CN111477578A - Automatic insert machine - Google Patents
Automatic insert machine Download PDFInfo
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- CN111477578A CN111477578A CN202010259564.2A CN202010259564A CN111477578A CN 111477578 A CN111477578 A CN 111477578A CN 202010259564 A CN202010259564 A CN 202010259564A CN 111477578 A CN111477578 A CN 111477578A
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- 235000012431 wafers Nutrition 0.000 claims abstract description 60
- 239000010453 quartz Substances 0.000 claims abstract description 59
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 59
- 238000012546 transfer Methods 0.000 claims abstract description 49
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 46
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 46
- 239000010703 silicon Substances 0.000 claims abstract description 46
- 244000126211 Hericium coralloides Species 0.000 claims description 6
- 238000007789 sealing Methods 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 5
- 241000252254 Catostomidae Species 0.000 claims description 4
- 238000007666 vacuum forming Methods 0.000 claims 1
- 230000008901 benefit Effects 0.000 abstract description 7
- 230000001360 synchronised effect Effects 0.000 description 10
- 230000005540 biological transmission Effects 0.000 description 8
- 238000010586 diagram Methods 0.000 description 8
- 238000009792 diffusion process Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000013459 approach Methods 0.000 description 3
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 238000001179 sorption measurement Methods 0.000 description 2
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1876—Particular processes or apparatus for batch treatment of the devices
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention relates to an automatic wafer inserting machine, which comprises a workbench, wherein at least one quartz boat transfer device, at least one ejection device, at least one clamping device, at least one multi-shaft servo device, at least one suction device and at least one flower basket transfer device are arranged on the workbench, the quartz boat transfer device is used for linear motion of quartz boats, the at least one flower basket transfer device is used for linear motion of flower baskets, the at least one clamping device is arranged on the multi-shaft servo device and used for clamping silicon wafers, and the at least one suction device is arranged at least one moving end of the multi-shaft servo device and used for sucking the silicon wafers. Compared with the prior art, the silicon wafer conveying device solves the problem of a traditional manual conveying mode, has the advantages of high automation degree, time and labor saving, reduces the labor intensity of workers, and improves the silicon wafer conveying efficiency of enterprises.
Description
Technical Field
The invention relates to the field of automation equipment, in particular to an automatic sheet inserting machine.
Background
At present, in the diffusion process of solar cells, a quartz boat is used as a bearing member of a silicon wafer and is used for performing the diffusion process in a quartz furnace tube, and the tolerance temperature of the quartz boat can reach more than 800 ℃. The quartz boat needs to be manually carried to the diffusion furnace before the process, the diffusion furnace is manually carried out after the process is finished, then the silicon wafers on the quartz boat are transferred to the flower basket from the quartz boat and transferred to the next process, and the manual silicon wafer transfer mode is high in labor intensity, time-consuming and labor-consuming, easily influences the quality of the silicon wafers and causes pollution to the quartz boat.
Disclosure of Invention
In view of the above-mentioned shortcomings of the prior art, it is an object of the present invention to provide an automatic sheet inserting machine. Compared with the prior art, the automatic silicon wafer transfer device has the advantages that the automatic transfer of the silicon wafer from the quartz boat to the flower basket can be realized, the time and the labor are saved, the labor intensity of workers is greatly reduced, and the automatic silicon wafer transfer device has the advantage of high automation degree.
In order to achieve the purpose, the technical scheme of the invention is as follows:
an automatic wafer inserting machine comprises a workbench, wherein at least one quartz boat transfer device, at least one ejection device, at least one clamping device, at least one multi-shaft servo device, at least one suction device and at least one flower basket transfer device are mounted on the workbench, the quartz boat transfer device is used for linear motion of quartz boats, the at least one flower basket transfer device is used for linear motion of flower baskets, the at least one clamping device is mounted on the multi-shaft servo device and used for clamping silicon wafers, the at least one suction device is mounted at least one motion end of the multi-shaft servo device and used for sucking the silicon wafers, and the at least one ejection device is mounted inside the workbench and is respectively in contact with the at least one quartz boat transfer device and the material supply end of the at least one flower basket transfer device and used for ejecting materials from the quartz boats or the flower baskets.
