CN110357597A - High thermal expansion ceramic baseplate material of a kind of calcium borosilicate system and preparation method thereof - Google Patents

High thermal expansion ceramic baseplate material of a kind of calcium borosilicate system and preparation method thereof Download PDF

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Publication number
CN110357597A
CN110357597A CN201910707119.5A CN201910707119A CN110357597A CN 110357597 A CN110357597 A CN 110357597A CN 201910707119 A CN201910707119 A CN 201910707119A CN 110357597 A CN110357597 A CN 110357597A
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thermal expansion
high thermal
calcium borosilicate
baseplate material
borosilicate system
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李波
王志勇
张树人
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University of Electronic Science and Technology of China
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University of Electronic Science and Technology of China
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  • Compositions Of Oxide Ceramics (AREA)

Abstract

The invention belongs to electronic ceramics baseplate material technical fields, provide high thermal expansion ceramic baseplate material of a kind of calcium borosilicate system and preparation method thereof, meet the requirement of large scale integrated circuit ceramic ball grid array (CBGA) package substrate.The component of ceramic material of the present invention includes: B2O3: 3~12wt%, Al2O3: 2~5wt%, SiO2: 50~70wt%, CaO:10~40wt%, CuO and ZrO2Mixture: 3~10wt%.Ceramic material of the present invention has high bending strength (up to arriving 190MPa) and Young's modulus (60~85GPa), has a good physical protection to act on chip；High thermal expansion coefficient (10~11ppm/ DEG C), the problem of capable of matching with pcb board, overcome thermal mismatching；Low dielectric constant (5~5.5@1MHz), is conducive to the high-speed transfer of signal；Low dielectric loss (< 8.5 × 10‑4@1MHz), reduce the thermal losses in signal transmission；It is also suitable at microwave frequencies, dielectric constant 5.4~5.8 (1~10GHz), dielectric loss < 4 × 10‑3(1~10GHz).

