CN111596527A - Method for optimizing rotation parameters in mask plate rotation gluing - Google Patents
Method for optimizing rotation parameters in mask plate rotation gluing Download PDFInfo
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- CN111596527A CN111596527A CN202010565019.6A CN202010565019A CN111596527A CN 111596527 A CN111596527 A CN 111596527A CN 202010565019 A CN202010565019 A CN 202010565019A CN 111596527 A CN111596527 A CN 111596527A
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/30—Computing systems specially adapted for manufacturing
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Abstract
The invention discloses a method for optimizing rotation parameters in mask plate rotary gluing, which comprises the following steps of S1 establishing a mask plate model, selecting rotation parameters influencing the mask plate rotary coating process and target parameters for checking the mask plate gluing quality; the rotation parameters comprise the rotation speed rpm of the gluing turntable, the rotation time t of the gluing turntable and the rotation acceleration a of the gluing turntable; the target parameters are average film thickness, uniformity of film thickness and chromatic aberration; s2, giving a plurality of parameter values to each rotation parameter, and establishing an orthogonal table by the parameter values and the target parameters; s3, endowing each group of parameter values in the orthogonal table to the coating turntable, carrying out rotary coating of the mask plate, and finally calculating target parameter values corresponding to each group of parameter values in the orthogonal table; s4, selecting an optimal set of rotation parameters from the orthogonal table; compared with the traditional screening method which needs a large number of tests, the method can obtain the optimal rotation parameters, is more efficient and reliable, and greatly reduces the test cost.
Description
Technical Field
The invention relates to the technical field of mask manufacturing, in particular to a rotation parameter optimization method for the rotation gluing of a high-generation mask.
Background
The Mask plate is also called as a photomask and a photomask plate (English name Photo Mask, Mask for short) and is used as the most important key material in the flat panel display manufacturing process, plays a role in exposure masking in the photoetching process of flat panel display device manufacturing, and directly determines the quality of a flat panel display terminal product.
In recent years, the display panel industry in China develops very rapidly, and particularly in the field of high-altitude panels such as G11 and the like, the display panel industry becomes a leading head for the development of global industry. The demand of the mask plate as a key core material in the manufacture of flat panel displays is also increasing with the expansion of the industrial scale of flat panel displays. In the manufacturing process of advanced masks, the photoresist coating process is a very critical link. The photoresist coating is used as the front-end process of mask manufacture, and the coating index and quality directly determine the pattern quality and pattern precision of the mask. In the manufacture of advanced photomask plates, two Coating and combining methods, namely, doctor blade Coating (Slit Coating) and Spin Coating (Spin Coating), are generally adopted. The blade coating process is to blade coat the photoresist on the photomask substrate by utilizing a scraper which can uniformly discharge the photoresist in uniform speed forward, and the spin coating process is carried out after the blade coating process is finished. The working principle of the spin coating method is as follows: when the mask is static, a certain amount of photoresist is discharged from the upper part of the mask, and then the mask uniformly diffuses on the mask to form a photoresist film with a certain thickness under the centrifugal action through high-speed rotation. The quality of the spin coating process directly determines the technical indexes of the photoresist coating thickness, the thickness uniformity, the Mura (color difference) and the like on the mask plate, and is the most important ring in the whole coating process.
Mura originally is a Japanese character, and as the liquid crystal display of Japan has great brightness around the world, the character becomes a character which can be communicated all over the world in the display world, and Mura refers to the phenomenon that the brightness of the display is not uniform, so that various marks are caused, and is comprehensively called as color difference.
For the low-generation mask, the size is small, and the parameters such as the film thickness and uniformity of the photoresist coating can be easily controlled by spin coating, for example, the size specification of the G4.5 generation mask is 800 × 920mm, and the size specification of the G6 generation mask is 800 × 960 mm. For the advanced photomask, for example, G11 is used as the mask, the size of the mask reaches 1620mm 1780mm 17mm, and the weight of the substrate of the mask is greater than 100Kg, so that the vibration and centrifugal force generated during the spin coating process are large, which can bring great challenges to the coating process. In the rotary gluing process, the rotating speed rpm and the rotating time t directly determine the glued film thickness, and the excessively high rotating speed or the excessively long rotating time can cause the film thickness to be too thin; too low a rotational speed or too short a time results in a larger film thickness, and in both cases the uniformity of the applied film thickness is also poor. In addition, the rotation acceleration a also seriously affects the uniformity and color difference of the coating thickness, large-area color difference may be generated due to too high rotation acceleration, and the coating thickness of the mask substrate is thin in the middle, thick on the periphery and poor in uniformity due to too low rotation acceleration. Therefore, how to adjust the parameters of the rotating speed, the rotating time and the rotating acceleration is the key to influence the quality of the gluing.