The further technical scheme is as follows:
preferably, the specific structure of the at least one quartz boat transfer device is as follows:
the positioning device comprises a first linear module, at least one group of clamping parts and at least one positioning part, wherein the at least one group of clamping parts are fixedly connected to the moving end of the first linear module, and the positioning part is fixedly connected to the moving end of the first linear module and close to the clamping parts;
preferably, the clamping part comprises a clamping block, and a bayonet for clamping a side plate of the quartz boat is formed in the surface of the clamping block; the positioning part comprises an air cylinder, a piston of the air cylinder is connected with a fixed plate, and the fixed plate is connected with at least one positioning head;
preferably, the at least one ejection device comprises a second linear module, a mounting seat, a vertical plate, a first fixing plate and at least one top plate, the mounting seat is fixed at the moving end of the second linear module, one end of the vertical plate is fixedly connected with the mounting seat, the first fixing plate is connected to the other end of the vertical plate, one end of the at least one top plate is fixedly connected with the first fixing plate, and the other end of the at least one top plate is provided with at least one first comb tooth;
preferably, the at least one clamping device comprises a clamping cylinder, the clamping cylinder is provided with at least one piston, the at least one piston is connected with one end of a second fixing plate, the second fixing plate is fixedly connected with at least one deviation correcting plate mounting block, the deviation correcting plate mounting block is fixedly connected with a deviation correcting plate, and one side of the deviation correcting plate is also provided with at least one second comb tooth;
preferably, the specific structure of the at least one multi-axis servo device is as follows:
the device comprises a first servo mounting plate, wherein at least one third linear module is mounted on the first servo mounting plate, the moving end of the at least one third linear module is connected with a second servo mounting plate, a fourth linear module is mounted on the second servo mounting plate, and the moving directions of the moving ends in the third linear module and the fourth linear module are different;
preferably, the specific structure of the at least one suction device is as follows:
the vacuum device comprises a vacuum emitter, a sixth linear module, a side sealing plate, a sucker mounting plate and at least one sucker component, wherein the vacuum emitter is fixed at the fixed end of the sixth linear module, and the moving end of the sixth linear module is provided with the at least one sucker component through the sucker mounting plate;
preferably, the at least one sucker component comprises a plurality of suckers embedded in a sucker mounting plate, the suckers are all penetrated through by at least one mounting rod, one end of the at least one mounting rod is fixedly connected with the side sealing plate, the other end of the at least one mounting rod is connected with an air communicating cover plate, and the air communicating cover plate is provided with at least one hole for communicating with a vacuum port of the vacuum emitter;
preferably, the sucker is provided with at least one rod mounting hole, an air channel hole, at least one air groove and at least one air vent, the at least one air vent is arranged in the at least one air groove, and the at least one air vent is communicated with the air channel hole through at least one through hole;
the flower basket transfer device comprises a seventh linear module, the moving end of the seventh linear module is fixedly connected with a supporting plate, at least one flower basket is installed on the supporting plate, at least one positioning cylinder is arranged on one side of the flower basket on the supporting plate, a limiting area is further arranged on the supporting plate, and the at least one positioning cylinder pushes the flower basket to move into the limiting area.
Compared with the prior art, the invention has the following beneficial technical effects:
the silicon wafer clamping device has the advantages that the quartz boat transfer device and the flower basket transfer device are arranged, so that the silicon wafers can be uniformly moved to the clamping and sucking stations, and the silicon wafers can be sucked and clamped conveniently.
The arrangement of the clamping device, the suction device and the multi-shaft servo device enables the silicon wafer to be transferred from the quartz boat to the flower basket without stopping, the silicon wafer space in the quartz boat is half of that of the flower basket, automatic transfer avoids damage to the silicon wafer caused by manual operation, conveying efficiency is greatly improved, and the arrangement of the suction pieces in the suction device is convenient for insertion from gaps among the silicon wafers and adsorption of the silicon wafers, so that damage to the silicon wafers is avoided.
