CN111702276A - Laser hot-pressing heating suction nozzle, device welding device and hot-pressing composite heating method - Google Patents
Laser hot-pressing heating suction nozzle, device welding device and hot-pressing composite heating method Download PDFInfo
- Publication number
- CN111702276A CN111702276A CN202010647130.XA CN202010647130A CN111702276A CN 111702276 A CN111702276 A CN 111702276A CN 202010647130 A CN202010647130 A CN 202010647130A CN 111702276 A CN111702276 A CN 111702276A
- Authority
- CN
- China
- Prior art keywords
- laser
- heating
- suction nozzle
- welded
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010438 heat treatment Methods 0.000 title claims abstract description 61
- 238000007731 hot pressing Methods 0.000 title claims abstract description 27
- 238000000034 method Methods 0.000 title claims abstract description 20
- 239000002131 composite material Substances 0.000 title claims abstract description 12
- 238000003466 welding Methods 0.000 title abstract description 28
- 239000000463 material Substances 0.000 claims description 9
- 238000003756 stirring Methods 0.000 claims description 5
- 230000005540 biological transmission Effects 0.000 claims description 2
- 238000007906 compression Methods 0.000 claims 4
- 238000005476 soldering Methods 0.000 claims 3
- 238000002310 reflectometry Methods 0.000 abstract description 8
- 239000011324 bead Substances 0.000 description 12
- 230000008439 repair process Effects 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 5
- 238000004093 laser heating Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000003825 pressing Methods 0.000 description 3
- 239000003086 colorant Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000012536 packaging technology Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 229920001621 AMOLED Polymers 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009529 body temperature measurement Methods 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 230000002427 irreversible effect Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/005—Soldering by means of radiant energy
- B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/04—Heating appliances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention relates to a laser hot-pressing heating suction nozzle, a device welding device and a hot-pressing composite heating method. The laser energy passing through the light hole can directly reach the device to be welded and is transmitted to the bonding pad, the laser energy on the outer ring of the light hole is directly gathered at the tip part of the suction nozzle to heat the suction nozzle and can be transmitted to the device to be welded and the bonding pad through heat conduction, coaxial laser energy formed by the light hole and the tip part and the heat conduction energy heat the device to be welded together, and the problem of heating stability caused by different object reflectivity differences can be effectively solved.
Description
Technical Field
The invention relates to the field of welding, in particular to a laser hot-pressing heating suction nozzle, a device welding device and a hot-pressing composite heating method.
Background
As is well known, the Mini/Micro LED has excellent performance and is expected to become a new trend of LED display, and an LCD display screen adopting the Mini LED backlight technology is superior to the current LCD display in brightness, contrast, color reduction and energy conservation, even can compete with AMOLED and can control the production cost.
Technological advances have driven minileds to be upgraded as small-pitch display products. The Mini LED is expected to be applied and penetrated in the commercial and household display fields as the extension of the small-spacing technology. The breakthrough of the four-in-one packaging technology is the key for the grounding of the Mini LED product.
COB is a core packaging technology suitable for Mini/Micro LED products, and has a great application prospect in the future. The Micro LED has wide application prospect in consumer electronics and wearable products, and the Micro LED display can realize the design of a display with low energy consumption or high brightness due to the self-luminous display characteristic and the matching of a simple structure almost without an optical consumption element.
At present, domestic display panel factories actively develop and put into production lines to produce 65-inch whole plates, 75-inch double-spliced and 110-inch miniLED multi-partition backlight display screens. Due to the large size and the large number of miniLEDs and miniICs, the repair cannot be manually completed, and the problem needs to be solved by a matched process and equipment.
The MiniLED backlight circuit board often has badly, damages MiniLED lamp pearl chip and MiniIC chip at the in-process of manufacturing, and this type of chip is bad mainly reflects that the device pastes the poor short circuit and open a way that leads to in the position, and solder and welding temperature lead to welding badly unusually, device quality problem itself, device paster process pressure unusually lead to damaging etc. need use this application to restore to improve the yield, reduction in production cost.