The prior art screens the parameters affecting the rotary gluing: changing one parameter value to test under the condition that all other parameters are kept unchanged, and then repeating the above steps to test one parameter value by one parameter, so that the method has large workload and low efficiency; and waste more mask base plate and photoresist, because the price of mask base plate and photoresist is expensive, therefore the cost of testing is higher.
Disclosure of Invention
The invention provides a method for optimizing rotation parameters in the rotary gluing of a high-generation mask plate, aiming at solving the technical problems of low efficiency and high cost of the traditional screening method.
The technical scheme adopted by the invention is as follows: the method for optimizing the rotation parameters in the mask plate rotation gluing comprises the following steps:
s1, establishing a mask model, and selecting rotation parameters influencing the mask spin coating process and target parameters for checking the mask gluing quality;
the rotation parameters comprise the rotation speed rpm of the gluing turntable, the rotation time t of the gluing turntable and the rotation acceleration a of the gluing turntable;
the target parameters are average film thickness, uniformity of film thickness and chromatic aberration;
s2, giving a plurality of parameter values to each rotation parameter, and establishing an orthogonal table by the parameter values and the target parameters;
s3, endowing each group of parameter values in the orthogonal table to the coating turntable, carrying out rotary coating of the mask plate, and finally calculating target parameter values corresponding to each group of parameter values in the orthogonal table;
s4 selects an optimal set of rotation parameters from the orthogonal table.
The invention establishes an orthogonal table by selecting the rotation parameters and the target parameters which affect the mask spin coating process, then endows each group of parameter values in the orthogonal table to a coating turntable, performs rotary coating on the mask, then calculates a plurality of groups of target parameter values, and finally selects one rotation parameter from the plurality of groups of target parameter values as the mask version of the specification. Compared with the traditional screening method which needs a large number of tests, the method can obtain the optimal rotation parameters, is more efficient and reliable, and greatly reduces the test cost.
Further, in step S2, the number of parameter values of each rotation parameter is four. 43Only 16 experiments are needed, and on the premise of ensuring the optimization of the rotation parameters, the test times are greatly reduced, the efficiency is improved, and the cost is reduced.
Further, the step S3 specifically includes:
the calculation method of the chromatic aberration comprises the following steps: establishing a coordinate system in the chromatic aberration graph area, and calculating the area of all chromatic aberration graphs through integration, wherein the calculation formula is as follows:
in formula (1):
Sm: the total area of the color difference pattern;
by SmAnd calculating the color difference M according to the following calculation formula:
in formula (2):
Sm: the total area of the color difference pattern;
S0: the area of the mask substrate;
m: color difference;
the average film thickness value calculation method comprises the following steps: measuring the film thickness of the coating turntable which is subjected to parameter value adjustment after coating on a mask plate by using a film thickness measuring instrument, selecting N measuring points on the film, and calculating to obtain an average film thickness value, wherein the calculation formula is as follows:
T＝(P1+P2…+PN)/N (3)
in formula (3):
P1,P2...,PNthe film thickness value of each point;
t is the average value of film thickness
And (3) calculating the film thickness uniformity: the calculation formula is as follows:
in formula (4):
Pmaxthe maximum value of the film thickness;
Pminis the minimum value of the film thickness;
u is film thickness uniformity.
Through the steps, three indexes of color difference, average film thickness and uniformity of film thickness of each group of parameters can be calculated, and the three indexes are used for guiding an operator to select an optimal group of rotation parameters; and the formula has simple calculation mode and high calculation efficiency.
Furthermore, the number of the measuring points is 21 × 21, 21 points are respectively selected on the X axis and the Y axis, that is, the measuring points are uniformly taken on the X axis and the Y axis, so that the measuring points are more representative, and the overall film thickness can be more completely reflected. Too many and too dense measuring points can increase a large amount of work, and the time and the labor are consumed; since the number of measurement points is too small and too sparse, it is not representative, and 441 measurement points are preferable in the present invention.
Further, the measuring points are arranged in an S shape, and the film thickness measuring instrument measures from left to right and then from right to left, and measures back and forth; the arrangement mode is more efficient and reasonable; the film thickness measuring instrument can conveniently measure back and forth, and the running track of the measuring instrument is also met; compared with the single mode that the two modes are from right to left or from left to right, the moving track is reduced, the time required by measurement is reduced, and the method is more efficient.
