CN111659959A - High-low frequency composite vibration processing device and method for hard and brittle materials - Google Patents
High-low frequency composite vibration processing device and method for hard and brittle materials Download PDFInfo
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- CN111659959A CN111659959A CN202010578500.9A CN202010578500A CN111659959A CN 111659959 A CN111659959 A CN 111659959A CN 202010578500 A CN202010578500 A CN 202010578500A CN 111659959 A CN111659959 A CN 111659959A
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Abstract
The invention provides a high-low frequency composite vibration processing device for hard and brittle materials. The device has the characteristic of simple structure. The invention also provides a high-low frequency composite vibration processing method for the hard and brittle materials, which effectively reduces the damage depth of the subsurface layer and improves the surface quality of processed parts by improving the relative motion mode and contact conditions of the workpiece and the cutter, and can meet the processing requirements of high-quality hard and brittle material parts.
Description
Technical Field
The invention belongs to the field of precision special machining, and particularly relates to a high-low frequency composite vibration machining device and method for hard and brittle materials.
Background
Hard and brittle materials such as ceramics, glass, crystals and the like are widely applied in the fields of space technology, energy engineering, mechanical engineering, automobile industry, petroleum, chemical industry, metallurgy, textile industry, biomedical engineering and the like at present due to the characteristics of low density, heat resistance, wear resistance, corrosion resistance and the like, and become indispensable novel materials in the high-tech fields of modern industry, national defense, aerospace and the like.
However, due to the special properties of hard and brittle materials, it is difficult to achieve part machining with conventional machining methods. At present, a high-frequency vibration processing technology adopting cutter ultrasonic vibration or workpiece ultrasonic vibration is one of the main processing technologies of hard and brittle materials. Although the technology has obvious advantages in the aspects of processing efficiency and complex structure forming, the technology has the outstanding problems of workpiece surface and subsurface damage, poor surface quality and the like, and cannot meet the processing requirement of high-quality hard and brittle material parts.
Disclosure of Invention
In view of the above, the present invention is directed to a hard and brittle material processing apparatus and method based on high and low frequency composite vibration.
To achieve the purpose, the invention specifically adopts the following scheme:
a high-low frequency composite vibration processing device for hard and brittle materials comprises an ultrasonic vibration tool shank and a cutter arranged on the ultrasonic tool shank through a driving coil, wherein the ultrasonic vibration tool shank is arranged on a main shaft of a machine tool, and the transmission of ultrasonic vibration energy and signals is realized through the driving coil; the device also comprises a low-frequency vibration platform used for placing parts to be processed, a waveform generator connected with the low-frequency vibration platform and a piezoelectric ceramic driving power supply, wherein the low-frequency vibration platform is arranged on an X-direction slide carriage or a Y-direction slide carriage of the machine tool.
Further, the waveform generator generates Vx +, Vx-, Vy + and Vy-two-channel four-path signals, namely vibration waveforms in the Vx direction and the Vy direction are provided for the low-frequency motion platform, and the low-frequency motion platform is driven to move after being amplified by the piezoelectric ceramic driving power supply.
Furthermore, the piezoelectric ceramic driving power supply is a multi-channel piezoelectric ceramic driving power supply; the waveform generator can output various waveforms such as square waves, triangular waves, sine waves and the like.
Furthermore, the vibration direction of the low-frequency motion platform and the direction of the machine tool motion platform form an angle theta.
Further, the theta angle ranges from 0 deg. to 90 deg..
Further, low frequency motion platform including moving part, install respectively in moving part Vx direction location ball I all around and Vx direction vibration auxiliary drive piezoceramics I, Vx direction location ball II and Vx direction vibration auxiliary drive piezoceramics II, Vy direction location ball I and Vy direction vibration auxiliary drive piezoceramics I, Vy direction location ball II and Vy direction vibration auxiliary drive piezoceramics II through fastening screw, low frequency motion platform still include respectively along horizontal direction and vertical direction and moving part lug connection's 8 spring pieces.