The repair technology has great difference with the traditional hot air heating repair, infrared heating repair and other technical lines. The traditional mode flow adopted by the hot air heating repair table in the SMT industry for repairing the fault of the PCB is as follows: the method comprises the following types of modes of alignment, heating, dismantling and welding: the alignment precision is low, the repair target size is large, the heating range is poor to control, the protection performance of the chip/PCB is not ideal, and the surgical scalpel type precise repair of a single bad IC cannot be carried out.
The need in the field of laser welding and rework of MiniLED lamp bead chips and miniics is a critical technique that locally heats the device within a very small range.
The traditional heating modes include hot air heating, laser heating and the like. The hot air heating is gradually replaced by a laser heating mode due to low efficiency, but the heat utilization rate of the common laser heating mode is low, the MiniLED lamp bead chip, the MiniIC chip and the bonding pad are frequently damaged due to overhigh laser intensity, different bonding pad materials have different colors and generate different reflectivities, the laser is a light wave, and the effect difference that the object absorbs the laser energy caused by different reflectivities of the light and converts the laser energy into heat is huge.
For example, the reflectivity of the bonding pad and the miniLED is different by several times, when laser is irradiated on the miniLED, if the laser is irradiated on the bonding pad with a slight deviation, the bonding pad can be burnt through instantly to cause fatal irreversible damage. Although the laser can carry out closed-loop temperature measurement to control energy output, the energy of the laser is undeniably very concentrated, when the temperature fed back by the infrared thermometer is abnormal, a signal is transmitted to a system through a transmitter to be judged, then the energy output of the laser is controlled, and at the moment, a bonding pad is damaged early and cannot be controlled in time.
Meanwhile, the blue and green lamp beads of the MiniLED are usually transparent crystals, laser can penetrate through the crystals, and heating can be completed when the energy is very low. However, the reflectivity of the surface of the red lamp bead is very high, the laser cannot penetrate through the red lamp bead, the laser energy needs to be adjusted to be very high at the moment to heat the red lamp bead, the position is slightly deviated, an object with large peripheral reflectivity difference can be damaged, the risk is very high, and the stability is poor.
Laser heating methods based on these factors often involve a great risk in terms of heating stability, and it is difficult to achieve the intended practical effect. The laser hot-pressing composite heating technology is developed on the basis of laser heating to solve the problems, the MiniLED lamp bead chip, the MiniIC chip and the bonding pad can be prevented from being damaged due to overhigh laser intensity by using the laser hot-pressing composite heating technology, a good adaptation effect can be achieved for different bonding pad material colors, and the laser heat utilization rate is high. The working efficiency and the product yield of the equipment heated by the method are greatly improved.
Disclosure of Invention
The invention aims to solve the technical problem of providing a laser hot-pressing heating suction nozzle, a device welding device and a hot-pressing composite heating method.
The technical scheme adopted by the invention for solving the technical problems is as follows: a laser hot-pressing heating suction nozzle is constructed and comprises a suction head;
the tip of suction head is equipped with the light trap, and the effective heating diameter of laser beam is greater than the aperture of light trap to let the laser energy through the light trap reach directly the suction head tip treat the welding device and conduct to the pad, be located the laser energy of light trap outer lane is right the suction nozzle heating, and the warp the suction head tip treat the welding device conduct to the pad.
Preferably, the laser hot pressing heating suction nozzle further comprises a main body connected with the large end of the suction nozzle, and the main body is cylindrical.
Preferably, the cleaner head is funnel-shaped.
Preferably, the side wall of the main body is provided with a positioning part protruding laterally.
Preferably, a material stirring table extends outwards from the end of the suction head, and the material stirring table is staggered with the light transmission hole so as to abut against the side face of the device to be welded and be positioned with the device to be welded.
A device welding device comprises the laser hot pressing heating suction nozzle and a laser device, wherein the laser device emits light beams through the light holes.
Preferably, a temperature control assembly for controlling temperature is also included.