The invention has the beneficial effects that:
1. the invention provides a method for optimizing the rotary gluing parameters of a high-generation mask and obtains an optimal rotary coating combination scheme; compared with the traditional screening method which needs a large number of tests, the method can obtain the optimal rotation parameters, is more efficient and reliable, and greatly reduces the test cost.
2. The invention quantifies the chromatic aberration by means of integration, and is more beneficial to screening out the optimal parameter combination.
3. The number of the measuring points is 21 multiplied by 21, namely the measuring points are uniformly taken on an X axis and a Y axis, so that the measuring points have more representativeness and statistics and can completely reflect the whole film thickness; and meanwhile, the measurement is carried out in an S shape, so that the method is more efficient and reasonable.
Drawings
FIG. 1 is a distribution diagram of chromatic aberration on a reticle substrate.
Fig. 2 is a distribution diagram of measurement points.
FIG. 3 is a schematic diagram of a single element calculus area.
FIG. 4 is a distribution diagram of film thickness values.
Labeled as: 1. a mask substrate; m, chromatic aberration.
Detailed Description
The invention is further described below with reference to the accompanying drawings.
Example (b):
in this embodiment, the G11-substituted reticle is taken as an example, the size of the G11-substituted reticle is 1620mm by 1780mm by 17mm, and the weight of the G11-substituted reticle substrate is greater than 100 Kg. Referring to fig. 1, fig. 1 is a distribution diagram of a coating chromatic aberration on a mask substrate under a normal spin coating process condition, and it can be seen that the chromatic aberration is large, and the coating chromatic aberration is cut at the edge of the mask substrate and is mostly presented in a shape of an approximate triangle or a parabola.
Referring to fig. 2, 3 and 4, the method for optimizing the rotation parameters in the mask plate rotation gluing of the invention comprises the following steps:
s1, establishing a mask model, and selecting rotation parameters influencing the mask spin coating process and target parameters for checking the mask gluing quality;
the rotation parameters comprise the rotation speed rpm of the gluing turntable, the rotation time t of the gluing turntable and the rotation acceleration a of the gluing turntable;
the target parameters are a film thickness average value T, film thickness uniformity U and color difference M;
s2 gives four parameter values to each rotation parameter, and establishes an orthogonal table L16 by using the four parameter values and three target parameters (4)3) And only 16 experiments are needed, so that the test times are greatly reduced, the efficiency is improved, and the cost is reduced on the premise of ensuring the optimization of the rotation parameters.
Referring to Table 1, Table 1 shows the spin coating process factor level L16 (4)3)。
Table 1: level of factors for the spin coating process L16 (4)3)
TABLE 2 orthogonal test and results of the spin coating process
Wherein a1, a2, A3, a4, B1, B2, B3, B4, C1, C2, C3 and C4 represent the four different parameter values taken for each rotation parameter, respectively.
S3, bringing the rotation parameter values in the table 1 into the table 2, endowing the three rotation parameter values of each serial number in the table 2 to a coating turntable, performing rotary gluing on a mask plate, and finally calculating a target parameter value corresponding to each group of parameter values in an orthogonal table;
the calculation method of the chromatic aberration comprises the following steps: establishing a coordinate system in the chromatic aberration graph area, and calculating the area of all chromatic aberration graphs through integration, wherein the calculation formula is as follows:
in formula (1):
Sm: the total area of the color difference pattern;
the traditional method can only estimate the color difference and cannot quantize the brightness, but the method quantizes the color difference in an integral mode, so that the optimal parameter combination can be screened out;
referring to FIG. 3, a diagram of a single-element calculus area, xk-1Denotes ykAnd yk-1First point of intersection, XkDenotes ykAnd yk-1A second point of intersection; y iskAnd yk-1The closed area enclosed between the two functions is the area of Mura, and the size of the color difference area can be obtained through an integral algorithm.
By SmAnd calculating the color difference M according to the following calculation formula:
in formula (2):
Sm: the total area of the color difference pattern;
S0: the area of the mask substrate;
m: color difference;
the average film thickness value calculation method comprises the following steps: and measuring the film thickness of the coating turntable subjected to parameter value adjustment after coating on the mask plate by using a film thickness measuring instrument, selecting 441 measuring points on the film, calculating to obtain an average film thickness value, wherein the preferable number of the measuring points N is 21 multiplied by 21, and selecting 21 points on an X axis and a Y axis respectively. Namely, the measuring points are uniformly taken on the X axis and the Y axis, so that the measuring points have more representativeness and the whole film thickness can be more completely reflected. Too many and too dense measuring points can increase a large amount of work, and the time and the labor are consumed; since the number of measurement points is too small and too sparse, it is not representative, and 441 measurement points are preferable in the present invention.