And (IV) the arrangement of the ejection device ensures that the silicon wafer is more stable when being sucked or clamped, and the yield of the product is improved.
And (V) the arrangement of the multi-axis servo device and each linear module realizes the interactive motion of the X, Y, Z axes, and has the advantages of high motion precision and accurate position.
The silicon wafer conveying device solves the problem of a traditional manual conveying mode, has the advantages of high automation degree, time saving and labor saving, reduces the labor intensity of workers, and improves the silicon wafer conveying efficiency of enterprises.
Drawings
Fig. 1 shows a schematic structural diagram of an automatic wafer inserting machine according to an embodiment of the present invention.
Fig. 2 shows a schematic structural diagram i of a quartz boat transfer device in an automatic wafer inserting machine according to an embodiment of the present invention.
Fig. 3 shows a schematic structural diagram ii of a quartz boat transfer device in an automatic wafer inserting machine according to an embodiment of the present invention.
Fig. 4 shows a schematic diagram of an ejection device in a quartz boat transfer device in an automatic wafer inserting machine according to an embodiment of the invention.
Fig. 5 shows an enlarged schematic view of fig. 4 at a.
Fig. 6 shows a schematic installation diagram of a multi-axis servo device, a suction device and a clamping device in an automatic wafer inserting machine according to an embodiment of the invention.
Fig. 7 shows an enlarged schematic view of fig. 6 at B.
Fig. 8 is a schematic structural diagram of a suction device in an automatic wafer inserting machine according to an embodiment of the present invention.
Fig. 9 is a schematic structural diagram of a suction sheet in an automatic sheet inserting machine according to an embodiment of the present invention.
Fig. 10 is a schematic diagram of a flower basket transfer device in an automatic sheet inserting machine according to an embodiment of the present invention.
Wherein: 1. a work table; 2. a quartz boat transfer device; 201. a first motor; 202. a first coupling; 203. a ball screw supporting seat; 204. a feed screw nut; 205. a screw rod; 2061. a linear guide rail; 2062. a guide rail seat; 207. a first slider; 2071. a carrier plate; 208. a cylinder; 209. a fixing plate; 210. positioning the head; 211. a quartz boat; 212. a first tilt sensor; 213. a clamping block; 214. a first linear module; 3. an ejection device; 301. a first motor; 302. a second linear module; 303. a second slider; 304. a mounting seat; 305. a vertical plate; 306. a first fixing plate; 307. a top plate; 308. a first comb tooth; 4. a clamping device; 401. a clamping cylinder; 402. a piston; 403. a second fixing plate; 404. a deviation correcting plate mounting block; 405. a deviation rectifying plate; 4051. a second comb tooth; 406. a clamping device mounting plate; 5. a multi-axis servo device; 501. a vertical plate; 502. a first servo mounting plate; 503. a second motor; 504. a semi-enclosed mount; 505. a third slider; 506. a second servo mounting plate; 507. a third motor; 508. a fourth slider; 6. a suction device; 601. a vacuum emitter; 602. a fourth motor; 603. a slide base; 604. a fifth slider; 605. a side closure panel; 606. a sucker mounting plate; 607. a suction cup; 6071. a pole mounting hole; 6072. an airway hole; 6073. a first through hole; 6074. a vent hole; 6075. an air tank; 6076. a guide surface; 6077. a second through hole; 608. a sucker positioning block; 609. mounting a rod; 610. a vent cover plate; 7. a flower basket transfer device; 701. a seventh linear module; 702. a fifth motor; 703. a second coupling; 704. a sixth slider; 705. a support plate; 706. positioning the air cylinder; 707. positioning a plate; 708. a second tilt sensor; 709. a first stopper; 710. a flower basket; 711. and a second limiting block.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The following detailed description of the claimed automatic wafer inserting machine will be given by way of example and as understood by those skilled in the art, with reference to the accompanying drawings.