Preferably, the welding device further comprises a pressure control assembly for controlling the suction nozzle to apply constant pressure to the to-be-welded device.
A hot-pressing composite heating method adopting the laser hot-pressing heating suction nozzle comprises the following steps:
the end part of the suction head is pressed on a welding disc of a device to be welded on the main board;
the laser beam penetrates through the suction nozzle and is emitted through the light holes, the effective heating diameter of the laser beam is larger than the aperture of the light holes, so that the laser energy passing through the light holes can reach the to-be-welded devices at the end part of the suction head and is conducted to the bonding pad, the suction nozzle is heated by the capacity of the outer ring of the light holes, and the to-be-welded devices at the end part of the suction head are conducted to the bonding pad.
Preferably, the suction nozzle is controlled to apply a pressure of a constant pressure to the to-be-welded device.
The laser hot-pressing heating suction nozzle, the device welding device and the hot-pressing composite heating method have the following beneficial effects: the laser energy passing through the light hole can directly reach the device to be welded and is transmitted to the bonding pad, the laser energy on the outer ring of the light hole is directly gathered at the tip part of the suction nozzle to heat the suction nozzle and can be transmitted to the device to be welded and the bonding pad through heat conduction, coaxial laser energy formed by the light hole and the tip part and the heat conduction energy heat the device to be welded together, and the problem of heating stability caused by different object reflectivity differences can be effectively solved.
Drawings
The invention will be further described with reference to the accompanying drawings and examples, in which:
FIG. 1 is a schematic cross-sectional view illustrating a laser heat pressing and heating nozzle pressing a to-be-welded part on a main board according to an embodiment of the present invention;
FIG. 2 is a schematic view of the suction head of the laser hot-pressing heating suction nozzle in FIG. 1 abutting against a part to be welded;
fig. 3 is a schematic view of the region a formed in fig. 2 where laser light is radiated through the light-transmitting hole to the device to be soldered.
Detailed Description
For a more clear understanding of the technical features, objects and effects of the present invention, embodiments of the present invention will now be described in detail with reference to the accompanying drawings.
As shown in fig. 1 to 2, the device bonding apparatus according to a preferred embodiment of the present invention includes a laser thermocompression heating nozzle 1, and a laser 2 emitting a light beam 21 through a light-transmitting hole 11 of the laser thermocompression heating nozzle 1.
The laser hot pressing heating suction nozzle 1 comprises a cylindrical main body 12 and a suction head 13 arranged at one end of the main body 12, and in other embodiments, the laser hot pressing heating suction nozzle can be provided without the main body 12 or with other appearance structures with the suction head 13.
The end part of the suction head 13 is provided with a light hole 11 communicated with the inner cavity of the main body 12, and the unsoldering suction nozzle 1 is arranged on vacuum suction equipment to generate suction force so that the light hole 11 of the suction head 13 can adsorb a device 3 to be welded.
Preferably, the laser beam 21 is effective to heat the diameter larger than the diameter of the light-transmitting hole 11, so that the laser energy passing through the light-transmitting hole 11 reaches the device 3 to be soldered at the end of the suction head 13 and is conducted to the pad 41, and the laser energy located outside the light-transmitting hole 11 heats the suction nozzle 1 and is conducted to the pad 41 through the device 3 to be soldered at the end of the suction head 13.
The main body 12 is cylindrical, the suction head 13 is funnel-shaped, and the main body 12 is connected with the big end of the suction head 13 to form the integral gyro-shaped dismounting and welding suction nozzle 1. The side wall of the main body 12 is provided with a positioning part 14 protruding laterally for clamping the vacuum equipment.
The material stirring platform 15 is positioned at the outer edge of the end part of the suction head 13, so that the end part of the suction head 13 can be attached to the surface of the device 3 to be welded to generate suction.
The end part of the suction head 13 extends outwards to form a material shifting table 15, and the material shifting table 15 is staggered with the light hole 11 so as to abut against the side surface of the device 3 to be welded and be positioned with the device 3 to be welded.