Description

High thermal expansion ceramic baseplate material of a kind of calcium borosilicate system and preparation method thereof
Technical field
The invention belongs to electronic ceramics baseplate material technical field more particularly to high-density packages baseplate materials, specifically mention For high thermal expansion ceramic baseplate material of a kind of calcium borosilicate system and preparation method thereof.
Background technique
Ceramic material have high mechanical strength, thermal property is good, electric property is excellent and the advantages such as stable chemical performance, Electronic Packaging field is very widely used.Calcium borosilicate system ceramic substrate material is always research hotspot, such as Publication No. In the patent document of CN109467426A, it is prepared for a kind of low-temperature co-fired ceramic substrate material, raw material Li2CO3、MgO、 ZnO、P2O5、CaCO3、SiO2、H3BO3、Al2O3、ZrO2、Na2CO3、K2CO3、Li2CO3, dielectric constant 5~8, dielectric loss≤ 0.002；For another example in the patent document of Publication No. US Patent 5258335, it is low temperature co-fired to disclose a kind of low-k CaO-B2O3-SiO2System glass ceramic material, each group are divided into 35~65%CaO, 0~50%B2O3With 10~65% SiO2, dielectric constant 5~5.2 (1kHz), thermal expansion coefficient 7 × 10-6/℃.It is known that the low dielectric loss of baseplate material has Conducive to reduce signals transmission in thermal losses, the former dielectric loss is bigger than normal, and the thermal expansion coefficient of the latter it is too low, it is difficult with Pcb board matching；In addition, baseplate material plays a part of a physical protection for chip, so mechanical property is baseplate material An important indicator, and the above patent do not have to this it is involved.
To meet the requirement that ceramic ball grid array in large scale integrated circuit (CBGA) is encapsulated, therefore the present invention prepares one The kind high thermal expansion ceramic baseplate material of calcium borosilicate system, the material mechanical performance is excellent, and thermal expansion coefficient is high, and Jie having had Electrical property (low dielectric constant and dielectric loss).
Summary of the invention
The drawbacks of it is an object of the invention to for material described in background technique, provides a kind of thermal expansion of calcium borosilicate system's height Ceramic substrate material and preparation method thereof, for meeting requirement of the CBGA encapsulation for baseplate material.Material of the present invention has height Bending strength (up to 130~190MPa), high Young's modulus (60~85GPa), high thermal expansion coefficient (10~11ppm/ DEG C) are low Dielectric constant (5~5.5@1MHz, 5.4~5.8 1~10GHz of@), low-dielectric loss (< 8.5 × 10-4@1MHz, < 4 × 10-3@1 ~10GHz)；In addition, being free of harmful substance, green non-pollution in the baseplate material；Preparation process is simple, is easy to industrialize big rule Mould production.
To achieve the above object, the technical solution adopted by the present invention are as follows:
A kind of high thermal expansion ceramic baseplate material of calcium borosilicate system, which is characterized in that by percentage to the quality, the ceramic base The component of plate material includes: B2O3: 3~12wt%, SiO2: 50~70wt%, CaO:10~40wt%, Al2O3: 1~4wt%, CuO and ZrO2Mixture: 3~10wt%；Wherein, CuO and ZrO2Mixture is the mixture of the two arbitrary proportion.
Further, the principal crystalline phase of the ceramic substrate material is wollastonite and quartz.
Further, the bending strength of the ceramic substrate material is 130~190MPa, and Young's modulus is 60~85GPa, Thermal expansion coefficient be 10~11ppm/ DEG C, dielectric constant be 5~5.5@1MHz, 5.4~5.8 1~10GHz of@, dielectric loss be < 8.5×10-4@1MHz、<4×10-31~10GHz of@.
The preparation method of the high thermal expansion ceramic baseplate material of above-mentioned calcium borosilicate system, comprising the following steps:
Step 1: according to recipe calculation B2O3、SiO2、CaO、Al2O3、CuO、ZrO2The quality of corresponding raw material, precise And it mixes；
Step 2: by step 1 gained mixture after ball milling, drying, sieving, obtaining evenly dispersed powder；
Step 3: step 2 gained powder being packed into crucible, in electric furnace pre-burning 1~3 hour at a temperature of 600~800 DEG C；
Step 4: after step 3 Preburning material again ball milling, drying, sieving, obtaining evenly dispersed powder；
Step 5: the resulting powder of step 4 being granulated, compression moulding obtains idiosome；
Step 6: idiosome obtained by step 5 compression moulding being placed in electric furnace, it is small that 1~3 is sintered at 850~950 DEG C after dumping When, obtain the high thermal expansion ceramic baseplate material of calcium borosilicate system.
To sum up, the beneficial effects of the present invention are:
1, the high thermal expansion ceramic baseplate material of a kind of calcium borosilicate system prepared by the present invention, it is with good performance, meet core The requirement of piece second level substrate；With high bending strength (130~190MPa) and Young's modulus (60~85GPa), for chip Has good physical protection effect；Thermal expansion coefficient is high and stability contorting is at 10~11ppm/ DEG C, can match with pcb board, The problem of overcoming thermal mismatching；Low dielectric constant (5~5.5@1MHz), is conducive to the high-speed transfer of signal；Low dielectric damage Consumption (< 8.5 × 10-4@1MHz), reduce the thermal losses in signal transmission；It is also suitable at microwave frequencies, dielectric constant 5.4~ 5.8 (1~10GHz), dielectric loss < 4 × 10-3(1~10GHz).
2, in the present invention, sintering temperature is low (≤950 DEG C), reduces the energy consumption in production process；Simple process, operation Simplicity is conducive to industrialized production.
Detailed description of the invention
Fig. 1 is the XRD diagram of the high thermal expansion ceramic baseplate material of calcium borosilicate system prepared by embodiment 3.
Fig. 2 is the SEM figure of the high thermal expansion ceramic baseplate material of calcium borosilicate system prepared by embodiment 3.
Specific embodiment
The present invention is further described below in conjunction with specific embodiment.
In the present invention, the high specific preparation process of thermal expansion ceramic baseplate material of calcium borosilicate system is as follows:
Step 1: according to recipe calculation B2O3、SiO2、CaO、Al2O3、CuO、ZrO2The quality of corresponding raw material, precise And it mixes；
Step 2: by step 1 gained mixture after ball milling, drying, sieving, obtaining evenly dispersed powder；
Step 3: step 2 gained powder being packed into crucible, in electric furnace pre-burning 1~3 hour at a temperature of 600~800 DEG C；
Step 4: after step 3 Preburning material again ball milling, drying, sieving, obtaining evenly dispersed powder；
Step 5: the resulting powder of step 4 being granulated, compression moulding obtains idiosome；
Step 6: idiosome obtained by step 5 compression moulding being placed in electric furnace, it is small that 1~3 is sintered at 850~950 DEG C after dumping When, obtain the high thermal expansion ceramic baseplate material of calcium borosilicate system.
In the present invention, the practical proportion of the high thermal expansion ceramic baseplate material each component of Examples 1 to 4 calcium borosilicate system and preparation work Skill parameter is as shown in table 1, is prepared into ceramic substrate material to it and tests, properties are as shown in table 2.
Table 1
Table 2
The above description is merely a specific embodiment, any feature disclosed in this specification, except non-specifically Narration, can be replaced by other alternative features that are equivalent or have similar purpose；Disclosed all features or all sides Method or in the process the step of, other than mutually exclusive feature and/or step, can be combined in any way.