As shown in fig. 1, the automatic wafer inserting machine comprises a worktable 1, at least one quartz boat transfer device 2, at least one ejection device 3, at least one clamping device 4, at least one multi-axis servo device 5, at least one suction device 6 and at least one basket transfer device are arranged on the worktable 1, the at least one quartz boat transfer device 2 is used for the linear motion of quartz boats, the at least one basket transfer device 7 is used for the linear motion of baskets, the at least one clamping device 4 is arranged on the multi-axis servo device 5 and is used for clamping silicon wafers, the at least one suction device 6 is arranged at least one moving end of the multi-axis servo device 5, the ejecting device 3 is arranged in the workbench 1 and is respectively contacted with the feeding ends of the quartz boat transfer device 2 and the flower basket transfer device 7 so as to eject the material from the quartz boat or the flower basket.
As shown in fig. 2 and 3, the specific structure of the at least one quartz boat transfer apparatus 2 is as follows:
the quartz boat transfer device comprises a first linear module, at least one group of clamping parts and at least one positioning part, preferably, the number of the clamping parts in the quartz boat transfer device 2 is eight, one quartz boat can be mounted on every four clamping parts in one group, the number of the positioning parts is two, and each quartz boat is provided with the positioning part.
As shown in fig. 2 and 3, the first linear module is a ball screw type linear module, and the first linear module includes a first motor 201, a first coupler 202, a pair of ball screw supporting seats 203, a screw nut 204, a screw 205, a rail seat 2062, a linear rail 2061, and a first slider 207, the screw 205 is installed between the pair of ball screw supporting seats 203, and one end of the screw 205 extends out of one of the ball screw supporting seats 203 and is connected to an output end of the first motor 201 through the first coupler 202. The screw nut 204 is connected to the bearing plate 2071, and the bottom of the bearing plate 2071 is slidably connected to the linear guide rail 2061 of the guide rail seat 2062 through a plurality of first sliders 207. The carrier plate 2071 forms a moving end of the first linear module 214.
As shown in fig. 2 and 3, at least one set of clamping portion is fixed to the moving end of the first linear module 214, and a positioning portion is fixed to the moving end of the first linear module 214 near the clamping portion. Preferably, the clamping part in the quartz boat transfer device 2 in the automatic wafer inserting machine according to the embodiment of the present invention includes a fixture block 213, and a bayonet for clamping a side plate of the quartz boat 211 is formed on a surface of the fixture block 213; the positioning part includes a cylinder 208, a piston of the cylinder 208 is connected to the fixing plate 209, and at least one positioning head 210 is connected to the fixing plate 209, preferably, two positioning heads 210 are provided on each fixing plate 209 in the quartz boat transfer apparatus 2 according to the embodiment of the present invention. As shown in fig. 2 and 3, the left and right side plates of the quartz boat 211 are inserted into the notches of the latch blocks 213. A first inclination sensor 212 is further installed on the bearing plate 2071, the first inclination sensor 212 detects whether the quartz boat 211 is installed on the fixture block 213 and is inclined, and when it is detected that the quartz boat 211 is installed in place, the piston of the cylinder 208 pushes the fixing plate 209 to contact one side of the quartz boat 211, so as to ensure that the quartz boat 211 is not inclined.
Preferably, in the automatic wafer inserting machine according to the embodiment of the present invention, the number of the ejector 3 in the quartz boat transfer device 2 corresponds to the number of the quartz boat transfer device 2 and the number of the basket transfer device 7, an opening through which the ejector 3 can extend is formed in the work table 1, and the ejector 3 is fixed to the bottom of the work table 1 through a back plate.
As shown in fig. 4, the ejection device 3 includes a second linear module 302, a mounting seat 304, a vertical plate 305, a first fixing plate 306 and at least one top plate 307, wherein the second linear module 302 is a synchronous belt type linear module, the synchronous belt type linear module includes a first motor 301, a belt is installed on transmission shafts on two sides of the second linear module 302, wherein one of the transmission shafts is connected with an output end of the first motor 301 through a synchronous belt and a synchronous wheel, a second slider 303 is fixed on the belt, and the second slider 303 constitutes a moving end of the second linear module 302.