Furthermore, the low-frequency motion platform also comprises a Vy direction displacement measurement sensor and a Vx direction displacement measurement sensor.
A high-low frequency composite vibration processing method for hard and brittle materials is characterized by comprising the following steps:
(a) installing a cutter on an ultrasonic vibration cutter handle with an ultrasonic driving coil;
(b) the method comprises the following steps of mounting a part to be processed on a low-frequency vibration platform, realizing simultaneous or single low-frequency vibration in the Vx direction and the Vy direction of the part to be processed under the drive of the low-frequency vibration platform, and realizing reciprocating translation under the drive of a machine tool X-direction slide carriage and a machine tool Y-direction slide carriage;
(c) the cutter is enabled to generate high-frequency vibration in the Vz direction through the vibration of the ultrasonic vibration cutter handle, and simultaneously, the cutter is driven by a machine tool spindle to respectively rotate around the axis of the machine tool spindle and perform reciprocating linear motion along the vertical direction (Z direction);
further, in the step (b), the low-frequency vibration parameters of the part to be processed are adjusted by adjusting the waveform, the waveform period and the waveform amplitude generated by the waveform generator; .
Further, in the step (c), the high-frequency vibration waveform of the cutter is a sine waveform, the vibration frequency of the cutter is adjusted by increasing or decreasing the balance weight, and the vibration amplitude of the cutter is adjusted by adjusting the input voltage of the ultrasonic drive coil.
The invention provides a high-low frequency composite vibration processing device for hard and brittle materials. The device has the characteristic of simple structure. The invention also provides a high-low frequency composite vibration processing method for the hard and brittle materials, which effectively reduces the damage depth of the subsurface layer and improves the surface quality of processed parts by improving the relative motion mode and contact conditions of the workpiece and the cutter, and can meet the processing requirements of high-quality hard and brittle material parts.
Drawings
FIG. 1 is a schematic structural diagram of a high-low frequency composite vibration processing device for hard and brittle materials according to the invention;
FIG. 2 is a schematic structural diagram of a low-frequency motion platform of the high-frequency and low-frequency composite vibration processing device for hard and brittle materials, which is disclosed by the invention;
in the figure, 1, an X-direction slide carriage 2, a driving coil 3, an ultrasonic vibration tool holder 4, a tool 5, a part to be machined 6, a Y-direction slide carriage 7, a low-frequency motion platform 8, a piezoelectric ceramic driving power supply 9, a waveform generator 11, a Vx-direction fastening screw 12, a Vx-direction vibration auxiliary driving piezoelectric ceramic 13, a Vy-direction positioning ball 14, a Vy-direction vibration auxiliary driving piezoelectric ceramic A15, a reverse and synchronous module A16, a fastening screw A17, a ball 18, a spring leaf 19, a moving part 20, a ball 21, a Vx-direction vibration auxiliary driving piezoelectric ceramic 22, a reverse and synchronous module B23, a fastening screw B24, a Vy-direction positioning ball 25, a Vy-direction vibration auxiliary driving piezoelectric ceramic B26, a Vy-direction fastening screw 27, a Vy-direction displacement measuring sensor 28, a Vx-direction displacement measuring sensor 29 and an outer framework are arranged.
Detailed Description
The invention is further explained below with reference to the drawings.
As shown in fig. 1, the high-low frequency composite vibration processing device for hard and brittle materials comprises an ultrasonic vibration tool shank 3 and a tool 4 mounted on the ultrasonic tool shank 3 through a driving coil 2, wherein the ultrasonic vibration tool shank 3 is mounted on a machine tool spindle, and ultrasonic vibration energy and signals are transmitted through the driving coil 2; the device also comprises a low-frequency vibration platform 7 used for placing the part 5 to be processed, a waveform generator 9 connected with the low-frequency vibration platform 7 and a piezoelectric ceramic driving power supply 8, wherein the low-frequency vibration platform 7 is arranged on an X-direction slide carriage 1 or a Y-direction slide carriage 6 of the machine tool.