Claims (4)

1. a kind of high thermal expansion ceramic baseplate material of calcium borosilicate system, which is characterized in that by percentage to the quality, the ceramic substrate The component of material includes: B2O3: 3~12wt%, SiO2: 50~70wt%, CaO:10~40wt%, Al2O3: 1~4wt%, CuO With ZrO2Mixture: 3~10wt%；Wherein, CuO and ZrO2Mixture is the mixture of the two arbitrary proportion.
2. by the high thermal expansion ceramic baseplate material of calcium borosilicate system described in claim 1, which is characterized in that the ceramic substrate material Bending strength be 130~190MPa, Young's modulus be 60~85GPa, thermal expansion coefficient be 10~11ppm/ DEG C, dielectric constant For 5~5.5@1MHz, 5.4~5.8 1~10GHz of@, dielectric loss is < 8.5 × 10-4@1MHz、<4×10-31~10GHz of@.
3. by the high thermal expansion ceramic baseplate material of calcium borosilicate system described in claim 1, which is characterized in that the ceramic substrate material Principal crystalline phase be wollastonite and quartz.
4. by the preparation method of the high thermal expansion ceramic baseplate material of calcium borosilicate system described in claim 1, comprising the following steps:
Step 1: according to recipe calculation B2O3、SiO2、CaO、Al2O3、CuO、ZrO2The quality of corresponding raw material, precise simultaneously mix It closes；
Step 2: by step 1 gained mixture after ball milling, drying, sieving, obtaining evenly dispersed powder；
Step 3: step 2 gained powder being packed into crucible, in electric furnace pre-burning 1~3 hour at a temperature of 600~800 DEG C；
Step 4: after step 3 Preburning material again ball milling, drying, sieving, obtaining evenly dispersed powder；
Step 5: the resulting powder of step 4 being granulated, compression moulding obtains idiosome；
Step 6: idiosome obtained by step 5 compression moulding being placed in electric furnace, is sintered 1~3 hour, obtains at 850~950 DEG C after dumping The high thermal expansion ceramic baseplate material of calcium borosilicate system.
CN201910707119.5A 2019-08-01 2019-08-01 High thermal expansion ceramic baseplate material of a kind of calcium borosilicate system and preparation method thereof Pending CN110357597A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111732426A (en) * 2020-06-16 2020-10-02 电子科技大学 Calcium-aluminum-silicon-based ceramic material for high-density packaging and preparation method thereof
CN114573333A (en) * 2022-02-28 2022-06-03 嘉兴佳利电子有限公司 Low-dielectric wollastonite low-temperature co-fired ceramic material and preparation method thereof
CN115124329A (en) * 2022-06-27 2022-09-30 清华大学深圳国际研究生院 LTCC substrate and preparation method thereof

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4735925A (en) * 1985-06-14 1988-04-05 Ngk Spark Plug Co., Ltd. Low-temperature sinterable ceramic composition
CN103482985A (en) * 2013-09-16 2014-01-01 中国科学院上海硅酸盐研究所 Low-temperature co-fired ceramic tape casting material and preparing method and application thereof
CN106396414A (en) * 2016-08-30 2017-02-15 深圳顺络电子股份有限公司 Low-temperature co-fired ceramic material and preparation method thereof
CN108610035A (en) * 2018-05-24 2018-10-02 电子科技大学 High thermal expansion ceramic baseplate material of high intensity and preparation method thereof
CN109467426A (en) * 2018-10-29 2019-03-15 中国电子科技集团公司第四十三研究所 A kind of low-temperature co-fired ceramic substrate material and preparation method thereof

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4735925A (en) * 1985-06-14 1988-04-05 Ngk Spark Plug Co., Ltd. Low-temperature sinterable ceramic composition
CN103482985A (en) * 2013-09-16 2014-01-01 中国科学院上海硅酸盐研究所 Low-temperature co-fired ceramic tape casting material and preparing method and application thereof
CN106396414A (en) * 2016-08-30 2017-02-15 深圳顺络电子股份有限公司 Low-temperature co-fired ceramic material and preparation method thereof
CN108610035A (en) * 2018-05-24 2018-10-02 电子科技大学 High thermal expansion ceramic baseplate material of high intensity and preparation method thereof
CN109467426A (en) * 2018-10-29 2019-03-15 中国电子科技集团公司第四十三研究所 A kind of low-temperature co-fired ceramic substrate material and preparation method thereof

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111732426A (en) * 2020-06-16 2020-10-02 电子科技大学 Calcium-aluminum-silicon-based ceramic material for high-density packaging and preparation method thereof
CN114573333A (en) * 2022-02-28 2022-06-03 嘉兴佳利电子有限公司 Low-dielectric wollastonite low-temperature co-fired ceramic material and preparation method thereof
CN115124329A (en) * 2022-06-27 2022-09-30 清华大学深圳国际研究生院 LTCC substrate and preparation method thereof
CN115124329B (en) * 2022-06-27 2023-08-08 清华大学深圳国际研究生院 LTCC substrate and preparation method thereof

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Application publication date: 20191022

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