The device welding device also comprises a temperature control assembly for controlling the temperature, the temperature of the objects such as the device 3 to be welded, the desoldering suction nozzle 1 and the like is increased in the heating process, the laser irradiation temperature needs to be controlled in a closed loop in the welding process, the welding pad 41 is melted enough, and the device 3 to be welded is welded so as to prevent the overheating temperature from damaging the device 3 to be welded and the welding pad 41.
The device welding device also comprises a pressure control assembly for controlling the suction nozzle 1 to apply constant pressure to the device 3 to be welded, most energy is generated through heat conduction during heating welding, so that the device is required to be subjected to micro-pressure by the welding nozzle 1 during welding, the device 3 to be welded or the bonding pad 41 is damaged when the pressure is too high, and the welding temperature is unstable when the pressure is too low. In the heating process, the temperature of the to-be-welded device 3, the desoldering suction nozzle 1 and other objects rises, the pressure of the to-be-welded device 3 of the desoldering suction nozzle 1 is increased rapidly after thermal expansion, and the desoldering suction nozzle 1 is required to actively adjust the pressing height according to the pressure change and thermal deformation influence through accurate pressure control, so that a pressure constant closed loop is realized.
The hot-pressing composite heating method for heating the suction nozzle 1 by adopting laser hot pressing comprises the following steps of:
the end of the suction head 13 is pressed on a bonding pad 41 of the device 3 to be welded on the main board 4;
referring to fig. 2 and 3, the laser beam 21 passes through the suction nozzle 1 and is emitted through the light hole 11, and the laser beam 21 effectively heats the diameter of the laser beam 21 to be larger than the diameter of the light hole 11, so that the laser beam passing through the light hole 11 can reach the to-be-welded device 3 at the end of the suction nozzle 13 and is conducted to the bonding pad 41, irradiate to the area a on the to-be-welded device 3, and heat the suction nozzle 1 by the capacity of the outer ring of the light hole 11 and is conducted to the bonding pad 41 through the to-be-welded device 3 at the end of.
The heating method of the present thermocompression heating nozzle 1 is given below:
after a suction nozzle 1 of the placement machine and a lamp bead/MiniIC chip to be welded wait for a welding device 3 to be aligned and contacted, laser is started, a coaxial laser beam 21 irradiates, and the effective heating diameter of the laser beam 21 is about 200 +/-5 microns of a typical value and is larger than 80 +/-microns of the aperture of a light hole 11 of the suction nozzle 1.
The laser energy passing through the light hole 11 can directly reach the miniLED lamp bead and the miniIC chip to wait for welding the device 3, and is conducted to the bonding pad 41, and the laser energy on the outer ring of the light hole 11 is directly gathered at the tip part of the suction nozzle 1 to heat the suction nozzle 1. The tip portion is in contact with the bead/MiniIC chip due to the partial plane, and the partial heat can be conducted to the bead/MiniIC chip and the bonding pad 41 through heat conduction.
The coaxial laser energy and the heat conduction energy jointly heat the lamp bead/MiniIC chip formed by the light hole and the tip part, and the energy provided by heating the device under the combined action of the two modes of measurement and calculation accounts for 70% of heat conduction and 30% of laser direct irradiation, so that the problem of heating stability caused by the difference of the reflectivity of different objects can be effectively solved.
It is to be understood that the above-described respective technical features may be used in any combination without limitation.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes performed by the present specification and drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. A laser hot pressing heating suction nozzle is characterized by comprising a suction head (13);
the tip of suction head (13) is equipped with light trap (11), and laser beam (21) effective heating diameter is greater than the aperture of light trap (11) to let the laser energy through light trap (11) is direct the device (3) of waiting to weld of suction head (13) tip and conduct to pad (41), and the laser energy that is located light trap (11) outer lane is right suction nozzle (1) heating, and the warp the device (3) of waiting to weld of suction head (13) tip conducts to pad (41).
2. Laser thermo-compression heating nozzle according to claim 1, characterised in that the suction head (13) is funnel-shaped.