According to the device, the ultrasonic vibration knife handle 3 drives the knife 4 to realize high-frequency vibration in the vertical direction Vz, the part 5 to be machined is arranged on the low-frequency motion platform 7, and the part 5 to be machined realizes low-frequency vibration in two orthogonal directions in the same plane under the driving of the low-frequency motion platform 7, namely vibration in the Vx direction and vibration in the Vy direction, wherein the Vx direction is vertical to the Vy direction.
Further, the waveform generator 9 generates two-channel four-path signals of Vx +, Vx-, Vy + and Vy-, namely provides vibration waveforms in the Vx direction and the Vy direction for the low-frequency motion platform 7, and drives the low-frequency motion platform 7 to move after being amplified by the piezoelectric ceramic driving power supply 8.
Further, the piezoelectric ceramic driving power supply 8 is a multi-channel piezoelectric ceramic driving power supply, and at most 4 groups of piezoelectric ceramics can be synchronously driven; the waveform generator 9 is a general commercial waveform generator and can output various waveforms such as square waves, triangular waves, sine waves and the like. The vibration waveform, vibration frequency and vibration amplitude in the Vx direction and the Vy direction can be synchronously or independently adjusted by adjusting the output waveform, waveform period and waveform amplitude of the waveform generator 9. The vibration waveforms in the Vx direction and the Vy direction can be square waves, triangular waves, sine waves and the like, the vibration frequency adjustment range is 0 Hz-1 kHz, and the vibration amplitude adjustment range is 0μm-10μm.
Furthermore, the vibration direction of the low-frequency motion platform 7 forms an angle theta with the motion platform direction of the machine tool, namely the Vx direction forms an angle theta with the motion platform in the X direction of the machine tool, or the Vx direction forms an angle theta with the motion platform in the Y direction of the machine tool.
Furthermore, the theta angle ranges from 0 degree to 90 degrees, the angle theta can be adjusted and determined when the low-frequency motion platform 7 is installed, and the theta angle is fixed after installation.
Further, low frequency motion platform 7 include moving part 19, install respectively in moving part 19 all around Vx direction location ball I13 and Vx direction vibration auxiliary drive piezoceramics I12, Vx direction location ball II 20 and Vx direction vibration auxiliary drive piezoceramics II 21, Vy direction location ball I17 and Vy direction vibration auxiliary drive piezoceramics I14, Vy direction location ball II 24 and Vy direction vibration auxiliary drive piezoceramics II 25, low frequency motion platform 7 still include respectively along horizontal direction and vertical direction and 8 spring pieces 18 of moving part 19 lug connection.
Specifically, Vx direction vibration auxiliary drive piezoelectric ceramic I12 of the low-frequency motion platform 7 is connected with an outer frame 29 of the low-frequency motion platform 7 through a Vx direction fastening screw I11, a Vx direction positioning ball I13 is in close contact with a moving part 19 by adjusting fastening force of the Vx direction fastening screw I11, pretightening force is applied to the Vx direction vibration auxiliary drive piezoelectric ceramic I12, and the Vx direction vibration auxiliary drive piezoelectric ceramic I12 can work normally. The Vy-direction vibration auxiliary driving piezoelectric ceramic II 25 of the low-frequency motion platform 7 is connected with an outer frame 29 of the low-frequency motion platform 7 through a Vy-direction fastening screw II 26, the Vy-direction positioning ball II 24 is in close contact with the moving part 19 by adjusting the fastening force of the Vy-direction fastening screw II 26, pre-tightening force is applied to the Vy-direction vibration auxiliary driving piezoelectric ceramic II 25, and the Vy-direction vibration auxiliary driving piezoelectric ceramic II 25 is guaranteed to work normally.