Referring to fig. 2, as another embodiment, the measurement points are arranged in an S shape, and the film thickness measuring instrument measures from left to right, then from right to left, and measures back and forth; the arrangement mode is more efficient and reasonable; the film thickness measuring instrument can conveniently measure back and forth, and the running track of the measuring instrument is also met; compared with the single mode that the two modes are from right to left or from left to right, the moving track is reduced, the time required by measurement is reduced, and the method is more efficient.
The calculation formula is as follows:
T＝(P1+P2…+P441)/441 (3)
in formula (3):
P1,P2...,P441the film thickness value of each point;
and (3) calculating the film thickness uniformity: the calculation formula is as follows:
in formula (4):
Pmaxthe maximum value of the film thickness;
Pminis the minimum value of the film thickness.
S4 selects an optimal set of rotation parameters from the orthogonal table. According to the requirement of pattern precision of a high-generation mask, the requirements of the photoresist coating thickness of the mask are controlled within the range of 700-800 nm by combining the processes of photoetching, developing, etching and the like, the photoresist thickness of the photoresist in the current production process is 735 +/-20 nm, the uniformity of the photoresist film thickness is controlled within 3%, Mura is not or slightly, and if Mura is serious, the coating failure is directly judged. Thus, the preferred result from table 2 is A3B2C4, i.e. the optimal rotation parameters are: the rotation speed is 400rpm, the rotation time is 25s, and the rotation acceleration is 45r/s 2.
Referring to FIG. 4, FIG. 4 is a film thickness distribution graph after using the rotation parameter A3B2C4, and it can be seen that the average film thickness value is better under the condition of changing the rotation parameter.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (5)
1. The method for optimizing the rotation parameters in the mask plate rotation gluing is characterized by comprising the following steps of:
s1, establishing a mask model, and selecting rotation parameters influencing the mask spin coating process and target parameters for checking the mask gluing quality;
the rotation parameters comprise the rotation speed rpm of the gluing turntable, the rotation time t of the gluing turntable and the rotation acceleration a of the gluing turntable;
the target parameters are a film thickness average value T, film thickness uniformity U and color difference M;
s2, giving a plurality of parameter values to each rotation parameter, and establishing an orthogonal table by the parameter values and the target parameters;
s3, endowing each group of parameter values in the orthogonal table to the coating turntable, carrying out rotary coating of the mask plate, and finally calculating target parameter values corresponding to each group of parameter values in the orthogonal table;
s4 selects an optimal set of rotation parameters from the orthogonal table.
2. The method for optimizing rotation parameters in mask plate rotation coating according to claim 1, wherein in step S2, the parameter value of each rotation parameter is four.
3. The method for optimizing the rotation parameter in the mask rotation coating according to claim 1, wherein the step S3 specifically comprises:
the calculation method of the chromatic aberration M comprises the following steps: establishing a coordinate system in the chromatic aberration graph area, and calculating the area of all chromatic aberration graphs through integration, wherein the calculation formula is as follows:
in formula (1):
Sm: the total area of the color difference pattern;
by SmAnd calculating the color difference M according to the following calculation formula:
in formula (2):
Sm: the total area of the color difference pattern;
S0: the area of the mask substrate;
m: color difference;
the method for calculating the average film thickness T comprises the following steps: measuring the film thickness of the coating turntable which is subjected to parameter value adjustment after coating on a mask plate by using a film thickness measuring instrument, selecting N measuring points on the film, and calculating to obtain an average film thickness value, wherein the calculation formula is as follows:
T＝(P1+P2…+PN)/N (3)
in formula (3):
P1,P2...,PNthe film thickness value of each point;
calculation of film thickness uniformity U: the calculation formula is as follows:
in formula (4):
Pmaxthe maximum value of the film thickness;
Pminis the minimum value of the film thickness.
4. The method for optimizing rotation parameters in mask plate rotation coating according to claim 3, wherein the number of the measurement points is 21X 21, and 21 points are selected in the X axis and the Y axis, respectively.
5. The method for optimizing rotation parameters in mask plate rotation coating according to claim 3, wherein the measuring points are arranged in an S shape.
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| CN114334736A (en) * | 2021-12-29 | 2022-04-12 | 华天科技（西安）有限公司 | Process optimization method for wafer gluing |
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