3. The laser hot pressing heating suction nozzle as claimed in claim 1, further comprising a main body (12) connected with the large end of the suction head (13), wherein the main body (12) is cylindrical.
4. A nozzle according to claim 1, wherein the side wall of the main body (12) is provided with a laterally protruding positioning portion (14).
5. The laser hot pressing heating suction nozzle according to any one of claims 1 to 4, characterized in that a material stirring table (15) extends outwards from the end of the suction head (13), and the material stirring table (15) is staggered with the light transmission hole (11) to abut against the side surface of the device (3) to be welded and is positioned with the device (3) to be welded.
6. A device soldering apparatus, comprising a laser thermo-compression heating nozzle (1) according to any one of claims 1 to 5, and a laser (2) emitting a light beam (21) through the light-transmitting hole (11).
7. The device soldering apparatus according to claim 6, further comprising a temperature control assembly for controlling temperature.
8. Device soldering apparatus according to claim 6, further comprising a pressure control assembly for controlling the suction nozzle (1) to apply a constant pressure to the device (3) to be soldered.
9. A thermo-compression composite heating method using the laser thermo-compression heating nozzle (1) according to any one of claims 1 to 5, characterized by comprising the steps of:
the end part of the suction head (13) is pressed on a bonding pad (41) of the device (3) to be welded on the main board (4);
the laser beam (21) penetrates through the suction nozzle (1) and is emitted out through the light hole (11), the effective heating diameter of the laser beam (21) is larger than the aperture of the light hole (11), so that the laser energy passing through the light hole (11) can reach the to-be-welded device (3) at the end part of the suction nozzle (13) and is conducted to the bonding pad (41), the suction nozzle (1) is heated by the capacity of the outer ring of the light hole (11), and the to-be-welded device (3) at the end part of the suction nozzle (13) is conducted to the bonding pad (41).
10. The thermocompression composite heating method according to claim 9, characterized in that the suction nozzle (1) is controlled to apply a pressure of a constant pressure to the device (3) to be soldered.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010647130.XA CN111702276B (en) | 2020-07-07 | 2020-07-07 | Laser hot-pressing heating suction nozzle, device welding device and hot-pressing composite heating method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010647130.XA CN111702276B (en) | 2020-07-07 | 2020-07-07 | Laser hot-pressing heating suction nozzle, device welding device and hot-pressing composite heating method |
Publications (2)
Publication Number | Publication Date |
---|---|
CN111702276A true CN111702276A (en) | 2020-09-25 |
CN111702276B CN111702276B (en) | 2023-07-14 |
Family
ID=72545314
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202010647130.XA Active CN111702276B (en) | 2020-07-07 | 2020-07-07 | Laser hot-pressing heating suction nozzle, device welding device and hot-pressing composite heating method |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN111702276B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI790118B (en) * | 2022-02-10 | 2023-01-11 | 友達光電股份有限公司 | Bonding apparatus |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2005102588A1 (en) * | 2004-04-13 | 2005-11-03 | Lexmark International, Inc. | Compensation plates and compliant members for laser welding a non-uniformly thick work piece to another |
CN101304064A (en) * | 2008-07-11 | 2008-11-12 | 哈尔滨工业大学 | LED heating heat sink rear using laser and heat sink bonding method |
CN102142655A (en) * | 2010-12-23 | 2011-08-03 | 大连艾科科技开发有限公司 | Metal suction end for assembling laser diode |
CN102489810A (en) * | 2011-12-23 | 2012-06-13 | 哈尔滨工业大学 | Method for self-assembling micro-electromechanical system (MEMS) based on solder ball laser remelting process |