Vx direction vibration auxiliary drive piezoelectric ceramic II 21 of the low-frequency motion platform 7 is connected with an outer frame 29 of the low-frequency motion platform 7 through a Vx direction fastening screw II 23, a Vx direction positioning ball II 20 is in close contact with the moving part 19 by adjusting the fastening force of the Vx direction fastening screw II 23, pretightening force is applied to the Vx direction vibration auxiliary drive piezoelectric ceramic II 21, and the Vx direction vibration auxiliary drive piezoelectric ceramic II 21 can work normally. The Vy-direction vibration auxiliary driving piezoelectric ceramic I14 of the low-frequency motion platform 7 is connected with an outer frame 31 of the low-frequency motion platform 7 through a Vy-direction fastening screw I16, a Vy-direction positioning ball I17 is in close contact with a moving part 19 by adjusting the fastening force of the Vy-direction fastening screw I16, pretightening force is applied to the Vy-direction vibration auxiliary driving piezoelectric ceramic I14, and the Vy-direction vibration auxiliary driving piezoelectric ceramic I14 can work normally. The structural rigidity of the low-frequency motion platform 7 can be improved by using the Vx-direction vibration auxiliary driving piezoelectric ceramic II 21 and the Vy-direction vibration auxiliary driving piezoelectric ceramic I14.
The Vx direction vibration auxiliary driving piezoelectric ceramics II 21 and Vy of the low-frequency motion platform 7 move in the opposite directions to the moving direction of the vibration auxiliary driving piezoelectric ceramics I14 and the moving direction of the Vx direction vibration auxiliary driving piezoelectric ceramics I12 and the moving direction of the Vy direction vibration auxiliary driving piezoelectric ceramics II 25 respectively, and move synchronously. Input signals of the Vx-direction vibration auxiliary driving piezoelectric ceramic II 21 and the Vx-direction vibration auxiliary driving piezoelectric ceramic I12 are the same signal Vxi, and the motion synchronization of the signals is ensured through a signal reversal and synchronization module B22. The input signals of the Vy-direction vibration auxiliary driving piezoelectric ceramics i 14 and the Vy-direction vibration auxiliary driving piezoelectric ceramics ii 25 are the same signal Vyi.
Further, the low-frequency motion platform 7 further comprises a Vy-direction displacement measurement sensor 27 and a Vx-direction displacement measurement sensor 28.
The Vx direction and Vy direction vibration of the low-frequency motion platform 7 utilizes the Vx direction displacement measurement sensor 28 and the Vy direction displacement measurement sensor 27 to measure the displacement of the moving part 19 of the low-frequency motion platform 7 in the Vx direction and the Vy direction in real time, the displacement signals are converted into voltage signals Vxo and Vyo to be fed back to the piezoelectric ceramic driving power supply 8 in real time, the piezoelectric ceramic driving power supply 8 adjusts output signals in real time according to the feedback signals, therefore, closed-loop control of vibration amplitude values in the Vx direction and the Vy direction is achieved, and the control precision of the vibration amplitude values is less than or equal to 5 nm.
The invention also discloses a high-low frequency composite vibration processing method for the hard and brittle materials, which comprises the following steps:
a, mounting a cutter 4 on an ultrasonic vibration cutter handle 3 with an ultrasonic driving coil 2;
b, mounting the part 5 to be processed on a low-frequency vibration platform 7, realizing simultaneous or single low-frequency vibration in the Vy direction of the part 5 to be processed in the Vx direction under the drive of the low-frequency vibration platform 7, and realizing reciprocating translation under the drive of a slide carriage 1 in the X direction and a slide carriage 6 in the Y direction of the machine tool;
c, enabling the cutter 4 to generate high-frequency vibration in the Vz direction through the vibration of the ultrasonic vibration cutter handle 3, and meanwhile, enabling the cutter to respectively rotate around the axis of the machine tool spindle and linearly reciprocate in the Z direction in the vertical direction under the driving of the machine tool spindle;
wherein, other cutting technological parameters such as the rotating speed of a main shaft of the machine tool, the feed speed, the cutting depth and the like are set by a numerical control processing program; and the high-low frequency composite vibration machining of the hard and brittle material is realized under the combined action of the low-frequency vibration in the Vx direction and the Vy direction of the part 5 to be machined and the high-frequency vibration of the cutter 4.
Further, the step b adjusts the low-frequency vibration parameters of the part 5 to be processed by adjusting the waveform, the waveform period and the waveform amplitude generated by the waveform generator 9.
