CN111213234A - 半导体组装件 - Google Patents

半导体组装件 Download PDF

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CN111213234A
CN111213234A CN201880066198.XA CN201880066198A CN111213234A CN 111213234 A CN111213234 A CN 111213234A CN 201880066198 A CN201880066198 A CN 201880066198A CN 111213234 A CN111213234 A CN 111213234A
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D.巴贡
T.里普尔
D.沃尔夫
C.奎斯特-马特
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Vitesco Technologies GmbH
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Abstract

一种半导体组装件，包括‑至少一个半导体器件（1），其中所述半导体器件（1）具有带有上侧（5）和下侧（7）的重新布线衬底（3）以及布置在所述上侧（5）上的半导体芯片（9），其中‑在所述重新布线衬底（3）的上侧（5）上布置用于与所述半导体芯片（9）的接触面（11）连接的接触连接面（13），‑在所述下侧（7）上布置外部接触面（17），所述外部接触面经由印制线路与所述接触连接面（13）电连接，并且‑外部接触面（17）在所述下侧（7）的第一区域（30）中以比在第二区域（32）中更大的彼此间距离布置；‑至少一个印刷电路板（21），在所述印刷电路板上布置有所述半导体器件（1），其中与外部接触件（17）对应的接触面（23）布置在所述印刷电路板（21）的上侧（22）上，使得接触面（23）在所述上侧（22）的第一区域（30）中以比在第二区域（32）中更大的彼此间距离布置；其中在所述印刷电路板（21）的第一区域（30）中在所述接触面（23）之间布置通孔（20）。

Description

半导体组装件
技术领域
本发明涉及一种具有至少一个半导体器件的半导体组装件。
背景技术
重新布线衬底（部分地也称为中介层）用于半导体器件中，以使得能够经由外部接触件对半导体芯片进行电接触。这种重新布线衬底可以特别是多层的并且具有由塑料或陶瓷构成的层，在所述由塑料或陶瓷构成的层中嵌入了印制线路。这些印制线路经由钻孔将所述重新布线衬底的上侧上的接触连接面与下侧上的外部接触面连接。
US2011/0001230 A1公开了一种球栅阵列（BGA）构造方式的半导体器件。在这种半导体器件的情况下，将焊球或焊珠形式的外部接触件施加到位于所述重新布线衬底的下侧上的外部接触面上。在回流焊接工艺（有时也称为“熔融焊接工艺”）中，将这种半导体器件焊接到更高级别的电路板上。
球栅阵列器件被广泛使用，并且可以使用成本有利的印刷电路板技术来加以制造。然而，这种器件的问题是，外部接触面或外部接触件的间距（pitch）不能太小，由此防止短路。另外，在一些具有更高冷却需求的半导体器件中，在印刷电路板上需要区域来用于散热，特别是用于连接至散热器。
发明内容
因此，本发明的任务是说明一种具有至少一个半导体器件的半导体组装件，该半导体组装件既具有令人满意的分散性和可接触性又具有有效的散热。
该任务通过具有权利要求1的特征的半导体组装件来解决。
有利的构型和扩展是从属权利要求的主题。
根据本发明的一个方面，说明了一种具有至少一个半导体器件的半导体组装件，其中所述半导体器件具有带有上侧和下侧的重新布线衬底以及布置在所述上侧上的半导体芯片。在所述重新布线衬底的上侧上布置有用于与所述半导体芯片的接触面连接的接触连接面。外部接触面布置在所述下侧上，所述外部接触面经由印制线路与所述接触连接面电连接。所述外部接触面在所述下侧的第一区域中以比在第二区域中更大的彼此间距离布置。
此外，所述半导体组装件具有至少一个印刷电路板，在所述至少一个印刷电路板上布置有所述半导体器件。对应于外部接触件的接触面布置在所述印刷电路板的上侧上，使得接触面在该上侧的第一区域中以比在第二区域中更大的彼此间距离布置。在所述印刷电路板的第一区域中，在所述接触面之间布置通孔。
对应的外部接触面和接触面在此特别是应理解为，用于与外部接触面电连接的所述接触面是经由外部接触件设置的，并且为此以相同的图案布置。
所述半导体组装件具有的优点是，经由布置在第一区域中的通孔可以实现良好的散热和与散热器的连接，所述通孔特别是可以构造为钻孔。为了创建用于热通孔的位置，在所述第一区域中所述接触面以彼此较大的距离（pitch，间距）布置。因此在所述第一区域中可能会比迄今为止常见的总共少一些接触面。但是，这些接触面的电功能可以转移到所述第二区域，在所述第二区域中所述接触面彼此之间具有较小的距离。由此在这些接触面之间创建出足够的位置来以机械方式钻出所述通孔，从而可以放弃使用具有激光钻出的孔的高成本微通孔（Microvia）技术。
因此，可以提供一种可以成本有利地制造的半导体组装件，利用所述半导体组装件可以以BGA技术既改善半导体器件的分散性又改善半导体器件的散热。
根据一个实施方式，所述半导体器件的外部接触面和所述印刷电路板的对应接触面被布置为具有均匀间距的行和列，其中所述第一区域中的间距不同于所述第二区域中的间距并且更大。
所述通孔从所述印刷电路板的上侧延伸到所述印刷电路板的下侧，在所述上侧上布置有所述半导体器件，所述下侧可以与散热器连接。所述通孔可以被构造为未填充的钻孔或为了特别好的热传导而被构造为填充铜的钻孔。散热特别是经由散热器进行，所述印刷电路板布置在该散热器上。
所述半导体组装件的优点在于，其可以特别简单并且成本有利地加以制造。特别地，可以在所述印刷电路板的制造过程中或事后钻出所述通孔，使得所述通孔的数量和布置可以与要优化的半导体组装件最佳地匹配。
根据一个实施方式，所述第一区域布置在芯片安装区域的下方，该芯片安装区域设置在所述重新布线衬底的上侧上。大多数要散发的热量都在此区域中累积。同时，这也是对分散性最没有吸引力的区域。
所述第二区域特别是可以被构造为所述重新布线衬底的***区域和所述印刷电路板的对应区域。在所述重新布线衬底的边缘处围绕所述芯片安装区域延伸的该***区域对于分散性特别重要。电接触件经由印制线路从所述芯片安装区域路由到该***区域中。
外部接触件可以特别是以焊球或焊柱的形式布置在所述外部接触面上。特别地，所述重新布线衬底可以被设置用于制造BGA半导体器件。
所述半导体芯片可以例如借助于线接合或以倒装芯片技术与所述重新布线衬底电连接。使用倒装芯片技术的连接原则上对于本领域技术人员而言是已知的，因此在此不再详细讨论。
所述半导体器件的优点在于，通过同时优化分散性和散热，所述半导体器件具有特别好的性能。如果需要，也可以在所述重新布线衬底中设置散热通孔，这些通孔可以对应于所述印刷电路板中的通孔，但不是必须的。在这种情况下，可以在所述重新布线衬底中的通孔与所述印刷电路板中的通孔之间设置导热连接。
所述半导体器件特别是可以被构造为BGA器件。对于这种器件来说，目前例如为了在汽车领域的控制设备中应用而通常采用1mm或0.8mm的间距，其中将来可以减小这些间距。
所述印刷电路板特别是可以与散热器热接触。所述散热器例如可以由金属构造而成并且也可以形成所述半导体组装件的壳体的一部分。在一种合适的构型中，将所述散热器布置在所述电路板的与上侧（22）相对的下侧上。在一种构型中，所述通孔与所述散热器邻接。在另一个构型中，所述通孔借助于导热膏与所述散热器热接触。在该构型中，所述通孔（例如金属填充的通孔）和所述散热器优选地在相对的侧上与所述导热膏邻接。
所述半导体组装件特别是可以是控制设备，例如用于机动车辆的控制设备。
附图说明
现在将基于所附的示意图更详细地解释本发明的实施方式。
图1示意性地示出了根据本发明的第一实施方式的半导体器件的横截面；
图2示意性地示出了根据本发明的第二实施方式的半导体器件的横截面，并且
图3示意性地示出了根据本发明的一个实施方式的重新布线衬底的下侧的视图。
具体实施方式
根据图1的半导体器件1具有带有上侧5和下侧7的重新布线衬底3。具有有源上侧10的半导体芯片9布置在重新布线衬底3的上侧5上。接触面11布置在上侧10上，所述接触面11经由接合线15与重新布线衬底3的上侧5上的接触连接面13电连接。重新布线衬底3的上侧5、半导体芯片9和接合线15被嵌入在塑料壳体料16中，所述塑料壳体料16保护它们免受环境影响。
在重新布线衬底3的下侧7上布置有外部接触面17，这些外部接触面17经由未示出的印制线路与在重新布线衬底3的上侧5上的接触连接面13电连接。焊球形式的外部接触件19布置在外部接触面17上。因此，半导体器件1被构造为BGA器件并且具有由塑料制成的基质，所述印制线路布置在该基质中。
半导体器件1被焊接到印刷电路板21上以形成半导体组装件。为此，外部接触件19在回流过程中被焊接到印刷电路板21的接触面23上。在所示的实施方式中，印刷电路板21经由未示出的TIM（热界面材料）与散热器25热接触。
为了冷却半导体组装件，即为了消散由半导体芯片9产生的热量，在印刷电路板21中设置有通孔20。在图1所示的实施方式中，这种通孔20仅设置在半导体芯片9下方的第一区域30中。但是，如果需要，也可以在该区域之外设置通孔。通过通孔20消散的热量通过散热器25中的热传导而消散。
图2示出了根据图1的半导体器件1的第二实施方式，该第二实施方式与图1所示的实施方式的不同之处仅在于，半导体芯片9不是以线接合技术而是以倒装芯片技术连接至重新布线衬底3。
为此，半导体芯片9在其有源上侧10上具有接触面11，这些接触面11经由倒装芯片接触件27与重新布线衬底3的上侧5上的接触连接面13电连接。
图3示出了根据图1和2的印刷电路板21的上侧22的视图。在该视图中可以看出，接触面23并非在每个地方都具有相同的间距。
在印刷电路板21的第一区域30中，所述第一区域对应于重新布线衬底3的第一区域30并且位于通过虚线所示的芯片安装区域34的下方，各个接触面23彼此相距距离a。在对应于重新布线衬底3的***区域的第二区域32中，接触面23彼此相距距离b。距离a大于距离b。
因此，接触面23在第一区域30中比在第二区域32中彼此更远。由此在第一区域30中相邻接触面23之间创建了位置，从而可以在接触面23之间分别放置通孔20。
如图3所示，在此通孔20同样可以以行和列的网格布置，其中每个通孔20布置在彼此成方格布置的四个接触面23的中心。因此，用于布置通孔20的间距对应于外部接触件19或接触面23的间距a。
在所示的实施方式中，通孔20仅布置在印刷电路板21的第一区域30中，因为这里存在着对散热的最大需要。然而，也可以将通孔20放置在第一区域30之外。
在所示的实施方式中，通孔20和与其相邻的接触面23之间的距离不仅小于距离a，而且小于距离b。由于在通孔20上没有布置外部接触件并且不可能发生不期望的短路，所以到相邻接触面23的距离可以相对较小。因此，可以在有限的面积上布置足够多的通孔20来有效散热。