CN103846563A (en) * | 2012-11-29 | 2014-06-11 | 上海航天设备制造总厂 | Laser stirring friction welding method and device thereof |
CN104842070A (en) * | 2015-05-13 | 2015-08-19 | 北京万恒镭特机电设备有限公司 | Laser eutectic soldering device and method |
CN110370655A (en) * | 2019-07-24 | 2019-10-25 | 威克锐光电科技(苏州)有限公司 | A kind of apparatus and method of laser beam connection plastic workpiece |
CN212419988U (en) * | 2020-07-07 | 2021-01-29 | 深圳市微组半导体科技有限公司 | Laser hot pressing heating suction nozzle and device welding device |
-
2020
- 2020-07-07 CN CN202010647130.XA patent/CN111702276B/en active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2005102588A1 (en) * | 2004-04-13 | 2005-11-03 | Lexmark International, Inc. | Compensation plates and compliant members for laser welding a non-uniformly thick work piece to another |
CN101304064A (en) * | 2008-07-11 | 2008-11-12 | 哈尔滨工业大学 | LED heating heat sink rear using laser and heat sink bonding method |
CN102142655A (en) * | 2010-12-23 | 2011-08-03 | 大连艾科科技开发有限公司 | Metal suction end for assembling laser diode |
CN102489810A (en) * | 2011-12-23 | 2012-06-13 | 哈尔滨工业大学 | Method for self-assembling micro-electromechanical system (MEMS) based on solder ball laser remelting process |
CN103846563A (en) * | 2012-11-29 | 2014-06-11 | 上海航天设备制造总厂 | Laser stirring friction welding method and device thereof |
CN104842070A (en) * | 2015-05-13 | 2015-08-19 | 北京万恒镭特机电设备有限公司 | Laser eutectic soldering device and method |
CN110370655A (en) * | 2019-07-24 | 2019-10-25 | 威克锐光电科技(苏州)有限公司 | A kind of apparatus and method of laser beam connection plastic workpiece |
CN212419988U (en) * | 2020-07-07 | 2021-01-29 | 深圳市微组半导体科技有限公司 | Laser hot pressing heating suction nozzle and device welding device |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI790118B (en) * | 2022-02-10 | 2023-01-11 | 友達光電股份有限公司 | Bonding apparatus |
Also Published As
Publication number | Publication date |
---|---|
CN111702276B (en) | 2023-07-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN111785752B (en) | Mainboard repairing method | |
TWI811938B (en) | Flip chip bonding apparatus using vcsel device | |
US20080047663A1 (en) | Apparatus and method for bonding anisotropic conductive film using laser beam | |
US20090090468A1 (en) | Flip-chip mounting apparatus | |
CN212419988U (en) | Laser hot pressing heating suction nozzle and device welding device | |
WO2013065861A1 (en) | Apparatus for manufacturing electronic part, method of manufacturing electronic part, and method of manufacturing led illumination | |
CN104842070A (en) | Laser eutectic soldering device and method | |
CN111702276A (en) | Laser hot-pressing heating suction nozzle, device welding device and hot-pressing composite heating method | |
CN109530838B (en) | Method for laser welding of power semiconductor chip | |
KR101703561B1 (en) | Solder reflow equipment | |
JP2006237451A (en) | Apparatus and method for bonding anisotropic conductive film by using laser | |
KR20070095038A (en) | A bonding method and apparatus for electronic elements using laser beam | |
KR20190100777A (en) | Flip chip bonding apparatus and method | |
JP4675667B2 (en) | Electronic component mounting method | |
JP2006303356A (en) | Packaging method of electronic component | |
JP7062703B2 (en) | Laser welding equipment and methods for semiconductor devices | |
CN116685076A (en) | Reflow and tooling return of electronic components | |
KR20150021223A (en) | Appratus For Reballing Semiconductor And Method The Same | |
JPH03120737A (en) | Bonding method and apparatus | |
JPH02213075A (en) | Jointing method for lead | |
CN111687790B (en) | Device dismantling device and method for dismantling and welding by device dismantling device | |
CN112658423A (en) | Multipoint synchronous soldering method and multipoint synchronous soldering device | |
TWI804082B (en) | Electronic component maintenance device and maintenance method | |
KR102297954B1 (en) | The chip soldering apparatus | |
TWI460041B (en) | Method for applying laser solder device on shielding screen or soldering |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant |