优点。本发明不受上述实施例的限制,上述实施例和说明书中描述的只是说明本发明的原理,在不脱离本发明精神和范围的前提下本发明还会有各种变化和改进,这些变化和改进都落入要求保护的本发明的范围内。本发明要求保护范围由所附的权利要求书及其等同物界定。
Claims (1)
1.一种大功率轴向双向二极管的生产工艺,其特征在于:包括以下步骤:
步骤(1)、铜粒预焊:将方铜粒、铜粒通过焊片焊接制成预焊铜粒;
步骤(2)、芯片预焊:将铜粒、方形芯片通过焊片焊接制成预焊芯片;
步骤(3)、下模填装:在下模内先填装下引线,再按正序或反序依次填装方形芯片、预焊芯片、预焊铜粒,并用焊片间隔;
步骤(4)、上模填装:在上模内填装上引线,所述上引线与所述下模内的方形芯片或预焊铜粒之间间隔有焊片;
步骤(5)、合模焊接:将上模与下模合模后压紧,送入焊接炉内焊接,
其中,所述步骤(1)中铜粒预焊为将方铜粒、焊片、铜粒、焊片依次按顺序叠放在铜粒预焊板上,再置入焊接炉中制成预焊铜粒,
其中,所述步骤(2)中芯片预焊为将铜粒、焊片、方形芯片依次按顺序叠放在芯片预焊板上,再置入焊接炉中制成I型预焊芯片;或者将铜粒、焊片、方形芯片、焊片、铜粒依次按顺序叠放在芯片预焊板上,再置入焊接炉中制成II型预焊芯片,
其中,所述步骤(3)中下模填装为在下模内先填装下引线,再在下引线上依次按顺序叠放焊片、方形芯片、焊片、I型预焊芯片、焊片、I型预焊芯片、预焊铜粒、焊片;或者在下模内先填装下引线,再在下引线上依次按顺序叠放焊片、预焊铜粒、方形芯片、焊片、II型预焊芯片、焊片、方形芯片、焊片,
其中,所述步骤(2)I型预焊芯片的制作步骤包含:a.将铜粒倒入真空吸盘中,摇晃吸盘,使每个焊片能均匀的分布在吸盘的每个坑中,启动真空机抽取空气,再将吸盘倒置,然后倒置的吸盘和芯片预焊板重合,断开真空机气管,敲击吸盘,铜粒自然落在芯片预焊板上;b.重复上面a操作;将装的材料换成焊片;c.重复上面a操作,将装的材料换成芯片;所述步骤(2)II型预焊芯片的制作步骤包含:a.将铜粒倒入真空吸盘中,摇晃吸盘,使每个焊片能均匀的分布在吸盘的每个坑中,启动真空机抽取空气,再将吸盘倒置,然后倒置的吸盘和芯片预焊板重合,断开真空机气管,敲击吸盘,铜粒自然落在芯片预焊板上;b.重复上面a操作,将装的材料换成焊片;c.重复上面a操作,将装的材料换成方形芯片;d.重复上面a操作,将装的材料换成焊片;e.重复上面a操作,将装的材料换成铜粒,
其中,所述步骤(3)中使用I型芯片的制作步骤包含A.将焊片倒入吸盘中,摇晃吸盘,使每个焊片能均匀的分布在吸盘的每个坑中,启动真空机抽取空气,再将吸盘倒置,然后倒置的吸盘和装有引线的下模重合,断开真空机气管,敲击吸盘,焊片自然落在模孔内;B.重复上面A操作,将装的材料换成方形芯片;C.重复上面A操作,将装的材料换成焊片;D.重复上面A操作,将装的材料换成预焊芯片;E.重复上面A操作,将装的材料换成焊片;所述步骤(3)中使用II型芯片的制作步骤包含:A.将焊片倒入吸盘中,摇晃吸盘,使每个焊片能均匀的分布在吸盘的每个坑中,启动真空机抽取空气,再将吸盘倒置,然后倒置的吸盘和装有引线的下模重合,断开真空机气管,敲击吸盘,焊片自然落在模孔内;B.重复上面A操作,将装的材料换成预焊铜粒;C.重复上面A操作,将装的材料换成方形芯片;D.重复上面A操作,将装的材料换成焊片;E.重复上面A操作,将装的材料换成II型预焊芯片;F.重复上面A操作,将装的材料换成焊片;G.重复上面A操作,将装的材料换成方形芯片;H.重复上面A操作,将装的材料换成焊片,
其中,所述真空吸盘、铜粒预焊板、芯片预焊板、下模和上模上设有位置一致的定位孔,所述定位孔内设有定位销,
其中,所述步骤(1)为:①将焊片倒入真空吸盘中,摇晃吸盘,使每个焊片能均匀的分布在吸盘的每个坑中,启动真空机抽取空气,再将吸盘倒置,然后倒置的吸盘和铜粒预焊板重合,断开真空机气管,敲击吸盘,焊片自然落在铜粒预焊板上;②重复上面①操作,将装的材料换成铜粒;③重复上面①操作,将装的材料换成焊片;④重复上面①操作,将装的材料换成方铜粒,
其中,所述步骤(5)中,将填装完下引线的下模用转换板盖好,再翻转过来,与下模装填好的石墨舟重合,
其中,所述下模和上模分别为下石墨舟和上石墨舟,
其中,真空吸盘,其尺寸大小与上模和下模相适应,并在其盘面上设计吸孔,吸孔的位置和数量与上模和下模相对,吸盘的内腔中空,且与吸孔连通,吸盘一侧设有抽气管与真空机相连通,通过控制真空机,吸附位于吸孔上的铜粒、焊片,
其中,铜粒预焊板,用石墨材质制作,板面上设有数量、位置与吸盘吸孔一致的孔槽,孔槽的大小、深度、形状与方形铜粒、焊片、铜粒相匹配,用于容纳吸盘上依次下落叠放的焊片,铜粒,
其中,芯片预焊板,用石墨材质制作,板面上设有数量、位置与吸盘吸孔一致的孔槽,孔槽的大小、深度、形状与方形芯片、焊片、铜粒相匹配,用于容纳吸盘上依次下落叠放的焊片,铜粒、方形芯片。
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