Furthermore, the high-frequency vibration waveform of the cutter 4 in the step c is a sine waveform, the vibration frequency of the cutter is adjusted by a method of increasing or decreasing the balance weight, and the vibration amplitude of the cutter is adjusted by adjusting the input voltage of the ultrasonic driving coil 2.
The device and the method have the advantages that: the low-frequency vibration is introduced into the process of processing the hard and brittle material by ultrasonic vibration, the impact cut-in angle and the instantaneous cutting thickness of the cutter can be effectively adjusted through reasonable vibration waveform and phase configuration, the chip forming mode and the expansion mode of micro-cracks on the surface and the subsurface of the workpiece are changed, and therefore the surface quality of the hard and brittle material can be improved. In addition, due to the introduction of low-frequency vibration, the contact time between the cutter and the workpiece can be shortened, the high-pressure cutting fluid is favorable for taking away tiny chips of the hard and brittle materials, the influence of the chips on the forming process of the surface of the workpiece is reduced, the service life of the cutter can be prolonged, and the high-pressure cutting fluid plays an important role in improving the surface quality of the hard and brittle materials.
Claims (10)
1. The high-low frequency composite vibration processing device for the hard and brittle materials is characterized by comprising an ultrasonic vibration tool shank (3) and a tool (4) which is arranged on the ultrasonic tool shank (3) through a driving coil (2), wherein the ultrasonic vibration tool shank (3) is arranged on a main shaft of a machine tool, and ultrasonic vibration energy and signals are transmitted through the driving coil (2); the device also comprises a low-frequency vibration platform (7) used for placing the part (5) to be processed, a waveform generator (9) connected with the low-frequency vibration platform (7) and a piezoelectric ceramic driving power supply (8), wherein the low-frequency vibration platform (7) is arranged on an X-direction slide carriage (1) or a Y-direction slide carriage (6) of the machine tool.
2. The hard and brittle material-oriented high-low frequency composite vibration processing device as claimed in claim 1, characterized in that the waveform generator (9) generates Vx +, Vx-, Vy + and Vy-two-channel four-way signals, namely provides vibration waveforms in Vx direction and Vy direction for the low-frequency motion platform (7), and drives the low-frequency motion platform (7) to move after being amplified by the piezoelectric ceramic driving power supply (8).
3. The hard and brittle material-oriented high and low frequency composite vibration processing device according to claim 1, characterized in that the piezoelectric ceramic driving power supply (8) is a multi-channel piezoelectric ceramic driving power supply; the waveform generator (9) can output various waveforms such as square waves, triangular waves, sine waves and the like.
4. The hard and brittle material oriented high and low frequency composite vibration processing device as claimed in claim 1, characterized in that the vibration direction of the low frequency motion platform (7) is at an angle θ with the motion platform direction of the machine tool.
5. The apparatus for processing hard and brittle materials as claimed in claim 1, characterized in that the θ angle is in the range of 0 ° to 90 °.
6. The hard and brittle material oriented high and low frequency composite vibration processing device as claimed in claim 1, characterized in that the low frequency motion platform (7) comprises a moving part (19), and a Vx direction positioning ball I (13) and a Vx direction vibration auxiliary driving piezoelectric ceramic I (12) and a Vx direction positioning ball II which are respectively arranged on the periphery of the moving part (19) through fastening screws
(20) And Vx direction vibration auxiliary drive piezoelectric ceramic II (21), Vy direction location ball I (17) and Vy direction vibration auxiliary drive piezoelectric ceramic I (14), Vy direction location ball II (24) and Vy direction vibration auxiliary drive piezoelectric ceramic II (25), low frequency motion platform (7) still including respectively along horizontal direction and vertical direction with moving part (19) lug connection's 8 spring pieces (18).
7. A high-low frequency composite vibration processing device facing hard and brittle materials as claimed in claim 6, characterized in that the low frequency motion platform (7) further comprises a Vy direction displacement measuring sensor (27) and a Vx direction displacement measuring sensor (28).