As shown in fig. 4, the mounting base 304 is fixed at the moving end of the second linear module 302, one end of the vertical plate 305 is fixedly connected to the mounting base 304, the first fixing plate 306 is connected to the other end of the vertical plate 305, and one end of at least one top plate 307 is fixedly connected to the first fixing plate 306.
As shown in fig. 6 and 7, the number of the clamp devices 4 corresponds to the number of the quartz boat transfer device 2 and the basket transfer device 7, and each of the plurality of clamp devices 4 is fixed to the clamp device mounting plate 406. The clamping device comprises a clamping cylinder 401, a pair of pistons 402 are mounted on the clamping cylinder 401, each piston 402 is fixedly connected with a second fixing plate 403, one end of a deviation correcting plate mounting block 404 is fixedly connected with the surface of the second fixing plate 403, the other end of the second fixing plate 403 is fixedly connected with a deviation correcting plate 405, a plurality of second comb teeth 4051 are arranged on the inner side of the deviation correcting plate 405, and a tooth gap for clamping a silicon wafer is formed between every two adjacent second comb teeth 4051.
As shown in fig. 6, the specific structure of the at least one multi-axis servo device 5 is as follows:
the servo mechanism comprises a first servo mounting plate 502, wherein at least one third linear module is mounted on the first servo mounting plate 502, the moving end of the at least one third linear module is connected with a second servo mounting plate 506, a fourth linear module is mounted on the second servo mounting plate 506, and the moving directions of the moving ends in the third linear module and the fourth linear module are different. Preferably, in an automatic wafer inserting machine according to an embodiment of the present invention, the third linear module and the fourth linear module are both synchronous belt type linear modules, a belt in the third linear module is installed in transmission shafts on both sides of the linear module, one of the transmission shafts is a power input shaft, the power input shaft is connected to an output end of the second motor 503 through a synchronous belt, a part of the belt in the third linear module penetrates through the semi-enclosed mounting seat 504, a belt in the fourth linear module is installed in the transmission shafts on both sides of the linear module, one of the transmission shafts is a power input shaft, and the power input shaft is connected to an output end of the third motor 507 through a synchronous belt. Preferably, in the automatic wafer inserting machine according to the embodiment of the present invention, the third linear modules are all installed on the first servo installation plate 502, the first servo installation plate 502 is fixedly connected between the two vertical plates 501, and the vertical plates 501 are installed on the workbench 1. In this embodiment, the third linear module moves along the Y-axis and the fourth linear module moves along the Z-axis. The belt of the third linear module is connected with the third slider 505, the third slider 505 forms the moving end of the third linear module, the belt of the fourth linear module is connected with the fourth slider 508, and the fourth slider 508 forms the moving end of the fourth linear module.
As shown in fig. 8, the specific structure of at least one suction device 6 is as follows:
comprises a vacuum emitter 601, a sixth linear module, a side sealing plate 605, a sucker mounting plate 606 and at least one sucker component, wherein the vacuum emitter 601 is mounted on the fourth slide 508 of the fourth linear module,
the vacuum emitter 601 is fixed on the profile of the sixth linear module, and the moving end of the sixth linear module is provided with at least one suction cup component through a suction cup mounting plate 606. Preferably, the sixth linear module in this embodiment is a ball screw type linear module, and the structure thereof is the same as that of the first linear module 214.
As shown in fig. 8, the moving end of the sixth linear module is a fifth slider 604 connected with the lead screw nut, the fifth slider 604 is fixedly connected with a suction cup mounting plate 606, the suction cup mounting plate 606 is fixedly connected with a suction cup positioning block 608, and the suction cup positioning block 608 is provided with a groove for mounting a suction cup assembly.