Claims (12)

1.一种半导体组装件，具有：
-至少一个半导体器件（1），其中所述半导体器件（1）具有带有上侧（5）和下侧（7）的重新布线衬底（3）以及布置在所述上侧（5）上的半导体芯片（9），其中
-在所述重新布线衬底（3）的上侧（5）上布置了用于与所述半导体芯片（9）的接触面（11）连接的接触连接面（13），
-在所述下侧（7）上布置了外部接触面（17），所述外部接触面经由印制线路与所述接触连接面（13）电连接，并且
-外部接触面（17）在所述下侧（7）的第一区域（30）中以比在第二区域（32）中更大的彼此间距离布置；
-至少一个印刷电路板（21），在所述印刷电路板上布置有所述半导体器件（1），其中与外部接触件（17）对应的接触面（23）布置在所述印刷电路板（21）的上侧（22）上，使得接触面（23）在所述上侧（22）的第一区域（30）中以比在第二区域（32）中更大的彼此间距离布置；
其中在所述印刷电路板（21）的第一区域（30）中在所述接触面（23）之间布置通孔（20）。
2.根据权利要求1所述的半导体组装件，其中，所述外部接触面（17）和对应的接触面（23）布置为具有均匀间距的行和列，其中所述第一区域（30）中的间距不同于所述第二区域（32）中的间距并且大于所述第二区域（32）中的间距。
3.根据权利要求2所述的半导体组装件，其中，所述通孔（20）同样以行和列分别布置在接触面（23）之间的空隙中。
4.根据前述权利要求中任一项所述的半导体组装件，其中，所述通孔（20）被构造为未填充的钻孔。
5.根据权利要求1至3中任一项所述的半导体组装件，其中，所述通孔（20）被构造为全部或部分填充有铜或铜合金的钻孔。
6.根据前述权利要求中任一项所述的半导体组装件，其中，所述第一区域（30）布置在芯片安装区域（34）的下方，所述芯片安装区域设置在所述重新布线衬底（3）的上侧（5）上。
7.根据前述权利要求中任一项所述的半导体组装件，其中，所述第二区域（32）被构造为所述重新布线衬底（3）的***区域。
8.根据前述权利要求中任一项所述的半导体组装件，其中，在所述外部接触面（17）上布置有外部接触件（19）。
9.根据权利要求8所述的半导体组装件，其中，所述半导体器件（1）被构造为球栅阵列器件。
10.根据前述权利要求中任一项所述的半导体组装件，其附加地具有散热器（25），其中所述印刷电路板（21）与所述散热器（25）热接触。
11.根据权利要求10所述的半导体组装件，其中，所述冷却体（25）布置在所述印刷电路板（21）的与所述上侧（22）相对的下侧上。
12.根据前述权利要求10和11中任一项所述的半导体组装件，其中，所述通孔（20）与所述散热器（25）邻接，或者借助于导热膏与所述散热器（25）热接触。
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