8. A high-low frequency composite vibration processing method for hard and brittle materials is characterized by comprising the following steps:
(a) installing a cutter (4) on an ultrasonic vibration cutter handle (3) with an ultrasonic driving coil (2);
(b) the method comprises the following steps of (1) installing a part (5) to be processed on a low-frequency vibration platform (7), realizing simultaneous or single low-frequency vibration in Vy direction of the part (5) to be processed in Vx direction under the drive of the low-frequency vibration platform (7), and realizing reciprocating translation under the drive of a slide carriage (1) in X direction and a slide carriage (6) in Y direction of a machine tool;
(c) the cutter (4) generates high-frequency vibration in the Vz direction through vibration of the ultrasonic vibration cutter handle (3), and meanwhile, the cutter respectively rotates around the axis of a machine tool spindle and reciprocates linearly along the vertical direction (Z direction) under the driving of the machine tool spindle.
9. The high-low frequency compound vibration processing method according to claim 8, characterized in that in the step (b), the low-frequency vibration parameters of the part (5) to be processed are adjusted by adjusting the waveform, the waveform period and the waveform amplitude generated by the waveform generator (9).
10. The high-low frequency compound vibration processing method according to claim 8, wherein in the step (c), the high-frequency vibration waveform of the tool (4) is a sine waveform, the tool vibration frequency is adjusted by adding or reducing a weight, and the tool vibration amplitude is adjusted by adjusting the input voltage of the ultrasonic driving coil (2).
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Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61214963A (en) * | 1985-03-20 | 1986-09-24 | Junichiro Kumabe | Method for precise cutting of vibrating plane of ceramics |
| JPH01109007A (en) * | 1987-10-23 | 1989-04-26 | Junichiro Kumabe | Vibration-cut drilling machine for precise boring of ceramics |
| CN2875698Y (en) * | 2006-04-04 | 2007-03-07 | 杭州电子科技大学 | Laminated vibration composite processing device using abrasive material |
| US20070052326A1 (en) * | 2005-09-07 | 2007-03-08 | Matsushita Electric Industrial Co., Ltd. | Method and apparatus for vibration machining with two independent axes |
| CN103817064A (en) * | 2014-02-28 | 2014-05-28 | 大连交通大学 | Two-dimension piezoelectric vibration platform |
| CN104624463A (en) * | 2015-01-09 | 2015-05-20 | 天津大学 | Two-dimensional ultrasound vibration platform |
| CN105499626A (en) * | 2016-01-04 | 2016-04-20 | 河南科技学院 | Compound vibration drilling device |
| CN109675781A (en) * | 2019-01-31 | 2019-04-26 | 天津大学 | A kind of plane ultrasonic vibration auxiliary tooling platform |
-
2020
- 2020-06-23 CN CN202010578500.9A patent/CN111659959A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61214963A (en) * | 1985-03-20 | 1986-09-24 | Junichiro Kumabe | Method for precise cutting of vibrating plane of ceramics |
| JPH01109007A (en) * | 1987-10-23 | 1989-04-26 | Junichiro Kumabe | Vibration-cut drilling machine for precise boring of ceramics |
| US20070052326A1 (en) * | 2005-09-07 | 2007-03-08 | Matsushita Electric Industrial Co., Ltd. | Method and apparatus for vibration machining with two independent axes |
| CN2875698Y (en) * | 2006-04-04 | 2007-03-07 | 杭州电子科技大学 | Laminated vibration composite processing device using abrasive material |
| CN103817064A (en) * | 2014-02-28 | 2014-05-28 | 大连交通大学 | Two-dimension piezoelectric vibration platform |
| CN104624463A (en) * | 2015-01-09 | 2015-05-20 | 天津大学 | Two-dimensional ultrasound vibration platform |
| CN105499626A (en) * | 2016-01-04 | 2016-04-20 | 河南科技学院 | Compound vibration drilling device |
| CN109675781A (en) * | 2019-01-31 | 2019-04-26 | 天津大学 | A kind of plane ultrasonic vibration auxiliary tooling platform |
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Application publication date: 20200915 |