As shown in fig. 8 and 9, at least one of the suction cup assemblies includes a plurality of suction cups 607 embedded in the suction cup mounting plate 606, the suction cups 607 are penetrated by at least one mounting rod 609, in this embodiment, four mounting rods 609 are provided, one end of each of the four mounting rods 609 is fixedly connected to the side sealing plate 605, the other end of each of the four mounting rods 609 is connected to an air-through cover plate 610, the air-through cover plate 610 is provided with at least one hole for communicating with a vacuum port of the vacuum emitter 601, and an opening at the other end of the hole in the air-through cover plate 610 is communicated with an air passage hole 6072 of the.
As shown in fig. 9, the suction cup 607 is provided with at least one rod mounting hole 6071, an air passage hole 6072, at least one air groove 6075 and at least one air vent 6074, the at least one air vent 6074 is provided in the at least one air groove 6075, and the at least one air vent 6074 is communicated with the air passage hole 6072 through at least one through hole. The air channel 6075 in this embodiment is two concentric circular channels, the through holes are a first through hole 6073 and a second through hole 6077, wherein the vent hole 6074 in the air channel 6075 with a smaller diameter is communicated with another vent hole 6074 through the second through hole 6077, and the other vent hole 6074 is communicated with the air channel hole 6072 through the first through hole 6073.
As shown in fig. 10, the basket transferring device 7 includes a seventh linear module 701, the seventh linear module is a synchronous belt type linear module, a belt in the seventh linear module is installed in transmission shafts on two sides of the linear module, one of the transmission shafts is a power input shaft, and the power input shaft is connected with an output end of the fifth motor 702 through a synchronous belt, a synchronous wheel and a second coupling 703. The moving end of the seventh linear module 701 is fixedly connected to a supporting plate 705, at least one flower basket 710 is mounted on the supporting plate 705, at least one positioning cylinder 706 is disposed on the supporting plate 705 at one side of the flower basket 701, and a limiting region is further disposed on the supporting plate 705 and is a space surrounded by a pair of first limiting blocks 709 and a second limiting block 711. The positioning plate 707 of the positioning cylinder 706 pushes the flower basket 710 to move into the limiting area. Second tilt sensors 708 are provided on the left and right sides of the positioning cylinder 706, and detect whether the mounting position of the basket 710 is tilted.
The specific using process of the invention is as follows:
as shown in fig. 1, when silicon wafers in the quartz boat 211 need to be transferred to the flower basket 710, the first linear module 214 works, as shown in fig. 2 and 3, the first motor 201 is started, the lead screw 205 is driven to rotate by the first coupler 202, so that the lead screw nut 204 axially moves on the lead screw 205, the lead screw nut 204 moves to drive the bearing plate 2071 to move, and the quartz boat with the silicon wafers is moved to a position right above the ejection device 3.
As shown in fig. 1 and 3, the ejector 3 is operated, the first motor 301 of the second linear module 302 is started, so that the belt of the second linear module 302 operates and drives the second slider 303 to perform linear motion up and down, as shown in fig. 3, the second slider 303 moves upwards, so that the top plate 307 with the first comb teeth 308 moves upwards, the first comb teeth 308 move upwards and contact the silicon wafer inside the quartz boat 211, and the gaps between adjacent first comb teeth 308 contact the silicon wafer and eject the silicon wafer upwards to the clamping device 4.
As shown in fig. 6 and 7, after the silicon wafer is ejected, the clamping cylinder 401 of the clamping device 4 operates, the piston 402 of the clamping cylinder 401 approaches to the center, so that the deviation correcting plate mounting block 404 and the deviation correcting plate 405 approach to the center synchronously, as shown in fig. 7, the second comb teeth 4051 on the deviation correcting plate 405 approach to clamp two sides of the silicon wafer, and the gap between the adjacent second comb teeth 4051 is used for mounting the silicon wafer.
After the silicon wafer is clamped, as shown in fig. 6, the multi-axis servo device 5 is started, the second motor 503 is started to make the belt in the third linear module move, so as to drive the third slider 505 to make linear motion on the Y axis, when the third slider moves to the clamping device 4 where the silicon wafer is clamped, the fourth linear module moves, the third motor 507 is started to make the belt in the fourth linear module move, so as to make the fourth slider 508 make up-and-down motion along the Z axis, until the suction device 6 moves to a position close to the silicon wafer and stops.
As shown in fig. 7 and 8, when the fourth motor 602 in the sixth linear module is started, the fourth motor 602 drives the fifth slider 604 to move linearly on the slide 603 along the X direction through the internal lead screw nut, when the sucker assembly moves right above the silicon wafer, the vacuum emitter 601 is started, passes through an orifice at one end of the vent cover plate 610 through an air pipe to be communicated, the other end of the vent cover plate 610 is connected to the air passage hole 6072 of the suction cup 607, since the suction cups 607 are arranged at intervals in the suction cup positioning block 608, the air passage holes 6072 are connected in series to form an air passage, the air passage has vacuum which makes each air vent 6074 have adsorption force through the first through hole 6073 and the second through hole 6077 on each suction cup 607, the bottom of the suction cup 607 is further provided with an inclined guide surface 6076 so that the silicon wafer can be smoothly sucked out of the quartz boat by the suction force of the side surface after the silicon wafer is inserted downwards by the suction cup 607.
As shown in fig. 1, after the silicon wafer is sucked out, the fifth motor 702 in the seventh linear module is started, so that the sixth slider 704 drives the support plate 705 and the flower basket 710 to move, the flower basket moves to a position close to the multi-axis servo device 5, the third linear module of the multi-axis servo device 5 is started again, the suction device moves to a position right above the flower basket 710, the fourth linear module works, and the silicon wafer drops in the flower basket 710 due to the air release of the suction device, so that the silicon wafer in the quartz boat is transferred to the inside of the flower basket.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. Automatic insert machine, including workstation (1), its characterized in that: at least one quartz boat transfer device (2), at least one ejection device (3), at least one clamping device (4), at least one multi-shaft servo device (5), at least one suction device (6) and at least one flower basket transfer device are arranged on the workbench (1), the at least one quartz boat transfer device (2) is used for linear motion of quartz boats, the at least one flower basket transfer device (7) is used for linear motion of flower baskets, the at least one clamping device (4) is arranged on the multi-shaft servo device (5) and used for clamping silicon wafers, the at least one suction device (6) is arranged at least one motion end of the multi-shaft servo device (5) and used for sucking the silicon wafers, the at least one ejection device (3) is arranged inside the workbench (1) and is respectively contacted with the at least one quartz boat transfer device (2) and the material supply end of the at least one flower basket transfer device (7), for ejecting the material from the quartz boat or the flower basket.
2. The automatic film inserting machine of claim 1, wherein: the specific structure of the at least one quartz boat transfer device (2) is as follows:
the positioning device comprises a first linear module, at least one group of clamping parts and at least one positioning part, wherein the at least one group of clamping parts are fixedly connected to the moving end of the first linear module, and the positioning part is fixedly connected to the moving end of the first linear module and close to the clamping parts.
3. The automatic film inserting machine of claim 2, wherein: the clamping part comprises a clamping block (213), and a bayonet used for clamping a side plate of the quartz boat (211) is arranged on the surface of the clamping block (213); the positioning part comprises a cylinder (208), a piston of the cylinder (208) is connected with a fixed plate (209), and at least one positioning head (210) is connected to the fixed plate (209).
4. The automatic film inserting machine of claim 1, wherein: the at least one ejection device (3) comprises a second linear module (302), a mounting seat (304), a vertical plate (305), a first fixing plate (306) and at least one top plate (307), the mounting seat (304) is fixed at a moving end of the second linear module, one end of the vertical plate (305) is fixedly connected with the mounting seat (304), the first fixing plate (306) is connected to the other end of the vertical plate (305), one end of the at least one top plate (307) is fixedly connected with the first fixing plate (306), and at least one first comb tooth (308) is arranged at the other end of the at least one top plate (307).
5. The automatic film inserting machine of claim 1, wherein: the at least one clamping device (4) comprises a clamping cylinder (401), the clamping cylinder (401) is provided with at least one piston (402), the at least one piston (402) is connected with one end of a second fixing plate (403), the second fixing plate (403) is fixedly connected with at least one deviation correcting plate mounting block (404), the deviation correcting plate mounting block (404) is fixedly connected with a deviation correcting plate (405), and one side of the deviation correcting plate (405) is further provided with at least one second comb tooth (4051).
6. The automatic film inserting machine of claim 1, wherein: the specific structure of the at least one multi-axis servo device (5) is as follows:
including first servo mounting panel (502) install an at least third straight line module on first servo mounting panel (502) the motion end of an at least third straight line module is connected second servo mounting panel (506), and the fourth straight line module is installed on second servo mounting panel (506), the third straight line module with the direction of motion end is different in the fourth straight line module.
7. The automatic film inserting machine of claim 1, wherein: the at least one suction device (6) has the following specific structure:
the vacuum sucking disc type vacuum forming machine comprises a vacuum emitter (601), a sixth linear module, a side sealing plate (605), a sucking disc mounting plate (606) and at least one sucking disc assembly, wherein the vacuum emitter (601) is fixed at the fixed end of the sixth linear module, and the moving end of the sixth linear module is provided with the at least one sucking disc assembly through the sucking disc mounting plate (606).
8. The automatic film inserting machine of claim 7, wherein: the at least one sucker component comprises a plurality of suckers (607) embedded in a sucker mounting plate (606), the suckers (607) are penetrated through by at least one mounting rod (609), one end of the at least one mounting rod (609) is fixedly connected with the side sealing plate (605), the other end of the at least one mounting rod (609) is connected with an air communicating cover plate (610), and the air communicating cover plate (610) is provided with at least one hole for being communicated with a vacuum port of the vacuum emitter (601).
9. The automatic film inserting machine of claim 8, wherein: set up at least one pole mounting hole (6071), air flue hole (6072), at least one air duct (6075) and at least air vent (6074) on sucking disc (607), set up in at least one air duct (6075) at least one air vent (6074), at least one air vent (6074) through at least one through-hole with air flue hole (6072) intercommunication.
10. The automatic film inserting machine of claim 1, wherein: the flower basket transfer device (7) comprises a seventh linear module (701), the moving end of the seventh linear module (701) is fixedly connected with a supporting plate (705), at least one flower basket (710) is mounted on the supporting plate (705), at least one positioning cylinder (706) is arranged on the supporting plate (705) on one side of the flower basket (701), a limiting area is further arranged on the supporting plate (705), and the at least one positioning cylinder (706) pushes the flower basket (701) to move into the limiting area.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010259564.2A CN111477578A (en) | 2020-04-03 | 2020-04-03 | Automatic insert machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010259564.2A CN111477578A (en) | 2020-04-03 | 2020-04-03 | Automatic insert machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111477578A true CN111477578A (en) | 2020-07-31 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010259564.2A Pending CN111477578A (en) | 2020-04-03 | 2020-04-03 | Automatic insert machine |
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| CN (1) | CN111477578A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113644016A (en) * | 2021-10-13 | 2021-11-12 | 江苏泰明易自动化设备有限公司 | Automatic insert machine moves and carries support piece device |
| CN118197975A (en) * | 2024-05-15 | 2024-06-14 | 浙江求是半导体设备有限公司 | Battery piece transferring and loading equipment and battery piece transferring and loading method |
-
2020
- 2020-04-03 CN CN202010259564.2A patent/CN111477578A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113644016A (en) * | 2021-10-13 | 2021-11-12 | 江苏泰明易自动化设备有限公司 | Automatic insert machine moves and carries support piece device |
| CN113644016B (en) * | 2021-10-13 | 2021-12-14 | 江苏泰明易自动化设备有限公司 | Automatic insert machine moves and carries support piece device |
| CN118197975A (en) * | 2024-05-15 | 2024-06-14 | 浙江求是半导体设备有限公司 | Battery piece transferring and loading equipment and battery piece transferring and loading method |
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